TWI711675B - Protected coating material for dicing process - Google Patents

Protected coating material for dicing process Download PDF

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TWI711675B
TWI711675B TW108102048A TW108102048A TWI711675B TW I711675 B TWI711675 B TW I711675B TW 108102048 A TW108102048 A TW 108102048A TW 108102048 A TW108102048 A TW 108102048A TW I711675 B TWI711675 B TW I711675B
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TW201932553A (en
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吳承燦
金昶圭
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南韓商Ｍｔｉ股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives

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  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
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  • Wood Science & Technology (AREA)
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  • Paints Or Removers (AREA)
  • Dicing (AREA)

Abstract

本發明涉及一種用於製備半導體的切片工藝用保護性塗層劑，具體涉及一種切片工藝用保護性塗層劑，其可以被塗布在晶圓片等的表面上而在半導體製備工藝中保護晶圓片等的表面。The invention relates to a protective coating agent for the slicing process for preparing semiconductors, in particular to a protective coating agent for the slicing process, which can be coated on the surface of a wafer or the like to protect the crystal during the semiconductor preparation process. The surface of the wafer etc.

Description

切片工藝用保護性塗層劑Protective coating agent for slicing process

本發明涉及一種用於製備半導體的切片工藝用保護性塗層劑，具體涉及一種切片工藝用保護性塗層劑，其可以被塗布在晶圓片等的表面上而在半導體製備工藝中保護晶圓片等的表面。The invention relates to a protective coating agent for the slicing process for preparing semiconductors, in particular to a protective coating agent for the slicing process, which can be coated on the surface of a wafer or the like to protect the crystal during the semiconductor preparation process. The surface of the wafer etc.

在半導體晶圓片加工工藝中，切片工藝，即鋸切工藝，是介於晶圓片製備工藝與封装工藝之間且將所述晶圓片以個別芯片單位分離的工藝。In the semiconductor wafer processing process, the slicing process, that is, the sawing process, is a process that is between the wafer preparation process and the packaging process and separates the wafers in individual chip units.

其中，在將半導體晶圓片的個別芯片用刀片互相分離的工藝中，落到芯片表面的碎片會造成不良。為了解決所述問題，從前使用的方法是將噴嘴沿著刀片的兩側與晶圓片的水平方向設置，以高壓噴射多量的水而立即去除落到芯片表面的碎片。所述方法在半導體芯片尺寸大，加工時間短，碎片量少時是有用的，然而，在半導體芯片的尺寸的減小，加工時間的增加，碎片產量增加時，無法立即去除碎片。Among them, in the process of separating individual chips of a semiconductor wafer from each other with a blade, the debris falling on the surface of the chip can cause defects. In order to solve the problem, the method used in the past is to arrange nozzles along both sides of the blade and the horizontal direction of the wafer, and spray a large amount of water at high pressure to immediately remove the debris falling on the surface of the chip. The method is useful when the size of the semiconductor chip is large, the processing time is short, and the amount of debris is small. However, when the size of the semiconductor chip is reduced, the processing time increases, and the output of debris increases, the debris cannot be removed immediately.

對此，為了克服所述問題，韓國專利申請第10-2009-0066314號公開了一種用聚氧化乙烯/聚環氧丙烷(Polyethyleneoxide/Polypropyleneoxide, PEO-PPO)，聚乙二醇(Polyethyleneglycol, PEG)以及其他添加即製備的洗滌劑組合物，所述聚氧化乙烯/聚環氧丙烷和聚乙二醇是非離子表面活性劑。In response to this, in order to overcome the problem, Korean Patent Application No. 10-2009-0066314 discloses a use of polyethylene oxide/polypropylene oxide (PEO-PPO), polyethylene glycol (PEG) As well as other detergent compositions prepared by adding, the polyethylene oxide/polypropylene oxide and polyethylene glycol are nonionic surfactants.

