TWI816984B - processing method - Google Patents

Abstract

[Issue] Shorten the processing time of the workpiece. [Solution] A processing method that uses a processing device to process a workpiece. The processing device is provided with a holding table for holding the workpiece and an injection nozzle for spraying a machining fluid. The workpiece is set along a first A first planned processing line in one direction and a second planned processing line along a second direction, and the processing method includes: a first positioning step that aligns the first direction of the workpiece with the processing feed direction. , and position the spray nozzle at one end of the first planned processing line; the first processing step is to process the object to be processed along the first planned processing line with machining fluid; the second positioning step is to make the The holding table rotates and aligns the second direction of the workpiece with the processing feed direction, and positions the injection nozzle at one end of the second planned processing line; and, in the second positioning step, in the The method of continuously injecting the machining fluid to the workpiece while the holding table is rotating causes the holding table and the injection nozzle to move relative to each other.

Description

processing method

The present invention relates to a processing method for processing a workpiece by injecting pressurized liquid.

If a plate-shaped workpiece is represented by a package substrate in which a plurality of element wafers arranged on the substrate are covered with a sealing material (sealing resin) composed of resin, or a semiconductor wafer in which a plurality of elements are formed, the processing Each component is divided into individual wafers. For example, the workpiece is provided with a first planned processing line along a first direction and a second planned processing line along a second direction intersecting the first direction. Furthermore, when forming individual wafers, the workpiece is divided along each planned processing line.

Furthermore, the workpiece may be processed along each planned processing line, and a groove (called a half-cut groove) of a predetermined depth may be formed on the surface of the workpiece. For dividing and processing the workpiece, for example, a cutting device equipped with an annular cutting blade is used.

The groove can be formed by rotating the cutting blade and cutting the cutting blade from the surface to a predetermined depth along each planned processing line of the workpiece. Thereafter, after the workpiece is subjected to processing such as coating, the bottom surface of the groove is further cut with the dicing blade to divide the workpiece, thereby forming individual wafers.

In addition, the outer peripheral part of the workpiece may be adhered to the adhesive film, and the adhesive film may be adhered to the annular frame. The integrated body of the workpiece, the adhesive film and the annular frame is called a frame unit, for example. If the workpiece is in a frame unit state, the workpiece can be transported easily, and the wafer formed by dividing the workpiece can be supported by an adhesive film.

If a highly ductile metal or other member is present in the line to be processed, when the workpiece is cut with a cutting blade to form a groove, the member is stretched by contact with the cutting blade, and a groove may be formed from the formed groove. Whisker-like projections called burrs. If the burrs remain in the wafers that are subsequently divided into parts to be processed, a short circuit may occur through the burrs, or the burrs may fall from the wafer when the wafer is assembled to the intended assembly target, resulting in assembly defects.

Therefore, in order to remove burrs, a processing device has been developed that can spray a machining fluid such as pressurized water along the grooves of a workpiece formed on the surface by cutting (see, for example, Patent Document 1) . This processing device is called a water jet processing device. This processing device performs processing by pressurizing the machining fluid and spraying it toward the groove of the workpiece, thereby removing burrs and the like from the workpiece.

This processing device includes a holding base whose upper surface serves as a holding surface, and an injection nozzle that injects a machining fluid onto a workpiece held on the holding base. This processing device can relatively move the holding table and the injection nozzle along the processing feed direction and the indexing feed direction orthogonal to the processing feed direction.

When removing burrs from a workpiece, the workpiece cut to produce burrs is moved to a holding surface of a holding table, and the holding table holds the workpiece. Then, the holding platform is rotated around an axis perpendicular to the holding surface, so that the first direction of the object to be processed is aligned with the processing feed direction of the processing device.

Furthermore, if the holding table and the injection nozzle are relatively moved in the processing feed direction while the injection nozzle injects the machining fluid, the workpiece will be processed along the first planned processing line. After that, after the holding table and the injection nozzle are relatively moved along the indexing feed direction, if the holding table and the injection nozzle are relatively moved along the processing feed direction again, the pair will be moved along another first planned processing line. The workpiece is processed.

After the workpiece is processed along all the first planned processing lines, the holding table is rotated so that the second planned processing line of the workpiece is aligned with the processing feed direction of the processing device. Then, when the holding table and the injection nozzle are relatively moved in the processing feed direction, the workpiece is processed along the second planned processing line. [Known technical documents] [Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. 2018-186133

[Problem to be solved by the invention] When the workpiece is adhered to the adhesive film and the adhesive film is adhered to the annular frame, if the processing fluid is sprayed onto the adhesive film, the adhesive film will rupture. Furthermore, if the machining fluid is sprayed onto the holding surface of the holding table, the holding table may be damaged. Therefore, when the workpiece is processed along the first planned processing line and the holding table is rotated before the workpiece is processed along the second planned processing line, the machining fluid will not be sprayed unexpectedly. objects other than the workpiece, causing the injection nozzle to stop injecting the machining fluid.

However, when the machining fluid is ejected from the injection nozzle again after the rotation of the holding table is completed, the processing of the workpiece needs to wait until the machining fluid is stably ejected from the injection nozzle again under predetermined injection conditions. Therefore, in order to reduce the processing time of the workpiece, it is desirable to shorten the standby time in which the workpiece is not processed.

The present invention was completed in view of this problem, and its object is to provide a processing method that can prevent damage to the adhesive film, the holding table, etc. and shorten the processing time of the workpiece.

