TW201140237A - Alkaline developing photosensitive resin composition, barrier for display element using the same, and display element - Google Patents

Abstract

The present invention provides an alkaline developing photosensitive resin composition, which has excellent compatibility with ink dispersing agent and shows excellent surface appearance and pattern after film making, has excellent surface ink repellency, and on the other hand, is capable of maintaining the surface ink repellency even after frequent washing or lapse of time. The alkaline developing photosensitive resin composition of the present invention comprises fluorine-contained resin (A) to serve as ink repellent agent and photosensitive component that is alkaline developable with reaction with ultraviolet light of wavelength of 300-450nm and is characterized by comprising fluorine-contained resin (A), which is predetermined random or block copolymers and has an average molecular weight within the range of 2000 to 200000 and the ratio of fluorine-contained resin in 100 parts of solvent removed mass is 0.05-1 mass part.

Description

[Technical Field] The present invention relates to a partition formed by an alkali-developing photosensitive light-sensitive tree and a display element, and a grease formed on a partition wall of a display element in an inkjet printing method. The composition, and the partition wall formed by using the same, [previously] color filter, usually in a black matrix such as glass or plastic sheet, and then sequentially formed in a color pattern to form red and green. , blue, etc. 3 . The size of the pattern is about 700 μιη with the color filter and each color. Further, the positional accuracy of the lamination is manufactured by a microfabrication technique with high dimensional accuracy. Representative production methods of the color filter include a dye dispersion method, an electrophoresis method, and the like. Among these, a special photopolymerizable composition is applied onto a transparent substrate, and is cured by light, development, and, if necessary, to form a color filter method, such as heat resistance of the position of the color filter pixel, film thickness, and the like. Excellent durability and few defects such as pinholes. On the other hand, the black matrix is generally red, arranged in a lattice shape, a strip shape or a mosaic shape, and has a contrast-enhancing contrast or a TFT which prevents light leakage. Therefore, black The substrate requires high light blocking properties. Conventional lipid compositions and their use are suitable for alkaline imaging of light-sensitive trees and display elements. The surface of the transparent substrate is different from the different hue of the chromatographic species such as mosaic, but is 5~μηι~ tens of μηι, the color method, the printing method, the color is, and the coloring material is repeatedly subjected to the image exposing device. Image pigments are widely used because of their high dispersion accuracy and light fastness. In the green and blue chromatograms, the color mixture between colors suppresses the effect of malfunction. The black matrix is formed of a metal film such as chromium-5-201140237, and is generally formed by photolithography using a photosensitive resin containing a light-shielding material. However, if the chromatogram is formed by the above method, it is necessary to separately perform the steps of exposure and development for each color, so that at least three light steps are required, which is expensive. Therefore, an ink jet method capable of providing a color filter at low cost has been proposed. In the region formed by the pixels, the red, green, and blue inks are simultaneously sprayed and coated only by the necessary pixels to form a pixel, and the partition wall is formed in a light step in advance, and the ink is ejected to the ink. A method of the pixel portion thereof has also been proposed. However, in this method, the penetration of the respective color regions or the color mixture between adjacent regions is caused. Therefore, it is required for the material constituting the partition wall to suppress the property of the coloring agent to diffuse outside the coloring target region. For example, Patent Document 2 exemplifies that if the static contact angle of the ink with the surface of the partition wall is 40 to 55°, color mixing can be effectively avoided. On the other hand, when considering the dynamic contact angle, it is preferable that the ink advances toward the front surface of the partition wall. Further, when the ink ejected from the ink jet head is simultaneously superposed on the partition wall in the pixel, the ink on the surface of the partition wall is required to return to the self-repairing action in the pixel due to the surface ink repellency. In particular, when the pixel is miniaturized and high definition is required, the frequency of the droplets ejected by the ink jet superimposed on the black matrix is increased, and the corners in the respective color regions are overprinted in the partition wall in order to complement the spreadability of the ink. The case of the Ministry is also proposed (see Patent Document 7). When the ink overlapping the partition portion is returned to the pixel, it is predicted that the contact angle of the ink is smaller as possible. Similarly, when a display element is formed using a coating type organic EL material, a means for applying a coating type organic EL material to a partition wall by an inkjet coating method after forming a partition wall in a light step is also proposed. -6 - 201140237 A method of providing a photoresist composition of a partition material under such a purpose, and a method of mixing a fluorine-based or polyoxane-based compound as a component imparting ink repellent property has been proposed. For example, Patent Document 1 discloses a photoresist composition comprising a copolymer of a fluorine-containing alkyl (meth) acrylate monomer and a polyoxyxylene-containing ethylenically unsaturated monomer. However, the amount of the copolymer added is 0.001 to 0.05% by mass relative to the solid content of the photoresist composition, and such low ink repellency is not sufficient. Patent Document 2 exemplifies a composition of a copolymer of hexafluoropropylene and an unsaturated carboxylic acid and/or an unsaturated carboxylic anhydride, and a composition of a fluorine organic compound. However, in order to obtain a polymer of hexafluoropropylene which must be polymerized under high pressure, the molecular weight thereof is also as small as 2,000 or less. Further, the fluoroorganic compound which assists it is also a surfactant system, and there is a problem in the ink repellency thereof. Patent Document 3 exemplifies a photoresist composition characterized by (:112 = (:(111)(:00乂1^(1^ represents a perfluoroalkyl group having a carbon number of 4 to 6). In the case of the fluorine-containing resin having a fluorine atom content of 7 to 35% by mass, the R1 group is limited to ruthenium, CH3 or CF3. Further, Patent Document 4 describes a negative photosensitive resin composition. The ink repellent containing a photosensitive resin having an acidic group and an alkali having three or more ethylenic double bonds in the molecule, and at least one having a hydrogen atom substituted with a fluorine atom and having a carbon number of 20 or less An ink-repellent agent composed of a polymerized unit of an alkyl group and a polymer copolymerized with a polymer unit having an ethylenic double bond. The polymerization unit of fluorine in the ink-repellent agent is also the same as that of the above Patent Document 3. In the case where the ratio of the fluorine-containing compound in the photo-resistance component is increased, the adhesion to the support substrate is lowered and the surface smoothness is deteriorated. 201140237 Patent Document 5 describes the manufacture of a surface-repellent black matrix. a method of using a resin contained in a black matrix A low affinity ink and/or fluorine ink repellency, after the development, the black matrix is fired at 150~230 ° C, thereby allowing the ink to be transferred to the surface, and the contact angle with the colored ink The control is 30 to 60°. The specific example of the ink-repellent agent can be exemplified by a fluororesin obtained by copolymerization with a fluorine-containing monomer such as difluoroethylene vinyl having an organic polyfluorene oxide in a main chain or a side chain. The polyoxo-oligomer and the fluorine-based oligomer containing a surfactant, etc., even if it migrates to the surface after firing, its ink repellency is lowered with the subsequent washing or time, which is a problem. Patent Document 8 exemplifies an ink-repellent containing an Rf group and an acidic group (carboxyl group, phenolic hydroxyl group, or sulfonic acid group) composed of a polyfluoroether structure, and Patent Document 9 exemplifies a case containing CH2 = C ( Rn)COOYRf (Rn is an organic group or chlorine having a carbon number of 2 or more) is a photoresist composition of a monomer ink-repellent agent. The two examples have good alkali developability and good patterning property, so that accompanying imaging is observed. The ink repellency is lowered. Therefore, in order to have sufficient ink repellency, a certain amount or more of addition is required, so it is impossible to avoid It is free from the contamination caused by the ink-repellent agent in the opening portion of the pixel. Further, it is suitable for forming a photoresist of a light-shielding resin substrate, and Patent Document 6 reports: a compound containing an unsaturated group (specific aromatic epoxy compound and a black photoresist which is a main component of a resin obtained by reacting a reaction product of (meth)acrylic acid with a polybasic acid carboxylic acid or an anhydride thereof, has high light-shielding property, and is easy to form a fine pattern by photolithography, and It is a composition for forming a light-shielding film which is excellent in insulation property, heat resistance, adhesion, and room temperature storage stability. However, in Patent Document 6, there is no ink-repellent property that is touched, and compatibility is not mentioned. _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. [Problem to be Solved by the Invention] Therefore, the object of the present invention is to solve the above problems, that is, to provide a photosensitive property suitable for forming a partition wall for a display element. a resin composition containing a photoresist composition (photosensitive resin composition) of a photosensitive component which is reacted with ultraviolet light (300 nm to 450 nm), wherein the ink-repellent has excellent compatibility; the surface appearance after film formation and The shape of the pattern is good and the surface is excellent in ink repellency. On the other hand, the surface ink repellency can be maintained even after usual washing and time lapse. [Means for Solving the Problem] That is, the present invention is as follows. (1) An alkali-developing photosensitive resin composition containing a fluorine-containing resin (A) as an ink-repellent agent and a photosensitivity of an alkali-developable image of an ultraviolet light reaction at a wavelength of 300 to 45 Onm 201140237 The component is characterized in that the fluorine-containing resin (A) is a random or block copolymer represented by the following formula (2), and the average molecular weight Mw is in the range of from 2,000 to 20,000, and the total amount of the solvent is removed. The ratio of the 00 parts by mass of the fluorine-containing resin (A) is 〜.〇 5 to 1 part by mass. 【化1】

