TWI809284B - 異向導電膜、連接構造體及連接構造體之製造方法 - Google Patents

異向導電膜、連接構造體及連接構造體之製造方法 Download PDF

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TWI809284B
TWI809284B TW109121150A TW109121150A TWI809284B TW I809284 B TWI809284 B TW I809284B TW 109121150 A TW109121150 A TW 109121150A TW 109121150 A TW109121150 A TW 109121150A TW I809284 B TWI809284 B TW I809284B
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conductive particles
anisotropic conductive
conductive film
holes
semiconductor substrate
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TW109121150A
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Chinese (zh)
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TW202038426A (zh
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篠原誠一郎
阿久津恭志
石松朋之
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日商迪睿合股份有限公司
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  • Non-Insulated Conductors (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Adhesive Tapes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW109121150A 2015-01-13 2016-01-13 異向導電膜、連接構造體及連接構造體之製造方法 TWI809284B (zh)

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JP2015004596 2015-01-13
JPJP2015-004596 2015-01-13

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TW202038426A TW202038426A (zh) 2020-10-16
TWI809284B true TWI809284B (zh) 2023-07-21

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TW109121150A TWI809284B (zh) 2015-01-13 2016-01-13 異向導電膜、連接構造體及連接構造體之製造方法
TW105101042A TWI806814B (zh) 2015-01-13 2016-01-13 多層基板

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TW105101042A TWI806814B (zh) 2015-01-13 2016-01-13 多層基板

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US (1) US11901325B2 (https=)
JP (2) JP2016131246A (https=)
KR (1) KR102094725B1 (https=)
CN (1) CN107210287B (https=)
TW (2) TWI809284B (https=)
WO (1) WO2016114320A1 (https=)

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Publication number Priority date Publication date Assignee Title
TWI809284B (zh) * 2015-01-13 2023-07-21 日商迪睿合股份有限公司 異向導電膜、連接構造體及連接構造體之製造方法
JPWO2017149977A1 (ja) * 2016-02-29 2018-12-20 パナソニックＩｐマネジメント株式会社 非水電解質二次電池
JP7125547B2 (ja) * 2018-12-29 2022-08-24 深南電路股▲ふん▼有限公司 多様に組み立て可能なプリント基板及びその製造方法
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