TWI838424B - 感光性樹脂組合物、含氟樹脂硬化物之製造方法、含氟樹脂、含氟樹脂膜、岸堤及顯示元件 - Google Patents

感光性樹脂組合物、含氟樹脂硬化物之製造方法、含氟樹脂、含氟樹脂膜、岸堤及顯示元件 Download PDF

Info

Publication number
TWI838424B
TWI838424B TW108142283A TW108142283A TWI838424B TW I838424 B TWI838424 B TW I838424B TW 108142283 A TW108142283 A TW 108142283A TW 108142283 A TW108142283 A TW 108142283A TW I838424 B TWI838424 B TW I838424B
Authority
TW
Taiwan
Prior art keywords
group
formula
fluorine
carbon atoms
repeating unit
Prior art date
Application number
TW108142283A
Other languages
English (en)
Chinese (zh)
Other versions
TW202030553A (zh
Inventor
兼子譲
宮澤覚
佐佐木佳子
佐野明日香
野村祐介
Original Assignee
日商中央硝子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商中央硝子股份有限公司 filed Critical 日商中央硝子股份有限公司
Publication of TW202030553A publication Critical patent/TW202030553A/zh
Application granted granted Critical
Publication of TWI838424B publication Critical patent/TWI838424B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F214/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
    • C08F214/18—Monomers containing fluorine
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/22—Esters containing halogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F14/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
    • C08F14/18—Monomers containing fluorine
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/04—Polymerisation in solution
    • C08F2/06—Organic solvent
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/54—Polymerisation initiated by wave energy or particle radiation by X-rays or electrons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
    • C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/14—Monomers containing only one unsaturated aliphatic radical containing one ring substituted by heteroatoms or groups containing heteroatoms
    • C08F212/22—Oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/22—Esters containing halogen
    • C08F220/24—Esters containing halogen containing perhaloalkyl radicals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
    • C08F220/282—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing two or more oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
    • C08F279/02—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00 on to polymers of conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/12—Polymers provided for in subclasses C08C or C08F
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Emergency Medicine (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
  • Electroluminescent Light Sources (AREA)
TW108142283A 2018-11-26 2019-11-21 感光性樹脂組合物、含氟樹脂硬化物之製造方法、含氟樹脂、含氟樹脂膜、岸堤及顯示元件 TWI838424B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2018-219938 2018-11-26
JP2018219938 2018-11-26
JP2018-227767 2018-12-05
JP2018227767 2018-12-05
JP2019-172138 2019-09-20
JP2019172138 2019-09-20

Publications (2)

Publication Number Publication Date
TW202030553A TW202030553A (zh) 2020-08-16
TWI838424B true TWI838424B (zh) 2024-04-11

Family

ID=70852912

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108142283A TWI838424B (zh) 2018-11-26 2019-11-21 感光性樹脂組合物、含氟樹脂硬化物之製造方法、含氟樹脂、含氟樹脂膜、岸堤及顯示元件

Country Status (6)

Country Link
US (2) US11939459B2 (https=)
JP (2) JP7401785B2 (https=)
KR (2) KR20260042521A (https=)
CN (1) CN113166294B (https=)
TW (1) TWI838424B (https=)
WO (1) WO2020110793A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022092155A1 (https=) 2020-10-28 2022-05-05
CN116829674A (zh) * 2021-02-08 2023-09-29 中央硝子株式会社 拒液剂、固化性组合物、固化物、分隔壁、有机电致发光元件、含氟涂膜的制造方法及含氟涂膜
JPWO2022190714A1 (https=) * 2021-03-09 2022-09-15
WO2024058265A1 (ja) * 2022-09-16 2024-03-21 株式会社Ｅｎｅｏｓマテリアル 共役ジエン系重合体、重合体組成物、架橋物、及びタイヤ