r λ —u \ r \ rr \ 0X1 2 CH 2 Cvlvli/ CH CiRn) (j:=0 f RZX Φ Rf ii VJPLJQL ) r VJ (2) [wherein R represents an alcoholic hydroxyl group or a phenolic hydroxyl group The organic group 'Rn represents hydrogen or a methyl group, Y represents a divalent organic group having no fluorine atom, and Rf represents a fluorine-containing group represented by the following formula (1): Ar represents an aromatic ring, and X and Z represent a hydrogen atom. An aromatic group, an alkyl group, an alkenyl group or an ester group having no fluorine atom may be the same or different from each other, and P, q, r and S are respectively the total number of copolymerized units, wherein p, q and s The number of 0 to 30 'P and q mouth 6 is 1 or more, and r is 1 to 40. In addition, the ratio of the fluorine-containing group of the formula (1) contained in the copolymer of the formula (2) is from 15 to 50% by mass in terms of mass. -10- 201140237 【化2】

(CF3) 2CF

(cf3) 2cf (2) The alkali-developing photosensitive resin composition as described in the above (1), wherein the fluorine-containing resin (A) and (B) have an acidic group and two or more in one molecule. An alkali-developing oligomer having an ethylenic double bond, (C) a photopolymerizable monomer having three or more ethylenic double bonds in one molecule, and (D) a photopolymerization initiator. (3) The alkali-developing photosensitive resin composition according to the above (2), wherein the component (B) is derived from a bisphenol represented by the following formula (4). An alkali-developing unsaturated group-containing oligomer obtained by reacting a reaction of an epoxy compound of a glycidyl ether with a (meth) acrylate and further reacting with a polybasic acid carboxylic acid or an anhydride thereof. [化3]

-11 - 201140237 [wherein, the ruler 1 and R2 are a hydrogen atom, an alkyl group having 1 to 5 carbon atoms or a halogen atom, which may be the same or different, and X represents -0: 〇-, -3〇2- , -<:(€?3)2-, -Si(CH3)2-, -ch2-, -C(CH3)2-, -〇-, 9,9-fluorenyl represented by the following formula, Or does not exist, η is an integer of 1 to 10]. (4) A light-shielding alkali-sensing photosensitive resin composition characterized by the alkali-sensing light described in any one of the above (1) to (3) a light-shielding dispersion liquid obtained by dispersing at least one selected from the group consisting of a black organic pigment, a mixed color organic pigment, and a light-shielding material, and a total of 100 parts by mass based on the total solid content. The (Ε) component is blended in a ratio of 25 to 60 parts by mass. (5) The photosensitive resin composition according to the above (4), which is used for forming a partition wall for a display element. (6) The photosensitive resin composition according to the above (5), which is used for forming a color filter partition. (7) A partition wall for a display element, wherein the photosensitive resin composition described in the above (5) or (6) is applied onto a substrate, and after drying, it is necessary to perform exposure by (a) an ultraviolet exposure apparatus. (b) development by an aqueous alkali solution and (a partition wall obtained by each step of hot calcination, characterized in that the film thickness is 1.5 to -12-201140237 3 μιη 〇 (8) - a display element' characteristic system In the partition wall described in the above (7), a pixel is formed by an inkjet printing method. [Effect of the Invention] The present invention provides a photosensitive resin composition suitable for forming a partition wall for a display element. A photoresist composition of a photosensitive component which is reacted by ultraviolet light (30 〇 nm to 45 nm), wherein the ink repellency agent is excellent in compatibility, and the surface appearance and pattern shape after film formation are good, and the surface ink repellency is excellent. For example, in the manufacturing method of a display element by an inkjet process, it is possible to provide a device that does not require the surface ink treatment of the atmospheric piezoelectric slurry to achieve cost reduction and contribute to improving the yield of the article. Material. In particular, It can be used for a liquid crystal display device and an organic EL filter produced by an inkjet printing method, and can also be used for a fluid-driven electronic paper application. [Embodiment] Hereinafter, the present invention will be described in detail. The fluorine-containing resin (A) in the resin composition is a fluorine-containing resin (A) having a substituent of the following formula (1). -13- 201140237 [Chemical 5 (CF3) 2CF\ /CF3 C=C ( 1 )

(CF3) 2CF The method of introducing the substituent represented by the formula (1) can be carried out by a known means. Specifically, a means represented by the following formula (5) can be used.

(CF3)2CF CF, (cf3)2cf CF, C=C + p-OH / \ (cf3)2cf fc=c / \ (cf3)2cf op (5 usually 'fluorine as shown in the above formula (5) The product contains the following isomer skeleton (lb), and exhibits the same effect as the substituent of the formula (the structure shown by 〇), so that the same fluorine-containing group can exert the effect of the present invention. 】 (CF3)2CF (cf3)2c

