TWI711675B - 切片工藝用保護性塗層劑 - Google Patents

切片工藝用保護性塗層劑 Download PDF

Info

Publication number
TWI711675B
TWI711675B TW108102048A TW108102048A TWI711675B TW I711675 B TWI711675 B TW I711675B TW 108102048 A TW108102048 A TW 108102048A TW 108102048 A TW108102048 A TW 108102048A TW I711675 B TWI711675 B TW I711675B
Authority
TW
Taiwan
Prior art keywords
chemical formula
weight
parts
compound represented
independently
Prior art date
Application number
TW108102048A
Other languages
English (en)
Chinese (zh)
Other versions
TW201932553A (zh
Inventor
吳承燦
金昶圭
Original Assignee
南韓商Ｍｔｉ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020180007028A external-priority patent/KR101928831B1/ko
Priority claimed from KR1020180148346A external-priority patent/KR102094404B1/ko
Application filed by 南韓商Ｍｔｉ股份有限公司 filed Critical 南韓商Ｍｔｉ股份有限公司
Publication of TW201932553A publication Critical patent/TW201932553A/zh
Application granted granted Critical
Publication of TWI711675B publication Critical patent/TWI711675B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
TW108102048A 2018-01-19 2019-01-18 切片工藝用保護性塗層劑 TWI711675B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR10-2018-0148346 2018-01-19
KR1020180007028A KR101928831B1 (ko) 2018-01-19 2018-01-19 웨이퍼 가공용 보호코팅제 조성물, 이를 포함하는 웨이퍼 가공용 보호코팅제 및 이의 제조방법
??10-2018-0007028 2018-01-19
KR10-2018-0007028 2018-01-19
KR1020180148346A KR102094404B1 (ko) 2018-11-27 2018-11-27 다이싱 공정용 보호코팅제
??10-2018-0148346 2018-11-27

Publications (2)

Publication Number Publication Date
TW201932553A TW201932553A (zh) 2019-08-16
TWI711675B true TWI711675B (zh) 2020-12-01

Family

ID=67302381

Family Applications (2)

Application Number Title Priority Date Filing Date
TW109111606A TW202045640A (zh) 2018-01-19 2019-01-18 切片製程用保護性塗層劑
TW108102048A TWI711675B (zh) 2018-01-19 2019-01-18 切片工藝用保護性塗層劑

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW109111606A TW202045640A (zh) 2018-01-19 2019-01-18 切片製程用保護性塗層劑

Country Status (4)

Country Link
JP (1) JP6862028B2 (ko)
CN (1) CN111630113B (ko)
TW (2) TW202045640A (ko)
WO (1) WO2019143203A1 (ko)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007158026A (ja) * 2005-12-05 2007-06-21 Furukawa Electric Co Ltd:The チップ用保護膜形成用シート

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04323279A (ja) * 1991-04-23 1992-11-12 Asahi Denka Kogyo Kk 電子部品のコーティング剤
DE19943933A1 (de) * 1999-07-30 2001-02-01 Bayer Ag Lichtechte Beschichtungsmittel
JP4571850B2 (ja) * 2004-11-12 2010-10-27 東京応化工業株式会社 レーザーダイシング用保護膜剤及び該保護膜剤を用いたウエーハの加工方法
JP4886429B2 (ja) * 2006-08-30 2012-02-29 関西ペイント株式会社 水性樹脂組成物及びこれを含む水性塗料組成物
KR101413380B1 (ko) * 2007-08-28 2014-06-30 쓰리엠 이노베이티브 프로퍼티즈 캄파니 반도체 다이의 제조방법, 상기 방법으로 제조된 반도체다이를 포함하는 반도체 소자
JP4851434B2 (ja) * 2007-12-18 2012-01-11 古河電気工業株式会社 チップ保護用フィルム
KR101539762B1 (ko) * 2008-05-29 2015-07-27 동우 화인켐 주식회사 웨이퍼 다이싱용 보호막 조성물
CN102077326B (zh) * 2008-05-29 2014-04-16 东友Fine-Chem股份有限公司 用于晶片切割的保护膜组合物
US8991329B1 (en) * 2014-01-31 2015-03-31 Applied Materials, Inc. Wafer coating
KR101860549B1 (ko) * 2016-07-22 2018-05-24 (주)엠티아이 웨이퍼 가공용 보호 코팅제 조성물 및 이를 포함하는 보호 코팅제
KR101764167B1 (ko) * 2017-01-26 2017-08-02 (주)엠티아이 레이저 스크라이빙 공정의 웨이퍼 보호용 코팅제 조성물
CN106883778A (zh) * 2017-03-24 2017-06-23 东莞市吉晨胶粘制品有限公司 一种晶圆高温保护膜及其制作方法、使用方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007158026A (ja) * 2005-12-05 2007-06-21 Furukawa Electric Co Ltd:The チップ用保護膜形成用シート