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200922949A (en) * 2007-09-20 2009-06-01 Fujifilm Corp Colored curable resin composition, method for forming colored pattern, colored pattern, method for producing color filter, color filter, and liquid crystal display element
TW201140237A (en) * 2010-03-29 2011-11-16 Nippon Steel Chemical Co Alkaline developing photosensitive resin composition, barrier for display element using the same, and display element
TW201421155A (zh) * 2012-11-21 2014-06-01 富士軟片股份有限公司 感光性樹脂組成物、硬化膜的製造方法、硬化膜、有機ｅｌ顯示裝置以及液晶顯示裝置
TW201543163A (zh) * 2014-02-18 2015-11-16 Asahi Glass Co Ltd 負型感光性樹脂組成物、樹脂硬化膜、隔壁及光學元件
CN105238197A (zh) * 2015-11-15 2016-01-13 孟红琳 一种高导热率的导热涂料

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0234617A (ja) * 1988-07-22 1990-02-05 Hitachi Ltd 含フツ素系熱硬化性樹脂組成物
JP4081905B2 (ja) * 1999-02-23 2008-04-30 旭硝子株式会社 含フッ素ジエン化合物の製造方法
JP2002040650A (ja) * 2000-07-25 2002-02-06 Fujifilm Arch Co Ltd ネガ型感光性樹脂組成物
JP2003221406A (ja) 2002-01-31 2003-08-05 Asahi Glass Co Ltd 水性分散液
KR101319775B1 (ko) 2005-04-21 2013-10-17 아사히 가라스 가부시키가이샤 광경화성 조성물, 미세 패턴 형성체 및 그 제조 방법
TW200714131A (en) 2005-07-29 2007-04-01 Sanyo Electric Co Organic electroluminescent element and organic electroluminescent display device
EP1995635A4 (en) * 2006-03-16 2011-03-30 Asahi Glass Co Ltd NEGATIVE LIGHT-SENSITIVE FLUORATED AROMATIC RESIN COMPOSITION
US8900788B2 (en) * 2006-10-18 2014-12-02 Tokyo Ohka Kogyo Co., Ltd. Resist composition for immersion exposure and method of forming resist pattern
JP2008250155A (ja) 2007-03-30 2008-10-16 Fujifilm Corp 離隔壁付基板及びその製造方法、カラーフィルタ及びその製造方法、並びに表示装置
WO2012057058A1 (ja) 2010-10-29 2012-05-03 住友化学株式会社 感光性樹脂組成物、パターン構造物、表示装置および隔壁
CN103261968A (zh) 2010-12-20 2013-08-21 旭硝子株式会社 感光性树脂组合物、间隔壁、彩色滤光膜及有机el元件
WO2012111595A1 (ja) 2011-02-14 2012-08-23 住友化学株式会社 有機エレクトロルミネッセンス装置とその製造方法
JP6171927B2 (ja) 2013-12-25 2017-08-02 Jsr株式会社 感放射線性樹脂組成物、硬化膜、発光素子および発光層の形成方法
KR20160138058A (ko) 2014-03-31 2016-12-02 스미또모 가가꾸 가부시키가이샤 격벽을 갖는 기판
JP6500458B2 (ja) 2015-01-29 2019-04-17 三菱ケミカル株式会社 感光性樹脂組成物、それで構成される硬化部材、及びそれを備えた画像表示装置
CN107430341B (zh) * 2015-02-05 2021-03-05 Ａｇｃ株式会社 感光性树脂组合物、树脂膜的制造方法、有机半导体元件的制造方法
CN105609656B (zh) 2016-01-06 2017-05-17 京东方科技集团股份有限公司 一种有机电致发光器件及显示装置
CN109641992B (zh) 2016-08-29 2021-09-21 Ａｇｃ株式会社 含氟聚合物、其制造方法、以及具备含氟聚合物的固化物的物品
CN109661855B (zh) 2016-09-05 2022-07-08 三菱化学株式会社 有机场致发光元件间隔壁形成用感光性树脂组合物、间隔壁、有机场致发光元件、图像显示装置及照明
JP6663380B2 (ja) 2017-03-22 2020-03-11 信越化学工業株式会社 ポリイミド前駆体の重合体、ポジ型感光性樹脂組成物、ネガ型感光性樹脂組成物、パターン形成方法、硬化被膜形成方法、層間絶縁膜、表面保護膜、及び電子部品
KR20200096487A (ko) 2017-12-04 2020-08-12 도레이 카부시키가이샤 기판, 광 확산 방지용 수지 조성물 및 화상 표시 장치
JP2019102664A (ja) 2017-12-04 2019-06-24 株式会社ブイ・テクノロジー Ｌｅｄ表示パネルの製造方法
JP7375546B2 (ja) 2017-12-11 2023-11-08 Ａｇｃ株式会社 ネガ型感光性樹脂組成物
WO2019176785A1 (ja) 2018-03-14 2019-09-19 東レ株式会社 ネガ型感光性着色組成物、硬化膜、それを用いたタッチパネル
WO2019225702A1 (ja) 2018-05-23 2019-11-28 セントラル硝子株式会社 パターン膜付き基板の製造方法および含フッ素共重合体