(lb) -14- 201140237 P-OH in the above formula (5) is a compound having a primary hydroxyl group or a phenol group. Therefore, in order to obtain the fluorine-containing resin (A) of the object, for example, it is mentioned. Process (i): a method in which a polymer having a primary hydroxyl group or a phenol group in a side chain is used as a precursor to introduce a fluorine-containing substituent of interest by a means represented by the formula (5); or, a method (Π): A method of copolymerizing a monomer having a fluorine-containing substituent represented by the formula (1) with another monomer. Among them, the method (Π) is preferable because the method (i) can quantitatively introduce a fluorine group into a molecular chain. The specific example of the method (i) can be exemplified by a (meth) acrylate derivative such as 2-hydroxyethyl methacrylate, 4-hydroxybutyl methacrylate or 6-hydroxybutyl methacrylate. A method in which a copolymer is used as a precursor; a copolymer of a vinyl compound having a phenol group such as p-hydroxystyrene. Specific examples of the method (Π) include, for example, a method of copolymerizing a p-hydroxystyrene with a fluorine group in the formula (5) and copolymerizing with another monomer; or a method represented by the following formula (3) (A) A method in which a monomer unit formed of an acrylate monomer is copolymerized with another monomer. CH2 = C(Rn)-C00-Y-0-Rf (3) [wherein, Rn represents hydrogen or a methyl group, Y represents a divalent organic group having no fluorine atom, and Rf is a fluorine of the formula (1) base]. The monomer represented by the formula (3) is a group in which Rf is bonded to a polymer backbone having an α-position substituent (Rn) by an organic group Y having a function of a spacer. The organic group Y can be exemplified by an alkyl group, a polyethylene glycol group, a phenyl group, etc., and can be exemplified by -15-201140237, such as having a fluorine group such as (meth)acrylic acid and a fluorine-containing product obtained by the above formula (5) The base of the functional group of the substance. Further, the fluorine-containing resin (A) is prepared by copolymerizing such a fluorine-containing monomer with a non-fluorine-containing monomer. By using the method (i) or (ii), for example, a fluorine-containing resin (A) composed of a random or block copolymer represented by the following formula (2) can be obtained. [Chemical 8] CH2C(Rn) ?( i Ο CH2 jXRn) Rf

CH2f(Rn) R

_n Z X (Rn)'

J

Wherein R represents an organic group having an alcoholic hydroxyl group or a phenolic hydroxyl group, Rn represents hydrogen or methyl 'Y represents a divalent organic group having no fluorine atom, and Rf represents a compound represented by the following formula (1) Fluorine group, Ar represents an aromatic ring, and X and z represent a hydrogen atom, an aromatic group, an alkyl group, an alkenyl group, or an ester group having no fluorine atom, which may be the same or different from each other, and p, q, r and s respectively The total number of each copolymerized unit, wherein _P, q, and s are 0 to 30, and the total of p and q is 1 or more, and r is 1 to 4 0]. In the fluorine-containing resin (A), it is necessary to contain a substituent of the formula (1) in a range of from 15 to 50% by mass. If it is less than 15% by mass, it is not possible to obtain sufficient ink-repelling effect after the alkali-developing photosensitive resin composition is hardened, and if it is desired to have sufficient ink-removing effect, it must be increased. (A) The amount of the component added may impair the alkali developability of the composition. The fluorine-containing resin (A) has a hydroxyl group as an essential component. By having a hydroxyl group, the compatibility with the alkali developing solution of the fluorine-containing resin (A) itself is slightly increased, and the residue on the developing substrate can be reduced. The method of introducing a hydroxyl group generally uses a (meth) acrylate derivative such as 2-hydroxyethyl methacrylate, 4-hydroxybutyl methacrylate or 6-hydroxybutyl methacrylate as a monomer, but Not limited to this method. Further, in the molecular chain of the fluorine-containing resin (A), a functional group capable of introducing a vinyl group may be optionally present, and for example, a hydroxyl group or a carboxyl group may be present. When the partition wall is formed by photolithography by introducing a vinyl group, it contributes to maintaining the ink repellency of the surface of the exposed portion after development, and it is particularly preferable to use a strong developing liquid. Specific means for introducing the acrylate or methacrylate compound having a bonding group such as an isocyanate group or an oxirane group with a hydroxyl group or a carboxyl group in the above fluorine-containing resin can be exemplified. For example, when an isocyanate group is used as a bonding group, it is less than the same equivalent amount as the hydroxyl group in the fluorine-containing resin (A) obtained in advance. The reason for this is that the remaining bond groups are detrimental to the possibility of preservation stability of the composition. When the oxirane group is used as a bonding group, the carboxyl group in the fluorine-containing resin (A) obtained in advance is reacted, so that the acid value of the fluorine-containing resin (A) is adjusted to 1 〇 to i 〇〇 mg. . Further, the non-fluorinated monomer can be adjusted by copolymerizing a general (meth) acrylate, a styrene derivative, a maleic acid ester or the like to adjust the fluororesin (A). The copolymerization with methacrylic acid is preferred from the viewpoint of compatibility with the alkali-developing resin and maintaining ink repellent property, and the alcohol residue of the side chain is benzyl-17-201140237, isobornyl, It is preferred that the adamantyl group is larger in volume. The proportion of the fluorine-containing resin in the fluorine-containing resin (A) is preferably 30% by mass or more. If the amount is less than 30% by mass, sufficient ink repellency cannot be exhibited, and the ink repellency of the black matrix may be lost during the formation of the black matrix and before the inkjet coating. Moreover, when it exceeds 8% by mass, the obtained copolymer is inferior in compatibility with the solvent used for the photoresist preparation or the components (B) and (C), and causes the gel to be produced. The weight average molecular weight of the fluororesin (A) component is in the range of from 2,000 to 20,000 in terms of polyethylene glycol equivalent weight average molecular weight (Mw) determined by a gel permeation chromatography (GPC) method. When the molecular weight is 2,000 or less, the ink-repelling action is lowered in the partition forming process, and the ink-repelling action is hard to continue. When the molecular weight (Mw) exceeds 20,000, the dissolution of the alkali developing solution is delayed, which is not preferable. In addition, the ratio of the fluorine-containing resin (A) to 100 parts by mass of the total solid content of the alkali-developing photosensitive resin composition of the solvent is 0.05 to 1 part by mass. When the proportion of the fluorine-containing resin (A) is less than 0.05 parts by mass, the ink repellency is insufficient, and if it exceeds 1 part by mass, the pattern of the alkali-developing photosensitive resin composition originally has an influence. Hey. Next, the components (B) to (E) used for the photosensitive resin composition (negative photoresist composition) containing the photosensitive component of the reaction of ultraviolet light (300 nm to 450 nm) will be described. (B) An example of an alkali-developing oligomer having an acidic group and two or more ethylenic double bonds in one molecule, and for example, two propylene-propylene groups derived from bisphenols An alkali-developing unsaturated group-containing oligomer obtained by reacting an ether epoxy compound with a (meth)acrylic acid-18 - 201140237 ester, and then reacting with a polybasic acid carboxylic acid or an anhydride thereof. Here, the epoxy compound having two epoxypropyl ethers derived from bisphenols is preferably an epoxy compound represented by the following formula (4). 【化9】