[Technical means to solve the problem] According to one aspect of the present invention, there is provided a processing method that uses a processing device to process a workpiece. The processing device is provided with: a holding table having a holding surface for holding the workpiece; and a spray nozzle that controls the workpiece. The workpiece held by the holding table is sprayed with machining fluid; a processing feed unit that relatively moves the holding table and the injection nozzle along the processing feed direction; and a rotation unit that makes the holding table rotate along the direction of the processing feed. An axis in a direction perpendicular to the holding surface rotates, and the surface of the workpiece is provided with a first planned machining line along a first direction and a second planned machining line along a second direction intersecting the first direction, The processing method is characterized in that it includes: a holding step of holding the workpiece with the holding table; and a first positioning step of rotating the holding table with the rotation unit to cause the workpiece to be processed after performing the holding step. The first direction of the object is aligned with the processing feed direction, and the injection nozzle is positioned at one end of the first planned processing line; the first processing step is to start from the injection nozzle after implementing the first positioning step. Spray the machining fluid, and then relatively move the holding table and the spray nozzle along the machining feed direction, thereby processing the workpiece along the first planned processing line with the machining fluid; second The positioning step includes, after performing the first processing step, using the rotation unit to rotate the holding table, aligning the second direction of the workpiece with the processing feed direction, and positioning the injection nozzle at the third One end of the second planned processing line; a second processing step, which after implementing the second positioning step, causes the holding table and the injection nozzle to move relatively along the processing feed direction to prevent the injection nozzle from the injection nozzle. The machining fluid processes the workpiece along the second planned processing line, and in the second positioning step, the machining fluid is continuously sprayed to the workpiece while the holding table rotates, so that the machining fluid is continuously sprayed to the workpiece. The holding table and the spray nozzle move relatively.

Preferably, a plurality of the first planned processing lines and a plurality of the second planned processing lines are set on the surface of the workpiece, and the workpiece has a component area and a peripheral remaining area surrounding the component area on the surface. , the component area is equipped with components in each area divided by the first planned processing line and the second planned processing line. In the second positioning step, the machining fluid is continuously sprayed to the holding table while the holding table is rotating. The remaining peripheral area of the workpiece.

Furthermore, preferably, a first groove along the first planned processing line and a second groove along the second planned processing line are formed on the surface of the workpiece, and in the second positioning step, While the holding table is rotating, the machining fluid is continuously sprayed to either the first groove or the second groove of the workpiece.

[Invention effect] In a machining method according to one aspect of the present invention, when the holding table is rotated in the second positioning step, the holding table and the injection nozzle are relatively moved such that the machining fluid is continuously sprayed onto the workpiece. In this case, even if the injection nozzle is not stopped to inject the machining fluid when the holding table is rotated, the machining fluid will not be directly ejected to an object other than the workpiece. That is, it is not necessary to stop the injection nozzle from injecting the machining fluid when rotating the holding table.

As long as the injection of the machining fluid is not stopped, the injection nozzle will stably continue to inject the machining fluid under the predetermined injection conditions. Therefore, after the second positioning step is performed, there is no need to wait for the second processing step to be performed. Therefore, the processing time of the workpiece can be shortened.

Therefore, according to the present invention, it is possible to provide a processing method that prevents damage to the adhesive film, the holding table, etc. and shortens the processing time of the workpiece.

Hereinafter, this embodiment will be described with reference to the drawings. FIG. 1 is a perspective view showing the processing device 2 used when implementing the processing method of this embodiment. The processing device 2 can cut the object to be processed by using a cutting blade, and can process the object by injecting pressurized liquid (hereinafter referred to as processing fluid) onto the object to be processed.

The processing device 2 includes a base 4 that supports each component that constitutes the processing device 2 . An opening 4a is formed in the front corner of the base 4, and a cassette support 6 that is raised and lowered by a lifting mechanism (not shown) is provided in the opening 4a. A cassette 8 for accommodating a plurality of workpieces 1 is provided on the upper surface of the cassette support base 6 . In addition, only the outline of the cassette 8 is shown in FIG. 1 for convenience of explanation.

The workpiece 1 is accommodated in the cassette 8 in a state supported by the annular frame 9 . An adhesive film 7 is adhered to the annular frame 9 so as to block the opening of the annular frame 9 , and the workpiece 1 is adhered to the opening of the annular frame 9 by the adhesive film 7 . Figure 1 shows a perspective view of a frame unit 11 in which the workpiece 1, the adhesive film 7 and the annular frame 9 are integrated.

However, the workpiece 1 processed by the processing device 2 is not limited to the state of the frame unit 11 . In the processing method of this embodiment, only the object 1 to be processed may be carried into the processing device 2 and processed. Hereinafter, a case where the workpiece 1 is processed by the processing device 2 in the state of the frame unit 11 will be described as an example.

The workpiece 1 is a package substrate including a plate-shaped substrate 1 a formed in a rectangular shape (see FIG. 2(A) ) and a plurality of elements 5 (see FIG. 2(B) and the like) arranged on the substrate 1 a. A resin layer (sealing resin) 1 b for sealing the plurality of elements 5 is formed on the substrate 1 a. However, the object 1 is not limited to a package substrate. For example, the object 1 may also be a wafer with components such as IC (Integrated Circuit) formed on the surface.

A circular adhesive film 7 is adhered to the resin layer 1b side of the object 1, and its diameter can cover the entire substrate 1a. By adhering the resin layer 1 b of the workpiece 1 to the center of the adhesive film 7 , the workpiece 1 is supported by the annular frame 9 with the substrate 1 a exposed upward. However, the substrate 1a may be bonded to the adhesive film 7 so that the resin layer 1b side of the workpiece 1 is exposed above.

