TWI786271B - 含磷之苯氧基樹脂、含磷之苯氧基樹脂的樹脂組成物、及硬化物 - Google Patents

含磷之苯氧基樹脂、含磷之苯氧基樹脂的樹脂組成物、及硬化物 Download PDF

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TWI786271B
TWI786271B TW108106513A TW108106513A TWI786271B TW I786271 B TWI786271 B TW I786271B TW 108106513 A TW108106513 A TW 108106513A TW 108106513 A TW108106513 A TW 108106513A TW I786271 B TWI786271 B TW I786271B
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resin
phosphorus
group
carbons
resin composition
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TW108106513A
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TW201938639A (zh
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佐藤洋
軍司雅男
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日商日鐵化學材料股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/48—Polymers modified by chemical after-treatment
    • C08G65/485—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
    • C08G65/42—Phenols and polyhydroxy ethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G79/00—Macromolecular compounds obtained by reactions forming a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon with or without the latter elements in the main chain of the macromolecule
    • C08G79/02—Macromolecular compounds obtained by reactions forming a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon with or without the latter elements in the main chain of the macromolecule a linkage containing phosphorus
    • C08G79/04—Phosphorus linked to oxygen or to oxygen and carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW108106513A 2018-02-26 2019-02-26 含磷之苯氧基樹脂、含磷之苯氧基樹脂的樹脂組成物、及硬化物 TWI786271B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-032187 2018-02-26
JP2018032187A JP7055664B2 (ja) 2018-02-26 2018-02-26 リン含有フェノキシ樹脂、その樹脂組成物、及び硬化物

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TW201938639A TW201938639A (zh) 2019-10-01
TWI786271B true TWI786271B (zh) 2022-12-11

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JP (1) JP7055664B2 (ja)
KR (1) KR102662809B1 (ja)
CN (1) CN110194843B (ja)
TW (1) TWI786271B (ja)

Families Citing this family (6)

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Publication number Priority date Publication date Assignee Title
EP4013097A4 (en) 2019-08-09 2022-09-14 KDDI Corporation RELAY DEVICE FOR TRANSMITTING A SIGNAL WITH A SPECIFIC PATH, CONTROL METHOD AND PROGRAM
CN110862662B (zh) * 2019-11-27 2021-08-20 唐山润峰复合材料有限公司 一种高强度高韧性隔热型采光板及其加工工艺
TW202142584A (zh) * 2020-03-27 2021-11-16 日商日鐵化學材料股份有限公司 含磷的苯氧基樹脂、樹脂組成物、硬化物、電氣電子電路用積層板、及含磷的苯氧基樹脂的製造方法
WO2022070849A1 (ja) * 2020-09-30 2022-04-07 日鉄ケミカル＆マテリアル株式会社 現場重合型熱可塑性エポキシ樹脂用の前駆体混合物、エポキシ樹脂組成物、エポキシ樹脂組成物シート、プリプレグ、及びこれらを用いた現場重合型の熱可塑性繊維強化プラスチック
EP4292811A1 (en) * 2021-02-10 2023-12-20 Resonac Corporation Welding film and joined body
CN116284748A (zh) * 2023-02-02 2023-06-23 四川东材科技集团股份有限公司 一种高阻燃大分子含磷固体苯氧树脂及其制备方法

Citations (4)

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Publication number Priority date Publication date Assignee Title
TW393496B (en) * 1998-04-29 2000-06-11 Chen Liou Wang Aryl phosphinate diglycidyl ethers and process for preparing the same
TW201136982A (en) * 2010-04-20 2011-11-01 Hong Tai Electric Ind Co Ltd Halogen-free flame retardant resin composition
TW201500412A (zh) * 2013-06-25 2015-01-01 Jiangsu Yoke Technology Co Ltd 含磷酚醛樹脂及包含其的阻燃環氧樹脂固化物
JP2015196720A (ja) * 2014-03-31 2015-11-09 三菱化学株式会社 リン含有エポキシ樹脂、リン含有エポキシ樹脂組成物、硬化物及び電気・電子回路用積層板

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WO1999019383A1 (fr) * 1997-10-15 1999-04-22 Otsuka Chemical Co., Ltd. Composes phenoxyphosphazene reticules, agent ignifugeant, compositions de resine ignifugeante et moulages a base de resines ignifugeante
JP4434427B2 (ja) * 2000-04-27 2010-03-17 東都化成株式会社 熱可塑性ポリヒドロキシポリエーテル樹脂及びそれから成形した絶縁性フィルム
JP4530187B2 (ja) 2000-06-21 2010-08-25 新日鐵化学株式会社 熱可塑性ポリヒドロキシポリエーテル樹脂を含有する硬化性樹脂組成物
EP2334691A1 (en) * 2008-08-28 2011-06-22 Dow Global Technologies LLC Phosphorus-containing compounds and polymeric compositions comprising same
JP5399733B2 (ja) * 2009-02-16 2014-01-29 新日鉄住金化学株式会社 難燃性リン含有エポキシ樹脂組成物及びその硬化物
JP6193689B2 (ja) * 2013-09-09 2017-09-06 新日鉄住金化学株式会社 リン含有エポキシ樹脂及び組成物、硬化物
JP6291978B2 (ja) 2014-03-31 2018-03-14 三菱ケミカル株式会社 リン含有エポキシ樹脂、リン含有エポキシ樹脂組成物、硬化物及び電気・電子回路用積層板
JP6956570B2 (ja) * 2017-09-01 2021-11-02 日鉄ケミカル＆マテリアル株式会社 リン含有エポキシ樹脂、その製造方法、エポキシ樹脂組成物及びその硬化物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW393496B (en) * 1998-04-29 2000-06-11 Chen Liou Wang Aryl phosphinate diglycidyl ethers and process for preparing the same
TW201136982A (en) * 2010-04-20 2011-11-01 Hong Tai Electric Ind Co Ltd Halogen-free flame retardant resin composition
TW201500412A (zh) * 2013-06-25 2015-01-01 Jiangsu Yoke Technology Co Ltd 含磷酚醛樹脂及包含其的阻燃環氧樹脂固化物
JP2015196720A (ja) * 2014-03-31 2015-11-09 三菱化学株式会社 リン含有エポキシ樹脂、リン含有エポキシ樹脂組成物、硬化物及び電気・電子回路用積層板

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KR102662809B1 (ko) 2024-05-02
JP2019147863A (ja) 2019-09-05
TW201938639A (zh) 2019-10-01
KR20190103039A (ko) 2019-09-04
CN110194843A (zh) 2019-09-03
CN110194843B (zh) 2023-01-03
JP7055664B2 (ja) 2022-04-18

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