(4) [wherein, where 1^ and 112 are a hydrogen atom, an alkyl group having 1 to 5 carbon atoms or a halogen atom' may be the same or different from each other, and X represents -(:0-, -3 02-, -(:(€?3)2-, -Si(CH3)2-, _cH2_, _(:(〇:ίί3)2-, _〇-, 9,9-fluorenyl represented by the following formula, or Does not exist, η is an integer from 1 to 10]. [Chemical 1 0] c^o is a ring of two epoxidized propyl ethers derived from bisphenols - 19.40237 Oxygen compound, a reaction of a methyl methacrylate (which is an acrylic acid and/or a methacrylic acid), and a hydroxy compound obtained by reacting a polybasic acid carboxylic acid or an anhydride thereof to obtain a (meth)acrylic acid epoxy ester acid adduct Further, the (meth)acrylic epoxy ester acid addition product can be used as the alkali-developing unsaturated group-containing oligomer of the component (B) of the present invention. (B) The component has an ethylenic double The base-developing oligomer of the bond has an acidic group such as an ethylenically unsaturated double bond and a carboxyl group, a hydroxyl group, a sulfonic acid group or a phosphoric acid group, and thus, for example, when used as a filter partition wall, Excellent for photosensitive resin composition The light-curing property, the good image-forming property, and the patterning property are improved, and the physical properties of the light-shielding barrier are improved. (B) The alkali-developing oligomer having an ethylenic double bond is preferably composed of the above formula. (4) Derived from the epoxy compound represented by the epoxy compound. The epoxy compound is derived from a bisphenol. Therefore, by describing the bisphenol, an alkali-developing oligomer containing an unsaturated group can be understood. Preferred examples of the bisphenols are preferred. The bisphenols which provide a preferred alkali-developing unsaturated group-containing oligomer may be mentioned, for example, as described below. Phenyl) ketone, bis(4-hydroxy-3,5-dimethylphenyl) ketone, bis(4-hydroxy-3,5-dichlorophenyl) ketone, bis(4-hydroxyphenyl)anthracene, Bis(4-hydroxy-3,5-dimethylphenyl)anthracene bis(4-hydroxy-3,5-dichlorophenyl)anthracene, bis(4-hydroxyphenyl)hexafluoropropane, double (4 -hydroxy-3,5·dimethylphenyl)hexafluoropropane, bis(4-hydroxy-3,5-dichlorophenyl)hexafluoropropane, bis(4-hydroxyphenyl)dimethyl decane, bis ( 4-hydroxy-3, 5-dimethylphenyl)dioxane, bis(4-hydroxy-3,5 -dichlorophenyl)dimethyloxane, bis(4-hydroxyphenyl)methane, bis(4-hydroxy-3,5-dichlorophenyl)methyl-20- 201140237 alkane, bis(4-hydroxy-3, 5-dibromophenyl)methane, 2,2-bis(4-hydroxyphenyl)propane, 2,2-bis(4-hydroxy-3,5-dimethylphenyl)propane, 2,2-double (4-hydroxy-3,5-dichlorophenyl)propane, 2,2-bis(4-hydroxy-3-methylphenyl)propane, 2,2-bis(4-hydroxy-3-chlorophenyl) a compound such as propane, bis(4-hydroxyphenyl)ether, bis(4-hydroxy-3,5-dimethylphenyl)ether or bis(4-hydroxy-3,5-dichlorophenyl)ether Or X in the formula (4) is 9,9-bis(4-hydroxyphenyl)anthracene, 9,9-bis(4-hydroxy-3-methylphenyl) of the 9,9-fluorenyl group described above. Indole, 9,9-bis(4-hydroxy-3-chlorophenyl)indole, 9,9-bis(4-hydroxy-3-bromophenyl)anthracene, 9,9-bis(4-hydroxy-3- Fluorophenyl)fluorene, 9,9-bis(4-hydroxy-3-methoxyphenyl)anthracene, 9,9-bis(4-hydroxy-3,5-dimethylphenyl)anthracene, 9, 9-bis(4-hydroxy-3,5.dichlorophenyl)anthracene, 9,9-bis(4-hydroxy-3,5-dibromophenyl)fusone, and 4,4'-biphenol, A compound such as 3,3'-biphenol. An alkali-developing oligomer having an ethylenic double bond of the component (B), which can be obtained from an epoxy compound derived from the above-mentioned bisphenols, except for the related epoxy compound, as long as it is deliberately contained in the phenolic aldehyde A compound having two epoxypropyl ethers such as a varnish-type epoxy compound or a cresol-type epoxy compound can be used. Further, when the bisphenol-based epoxy propyl group is etherified, the oligo unit is mixed, and if η in the formula (4) is in the range of 0 to 10, preferably 0 to 2, This can cause problems in the performance of the resin composition. Further, a polybasic acid carboxylic acid or an anhydride thereof which can react with a hydroxyl group in a (meth)acrylic acid epoxy ester molecule obtained by reacting such an epoxy compound with (meth)acrylic acid, for example, maleic acid or amber Acid, itaconic acid, phthalic acid, tetrahydrofurfuric acid, hexahydrofurfuric acid, methyl endomethylenetetrahydrofurfuric acid, chlorobridge acid, methyltetrahydrofurfuric acid, trimellitic acid, pyromellite An acid or the like or an acid anhydride thereof, -21 - 201140237, an aromatic polycarboxylic acid such as diphenyl ketone tetracarboxylic acid, biphenyltetracarboxylic acid or diphenyl ether tetracarboxylic acid or an acid dianhydride thereof. Regarding the ratio of use of the acid anhydride to the acid dianhydride, the ratio of the visible pattern and the alkali development operation is suitable for forming a fine pattern. The alkali-developing oligomer ′ having an ethylenic double bond as the component (B) may be used alone or in combination of two or more. Further, the reaction of the epoxy compound with (meth)acrylic acid, the reaction of the (meth)acrylic acid epoxy ester obtained by the reaction with the polybasic acid or the anhydride thereof may be carried out by a method known in the above Patent Document 6 or the like, but no Specially limited. Further, in another method for producing the component (B), an ethylenically unsaturated monomer having 1 or more carboxyl groups may be contained, and 2) a hydroxyl group having an unsaturated group introduced into the side chain after polymerization may be contained. An ethylenically unsaturated monomer such as an acid anhydride group or an epoxy propyl group, and 3) a monomer of another ethylenically unsaturated monomer, which is a solvent in a solvent in which a peroxide and a chain transfer agent coexist. After the copolymer is obtained by polymerization, an unsaturated compound is added to a functional group which can be added to the side chain of the above 2) to form a binder resin, whereby an alkali-developing oligomer having an ethylenic double bond can also be obtained. The ethylenically unsaturated monomer having one or more carboxyl groups may be used as the monomer mixture, and examples thereof include acrylic acid, methacrylic acid, crotonic acid, α-chloroacrylic acid, 2-ethylacrylic acid, and cinnamic acid. Saturated monocarboxylic acids; unsaturated dicarboxylic acids (anhydrides) such as maleic acid, maleic anhydride, fumaric acid, itaconic acid, itaconic anhydride, citraconic acid, citraconic anhydride, methyl fumaric acid : an unsaturated polycarboxylic acid (anhydride) having a valence of three or more. Among them, acrylic acid and methacrylic acid are preferred. These carboxyl group-containing ethylenically unsaturated monomers may be used singly or in combination of two or more kinds as -22 to 201140237. Another component of the monomer mixture, 3) other ethylenically unsaturated monomer, may, for example, be an aromatic vinyl such as styrene, α-methylstyrene, vinyltoluene, chlorostyrene or methoxystyrene. Base compound; methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, propyl acrylate, propyl methacrylate, butyl acrylate, butyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, benzyl acrylate, benzyl methacrylate, lauryl methacrylate, tetradecyl methacrylate, hexadecyl methacrylate, stearyl methacrylate, methacrylic acid Unsaturated carboxylic acid esters such as octadecyl ester, behenyl methacrylate and octadecyl methacrylate; aminoethyl acrylate, aminoethyl methacrylate, aminopropyl acrylate, methacrylic acid amine Alkyl alkyl esters of unsaturated carboxylic acids such as propyl acrylate; unsaturated carboxylic acid glycidyl esters such as glycidyl acrylate and glycidyl methacrylate; vinyl acetate, vinyl propionate, butyric acid Vinyl ester, benzoic acid Vinyl carboxylates such as olefin esters; unsaturated ethers such as vinyl methyl ether, vinyl ethyl ether, propylene propylene propylene ether, methacryl epoxidized propyl ether; acrylonitrile, methacrylonitrile, α-chloride A vinyl cyanide compound such as acrylonitrile or vinyl cyanide; acrylamide, methacrylamide, α-chloropropenylamine, hydrazine-hydroxyethyl acrylamide, hydrazine-hydroxyethyl methacrylamide, An unsaturated decylamine such as maleic amine or an unsaturated sulfoxide; an aliphatic conjugated diene such as butadiene, isoprene or