FIG. 2(B) includes a schematic enlarged plan view showing the substrate 1 a side exposed above the workpiece 1 . The workpiece 1 is provided with a first planned processing line 3a along the first direction 1c and a second planned processing line 3b along the second direction 1d intersecting the first direction 1c on its surface. FIG. 2(B) and the like show a case where the first direction 1c and the second direction 1d are orthogonal to each other, but the workpiece 1 is not limited to this. That is, the first direction 1c and the second direction 1d may not be orthogonal to each other.

As shown in FIG. 2(B) and others, a plurality of first planned processing lines 3 a and a plurality of second planned processing lines 3 b can be set on the surface of the workpiece 1 . Components 5 are arranged in respective regions of the workpiece 1 divided by the first planned processing line 3 a and the second planned processing line 3 b. Furthermore, if the workpiece 1 is divided and singulated along the first planned processing line 3a and the second planned processing line 3b, a plurality of packaged components each including a component chip can be obtained.

A region on the surface of the workpiece 1 in which a plurality of elements 5 are arranged is called an element region 5b, and a region surrounding the element region 5b other than the element region 5b is called an outer peripheral remaining region 5c. The element 5 is not formed in the outer peripheral remaining area 5 c of the workpiece 1 .

Metal (wiring) connected to the element chip covered by the resin layer 1 b is arranged inside the resin layer 1 b. Furthermore, on the upper surface side (substrate 1 a side) of the workpiece 1 , the resin layer 1 b is exposed so as to surround the element 5 in a plan view, and the metal is exposed from the first planned processing line 3 a and the second planned processing line 3 b. The resin layer 1b is exposed. Furthermore, if a groove called a half-cut groove is formed in the workpiece 1 along the first planned processing line 3a and the second planned processing line 3b, the metal will also be exposed on the side wall of the groove.

FIG. 3 is a schematic enlarged plan view of the upper surface side of the workpiece 1 in which the first groove 13 a is formed along the first planned processing line 3 a. The metal exposed on the upper surface side of the workpiece 1 and the side wall of the first groove 13a plays a role when the workpiece 1 is divided into a plurality of package components and each package component is assembled on the intended assembly target. The function of the connection electrode 5a formed in the terminal connection of this assembly object.

In the processing device 2 shown in FIG. 1 , a rectangular opening 4 b is formed on the side of the cassette support 6 on the upper surface of the base 4 so that the long side direction is along the X-axis direction (processing feed direction). . A ball screw type X-axis moving mechanism 10, a table cover 12 and a dust-proof and drip-proof cover 14 covering the upper part of the X-axis moving mechanism 10 are arranged in the opening 4b. The X-axis moving mechanism 10 includes an X-axis moving table (not shown) covered by the table cover 12 and moves the X-axis moving table in the X-axis direction.

A temporary placement mechanism 16 for temporarily placing the workpiece 1 is provided at a position close to the side of the cassette support 6 . The temporary setting mechanism 16 includes, for example, a pair of guide rails 16 a and 16 b that approach and separate while maintaining a state parallel to the Y-axis direction (indexing feed direction). The pair of guide rails 16a and 16b clamps the workpiece 1 extracted from the cassette 8 in the X-axis direction and aligns the workpiece 1 with a predetermined position.

On the upper surface of the X-axis moving table, a holding table 18 for sucking and holding the workpiece 1 is provided so as to be exposed from the table cover 12 . The upper surface of the holding base 18 serves as a holding surface 18 a that attracts and holds the workpiece 1 . The holding surface 18 a is formed substantially parallel to the X-axis direction and the Y-axis direction, and is connected to a suction source (not shown) such as an injector through a suction path (not shown) provided inside the holding base 18 .

Four clamps 20 are provided around the holding table 18 for fixing the annular frame 9 that supports the workpiece 1 from four directions. Furthermore, a transport unit (not shown) that transports the workpiece 1 to the holding table 18 and the like is arranged in an area adjacent to the opening 4 b.

The holding base 18 is connected to a rotation unit (not shown) such as a motor. This rotation unit rotates the holding table 18 about an axis substantially parallel to the Z-axis direction perpendicular to the holding surface 18a. Furthermore, the holding table 18 moves in the X-axis direction together with the X-axis moving table and the table cover 12 by the X-axis moving mechanism 10 .

A cutting unit 22 that cuts the workpiece 1 with an annular cutting blade and an injection unit 24 that injects pressurized liquid (machining fluid) onto the workpiece 1 are provided above the holding table 18 . Furthermore, a door-shaped support structure 26 for supporting the cutting unit 22 and the spray unit 24 is arranged on the upper surface of the base 4 so as to span the opening 4 b.

A moving unit 28 a that moves the cutting unit 22 in the Y-axis direction and the Z-axis direction, and a moving unit 28 b that moves the spray unit 24 in the Y-axis direction and the Z-axis direction are provided on the upper front surface of the support structure 26 .

The moving unit 28a is equipped with the Y-axis moving plate 32a, and the moving unit 28b is equipped with the Y-axis moving plate 32b. The Y-axis moving plate 32a and the Y-axis moving plate 32b are slidably mounted on a pair of Y-axis guide rails 30 arranged in front of the support structure 26 along the Y-axis direction.

A nut portion (not shown) is provided on the back side (rear side) of the Y-axis moving plate 32a. This nut portion is threadedly engaged with the Y-axis ball screw 34a. The Y-axis ball screw 34a is approximately angled relative to the Y-axis guide rail 30. parallel. Furthermore, a nut portion (not shown) is provided on the back side (rear side) of the Y-axis moving plate 32b, and this nut portion is threadedly engaged with the Y-axis ball screw 34b. The Y-axis ball screw 34b is positioned relative to the Y-axis guide rail 30 Approximately parallel.