然而，用所述組合物進行鋸切工藝時，可以去除一定大小的碎片，但無法完全去除微小的碎片。結果，被殘留的微小碎片所引起的刮痕，凿痕等缺陷仍未解決。However, when the composition is used for the sawing process, fragments of a certain size can be removed, but tiny fragments cannot be completely removed. As a result, defects such as scratches, gouges, etc. caused by the remaining tiny fragments have not been resolved.

因此，仍然存在着對用於切片工藝的保護性塗層劑的需求，其可以在晶圓片表面型成塗層而防止在切片工藝和其他加工工藝中發生的刮痕，凿痕，污點，變白或腐蝕等缺陷。Therefore, there is still a need for a protective coating agent for the slicing process, which can form a coating on the surface of the wafer to prevent scratches, gouges, and stains that occur during the slicing process and other processing processes. Defects such as whitening or corrosion.

[技術問題][technical problem]

本發明是斟酌所述內容而提出的，其目的在於提供一種切片工藝用保護性塗層劑，其在半導體製備工藝中加工晶圓片等時保護表面并防止因雜質流入而發生的表面損傷。 [技術方案]The present invention is proposed in consideration of the content, and its purpose is to provide a protective coating agent for the slicing process, which protects the surface and prevents surface damage due to the influx of impurities during the processing of wafers in the semiconductor manufacturing process. [Technical solutions]

為了解決所述技術問題，本發明的切片工藝用保護性塗層劑組合物包括由下面的化學式1表示的化合物以及由下面的化學式2表示的化合物。 [化學式1]

Figure 02_image001
In order to solve the technical problem, the protective coating agent composition for the slicing process of the present invention includes a compound represented by the following Chemical Formula 1 and a compound represented by the following Chemical Formula 2. [Chemical formula 1]
Figure 02_image001

在所述化學式1中，R13 與R14 各自獨立地為C1~C10亞烷基，R15為C1~C10烷基，R24 與R25 各自獨立地為

Figure 02_image003
或
Figure 02_image005
，R0 為
Figure 02_image007
，
Figure 02_image009
或
Figure 02_image011
，R9 ，R10 ，R11 以及R32 各自獨立地為C1~C10烷基，R12 為C1~C10亞烷基，R1 為
Figure 02_image013
，
Figure 02_image015
或
Figure 02_image017
，R2 ，R3 ，R4 ，R5 ，R6 ，R7 以及R8 各自獨立地為C1~C15亞烷基，n，m以及l各自獨立地為1~50的有理數，R20 為C1~C10亞烷基，
Figure 02_image019
或
Figure 02_image021
，R27 ，R28 ，R29 ，R30 以及R31 各自獨立地為C1~C10亞烷基，R21 ，R22 以及R23 各自獨立地為C1~C10烷基，R16 為C1~C10烷基， [化學式2]
Figure 02_image023
在所述化學式2中，R17 ，R18 以及R19 各自獨立地為氫，芳基或C1~C10烷基。In the chemical formula 1, R 13 and R 14 are each independently a C1~C10 alkylene group, R15 is a C1~C10 alkyl group, and R 24 and R 25 are each independently
Figure 02_image003
or
Figure 02_image005
, R 0 is
Figure 02_image007
,
Figure 02_image009
or
Figure 02_image011
, R 9 , R 10 , R 11 and R 32 are each independently C1~C10 alkyl, R 12 is C1~C10 alkylene, R 1 is
Figure 02_image013
,
Figure 02_image015
or
Figure 02_image017
, R 2 , R 3 , R 4 , R 5 , R 6 , R 7 and R 8 are each independently a C1-C15 alkylene group, n, m and l are each independently a rational number from 1 to 50, and R 20 is C1~C10 alkylene,
Figure 02_image019
or
Figure 02_image021
, R 27 , R 28 , R 29 , R 30 and R 31 are each independently a C1~C10 alkylene group, R 21 , R 22 and R 23 are each independently a C1~C10 alkyl group, and R 16 is C1~C10 Alkyl, [Chemical formula 2]
Figure 02_image023
In the chemical formula 2, R 17 , R 18 and R 19 are each independently hydrogen, an aryl group, or a C1~C10 alkyl group.