chloroprene; Among them, preferred are methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, benzyl acrylate, benzyl methacrylate. . These other unsaturated monomers -23- 201140237 may be used alone or in combination of two or more. Further, the acid value of the component (B) is K0H necessary for neutralizing the carboxyl group in the resin lg. The number of mg is expressed by the viewpoint of the development processing time, the pattern shape, and the adhesion of the cured film when the image pattern is formed, and is preferably 50 to 150 (KOH mg/g). If it is less than 50, it is impossible to form a pattern by an alkali developing solution, and when a crosslinking agent is used, 'cross-linking with an epoxy resin as a crosslinking agent may be insufficient', and heat resistance may be lowered, and an organic solvent may be produced. Poor adhesion and so on. When the acid value exceeds 1,500, the surface roughness during alkali development, the poor image adhesion of the fine line pattern, and the moisture resistance of the cured film may become a problem. (C) The photopolymerizable monomer having at least three or more ethylenic double bonds in one molecule, and examples thereof include trimethylolpropane tri(meth)acrylate and trishydroxymethylethane tris( Methyl) acrylate, neopentyl alcohol tri(meth) acrylate, neopentyl alcohol tetra (meth) acrylate, dipentaerythritol tetra (meth) acrylate, dipentaerythritol hexa A (meth) acrylate such as a methyl acrylate may be used alone or in combination of two or more. In the alkali-developing photosensitive resin composition of the present invention, a photopolymerizable compound such as the component (B) or the component (C) is contained, and a photopolymerization initiator containing the component (D) is used for photohardening. It is better. The component (D) is generated by ultraviolet light irradiation, particularly ultraviolet irradiation of 300 to 450 nm, and is added to a photopolymerizable compound to initiate radical polymerization to harden the resin composition. The photopolymerization initiator of the component (D) may, for example, be diphenyl ketone, miche-24 - 201140237 ketone, N, N'-tetramethyl-4,4,-diaminodiphenyl ketone, 4-methoxy-4'-dimethylaminodiphenyl ketone, 4,4'-diethylaminodiphenyl ketone, 2-ethyl fluorene, phenanthrene and other aromatic ketones, benzoin methyl ether Benzoin, benzoin ether, benzoin, ethyl benzoin and other benzoin, 2-(o-chlorophenyl)-4,5-phenylimidazole 2, 2-(o-chlorophenyl) -4,5-bis(m-methoxyphenyl)imidazole 2 polymer, 2-(o-fluorophenyl)-4,5-diphenylimidazole 2 polymer, 2-(o-methoxyphenyl) _4,5-diphenylimidazole 2 polymer, 2,4,5-triarylimidazole 2 polymer, 2-benzyl-2-dimethylamino-1-(4-carboline phenyl)-butyl Ketone, 2-trichloromethyl-5-styryl-1,3,4-oxadiazole, 2-trichloromethyl-5-(p-cyanostyryl)-l,3,4-indole Halogenomethylthiazole compound such as oxadiazole or 2-trichloromethyl-5-(p-methoxystyryl)-1,3,4-oxadiazole, 2.4.6-tris(trichloromethyl)- i,3,5-triazine, 2-methyl-4,6-bis(trichloromethyl)-1,3,5-triazine, 2 -phenyl-4,6-bis(trichloromethyl)-1,3,5-triazine, 2-(4-chlorophenyl)-4,6-bis(trichloromethyl)-1,3 ,5-triazine, 2-(4-methoxyphenyl)-4.6-bis(trichloromethyl)-l,3,5-triazine, 2-(4-methoxynaphthyl)·4 ,6-bis(trichloro-R-methyl)-1,3,5-triazine, 2-(4-methoxystyryl)-4,6-bis(dichloromethyl)-1,3, 5-trimium, 2-(3,4,5-dimethoxyphenylethyl)-4,6-bis(trichloromethyl)-1,3,5-triazine, 2-(4-methyl Halomethyl-S-triazine compounds, 2,2-dimethoxy-1, such as thiophenylstyrene)-4,6-bis(trichloromethyl)-1,3,5-triazine ,2-diphenylethan-1-one, 2-methyl-1-[4·(methylthio)phenyl]-2-morpholinepropane, 2-benzyl·2-dimethylamino Phenolic phenyl]-butane-1,1-hydroxy-cyclohexyl-phenyl ketone, and the like. These photopolymerization initiators may be used singly or in combination of two or more. Further, it may be added such that it does not function as a photopolymerization initiator or a sensitizing agent -25-201140237, and by using it in combination with the above-mentioned compound, it is possible to increase the photopolymerization initiator or the sensitizer. Compound. When such a compound is used in combination with diphenyl ketone, the use amount of a photopolymerization initiator such as a tertiary amine (D) component such as an effective triethanolamine can be used, with (A), (B) and ( C) When the total amount of each component is 1 part by mass, it is preferably 5 to 40 parts by mass. When the compounding ratio of the component (0) is less than 5 parts by mass, the speed of photopolymerization becomes slow and the sensitivity is lowered. On the other hand, when it exceeds 40 parts by mass, the sensitivity is too strong, and the pattern line width is relative to the pattern mask. It becomes a thickened state, and the line width with respect to the reticle cannot be faithfully presented. Moreover, the edge of the pattern has a problem of being jagged and unable to form a sharp edge. By adding a pigment or the like to the alkali-developing photosensitive resin composition containing the above components (A) to (D), it is possible to form a photosensitive resin composition for partition wall formation for a display element. In particular, when it is a partition for a filter, it is preferable to use a light-shielding dispersion (E component) for the purpose of shielding the TFT element. The black organic pigment, the mixed color organic pigment, and the light-shielding material contained in the light-shielding dispersion of the component (E) are preferably excellent in heat resistance, light resistance, and solvent resistance. Here, examples of the black organic pigment include perylene black, cyanine black, and the like. The mixed color organic pigment may be, for example, a mixture of at least two kinds of pigments selected from the group consisting of red, blue, green, purple, yellow, cyanine, and magenta. The light-shielding material may, for example, be carbon black, chromium oxide, iron oxide, titanium black, aniline black or cyanine black, or may be appropriately selected from two or more types, and may have light-shielding property, surface smoothness, dispersion stability, and resin. The viewpoint of good compatibility is particularly preferable to carbon black. A light-shielding dispersion liquid can be prepared by dispersing one or more of the pigments or light-shielding materials, -26 to 201140237, as needed, together with a dispersing agent or a dispersing aid in an organic solvent. With respect to the blending ratio of the component (E), the ratio of the pigment or the light-shielding material contained in the component (E) is preferably 100 parts by mass to 60 parts by mass based on 100 parts by mass of the total solid content of the photosensitive resin composition. If it is less than 25 parts by mass, the light shielding property will be insufficient. When the amount is more than 60 parts by mass, the content of the photosensitive resin which is the original pattern is reduced, which causes a problem that the development characteristics are impaired and the film forming ability is impaired. In the photosensitive resin composition for forming a partition wall of the display device of the present invention, other solvents may be used in addition to the solvents contained in the components (A) to (D). The other solvent used herein may, for example, be an alcohol such as methanol 'ethanol, n-propanol, isopropanol or ethylene glycol 'propylene glycol, or an anthracene such as /3-terpineol, acetone, methyl ethyl ketone or cyclohexanone. , ketones such as Ν-methyl-2-pyrrolidone, aromatic hydrocarbons such as toluene, xylene, tetramethylbenzene, celecoxime, methyl cyanidin, ethyl cyanidin, carbitol, methyl Carbitol, ethyl carbitol, butyl carbitol, propylene glycol monomethyl ether, propylene glycol monoethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether Ethylene glycol ethers, ethyl acetate, butyl acetate, ceramide acetate, acesulfame acetate, butyl acesulfame acetate, carbitol acetate, carbitol acetate, butyl carbitol acetic acid Acetate such as ester, propylene glycol monomethyl ether acetate or propylene glycol monoethyl ether acetate can be used as a homogeneous solution by dissolving and mixing. Further, in the photosensitive resin composition for forming a partition wall of the display device of the present invention, a curing accelerator, a thermal polymerization inhibiting agent, a plasticizer -27-201140237, a filler, a leveling agent, an antifoaming agent, and