A Y-axis pulse motor 36 is connected to one end portion of the Y-axis ball screws 34a and 34b respectively. The Y-axis ball screw 34a is rotated by the Y-axis pulse motor 36 connected to the Y-axis ball screw 34a, whereby the Y-axis moving plate 32a moves in the Y-axis direction along the Y-axis guide rail 30. Furthermore, the Y-axis ball screw 34b is rotated by the Y-axis pulse motor connected to the Y-axis ball screw 34b, whereby the Y-axis moving plate 32b moves in the Y-axis direction along the Y-axis guide rail 30.

A pair of Z-axis guide rails 38a are provided along the Z-axis direction on the front (front) side of the Y-axis moving plate 32a, and a pair of Z-axis guide rails are provided along the Z-axis direction on the front (front) side of the Y-axis moving plate 32b. 38b. Furthermore, the Z-axis moving plate 40a is slidably attached to the pair of Z-axis guide rails 38a, and the Z-axis moving plate 40b is slidably attached to the pair of Z-axis guide rails 38b.

A nut portion (not shown) is provided on the back side (rear side) of the Z-axis moving plate 40a. This nut portion is threadedly engaged with the Z-axis ball screw 42a. The Z-axis ball screw 42a is arranged along the axis relative to the Z-axis. The guide rails 38a are provided in substantially parallel directions. One end of the Z-axis ball screw 42a is connected to the Z-axis pulse motor 44a. The Z-axis pulse motor 44a rotates the Z-axis ball screw 42a, whereby the Z-axis moving plate 40a moves in the Z-axis direction along the Z-axis guide rail 38a. .

A nut portion (not shown) is provided on the back side (rear side) of the Z-axis moving plate 40b. This nut portion is threadedly engaged with the Z-axis ball screw 42b. The Z-axis ball screw 42b is arranged along the axis relative to the Z-axis. The guide rails 38b are provided in substantially parallel directions. One end of the Z-axis ball screw 42b is connected to the Z-axis pulse motor 44b. The Z-axis pulse motor 44b rotates the Z-axis ball screw 42b, so that the Z-axis moving plate 40b moves in the Z-axis direction along the Z-axis guide rail 38b. .

A cutting unit 22 is provided at the lower part of the Z-axis moving plate 40a. An imaging unit (camera) 46 a is provided adjacent to the cutting unit 22 for photographing the workpiece 1 and the like attracted and held by the holding table 18 . Furthermore, the injection unit 24 is provided at the lower part of the Z-axis moving plate 40b. An imaging unit (camera) 46 b is provided adjacent to the injection unit 24 for photographing the workpiece 1 and the like sucked and held by the holding table 18 .

The moving unit 28a controls the Y-axis and Z-axis positions of the cutting unit 22 and the imaging unit 46a, and the Y-axis and Z-axis positions of the injection unit 24 and the imaging unit 46b are controlled by the moving unit 28b. That is, the position of the cutting unit 22 and the position of the injection unit 24 are controlled independently.

An opening 4c is formed at a position opposite to the opening 4a with respect to the opening 4b. A cleaning unit 48 for cleaning the workpiece 1 is disposed in the opening 4c. The workpiece 1 that has been subjected to predetermined processing on the holding table 18 is cleaned by the cleaning unit 48.

The annular cutting blade (not shown) mounted on the cutting unit 22 is rotated and cut into the workpiece 1 , whereby the workpiece 1 can be cut. The cutting unit 22 is provided with a main shaft, the axis of which is substantially parallel to the holding surface 18 a of the holding table 18 , and an annular cutting blade is installed at the front end of the main shaft. The cutting blade is composed of, for example, an electroformed grindstone with nickel-plated fixed diamond abrasive grains.

The spindle is connected to a rotational drive source such as a motor, and the cutting blade mounted on the spindle is rotated by force transmitted from the rotational drive source. The cutting blade is rotated to cut into the workpiece 1 held on the holding table 18 , and the holding table 18 and the cutting blade are relatively moved in the X-axis direction (processing feed direction) to cut the workpiece 1 .

Furthermore, by injecting pressurized liquid such as water (machining fluid) from the injection unit 24 toward the workpiece 1 , the following processing can be performed: removing a part of the workpiece 1 , removing metal burrs formed on the workpiece 1 , etc. . In addition, the removal of burrs using the spray unit 24 will be described later.

The injection unit 24 is equipped with an injection nozzle 24 c that injects the machining fluid to the workpiece 1 held on the holding table 18 . The injection nozzle 24c is connected to the supply source 24a of the machining fluid through the supply path 24d. When the workpiece 1 is processed, the switching valve 24b provided in the supply path 24d is opened, the machining fluid is supplied from the supply source 24a to the injection nozzle 24c, and the processing fluid is sprayed toward the workpiece 1 from the injection port of the injection nozzle 24c. machining fluid.

Furthermore, the injection unit 24 is provided with the cover 24e which covers the lower part of the injection nozzle 24c. The inside of the cover 24e is formed into a hollow hemispherical shape (bowl shape). The injection nozzle 24c is inserted into the cover 24e, and the cover 24e is attached to the injection nozzle 24c so that the lower annular edge faces the holding surface 18a of the holding base 18. The cover 24e prevents mist generated during processing and machining chips from scattering. In addition, for convenience of explanation, the cover 24e is omitted in the figures other than FIG. 1 .

Furthermore, an opening is formed on the side wall of the cover 24e, and the opening is connected to one end of the conduit 24f provided outside the cover 24e. The other end of this duct 24f is connected to a suction source (not shown). The mist or processing chips generated inside the cover 24e due to the processing of the workpiece 1 are sucked and removed through the duct 24f.