作為本發明的一個優選實施例，由所述化學式1表示的化合物的R24 與R25 可以為

Figure 02_image003
。As a preferred embodiment of the present invention, R 24 and R 25 of the compound represented by the chemical formula 1 may be
Figure 02_image003
.

作為本發明的一個優選實施例，由所述化學式1表示的化合物的R24 可以為

Figure 02_image003
，R25 可以為
Figure 02_image005
。As a preferred embodiment of the present invention, R 24 of the compound represented by the chemical formula 1 may be
Figure 02_image003
, R 25 can be
Figure 02_image005
.

作為本發明的一個優選實施例，本發明的保護性塗層劑組合物還可以包括極性有機溶劑，表面調節用添加劑，流動性添加劑以及附著促進劑中一種以上。As a preferred embodiment of the present invention, the protective coating composition of the present invention may also include at least one of polar organic solvents, surface adjustment additives, fluidity additives and adhesion promoters.

本發明的切片工藝用保護性塗層劑可以包括由下面的化學式10表示的化合物。 [化學式10]

Figure 02_image026
The protective coating agent for the slicing process of the present invention may include a compound represented by Chemical Formula 10 below. [Chemical formula 10]
Figure 02_image026

在所述化學式10中，R13 與및R14 各自獨立地為C1~C10亞烷基，R15 為C1~C10烷基，R24 與R25 各自獨立地為

Figure 02_image003
或
Figure 02_image005
，R0 為
Figure 02_image007
，
Figure 02_image009
或
Figure 02_image011
，R9 ，R10 ，，R11 以及R32 各自獨立地為氫或C1~C10烷基，R12 為C1~C10亞烷基，R1 為
Figure 02_image013
，
Figure 02_image015
或
Figure 02_image017
，R2 ，R3 ， R4 ，R5 ，R6 ，R7 以及R8 各自獨立地為C1~C15亞烷基，n，m以及l各自獨立地為1~50的有理數，R16 為C1~C10烷基，R20 為C1~C10亞烷基，
Figure 02_image019
或
Figure 02_image021
，R27 ，R28 ，R29 ，R30 以及R31 各自獨立地為C1~C10亞烷基，R21 ，R22 以及R23 各自獨立地為C1~C10烷基， A+ 為
Figure 02_image037
，R17 ，R18 以及R19 各自獨立地為氫，芳基或C1~C10烷基。In the chemical formula 10, R 13 and R 14 are each independently a C1~C10 alkylene group, R 15 is a C1~C10 alkyl group, and R 24 and R 25 are each independently
Figure 02_image003
or
Figure 02_image005
, R 0 is
Figure 02_image007
,
Figure 02_image009
or
Figure 02_image011
, R 9 , R 10 , R 11 and R 32 are each independently hydrogen or C1~C10 alkyl, R 12 is C1~C10 alkylene, R 1 is
Figure 02_image013
,
Figure 02_image015
or
Figure 02_image017
, R 2 , R 3 , R 4 , R 5 , R 6 , R 7 and R 8 are each independently a C1~C15 alkylene group, n, m and l are each independently a rational number from 1 to 50, and R 16 is C1~C10 alkyl, R 20 is C1~C10 alkylene,
Figure 02_image019
or
Figure 02_image021
, R 27 , R 28 , R 29 , R 30 and R 31 are each independently a C1~C10 alkylene group, R 21 , R 22 and R 23 are each independently a C1~C10 alkyl group, and A + is
Figure 02_image037
, R 17 , R 18 and R 19 are each independently hydrogen, aryl or C1-C10 alkyl.

作為本發明的一個優選實施例，由所述化學式10表示的化合物的R24 與R25 可以為

Figure 02_image003
。As a preferred embodiment of the present invention, R 24 and R 25 of the compound represented by the chemical formula 10 may be
Figure 02_image003
.

作為本發明的一個優選實施例，由所述化學式10表示的化合物的R24 可以為

Figure 02_image003
，R25 可以為
Figure 02_image005
。As a preferred embodiment of the present invention, R 24 of the compound represented by the chemical formula 10 may be
Figure 02_image003
, R 25 can be
Figure 02_image005
.