the like may be added as needed. . The thermal polymerization inhibiting agent may, for example, be hydroquinone, hydroquinone monomethyl ether, gallic phenol, tertiary butyl catechol, phenothiazine or the like, and a plasticizer, for example, dibutyl phthalate or citric acid Examples of the octyl ester, the trimethylbenzene, and the like include a glass fiber, a cerium oxide, a mica, an alumina, and the like, and an antifoaming agent or a leveling agent, for example, a polyfluorene type, a fluorine type, or an acrylic type. Compound. In particular, when adding a material having an interfacial activity such as a leveling agent or an antifoaming agent used for improving the surface property, it is necessary to add it so as not to impair the surface ink repellency after hardening, and preferably It is added in a smaller amount than the ink-repellent agent with respect to the concentration of the total solid content in the composition. In the photosensitive resin composition for forming a partition wall for a display element of the present invention, the components (A) to (E) or the solvent and the solvent are contained as a main component. In the case where the solid component of the solvent is removed (the monomer having a solid component after curing), the total amount of the components (A) to (E) is preferably 70% by mass or more, more preferably 80% by mass, and further More preferably, it is 90% by mass or more. The amount of the solvent varies depending on the viscosity of the target depending on the coating method, and is preferably in the range of 30 to 90% by mass. In order to form the partition wall for a display element or the filter partition of the present invention, the above-described alkali-developing photosensitive resin composition of the present invention is formed by photolithography. The manufacturing process may be, for example, a method in which a photosensitive resin composition is applied as a solution onto a surface of a substrate, and then the solvent is dried (prebaked), and then the film thus obtained is covered with a mask to irradiate ultraviolet rays. The exposed portion is cured, and the unexposed portion is eluted by using an aqueous alkali solution to develop a pattern, and then post-baking is performed as post-drying. -28- 201140237 A substrate coated with a solution of a photosensitive resin composition, which can be used for vapor deposition or sputtering on glass, transparent films (for example, 'polycarbonate, polyethylene terephthalate, polyether oxime, etc.) Plating ITO, gold and other transparent electrodes. The method of applying the solution of the photosensitive resin composition to the substrate can be carried out by any known method such as a solution dipping method, a spray method, or a roll coater, a pad coater or a rotary machine. By applying these methods to a desired thickness, the solvent is removed (prebaking) to form a film. The prebaking can be carried out by heating in an oven, a hot plate or the like. The heating temperature and the heating time in the prebaking are appropriately selected depending on the solvent to be used, for example, exposure at a temperature of 60 to 120 ° C for 1 to 1 minute after the β prebaking is performed. The exposure machine performs, by exposing through the reticle, only the photoresist photosensitive exposure device corresponding to the pattern portion and the exposure conditions thereof are appropriately selected, and an ultrahigh pressure mercury lamp, a high pressure mercury lamp, a metal halide lamp, A light source such as a far-ultraviolet lamp is exposed to light to cure the photosensitive resin composition. The alkali image after exposure is carried out for the purpose of removing the photoresist of the unexposed portion, and the desired pattern is formed by the development. The developing solution suitable for the alkali development may, for example, be an aqueous solution of a carbonate of an alkali metal or an alkaline earth metal, an aqueous solution of a hydroxide of an alkali metal, or the like, and in particular, a sodium carbonate or potassium carbonate containing carbonic acid is used. A weakly alkaline aqueous solution of 0.05 to 3% by mass of a carbonate such as lithium is preferably formed at a temperature of 20 to 30 ° C, and a fine image can be precisely formed using a commercially available image forming machine or an ultrasonic cleaning machine. . After the development as described above, heat treatment (post-baking) was carried out at a temperature of 1600 to 250 ° C and a temperature of 20 to 100 minutes. This post-baking is carried out for the purpose of improving the adhesion between the light-shielding film and the substrate after the drawing of -29 - 201140237. The same as the prebaking, it can be carried out by heating in an oven, a hot plate or the like. The light-shielding film (partition wall) after the patterning of the present invention is formed by the above-described photolithography method. Further, the photosensitive resin composition for forming a partition wall of the present invention can be obtained by, for example, forming a light-shielding filter partition wall by the above-described method or the like, and setting a pixel by various means to form a predetermined color pattern. Device. In particular, the filter partition formed by using the photosensitive resin composition of the present invention is excellent in adhesion to the substrate and excellent in ink repellency, and therefore it is preferred to spray it in the obtained partition wall of the light-shielding filter. In the ink printing method, a pixel is formed to obtain a filter. [Embodiment] Hereinafter, embodiments of the present invention will be specifically described based on examples and comparative examples. Moreover, the invention is not limited to the embodiments. &lt;Synthesis Examples A-1 to A-6, Comparative Synthesis Examples a1, a-2&gt; A reactor having a volume of 1 liter in an internal volume of a stirrer, and a monomer, a polymerization initiator, and a chain shown in Table 1 were attached. The transfer agent was further added to propylene glycol monomethyl acetate (PGMEA) so that the solid content concentration was 40% by mass, and the mixture was polymerized at 90 ° C for 14 hours while stirring under a nitrogen atmosphere. After the temperature was lowered, the solid content concentration was 20% by mass by PGMEA, and a solution of the fluorine-containing resins A-1 to A-6, a-Ι, and a_2 was obtained. The weight average molecular weight was determined by GPC using tetrahydrofuran as a developing solvent (in terms of polyethylene glycol). Further, the unit of the number described in the column of each component shown in Table 1-30-201140237 is "g". Further, the weight (%) of the fluorine-containing group is determined by calculating the theoretical weight of the fluorine atom contained in one molecule from the average molecular weight in terms of the mounting ratio. Furthermore, the abbreviations in Table 1 are as follows. CF9BuMA : CH2 = C(CH3)COOCH2CH2CH2CH2OC9F17 CF9PEMA : CH2 = C(CH3)COOCH2CH2OCOC6H4OC9F17 2-HEMA: 2-hydroxybutyl methacrylate 4-HEMA: 4-hydroxybutyl methacrylate MMA: methyl methacrylate IBMA : isobornyl methacrylate 4-HBAGE: 4-hydroxybutyl acrylate propylene glycol AIBN: azo-isobutyl LM: lauryl mercaptan [Table 1] A-1 A-2 A-3 A-4 A-5 A-6 a-1 a-2 Monomer CF9BuMA 60 60 CF9PEMA 60 60 60 60 85 2-HEMA 30 4-HBMA 30 30 30 15 15 25 10 MMA 10 10 10 10 IBMA 10 10 35 5 4- HBAGE 15 15 15 Polymeric gambling agent and chain transfer agent AIBN 0.91 0.83 0.8 0.67 0.62 0.76 0.89 0.43 LM 2.18 1.98 1.92 1.59 1.5 1.82 2.12 1.04 Weight average molecular weight 8800 8200 7600 8000 7400 8100 6900 (cannot be measured) Solubility (20 ° C) 〇〇〇〇0. 