Furthermore, the position of the injection nozzle 24c can be controlled by the moving unit 28b. By controlling the moving unit 28b, the holding base 18 and the injection nozzle 24c can be relatively moved.

The supply source 24a is equipped with a pump (not shown) for pressurizing a liquid and supplying it as a machining fluid, and a liquid system such as water is pressurized by the pump. The supply source 24a is provided with a control mechanism that controls the flow rate and pressure of the machining fluid ejected from the injection nozzle 24c. The injection unit 24 supplies the machining fluid at a predetermined pressure (for example, 0 MPa to 70 MPa) and a predetermined flow rate to the workpiece 1 held on the holding table 18, and processes the workpiece 1.

The processing device 2 may process the object 1 using only the spray unit 24 , or may use the cutting unit 22 and the spray unit 24 to process the object 1 . Furthermore, the processing device 2 does not need to include the cutting unit 22 , and may be a water jet processing device that supplies high-pressure water to the workpiece 1 .

Next, each step of the processing method of this embodiment will be described. Hereinafter, a case where the workpiece 1 is carried into the processing device 2 in the state of the frame unit 11 and processed will be described, but the processing method of this embodiment is not limited thereto. The workpiece 1 does not need to be integrated with the annular frame 9 and the adhesive film 7 .

In this processing method, first, a holding step of holding the workpiece 1 on the holding table 18 is performed. Fig. 2(A) is a cross-sectional view schematically showing the holding step. The workpiece 1 is arranged on the holding surface 18 a of the holding table 18 through the adhesive film 7 , and the annular frame 9 is fixed by the clamp 20 . Thereafter, the suction source is operated to cause negative pressure to act on the workpiece 1 , whereby the workpiece 1 is attracted and held by the holding table 18 through the adhesive film 7 .

In addition, in the processing method of this embodiment, the first groove 13a of a predetermined depth along the first planned processing line 3a and the first groove 13a along the second planned processing line 3a are formed in advance on the workpiece 1 processed by the injection unit 24. a second groove 13b of a predetermined depth along line 3b.

For example, a groove forming step for forming grooves 13 a and 13 b in the workpiece 1 may be performed before the holding step. For example, the groove forming step may be performed in other processing equipment or the like before being stored in the cassette 8 . Alternatively, after the holding step is performed, the groove forming step may be performed by the cutting unit 22 of the processing device 2 .

When performing the groove forming step in the processing device 2 , first, the holding table 18 is rotated by a rotation unit that rotates the holding table 18 so that the first direction 1 c of the workpiece 1 is aligned with the processing feed direction 12 a of the processing device 2 (X-axis direction). Then, the cutting blade of the cutting unit 22 is positioned above the extension line of the first planned processing line 3 a on the outside of the workpiece 1 .

Thereafter, the cutting blade is started to be rotated, so that the cutting unit 22 is lowered to a predetermined height position. Then, the holding table 18 and the cutting unit 22 are relatively moved along the processing feed direction 12a. In this case, the rotating cutting blade contacts the workpiece 1, the workpiece 1 is cut along the first planned processing line 3a, and the first groove along the first planned processing line 3a is formed in the workpiece 1 13a.

After the workpiece 1 is cut along a first planned processing line 3a to form the first groove 13a, the holding table 18 and the cutting unit 22 are relatively moved along the indexing feed direction (Y-axis direction) and moved along the other direction. A first planned processing line 3a cuts the workpiece 1. Then, the workpiece 1 is cut along all the first planned processing lines 3a, and the first grooves 13a are formed along the respective first planned processing lines 3a.

Thereafter, the holding table 18 is rotated by the rotation unit so that the second direction 1d of the object 1 is aligned with the processing feed direction 12a of the processing device 2 . Then, the workpiece 1 is similarly cut along the second planned processing line 3b, and the second groove 13b along the second planned processing line 3b is formed in the workpiece 1. Here, the first groove 13a and the second groove 13b are called half-cut grooves.

In addition, although the case where the second groove 13b is formed after the first groove 13a is formed is described, the groove forming step is not limited to this. For example, the first groove 13a may be formed after the second groove 13b is formed.

Here, the metal used for the electrode exists in the first planned processing line 3 a and the second planned processing line 3 b of the workpiece 1 . And when metal is cut with a cutting blade, the metal contacts the cutting blade and is stretched, and whisker-shaped protrusions called burrs are formed in the grooves 13a and 13b.

If the burrs remain inside the grooves 13a and 13b, they will become an obstacle when the workpiece 1 is divided to form packaged components and the packaged components are assembled on a predetermined assembly target. Therefore, in the processing method of this embodiment, the processing fluid is ejected from the injection nozzle 24c of the injection unit 24 along the grooves 13a and 13b to remove the burrs.

In the processing method of this embodiment, after the holding step is performed, the first positioning step is performed. In the first positioning step, the rotation unit is used to rotate the holding table 18 so that the first direction 1c of the workpiece 1 is aligned with the processing feed direction 12a of the processing device 2, and the injection nozzle 24c is positioned at the first planned processing position. One end of line 3a. FIG. 2(B) shows a plan view schematically showing the workpiece 1 and the injection nozzle 24c at the end of the first positioning step.

In the first positioning step, the camera unit 46b is used to photograph the workpiece 1, for example, to detect an alignment mark (not shown) provided on the workpiece 1 corresponding to the first planned processing line 3a or the first planned processing line 3a. The first direction 1c is thus detected. Then, when the first direction 1c is not aligned with the processing feed direction 12a of the processing device 2, the holding table 18 is rotated so that the first direction 1c of the workpiece 1 is aligned with the processing feed direction 12a.

