TWI816984B - 加工方法 - Google Patents
加工方法 Download PDFInfo
- Publication number
- TWI816984B TWI816984B TW109105440A TW109105440A TWI816984B TW I816984 B TWI816984 B TW I816984B TW 109105440 A TW109105440 A TW 109105440A TW 109105440 A TW109105440 A TW 109105440A TW I816984 B TWI816984 B TW I816984B
- Authority
- TW
- Taiwan
- Prior art keywords
- processing
- workpiece
- holding table
- injection nozzle
- planned
- Prior art date
Links
- 238000003672 processing method Methods 0.000 title claims abstract description 24
- 238000012545 processing Methods 0.000 claims abstract description 256
- 238000002347 injection Methods 0.000 claims abstract description 121
- 239000007924 injection Substances 0.000 claims abstract description 121
- 238000003754 machining Methods 0.000 claims abstract description 77
- 239000012530 fluid Substances 0.000 claims abstract description 75
- 238000000034 method Methods 0.000 claims abstract description 20
- 239000007921 spray Substances 0.000 claims abstract description 17
- 230000002093 peripheral effect Effects 0.000 claims description 14
- 238000005507 spraying Methods 0.000 abstract description 2
- 239000000243 solution Substances 0.000 abstract 1
- 238000005520 cutting process Methods 0.000 description 38
- 239000002313 adhesive film Substances 0.000 description 25
- 239000002184 metal Substances 0.000 description 16
- 239000000758 substrate Substances 0.000 description 13
- 239000011347 resin Substances 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 235000012431 wafers Nutrition 0.000 description 10
- 239000007788 liquid Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000003384 imaging method Methods 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 2
- 239000003595 mist Substances 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0683—Accessories therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019031611A JP2020131406A (ja) | 2019-02-25 | 2019-02-25 | 加工方法 |
| JP2019-031611 | 2019-02-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202032653A TW202032653A (zh) | 2020-09-01 |
| TWI816984B true TWI816984B (zh) | 2023-10-01 |
Family
ID=72201101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW109105440A TWI816984B (zh) | 2019-02-25 | 2020-02-20 | 加工方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2020131406A (ja) |
| KR (1) | KR102631487B1 (ja) |
| CN (1) | CN111613528A (ja) |
| TW (1) | TWI816984B (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115532706B (zh) * | 2022-11-30 | 2023-03-28 | 济南弘正科技有限公司 | 一种摩托车离合器零件脱油清洗设备及使用方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005169515A (ja) * | 2003-12-08 | 2005-06-30 | Disco Abrasive Syst Ltd | 切断方法 |
| JP2018186133A (ja) * | 2017-04-24 | 2018-11-22 | 株式会社ディスコ | ウォータージェット加工装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05345294A (ja) * | 1992-06-12 | 1993-12-27 | Ebara Corp | 連続切断装置 |
| JP2012024885A (ja) * | 2010-07-23 | 2012-02-09 | Disco Corp | バイト工具を備えた加工装置 |
-
2019
- 2019-02-25 JP JP2019031611A patent/JP2020131406A/ja active Pending
-
2020
- 2020-01-28 KR KR1020200009756A patent/KR102631487B1/ko active IP Right Grant
- 2020-02-20 TW TW109105440A patent/TWI816984B/zh active
- 2020-02-21 CN CN202010106408.2A patent/CN111613528A/zh active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005169515A (ja) * | 2003-12-08 | 2005-06-30 | Disco Abrasive Syst Ltd | 切断方法 |
| JP2018186133A (ja) * | 2017-04-24 | 2018-11-22 | 株式会社ディスコ | ウォータージェット加工装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111613528A (zh) | 2020-09-01 |
| KR20200103533A (ko) | 2020-09-02 |
| JP2020131406A (ja) | 2020-08-31 |
| TW202032653A (zh) | 2020-09-01 |
| KR102631487B1 (ko) | 2024-01-30 |
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