〇〇X fluorinated base weight (%) 42.7 42.8 37 37.2 37.2 37.1 15.4 53.1 &lt;Synthesis Example A-ls~A-6s, Comparative Synthesis Example a-ls, a-2s&gt; (Double Bond -31 - 201140237 Fluorine-containing fluorine prepared for the above "Synthesis Examples A1 to A-6, Comparative Synthesis Examples a1, a_2" Fat (A), respectively, for 100 g of a 20% by mass PGMEA solution, 2-propenylmethoxyethyl isocyanate (Mw = 141.12) so that the hydroxyl group in the isocyanate group / fluorine-containing resin (A) = 0.5 mol / mol The mixture was added, and further, 1,4-diazabicyclo[2,2,2]octane〇.3g was mixed, stirred at 50 ° C for 12 hours, and cooled to room temperature. The obtained polymer solutions A-l s~A-6s, a-ls, and a-3s were confirmed by IR to disappear from NCO absorption (273001^1). &lt;Examples 1 to 14 and Comparative Examples 1 to 2 &gt; First, the components (B) to (F) of the fluorine-containing resin (A) and YX-4000H (manufactured by Showa Co-halogen; tetramethyldiphenyl) were removed. The base epoxy resin was mixed in the ratio (parts by weight) shown in Table 2 and Table 3, and propylene glycol monomethyl ether acetate was added so that the solid content concentration was 20% by mass. Next, the component (A) solution was added in parts by weight as shown in Tables 2 and 3. Subsequently, it was filtered under pressure with 0.2 kg/crn 2 using a 2 μηι polypropylene membrane filter to prepare an alkali-developing photosensitive resin composition. In Tables 2 and 3, in the component (B), the blending ratio with respect to the total solid fraction is expressed by mass%. Further, the compounding ratio of the component (E) is shown in the column for the total solid content (pigment/total solid content). Furthermore, the abbreviations in Tables 2 and 3 are as follows. (B)-l: a propylene glycol monomethyl ether acetate solution of an acid anhydride polycondensate of an oxime skeleton (resin solid concentration = 56.1% by weight, manufactured by Nippon Steel Chemical Co., Ltd., trade name V25 9ME) B)-2: propylene glycol monomethyl ether of weight average molecular weight 30,000, acid value l〇〇(KOHmg/g) -32- 201140237 of N-ethylmaleamide/methacrylic acid/benzyl methacrylate copolymer Acetate solution (resin solid concentration = 36.7 wt%) (N-ethyl maleamide: methacrylic acid: benzyl methacrylate = 29: 2 0 : 5 1 m ο 1 %) (C) -l : a mixture of dipentaerythritol hexaacrylate and dipentaerythritol pentaacrylate (manufactured by Nippon Kayaku Co., Ltd., trade name DPHA) (D) -l : IRGACURE OXE-02 (Ciba Special Chemicals Co., Ltd. (D)-2 : IRGACURE OXE-01 (manufactured by Ciba Specialty Chemicals Co., Ltd.) (Ε)·1: propylene glycol monomethyl ether acetate having a carbon black concentration of 20% by weight and a polymer dispersant concentration of 5% by weight Dispersion (solid content 25%) (F)-l : decane coupling agent S-510 (made by Gisson (stock)) [Table 2] Real® Example 1 2 3 4 5 6 7 8 9 10 A composition (2〇 % solution) Ingredient name A-1 Α·1 s A-2s A-2s A-3s A-3s A-4s A-5s A-6s A-6s Addition 0.25 0.25 0.25 0.15 0.25 0.15 0.25 0.25 0.25 0.15 8 component B-1 (56.5%) 11.8 11.8 11.8 11.8 11.8 11.8 11.8 11.8 11.8 11.8 B-2 (36.7%) 4.2 4.2 4.2 4.2 4.2 4.2 4.2 4.2 4.2 4.2 c component C-1 2.1 2.1 2.1 2.1 2.1 2.1 2.1 2.1 2.1 D component D-1 1.26 1.26 1.26 1.26 1.26 1.26 1.26 1.26 1.26 1.26 D -2 E component E-1 33 33 33 33 33 33 33 33 33 33 F component F-1 0.23 0.23 0.23 0.23 0.23 〇23 〇23 0,23 0.23 0.23 5^._ YX-4000H Total solid fraction (%) 33 33 33 33 33 33 33 33 33 33 〇〇〇〇ο Ο Ο ο ο 〇 Visualization 0 〇〇〇ο Ο Ο ο ο 〇 Surface roughness 0 〇〇〇0 Ο Ο ο ο 0合性 0 0 ο 0 ο ο 〇ο ο 0 〇 〇 ο ο ο ο 〇 ο 0 2.3 2.3 2.3 2.3 2.3 2.3 2.3 2.3 2.3 2.3 〇〇〇〇ο 〇〇ο ο 0 Ink 展开ο 〇〇ο ο 0 Depicting condition 2 ---- Ink residual 〇ο ο ο ο ο ο ο ο 0 Leaking 0 ο ο ο 〇ο ο ο ο 0 -33- 201140237 [Table 3] Comparison Example» _ 1 2 11 12 13 14 A component (20% solution) Ingredient name A-3s a-1s Α-1 s A-3s A-5s Α-5 Add a 2 2 0.25 0.25 0.25 0.25 B component B- 1 (56.5%) 11,8 11.8 23.6 23.6 23.6 23.6 B-2 (36.7%) 4.2 4.2 C component C-1 2.1 2.1 5,71 5.71 5.71 5.71 D component D-1 1.26 1.26 D-2 0.6 0.6 0.6 0.6 E Component E-1 33 33 F component F-1 0.23 0.23 0.2 0.2 0.2 0.2 Other YX-4000H 1 1 1 1 Pigment/Total solids (%) 33 33 Coating foreign matter X 〇〇〇〇〇 Imaging X 〇ο 〇〇〇 Surface roughness 〇ο 〇〇〇〇 pattern adhesion 〇ο 〇〇ο 〇 PCT adhesion 〇〇0 〇ο 0 OD/ β m 2.3 2,3 - - - - Contact angle [. ], BCA 〇X 〇〇〇〇IJ characteristic drawing condition 1 Ink spreadability X 0 〇ο ο ο Drawing condition 2 Ink residual X ο ο ο ο ο 漏 〇 X ο 〇 ο ο The results of the above examples and comparative examples The alkali-developing photosensitive resin composition was applied onto a glass substrate of 125 mm x 25 mm so that the film thickness after post-baking was 2.1 μm, and dried at 80 ° C for 1 minute using a spin coater. Thereafter, the exposure gap was adjusted to 150 μm, and the negative film was covered on the dried film, and an ultraviolet ray of 100 mJ/cm 2 was irradiated with an ultrahigh pressure mercury lamp having an I illuminance of 30 mW/cm 2 to carry out a photohardening reaction of the photosensitive portion. The reticle used is a substrate in which an opening of 50 μπι line + 3 50 μm in the X direction and a line of 20 μπι line + 180 μπι in the y direction are formed. Next, the exposed coated plate was subjected to a shower of 1 kgf/cm 2 pressure and a spray water of 5 kgf/cm 2 pressure in a 0.05% aqueous sodium hydroxide solution at 23 ° C for 60 seconds or 80 seconds. - 201140237 Washing to remove the unexposed portions of the coating film to form a pixel pattern on the glass substrate, followed by hot post-baking at 230 ° C for 30 minutes using a hot air dryer. The evaluation items and methods in the examples and comparative examples are as follows, and the evaluation results of the respective items are shown in Tables 2 and 3. Film thickness: Measurement was carried out using a stylus type film thickness meter (manufactured by Tokyo Seimitsu Co., Ltd., trade name: Safir). Coating foreign matter: When the film was observed after spin coating, the radial streaks were observed as x &lt;bad &gt; and when not observed, it was 〇 &lt;good&gt;. Imaging property: The pixel pattern after image observation was observed by a microscope, and it was not confirmed that the peeling of the substrate or the jaggedness of the edge portion of the pattern was evaluated as 〇 &lt;good&gt;, and it was confirmed that X was judged as "bad". The surface roughness of the coating film: after the development and the surface roughness (Ra) of the coating film after the thermal firing, the evaluation was 〇 &lt;good&gt; after less than 150 A, and X <bad> was evaluated at 150 A or more. Pattern adhesion: The peeling test did not confirm that the peel of the 20 μm pattern was evaluated as 〇 &lt;good&gt;, and the confirmed person was evaluated as &lt;bad&gt;. PCT Adhesiveness: The pattern is formed after the baking is completed, and the pct (pressure digester) test is carried out at 12 1 ° C, 100% RH, 2 atm, and 24 times, and then in the 20 μιη pattern portion. A peeling test was performed by attaching a transparent tape to evaluate the pattern adhesion. OD measurement: When a black pigment was mixed as a (Ε) component, a coating film of 2 · 1 μm after baking was measured using a 〇d meter manufactured by Otsuka Electronics Co., Ltd., and an OD 每 per 1 μm was described. Contact angle measurement: A four-neck pattern of 10 nmim x 10 mm x 2.1 pm was formed on the glass -35-201140237 substrate by the same method as above. The static contact angle on the coating film was measured using butyl carbitol acetate (BCA). When the static contact angle was 40 or more, it was evaluated as 〇 &lt;good &gt;, and when it was less than 40, it was evaluated as x &lt; bad &gt; IJ (inkjet) ink coating characteristics: Into the thus obtained substrate, a filter having a viscosity of 10 mPa·sec and a solid concentration of 20% was sprayed with green ink in the following manner using an inkjet head manufactured by Toshiba Corporation. After drying at 80 ° C for 1 minute, post-baking was carried out at 23 ° C, and the coating state was observed under an optical microscope. Drawing condition 1: On the center of the 350 χ 180 μm pixel glass, 42 pl of green ink was dropped. At this time, the liquid spreadability on the glass surface which is the same as that of the comparative example in which no ink-repellent was added was evaluated as 〇. Condition 2: The green ink was dropped into the matrix after the post-baking average film was 1.8 μm, and after the post-baking, the presence or absence of light leakage near the substrate was observed, or the ink remained on the substrate. Mark of. From the above results, any of the examples satisfies the characteristics as the filter partition, and the static contact angle is also 40° or more in butyl carbitol acetate (BCA). On the other hand, after the development of Comparative Example 1, the residue was observed on the substrate, and the problem of the ink spreadability at the time of coating was observed. In Comparative Example 2, the contact angle was not sufficiently obtained, and the U-coating was observed by the partition wall. The phenomenon of ink leakage. -36-

