TWI731298B - 印刷電路板 - Google Patents

印刷電路板 Download PDF

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Publication number
TWI731298B
TWI731298B TW108103192A TW108103192A TWI731298B TW I731298 B TWI731298 B TW I731298B TW 108103192 A TW108103192 A TW 108103192A TW 108103192 A TW108103192 A TW 108103192A TW I731298 B TWI731298 B TW I731298B
Authority
TW
Taiwan
Prior art keywords
resin layer
rough
roughness
thermosetting
interface
Prior art date
Application number
TW108103192A
Other languages
English (en)
Chinese (zh)
Other versions
TW202007239A (zh
Inventor
閔太泓
小椋一郎
張俊亨
崔晸宇
宋堯韓
Original Assignee
南韓商三星電機股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南韓商三星電機股份有限公司 filed Critical 南韓商三星電機股份有限公司
Publication of TW202007239A publication Critical patent/TW202007239A/zh
Application granted granted Critical
Publication of TWI731298B publication Critical patent/TWI731298B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW108103192A 2018-07-16 2019-01-29 印刷電路板 TWI731298B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020180082454A KR102214641B1 (ko) 2018-07-16 2018-07-16 인쇄회로기판
KR10-2018-0082454 2018-07-16

Publications (2)

Publication Number Publication Date
TW202007239A TW202007239A (zh) 2020-02-01
TWI731298B true TWI731298B (zh) 2021-06-21

Family

ID=69170027

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108103192A TWI731298B (zh) 2018-07-16 2019-01-29 印刷電路板

Country Status (3)

Country Link
JP (1) JP6938825B2 (https=)
KR (1) KR102214641B1 (https=)
TW (1) TWI731298B (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102880997B1 (ko) 2020-03-02 2025-11-04 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 모듈
WO2022024907A1 (ja) * 2020-07-29 2022-02-03 京セラ株式会社 回路基板およびその製造方法
KR102798468B1 (ko) * 2022-09-06 2025-04-23 주식회사 엔트리얼즈 다층 인쇄회로기판 제조방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204994111U (zh) * 2013-02-15 2016-01-20 株式会社村田制作所 层叠电路基板
TWM543773U (zh) * 2017-01-26 2017-06-21 長興材料工業股份有限公司 感光型乾膜

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080043408A (ko) * 1998-12-16 2008-05-16 이비덴 가부시키가이샤 도전성접속핀 및 패키지기판
JP2003258435A (ja) * 2002-03-07 2003-09-12 Shinko Electric Ind Co Ltd 配線基板用シート材料及び多層配線基板
SG163439A1 (en) 2003-04-15 2010-08-30 Denki Kagaku Kogyo Kk Metal base circuit board and its production process
JP2006191145A (ja) * 2006-03-20 2006-07-20 Kyocera Corp 多層配線基板
KR100752025B1 (ko) * 2006-07-10 2007-08-28 삼성전기주식회사 인쇄회로기판의 제조 방법
KR100815319B1 (ko) * 2006-08-30 2008-03-19 삼성전기주식회사 고밀도 인쇄회로기판 및 그 제조 방법
JP5855905B2 (ja) * 2010-12-16 2016-02-09 日本特殊陶業株式会社 多層配線基板及びその製造方法
KR101180366B1 (ko) * 2011-02-25 2012-09-10 주식회사 심텍 회로기판 및 그 제조방법
JP5885791B2 (ja) * 2013-08-20 2016-03-15 Ｊｘ金属株式会社 表面処理銅箔及びそれを用いた積層板、キャリア付銅箔、銅箔、プリント配線板、電子機器、電子機器の製造方法、並びに、プリント配線板の製造方法
JP5658399B1 (ja) * 2014-05-21 2015-01-21 株式会社フジクラ プリント配線板
JP6653466B2 (ja) * 2014-06-05 2020-02-26 パナソニックＩｐマネジメント株式会社 金属箔付き液晶ポリマーフィルムの製造方法、金属箔付き液晶ポリマーフィルム、多層プリント配線板の製造方法
KR102473405B1 (ko) * 2015-10-30 2022-12-02 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR20170079574A (ko) * 2015-12-30 2017-07-10 삼성전기주식회사 인쇄회로기판 및 그 제조방법
WO2017175649A1 (ja) * 2016-04-05 2017-10-12 株式会社村田製作所 液晶ポリマー片面積層板
JP7114214B2 (ja) * 2016-05-24 2022-08-08 味の素株式会社 接着フィルム
KR102494341B1 (ko) * 2017-11-08 2023-02-01 삼성전기주식회사 인쇄회로기판

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204994111U (zh) * 2013-02-15 2016-01-20 株式会社村田制作所 层叠电路基板
TWM543773U (zh) * 2017-01-26 2017-06-21 長興材料工業股份有限公司 感光型乾膜

Also Published As

Publication number Publication date
JP6938825B2 (ja) 2021-09-22
KR20200008389A (ko) 2020-01-28
TW202007239A (zh) 2020-02-01
JP2020013977A (ja) 2020-01-23
KR102214641B1 (ko) 2021-02-10

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