TWI792211B - 描繪裝置、資料處理裝置、描繪方法以及描繪資料生成方法 - Google Patents
描繪裝置、資料處理裝置、描繪方法以及描繪資料生成方法 Download PDFInfo
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- TWI792211B TWI792211B TW110107822A TW110107822A TWI792211B TW I792211 B TWI792211 B TW I792211B TW 110107822 A TW110107822 A TW 110107822A TW 110107822 A TW110107822 A TW 110107822A TW I792211 B TWI792211 B TW I792211B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70541—Tagging, i.e. hardware or software tagging of features or components, e.g. using tagging scripts or tagging identifier codes for identification of chips, shots or wafers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Image Generation (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020-052384 | 2020-03-24 | ||
JP2020052384A JP7463154B2 (ja) | 2020-03-24 | 2020-03-24 | 描画装置、データ処理装置、描画方法、および描画データ生成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202205346A TW202205346A (zh) | 2022-02-01 |
TWI792211B true TWI792211B (zh) | 2023-02-11 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW110107822A TWI792211B (zh) | 2020-03-24 | 2021-03-05 | 描繪裝置、資料處理裝置、描繪方法以及描繪資料生成方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7463154B2 (ja) |
KR (1) | KR102566081B1 (ja) |
CN (1) | CN113448177A (ja) |
TW (1) | TWI792211B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023141515A (ja) * | 2022-03-24 | 2023-10-05 | 株式会社Screenホールディングス | 指示用プログラム、プログラムセットおよび描画システム |
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TW201513171A (zh) * | 2013-09-25 | 2015-04-01 | Screen Holdings Co Ltd | 描繪方法以及描繪裝置 |
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2020
- 2020-03-24 JP JP2020052384A patent/JP7463154B2/ja active Active
-
2021
- 2021-03-05 TW TW110107822A patent/TWI792211B/zh active
- 2021-03-16 KR KR1020210034157A patent/KR102566081B1/ko active IP Right Grant
- 2021-03-18 CN CN202110293334.2A patent/CN113448177A/zh active Pending
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US6046094A (en) * | 1996-08-02 | 2000-04-04 | Micron Technology, Inc. | Method of forming wafer alignment patterns |
WO2000016381A1 (fr) * | 1998-09-14 | 2000-03-23 | Nikon Corporation | Appareil d'exposition et son procede de fabrication, et procede de production de dispositif |
US20180197820A1 (en) * | 2012-07-10 | 2018-07-12 | Nikon Corporation | Mark, method for forming same, and exposure apparatus |
TW201513171A (zh) * | 2013-09-25 | 2015-04-01 | Screen Holdings Co Ltd | 描繪方法以及描繪裝置 |
TW201703096A (zh) * | 2015-04-21 | 2017-01-16 | 英特爾股份有限公司 | 用於電子束曝光系統之精密校準系統 |
CN109585246A (zh) * | 2017-09-29 | 2019-04-05 | 纽富来科技股份有限公司 | 多带电粒子束描绘装置及多带电粒子束描绘方法 |
Also Published As
Publication number | Publication date |
---|---|
TW202205346A (zh) | 2022-02-01 |
JP7463154B2 (ja) | 2024-04-08 |
CN113448177A (zh) | 2021-09-28 |
KR102566081B1 (ko) | 2023-08-10 |
JP2021152572A (ja) | 2021-09-30 |
KR20210119309A (ko) | 2021-10-05 |
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