Also Published As

Publication number Publication date
CN111630113A (zh) 2020-09-04
JP2020532881A (ja) 2020-11-12
WO2019143203A1 (ko) 2019-07-25
CN111630113B (zh) 2022-02-08
TW202045640A (zh) 2020-12-16
TW201932553A (zh) 2019-08-16
JP6862028B2 (ja) 2021-04-21

Similar Documents

Publication Publication Date Title
JP5511799B2 (ja) ウエハーダイシング用保護膜組成物
CN104962209B (zh) 粘结膜用剥离膜、以及使用该粘结膜用剥离膜的粘结膜
TWI711642B (zh) 環氧改性聚矽氧樹脂及其製造方法、硬化性組成物及電子零件
TWI663187B (zh) 熱硬化性組成物、硬化膜、彩色濾光片、液晶顯示元件、固體攝像元件及發光二極體發光體
US20120070689A1 (en) Coatings and Hard Mask Compositions for Integrated Circuit Applications, Methods of Production and Uses Thereof
JP6038637B2 (ja) 金属酸化物ナノ粒子とシルセスキオキサンポリマーとの複合体およびその製造方法、ならびにその複合体を用いて製造した複合材料
EP2615124B1 (en) Organopolysiloxane, temporary adhesive composition containing organopolysiloxane, and method of producing thinned wafer using the same
JP5278457B2 (ja) エポキシ樹脂組成物、それを用いたダイアタッチ方法及び該組成物の硬化物を有する半導体装置
KR20150100817A (ko) 규소 산화물 나노 입자와 실세스퀴옥산 중합체의 복합체 및 그의 제조 방법, 및 그 복합체를 사용하여 제조한 복합 재료
KR20150092127A (ko) 보호막 형성용 조성물, 보호막 형성용 시트, 및 경화 보호막을 구비한 칩
TWI495687B (zh) 矽氧烷樹脂組成物的硬化被膜形成方法
JP5525782B2 (ja) 接着剤組成物および接着フィルム
TWI711675B (zh) 切片工藝用保護性塗層劑
TWI617633B (zh) 晶片加工用保護塗層劑組合物及包含其的保護塗層劑
KR101928831B1 (ko) 웨이퍼 가공용 보호코팅제 조성물, 이를 포함하는 웨이퍼 가공용 보호코팅제 및 이의 제조방법
KR20140077108A (ko) 열경화성 수지 조성물
KR102094404B1 (ko) 다이싱 공정용 보호코팅제
TWI677543B (zh) 切片工藝用保護性塗層劑的剝離劑
JPH0673347A (ja) ウエハ加工用テープおよびその使用方法
KR20200002757A (ko) 다이싱 공정용 보호코팅제
JP2009203450A (ja) 接着剤組成物、および接着フィルム
KR20160006095A (ko) 스크린 프린팅용 저온 경화성 수지 조성물
JP6862027B2 (ja) ウェハ加工用保護コーティング剤組成物、及びそれを含む保護コーティング剤
TW202311317A (zh) 切割保護層用之樹脂組成物及半導體晶圓的加工方法
JPH0677194A (ja) ウエハ加工用テープおよびその使用方法