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200922949A (en) * 2007-09-20 2009-06-01 Fujifilm Corp Colored curable resin composition, method for forming colored pattern, colored pattern, method for producing color filter, color filter, and liquid crystal display element
TW201140237A (en) * 2010-03-29 2011-11-16 Nippon Steel Chemical Co Alkaline developing photosensitive resin composition, barrier for display element using the same, and display element
TW201421155A (zh) * 2012-11-21 2014-06-01 富士軟片股份有限公司 感光性樹脂組成物、硬化膜的製造方法、硬化膜、有機ｅｌ顯示裝置以及液晶顯示裝置
TW201543163A (zh) * 2014-02-18 2015-11-16 Asahi Glass Co Ltd 負型感光性樹脂組成物、樹脂硬化膜、隔壁及光學元件
CN105238197A (zh) * 2015-11-15 2016-01-13 孟红琳 一种高导热率的导热涂料

Also Published As

Publication number Publication date
JP7755181B2 (ja) 2025-10-16
KR102929030B1 (ko) 2026-02-23
KR20210097737A (ko) 2021-08-09
US12460031B2 (en) 2025-11-04
JPWO2020110793A1 (ja) 2021-10-21
JP7401785B2 (ja) 2023-12-20
CN113166294A (zh) 2021-07-23
US11939459B2 (en) 2024-03-26
JP2024028789A (ja) 2024-03-05
US20240270952A1 (en) 2024-08-15
KR20260042521A (ko) 2026-03-31
CN113166294B (zh) 2024-01-12
TW202030553A (zh) 2020-08-16
WO2020110793A1 (ja) 2020-06-04
US20230027085A1 (en) 2023-01-26

Similar Documents

Publication Publication Date Title
TWI475319B (zh) 光阻組成物，光阻圖型之形成方法，高分子化合物及化合物
TWI465849B (zh) 光阻組成物及光阻圖型形成方法，及化合物與其所形成之酸產生劑
TWI493291B (zh) 正型光阻組成物，光阻圖型之形成方法
TWI507424B (zh) 光阻組成物、光阻圖型之形成方法、新穎的化合物及酸產生劑
TWI444773B (zh) 正型光阻組成物及光阻圖型之形成方法
JP7755181B2 (ja) 感光性樹脂組成物、含フッ素樹脂硬化物の製造方法
TWI406094B (zh) 浸潤式曝光用正型光阻組成物、光阻圖型之形成方法及含氟高分子化合物
TW201312262A (zh) 高分子化合物之製造方法、光阻組成物及光阻圖型之形成方法
TW201406797A (zh) 高分子化合物之製造方法，光阻組成物及光阻圖型之形成方法
JP5264404B2 (ja) レジスト組成物、レジストパターン形成方法、化合物、酸発生剤
TW201329617A (zh) 光阻組成物及光阻圖型之形成方法
TWI877368B (zh) 發光元件之製造方法
TWI895532B (zh) 含氟樹脂、撥液劑、感光性樹脂組合物、硬化物及顯示器
TWI911388B (zh) 感光性樹脂組合物、硬化物、含氟樹脂硬化膜及顯示器
JP5504892B2 (ja) 新規なトリシクロデカン誘導体及びその製造方法
CN116829674A (zh) 拒液剂、固化性组合物、固化物、分隔壁、有机电致发光元件、含氟涂膜的制造方法及含氟涂膜