作為本發明的一個優選實施例，對由所述化學式10表示的化合物100重量份，本發明的保護性塗層劑還可以包括極性有機溶劑8~500重量份，表面調節用添加劑0.08~100重量份，流動性調整劑0.4~200重量份以及附著促進劑0.32~250重量份。As a preferred embodiment of the present invention, for 100 parts by weight of the compound represented by the chemical formula 10, the protective coating agent of the present invention may further include 8 to 500 parts by weight of a polar organic solvent, and 0.08 to 100 parts by weight of additives for surface adjustment. Parts, 0.4~200 parts by weight of fluidity regulator and 0.32~250 parts by weight of adhesion promoter.

進而，本發明的切片工藝用保護性塗層劑的製備方法可以包括：第一步骤，對由下面的化學式7表示的化合物，由下面的化學式8表示的化合物，由下面的化學式9表示的化合物以及溶劑進行混合與聚合反應而製備第一聚合物；第二步骤，對製備的第一聚合物與由下面的化學式6表示的化合物以及由下面的化學式4表示的化合物中一種以上進行混合與反應而製備第二聚合物或第三聚合物；以及第三步骤，其對製備的第二聚合物或第三聚合物與由下面的化學式2表示的化合物以及水進行混合與反應而製備由下面的化學式10表示的化合物。 [化學式7]

Figure 02_image039
Furthermore, the preparation method of the protective coating agent for the slicing process of the present invention may include: a first step, for the compound represented by the following chemical formula 7, the compound represented by the following chemical formula 8, and the compound represented by the following chemical formula 9 And the solvent is mixed and polymerized to prepare the first polymer; in the second step, the prepared first polymer is mixed and reacted with the compound represented by the following chemical formula 6 and the compound represented by the following chemical formula 4 And preparing a second polymer or a third polymer; and a third step of mixing and reacting the prepared second polymer or third polymer with the compound represented by the following chemical formula 2 and water to prepare the following The compound represented by Chemical Formula 10. [Chemical formula 7]
Figure 02_image039