In addition, when the groove forming step is performed before the first positioning step, etc., it is found that the first direction 1c is aligned with the processing feed direction 12a before the holding table 18 is rotated by photographing the workpiece 1 with the imaging unit 46b. situation. Thus, as a result, the first positioning step also includes confirming that there is no need to rotate the holding table 18 . In other words, the first positioning step also includes using the rotation unit to rotate the holding platform 18 by 0 degrees.

After the first positioning step is performed, a first processing step is performed in which the processing fluid is sprayed from the injection nozzle 24c to process the workpiece 1 along the first planned processing line 3a. Fig. 4(A) is a cross-sectional view schematically showing the first processing step.

In the first machining step, first, injection of the machining fluid from the injection nozzle 24c is started. At this time, in order to process the entire area of the workpiece 1 uniformly, a wait is performed until the machining fluid is stably ejected from the ejection nozzle 24c under predetermined ejection conditions. Thereafter, the holding table 18 and the injection nozzle 24c are relatively moved along the processing feed direction 12a, whereby the workpiece 1 is processed along the first planned processing line 3a with the processing fluid.

When the machining fluid is ejected onto the workpiece 1 along the first planned machining line 3a, the metal burrs existing along the first groove 13a are removed. In addition, when the processing of the workpiece 1 along the initial first planned processing line 3a is completed, the holding table 18 and the injection nozzle 24c are stopped before the injection nozzle 24c is separated from the area overlapping the workpiece 1. relative movement.

If the injection nozzle 24c is separated from this area, the machining fluid will be directly injected to the adhesive film 7 and the holding surface 18a of the holding table 18, and the adhesive film 7 and the holding table 18 will be damaged. Then, for example, while the injection nozzle 24 c is arranged above the outer peripheral remaining area 5 c of the workpiece 1 (see FIG. 2(B) and the like), the relative movement of the holding base 18 and the injection nozzle 24 c is stopped.

Then, the holding table 18 and the injection nozzle 24c are moved in the indexing feed direction (Y-axis direction) orthogonal to the processing feed direction 12a, and the injection nozzle 24c is positioned above the other first planned processing line 3a. Thereafter, the holding table 18 and the injection nozzle 24c are moved along the processing feed direction 12a again, thereby processing the workpiece 1 along the other first planned processing line 3a. Processing is performed continuously, the workpiece 1 is processed along all the first planned processing lines 3a, and the first processing step is completed.

In addition, in the first processing step, when processing the workpiece 1 along the first planned processing line 3a, the processing fluid may be sprayed into one area and the other area separated by the first groove 13a. And the workpiece 1 is processed. The trajectory of the injection nozzle 24c in this case will be described. In the top view of the workpiece 1 shown in FIG. 3 , the injection nozzle 24c is shown relative to the track 24g of the workpiece 1 .

As shown in FIG. 3 , after the injection nozzle 24 c is relatively moved along one side wall of the first groove 13 a to process the workpiece 1 , the injection nozzle 24 c is relatively moved along the other side wall of the first groove 13 a. Move to process the workpiece 1. In this case, since the metal burrs present on the one side wall of the first groove 13a and the metal burrs present on the other side wall of the first groove 13a can be sprayed with the machining fluid respectively, the respective burrs can be removed more reliably. However, the processing method of this embodiment is not limited to this.

As preparation for processing the workpiece 1 along the second planned processing line 3b, the second positioning step is performed after the first processing step. In the second positioning step, the rotation unit is used to rotate the holding table 18 so that the second direction 1d of the workpiece 1 is aligned with the processing feed direction 12a of the processing device 2, and the injection nozzle 24c is positioned at the second planned processing line 3b one end. In addition, the second positioning step will be described in detail later.

After the second positioning step is performed, the second processing step is performed to process the workpiece 1 along the second planned processing line 3b. FIG. 4(B) is a cross-sectional view schematically showing the second processing step. In the second processing step, the holding table 18 and the injection nozzle 24c are relatively moved along the processing feed direction 12a, so that the processing fluid injected from the injection nozzle 24c is applied to the workpiece along the second planned processing line 3b. 1 for processing.

In the second processing step, similarly to the first processing step, the movement of the holding table 18 and the injection nozzle 24c in the processing feed direction 12a and the movement in the indexing feed direction are repeated. Then, the workpiece 1 is processed along all the second planned processing lines 3b, and the second processing step is completed. Then, the operation of injecting the machining fluid from the injection nozzle 24 c that has been continued since the start of the first processing step is stopped.

If the first processing step and the second processing step are performed, the metal burrs formed in the grooves 13a and 13b can be removed. Therefore, when the package components formed by dividing the workpiece 1 are subsequently assembled on a predetermined assembly target, there will be no metal burrs that hinder proper assembly.

However, conventionally, after processing the workpiece 1 along the first planned processing line 3a, when the holding table 18 is rotated by the rotation unit, the injection nozzle 24c temporarily stops injecting the machining fluid. The reason for this is that as the holding table 18 rotates, the workpiece 1 moves away from the area directly below the injection nozzle 24c. In this case, if the machining fluid is continued to be sprayed while the holding table 18 is rotating, the machining fluid will be sprayed directly to the adhesive film 7 and the holding surface 18 a of the holding table 18 , causing damage to the adhesive film 7 and the like.

However, if the injection of the machining fluid is stopped once, it is necessary to make a reservation after rotating the holding table 18 and positioning the injection nozzle 24c at one end of the second planned machining line 3b, and then causing the injection nozzle 24c to start injecting the machining fluid again. Time to wait. The reason for this is that in order to stably process the workpiece 1 along the second planned processing line 3b under predetermined conditions, it is necessary to start processing after the machining fluid is stably injected from the injection nozzle 24c under the predetermined injection conditions. .