Claims (1)

201140237 VII. Patent application scope: 1. An alkali-developing photosensitive resin composition containing a fluorine-containing resin (A) as an ink-repellent agent and a base which reacts with ultraviolet light having a wavelength of 300 to 45 nm. The photosensitive component to be developed is characterized in that the fluorine-containing resin (A) is a random or block copolymer represented by the following formula (2), and the average molecular weight Mw is in the range of 2,000 to 20,000, as opposed to The proportion of the fluororesin (A) in which 100 parts by mass of the total of the solvent is removed is 0.05 to 1 part by mass; [Chemical 1] CH2C(Rn) ? &lt; i 0 CH2C(Rn) Rf r , CH2Q(Rn) (R r , m C(Rn)· ZX [wherein R represents an organic group having an alcoholic hydroxyl group or a phenolic hydroxyl group, Rn represents hydrogen or a methyl group, and Y represents a divalent organic group having no fluorine atom, Rf represents a fluorine-containing group represented by the following formula (1), Ar represents an aromatic ring, and X and Z represent a hydrogen atom, an aromatic group, an alkyl group, an alkenyl group or an ester group having no fluorine atom; The same or different, P, q, r and s are the total number of each copolymerized unit, wherein p, q and s are 〇~30, and the total of P and q is 1 or more. r is a number of 1 to 40; and the ratio of the fluorine-containing group of the formula (1) -37 to 201140237 contained in the copolymer of the formula (2) is 15 to 50% by mass in terms of mass, [Chemical 2] (CF3) 2CF C=C (cf3) 2 cf. The alkali-developing photosensitive resin composition according to the first aspect of the invention, wherein the fluorine-containing resin (A) or (B) has an acidic group and two or more in one molecule. An alkali-developing oligomer of an ethylenic double bond, (C) a photopolymerizable monomer having three or more ethylenic double bonds in one molecule, and (D) a photopolymerization initiator. 3. The alkali-developing photosensitive resin composition according to the second aspect of the invention, wherein the component (B) has two phenols derived from the following formula (4). An alkali-developing unsaturated group-containing oligomer obtained by reacting an epoxy compound of a epoxidized propyl ether with a (meth) acrylate and reacting with a polybasic acid carboxylic acid or an anhydride thereof; -38- 201140237 【化3】 [wherein 'Rl and Han 2 are a hydrogen atom, an alkyl group having a carbon number of 1 to 5 or a halogen atom' may be phased or different, and X represents -CO-, -so2-, -c(cf3)2- , -Si(CH3)2-, _ch2_, c(CH3)2_, _〇_, 9,9-fluorenyl represented by the following formula, or absent, n is an integer from 1 to 10], [Chemical 4 】 4. A light-shielding alkali-developing photosensitive resin composition characterized by being added to the alkali-developing photosensitive resin composition according to any one of claims 1 to 3 of the patent application. a light-shielding dispersion of at least 1% of the group consisting of (E) a black organic pigment, a mixed color organic pigment, and a light-shielding material, and a mass of 2 5 to 60 with respect to the total solid content of 100 parts by mass The proportion of the portion is matched with the component (E). 5. The photosensitive resin composition of claim 4, wherein the display element is formed by a partition wall of -39-201140237. 6. The photosensitive resin composition of claim 5, which is formed by a color filter partition. A partition wall for a display element, which is coated on a substrate with a photosensitive resin composition as disclosed in claim 5 or 6, and after drying, must be exposed by (a) an ultraviolet exposure device, (b) a partition wall obtained by performing an aqueous alkali solution and (c) each step of thermal firing, characterized in that the film thickness is 1 · 5 〜 3 μπι 〇 8. - a display element, the characteristics of which are as applied In the partition of item 7 of the patent range, pixels are formed by inkjet printing. 201140237 IV. Designated representative map: (1) The representative representative of the case is: None (2) The symbol of the representative figure is simple: No 201140237 5. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: None