在所述化學式7，R1 為

Figure 02_image013
，
Figure 02_image015
或
Figure 02_image017
，R2 ，R3 ，R4 ，R5 ，R6 ，R7 以及R8 各自獨立地為C1~C15亞烷基，n，m以及l各自獨立地為1~50的有理數， [化學式8]
Figure 02_image044
在所述化學式8，R0 為
Figure 02_image007
，
Figure 02_image009
或
Figure 02_image011
，R9 ，R10 ，R11 以及R32 各自獨立地為氫或C1~C10烷基，R12 為C1~C10亞烷基， [化學式9]
Figure 02_image047
在所述化學式9，R13 與R14 各自獨立地為C1~C10亞烷基，R15 為C1~C10烷基， [化學式6]
Figure 02_image049
在所述化學式6，R20 為C1~C10亞烷基，
Figure 02_image019
或
Figure 02_image021
，R27 ，R28 ，R29 ，R30 以及R31 各自獨立地為C1~C10亞烷基，R21 ,，R22 以及R23 各自獨立地為C1~C10烷基， [化學式4]
Figure 02_image052
在所述化學式4，R16 為C1~C10烷基， [化學式2]
Figure 02_image023
在所述化學式2，R17 ，R18 以及R19 各自獨立地為氫，芳基或C1~C10烷基， [化學式10]
Figure 02_image026
在所述化學式10，R13 與R14 各自獨立地為C1~C10亞烷基，R15 為C1~C10烷基，R24 與R25 各自獨立地為
Figure 02_image003
或
Figure 02_image005
，R0 為
Figure 02_image007
，
Figure 02_image009
或
Figure 02_image011
，R9 ，R10 ，R11 以及R32 各自獨立地為氫或C1~C10烷基，R12 為C1~C10亞烷基，R1 為
Figure 02_image013
，
Figure 02_image015
或
Figure 02_image017
，R2 ，R3 ，R4 ，R5 ，R6 ，R7 以及R8 各自獨立地為C1~C15亞烷基，n，m以及l各自獨立地為1~50的有理數，R16 為C1~C10烷基，R20 為C1~C10亞烷基，
Figure 02_image019
或
Figure 02_image021
，R27 ，R28 ，R29 ，R30 以及R31 各自獨立地為C1~C10亞烷基，R21 ，R22 以及R23 各自獨立地為C1~C10烷基，A+ 為
Figure 02_image037
，R17 ，R18 以及R19 各自獨立地為氫，芳基或C1~C10烷基。In the chemical formula 7, R 1 is
Figure 02_image013
,
Figure 02_image015
or
Figure 02_image017
, R 2 , R 3 , R 4 , R 5 , R 6 , R 7 and R 8 are each independently a C1~C15 alkylene group, n, m and l are each independently a rational number from 1 to 50, [Chemical formula 8 ]
Figure 02_image044
In the chemical formula 8, R 0 is
Figure 02_image007
,
Figure 02_image009
or
Figure 02_image011
, R 9 , R 10 , R 11 and R 32 are each independently hydrogen or C1~C10 alkyl, R 12 is C1~C10 alkylene, [Chemical formula 9]
Figure 02_image047
In the chemical formula 9, R 13 and R 14 are each independently a C1~C10 alkylene group, and R 15 is a C1~C10 alkyl group, [Chemical formula 6]
Figure 02_image049
In the chemical formula 6, R 20 is a C1~C10 alkylene group,
Figure 02_image019
or
Figure 02_image021
, R 27 , R 28 , R 29 , R 30 and R 31 are each independently a C1~C10 alkylene group, R 21 , R 22 and R 23 are each independently a C1~C10 alkyl group, [Chemical formula 4]
Figure 02_image052
In the chemical formula 4, R 16 is a C1~C10 alkyl group, [Chemical formula 2]
Figure 02_image023
In the chemical formula 2, R 17 , R 18 and R 19 are each independently hydrogen, an aryl group or a C1~C10 alkyl group, [Chemical formula 10]
Figure 02_image026
In the chemical formula 10, R 13 and R 14 are each independently a C1~C10 alkylene group, R 15 is a C1~C10 alkyl group, and R 24 and R 25 are each independently
Figure 02_image003
or
Figure 02_image005
, R 0 is
Figure 02_image007
,
Figure 02_image009
or
Figure 02_image011
, R 9 , R 10 , R 11 and R 32 are each independently hydrogen or C1~C10 alkyl, R 12 is C1~C10 alkylene, R 1 is
Figure 02_image013
,
Figure 02_image015
or
Figure 02_image017
, R 2 , R 3 , R 4 , R 5 , R 6 , R 7 and R 8 are each independently a C1~C15 alkylene group, n, m and l are each independently a rational number from 1 to 50, and R 16 is C1~C10 alkyl, R 20 is C1~C10 alkylene,
Figure 02_image019
or
Figure 02_image021
, R 27 , R 28 , R 29 , R 30 and R 31 are each independently a C1~C10 alkylene group, R 21 , R 22 and R 23 are each independently a C1~C10 alkyl group, and A + is
Figure 02_image037
, R 17 , R 18 and R 19 are each independently hydrogen, aryl or C1-C10 alkyl.

作為本發明的一個優選實施例，在所述第二步骤可以對製備的第一聚合物與由下面的化學式4表示的化合物進行混合與反應而製備第二聚合物，在所述第三步骤可以對製備的第二聚合物與由所述化學式2表示的化合物與水進行混合與反應而製備由下面的化學式10表示的化合物。 [化學式10]

Figure 02_image026
As a preferred embodiment of the present invention, in the second step, the prepared first polymer can be mixed and reacted with the compound represented by the following chemical formula 4 to prepare the second polymer. In the third step, The prepared second polymer is mixed and reacted with the compound represented by the chemical formula 2 and water to prepare the compound represented by the following chemical formula 10. [Chemical formula 10]
Figure 02_image026