For example, the total processing time required to process one workpiece 1 is about 70 seconds. The waiting time from when the injection of the machining fluid is restarted until the injection state of the machining fluid stabilizes is, for example, about 20 seconds to 30 seconds. That is, the proportion of the waiting time in the processing time is not small, and it is desired to shorten the waiting time.

Therefore, in the machining method of this embodiment, in the second positioning step of rotating the holding table 18, the injection nozzle 24c is not stopped from injecting the machining fluid. That is, in the second positioning step, the holding table 18 and the injection nozzle 24 c are relatively moved in such a manner that the machining fluid is continuously sprayed to the workpiece 1 while the holding table 18 is rotating.

For example, the following positions are registered in advance in the processing device 2: the positions of the injection nozzle 24c at the start and end of the first processing step of the workpiece 1, and the positions of the injection nozzle 24c at the start and end of the second processing step. . Furthermore, the processing start position and the processing end position in each of the first planned processing line 3a and the second planned processing line 3b are registered. Then, the trajectory of the injection nozzle 24c from the position at the end of the first processing step to the position at the start of the second processing step is calculated.

Furthermore, in the second positioning step, the holding table 18 is rotated while aligning with the trajectory, and the holding table 18 and the injection nozzle 24 c are relatively moved in the X-axis direction and the Y-axis direction. In this case, since the workpiece 1 will not leave the area directly below the injection nozzle 24c, there is no need to stop the injection nozzle 24c from injecting the machining fluid. Since the machining fluid is stably ejected from the injection nozzle 24c under predetermined conditions, the second machining step can be started immediately after the second positioning step is performed.

Therefore, in the processing method of this embodiment, the waiting time before starting the second processing step can be shortened, and the time required for processing the workpiece 1 can be shortened.

In addition, in the processing method of this embodiment, before performing the second positioning step, a registration step may be performed, which is to register the relative movement plan of the holding table 18 and the injection nozzle 24c in the second positioning step. to processing device 2. Furthermore, when a plurality of workpieces 1 of the same type are continuously processed, if a plan for the relative movement of the holding table 18 and the injection nozzle 24c is once registered, the plan can be used for all the workpieces 1 Second processing step.

Furthermore, in the second positioning step, for example, the holding table 18 and the injection nozzle 24 c may be relatively moved such that the machining fluid is continuously sprayed to the remaining outer peripheral area 5 c of the workpiece 1 while the holding table 18 is rotating. While the second positioning step is being performed, if the machining fluid is continuously sprayed into the component area 5 b of the workpiece 1 , the component 5 formed in the component area 5 b may be damaged or the like. Therefore, it is preferable that the remaining outer peripheral area 5 c of the workpiece 1 continues to receive the machining fluid sprayed while the holding table 18 rotates.

Alternatively, in the second positioning step, the machining fluid may be continuously sprayed to either the first groove 13 a or the second groove 13 b of the workpiece 1 while the holding table 18 is rotating, so that the holding table 18 and the injection nozzle 24c moves relatively. The movement path of the injection nozzle 24c in this case will be described using Fig. 5(A), Fig. 5(B), and Fig. 5(C).

FIG. 5(A) is a top view schematically showing the position of the injection nozzle at the end of the first processing step. The position of the injection nozzle 24c at the end of the first processing step or at the beginning of the second positioning step is shown in Figure 5(A). As shown in FIG. 5(A) , at this point in time, the injection nozzle 24 c is positioned in the outer peripheral remaining area 5 c and above the first groove 13 a formed along the first planned processing line 3 a.

FIG. 5(B) is a top view schematically showing the second positioning step. In the second positioning step, the holding table 18 and the injection nozzle 24c are relatively moved while the holding table 18 is rotated. At this time, as shown in FIG. 5(B) , the holding base 18 and the injection nozzle 24 c are relatively moved so that the injection nozzle 24 c can be continuously positioned above the first groove 13 a of the workpiece 1 .

Thereafter, when the second direction 1d of the workpiece 1 is aligned with the processing feed direction 12a of the processing device 2, the rotation of the holding table 18 is stopped. Next, the holding table 18 and the injection nozzle 24c are relatively moved, and the injection nozzle 24c positioned above the first groove 13a is positioned above the second groove 13b along the second planned processing line 3b, thereby completing the second positioning step. Thereafter, the second processing step begins. FIG. 5(C) is a top view schematically showing the position of the injection nozzle at the start of the second processing step.

In addition, in the second positioning step, although the case where the machining fluid is continuously sprayed to the first groove 13 a of the workpiece 1 is described while the holding table 18 is rotating, the machining fluid may also be continuously sprayed while the holding table 18 is rotating. Spray to the second groove 13b. In this case, before starting to rotate the holding table 18, the injection nozzle 24c positioned above the first groove 13a is positioned above the second groove 13b. Thereafter, the rotation of the holding table 18 is started.

In addition, while the holding table 18 is rotated in the second positioning step, it is not necessary to continuously spray the machining fluid to the same place on the workpiece 1 . For example, while the holding table 18 is being rotated, the position for receiving the machining fluid can be changed in the outer peripheral remaining area 5 c of the workpiece 1 . Furthermore, the injection nozzle 24c may be positioned above the second groove 13b at the same time as the rotation of the holding table 18 is completed.

In this case, the rotation of the holding table 18 can be started immediately after the first processing step is performed. Moreover, after the rotation of the holding table 18 is completed, the second processing step can be started immediately. Therefore, the time required for the second positioning step can be minimized.

