JPWO2022190714A1 - - Google Patents
Info
- Publication number
- JPWO2022190714A1 JPWO2022190714A1 JP2023505208A JP2023505208A JPWO2022190714A1 JP WO2022190714 A1 JPWO2022190714 A1 JP WO2022190714A1 JP 2023505208 A JP2023505208 A JP 2023505208A JP 2023505208 A JP2023505208 A JP 2023505208A JP WO2022190714 A1 JPWO2022190714 A1 JP WO2022190714A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
- C08F212/06—Hydrocarbons
- C08F212/08—Styrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
- C08F212/06—Hydrocarbons
- C08F212/12—Monomers containing a branched unsaturated aliphatic radical or a ring substituted by an alkyl radical
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
- C08F212/14—Monomers containing only one unsaturated aliphatic radical containing one ring substituted by heteroatoms or groups containing heteroatoms
- C08F212/22—Oxygen
- C08F212/24—Phenols or alcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/22—Esters containing halogen
- C08F220/24—Esters containing halogen containing perhaloalkyl radicals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/08—Copolymers of styrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D125/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Coating compositions based on derivatives of such polymers
- C09D125/02—Homopolymers or copolymers of hydrocarbons
- C09D125/04—Homopolymers or copolymers of styrene
- C09D125/08—Copolymers of styrene
- C09D125/14—Copolymers of styrene with unsaturated esters
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/322—Aqueous alkaline compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Emergency Medicine (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021037813 | 2021-03-09 | ||
| JP2021137531 | 2021-08-25 | ||
| PCT/JP2022/003873 WO2022190714A1 (ja) | 2021-03-09 | 2022-02-01 | ポジ型レジスト組成物及びレジストパターン形成方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022190714A1 true JPWO2022190714A1 (https=) | 2022-09-15 |
Family
ID=83226695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023505208A Pending JPWO2022190714A1 (https=) | 2021-03-09 | 2022-02-01 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240160102A1 (https=) |
| JP (1) | JPWO2022190714A1 (https=) |
| KR (1) | KR20230154820A (https=) |
| TW (1) | TW202246899A (https=) |
| WO (1) | WO2022190714A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2024070672A1 (https=) * | 2022-09-30 | 2024-04-04 | ||
| WO2024150677A1 (ja) * | 2023-01-11 | 2024-07-18 | 富士フイルム株式会社 | 感活性光線性又は感放射線性樹脂組成物 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016009128A (ja) * | 2014-06-25 | 2016-01-18 | 東京応化工業株式会社 | レジスト組成物、レジストパターン形成方法及び高分子化合物 |
| WO2017169569A1 (ja) * | 2016-03-30 | 2017-10-05 | 富士フイルム株式会社 | 保護膜形成用組成物、保護膜形成用組成物の製造方法、パターン形成方法、および、電子デバイスの製造方法 |
| WO2018123667A1 (ja) * | 2016-12-27 | 2018-07-05 | 日本ゼオン株式会社 | 重合体、ポジ型レジスト組成物、及びレジストパターン形成方法 |
| JP2018154754A (ja) * | 2017-03-17 | 2018-10-04 | 日本ゼオン株式会社 | 共重合体およびポジ型レジスト組成物 |
| JP2018197856A (ja) * | 2017-05-22 | 2018-12-13 | Jnc株式会社 | 硬化性組成物、硬化体及び液晶表示素子 |
| WO2020045535A1 (ja) * | 2018-09-01 | 2020-03-05 | 富士フイルム株式会社 | 感活性光線性又は感放射線性樹脂組成物、感活性光線性又は感放射線性膜、パターン形成方法、フォトマスク、電子デバイスの製造方法、及び化合物 |
| JP2020064170A (ja) * | 2018-10-17 | 2020-04-23 | 日立化成株式会社 | 感光性樹脂組成物、パターン硬化膜及びその製造方法、半導体素子、並びに、電子デバイス |
| WO2020110793A1 (ja) * | 2018-11-26 | 2020-06-04 | セントラル硝子株式会社 | 感光性樹脂組成物、含フッ素樹脂硬化物の製造方法、含フッ素樹脂、含フッ素樹脂膜、バンク及び表示素子 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5891075B2 (ja) * | 2012-03-08 | 2016-03-22 | 東京応化工業株式会社 | ブロックコポリマー含有組成物及びパターンの縮小方法 |
| KR20170031053A (ko) * | 2015-09-10 | 2017-03-20 | 제이에스알 가부시끼가이샤 | 레지스트 패턴 형성 방법 |
| US11402753B2 (en) * | 2017-09-29 | 2022-08-02 | Zeon Corporation | Positive resist composition, resist film formation method, and laminate manufacturing method |
| US11919985B2 (en) * | 2018-09-25 | 2024-03-05 | Zeon Corporation | Copolymer and positive resist composition |
| KR20240043138A (ko) * | 2021-08-25 | 2024-04-02 | 니폰 제온 가부시키가이샤 | 포지티브형 레지스트 조성물 |
-
2022
- 2022-02-01 JP JP2023505208A patent/JPWO2022190714A1/ja active Pending
- 2022-02-01 US US18/546,430 patent/US20240160102A1/en active Pending
- 2022-02-01 KR KR1020237029328A patent/KR20230154820A/ko active Pending
- 2022-02-01 WO PCT/JP2022/003873 patent/WO2022190714A1/ja not_active Ceased
- 2022-02-09 TW TW111104679A patent/TW202246899A/zh unknown
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016009128A (ja) * | 2014-06-25 | 2016-01-18 | 東京応化工業株式会社 | レジスト組成物、レジストパターン形成方法及び高分子化合物 |
| WO2017169569A1 (ja) * | 2016-03-30 | 2017-10-05 | 富士フイルム株式会社 | 保護膜形成用組成物、保護膜形成用組成物の製造方法、パターン形成方法、および、電子デバイスの製造方法 |
| WO2018123667A1 (ja) * | 2016-12-27 | 2018-07-05 | 日本ゼオン株式会社 | 重合体、ポジ型レジスト組成物、及びレジストパターン形成方法 |
| JP2018154754A (ja) * | 2017-03-17 | 2018-10-04 | 日本ゼオン株式会社 | 共重合体およびポジ型レジスト組成物 |
| JP2018197856A (ja) * | 2017-05-22 | 2018-12-13 | Jnc株式会社 | 硬化性組成物、硬化体及び液晶表示素子 |
| WO2020045535A1 (ja) * | 2018-09-01 | 2020-03-05 | 富士フイルム株式会社 | 感活性光線性又は感放射線性樹脂組成物、感活性光線性又は感放射線性膜、パターン形成方法、フォトマスク、電子デバイスの製造方法、及び化合物 |
| JP2020064170A (ja) * | 2018-10-17 | 2020-04-23 | 日立化成株式会社 | 感光性樹脂組成物、パターン硬化膜及びその製造方法、半導体素子、並びに、電子デバイス |
| WO2020110793A1 (ja) * | 2018-11-26 | 2020-06-04 | セントラル硝子株式会社 | 感光性樹脂組成物、含フッ素樹脂硬化物の製造方法、含フッ素樹脂、含フッ素樹脂膜、バンク及び表示素子 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202246899A (zh) | 2022-12-01 |
| US20240160102A1 (en) | 2024-05-16 |
| WO2022190714A1 (ja) | 2022-09-15 |
| KR20230154820A (ko) | 2023-11-09 |
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