In addition, the present invention is not limited to the description of the above embodiment, and can be implemented with various modifications. For example, in the above-mentioned embodiment, the case where the workpiece 1 is processed to remove metal burrs has been described, but an aspect of the present invention is not limited thereto. For example, in one aspect of the processing method of the present invention, the workpiece 1 can be processed for purposes other than removing metal burrs.

Furthermore, although the case where the workpiece 1 is processed along the first planned processing line 3a and then the workpiece 1 is processed along the second planned processing line 3b is described, one aspect of the present invention The processing method is not limited to this. That is, after processing the workpiece 1 along the second planned processing line 3b, the workpiece 1 may be processed along the first planned processing line 3a. Furthermore, the first direction 1 c is not limited to the direction along the long side of the workpiece 1 , and the second direction 1 d is not limited to the direction along the short side of the workpiece 1 .

In addition, the structures, methods, etc. of the above-described embodiments can be appropriately modified and implemented as long as they do not deviate from the scope of the invention.

1: Processed object 1a:Substrate 1b: Resin layer 1c, 1d: direction 3a, 3b: Processing scheduled line 5:Component 5a:Electrode 5b: component area 5c: Remaining peripheral area 7: Adhesive film 9: Ring frame 11: Frame unit 13a, 13b: slot 2: Processing device 4:Abutment 4a, 4b, 4c: opening 6: Cassette support platform 8: Cassette 10:X-axis moving mechanism 12:Workbench cover 12a: Processing feed direction 14: Dust-proof and drip-proof cover 16: Temporary institution 16a, 16b: guide rail 18:Keeping platform 18a:Maintenance surface 20: Fixture 22: Cutting unit 24:Injection unit 24a: Source of supply 24b: switching valve 24c:Jet nozzle 24d: Supply path 24e: Cover 24f:Conduit 24g: Orbit 26:Support structure 28a, 28b: mobile unit 30, 38a, 38b: guide rail 32a, 32b, 40a, 40b: moving board 34a, 34b, 42a, 42b: Ball screw 36, 44a, 44b: Y-axis pulse motor 46a, 46b: camera unit 48:Cleaning unit

Fig. 1 is a perspective view schematically showing a processing device. FIG. 2(A) is a cross-sectional view schematically showing the holding step, and FIG. 2(B) is a plan view schematically showing the frame unit held on the holding table. FIG. 3 is a schematic enlarged plan view showing the upper surface of the workpiece. FIG. 4(A) is a cross-sectional view schematically showing the first processing step, and FIG. 4(B) is a cross-sectional view schematically showing the second processing step. Figure 5(A) is a top view schematically showing the position of the injection nozzle at the end of the first processing step. Figure 5(B) is a top view schematically showing the second positioning step. Figure 5(C) is a schematic top view showing the position of the injection nozzle at the end of the first processing step. Top view of the position of the spray nozzle at the beginning of the second processing step.

1: Processed object

1c, 1d: direction

3a, 3b: Processing scheduled line

5:Component

5b: component area

5c: Remaining peripheral area

7: Adhesive film

9: Ring frame

11: Frame unit

12a: Processing feed direction

13a, 13b: slot

18a:Maintenance surface

20: Fixture

24c:Jet nozzle

Claims (2)

A processing method that uses a processing device to process a workpiece. The processing device is provided with: a holding table having a holding surface for holding the workpiece; and a spray nozzle that sprays the workpiece held by the holding table. machining fluid; a machining feed unit that relatively moves the holding table and the injection nozzle along the machining feed direction; and a rotation unit that rotates the holding table around an axis along a direction perpendicular to the holding surface, Furthermore, the surface of the workpiece is provided with a first planned processing line along a first direction and a second planned processing line along a second direction intersecting the first direction. The processing method is characterized by: a holding step, which uses the holding table to hold the workpiece; a first positioning step, which after performing the holding step, uses the rotation unit to rotate the holding table so that the first direction of the workpiece is aligned with the machining feed direction, and positioning the injection nozzle at one end of the first planned processing line; the first processing step, after implementing the first positioning step, starts to inject the processing fluid from the injection nozzle, and then causes the The holding table and the injection nozzle move relatively along the processing feed direction, thereby processing the workpiece along the first planned processing line with the processing fluid; the second positioning step is to perform the first After the processing step, the rotation unit is used to rotate the holding table, so that the second direction of the processed object is aligned with the processing feed direction, and the injection nozzle is positioned at one end of the second planned processing line; second The processing step includes, after implementing the second positioning step, relatively moving the holding table and the injection nozzle along the processing feed direction so that the processing fluid sprayed from the injection nozzle moves along the second processing plan. The workpiece is processed in a line, and in the second positioning step, the holding table and the injection nozzle are relatively moved in such a manner that the machining fluid is continuously sprayed to the workpiece while the holding table is rotating. , the following positions are registered in advance in the processing device: the positions of the injection nozzle at the beginning and end of the first processing step of the workpiece, and the positions of the injection nozzle at the beginning and end of the second processing step. , the processing start position and the processing end position in each of the first planned processing line and the second planned processing line, and the position from the position at the end of the first processing step to the position at the start of the second processing step is calculated. the trajectory of the spray nozzle, In the second positioning step, the holding platform is rotated and aligned with the trajectory, and the holding platform and the injection nozzle are relatively moved along the X-axis direction and the Y-axis direction. The processing method of claim 1, wherein a plurality of the first planned processing lines and a plurality of the second planned processing lines are set on the surface of the workpiece, and the workpiece has a component area on the surface and surrounding the The remaining peripheral area of the component area, which is provided with components in each area divided by the first planned processing line and the second planned processing line. In the second positioning step, the holding table is rotated while the components are arranged. The machining fluid is continuously sprayed to the remaining peripheral area of the workpiece.