在所述化學式10，R13 與R14 各自獨立地為C1~C10亞烷基，R15 為C1~C10烷基，R24 以及R25 為

Figure 02_image003
，R0 為
Figure 02_image007
，
Figure 02_image009
或
Figure 02_image011
，R9 ，R10 ，R11 以及R32 各自獨立地為C1~C10烷基，R12 為C1~C10亞烷基，R1 為
Figure 02_image013
，
Figure 02_image015
或
Figure 02_image017
，R2 ，R3 ，R4 ，R5 ，R6 ，R7 以及R8 各自獨立地為C1~C15亞烷基，n，m以及l各自獨立地為1~50的有理數，R16 為C1~C10烷基，A+ 為
Figure 02_image037
，R17 ，R18 以及R19 各自獨立地為氫，芳基或C1~C10烷基。In the chemical formula 10, R 13 and R 14 are each independently a C1~C10 alkylene group, R 15 is a C1~C10 alkyl group, R 24 and R 25 are
Figure 02_image003
, R 0 is
Figure 02_image007
,
Figure 02_image009
or
Figure 02_image011
, R 9 , R 10 , R 11 and R 32 are each independently C1~C10 alkyl, R 12 is C1~C10 alkylene, R 1 is
Figure 02_image013
,
Figure 02_image015
or
Figure 02_image017
, R 2 , R 3 , R 4 , R 5 , R 6 , R 7 and R 8 are each independently a C1~C15 alkylene group, n, m and l are each independently a rational number from 1 to 50, and R 16 is C1~C10 alkyl, A + is
Figure 02_image037
, R 17 , R 18 and R 19 are each independently hydrogen, aryl or C1-C10 alkyl.

作為本發明的一個優選實施例，第二步骤可以包括第2-1步骤和第2-2步骤，在第2-1步骤，對製備的第一聚合物與由所述化學式6表示的化合物進行混合與反應而製備第三中間聚合物，在第2-2步骤，對製備的第三中間聚合物與由所述化學式4表示的化合物進行混合與反應而製備第三聚合物，還有，在第三步骤可以對製備的第三聚合物與由所述化學式2表示的化合物與水進行混合與反應而製備由所述化學式10表示的化合物。 [化學式10]

Figure 02_image026
As a preferred embodiment of the present invention, the second step may include step 2-1 and step 2-2. In step 2-1, the prepared first polymer and the compound represented by the chemical formula 6 The third intermediate polymer is prepared by mixing and reacting. In step 2-2, the prepared third intermediate polymer is mixed and reacted with the compound represented by the chemical formula 4 to prepare the third polymer, and The third step may mix and react the prepared third polymer with the compound represented by the chemical formula 2 and water to prepare the compound represented by the chemical formula 10. [Chemical formula 10]
Figure 02_image026

在所述化學式10，R13 與R14 各自獨立地為C1~C10亞烷基，R15 為C1~C10烷基，R24 為

Figure 02_image003
，R25 為
Figure 02_image005
，R0 為
Figure 02_image007
，
Figure 02_image009
或
Figure 02_image011
，R9 ，R10 ，R11 以及R32 各自獨立地為C1~C10烷基，R12 為C1~C10亞烷基，R1 為
Figure 02_image013
，
Figure 02_image015
或
Figure 02_image017
，R2 ，R3 ，R4 ，R5 ，R6 ，R7 以及R8 各自獨立地為C1~C15亞烷基，n，m以及l各自獨立地為1~50的有理數，R16 為C1~C10烷基，R20 為C1~C10亞烷基，
Figure 02_image019
或
Figure 02_image021
，R27 ，R28 ，R29 ，R30 以及R31 各自獨立地為C1~C10亞烷基，R21 ，R22 以及R23 各自獨立地為C1~C10烷基，A+ 為
Figure 02_image037
，R17 ，R18 以及R19 各自獨立地為氫，芳基，或C1~C10烷基。In the chemical formula 10, R 13 and R 14 are each independently a C1~C10 alkylene group, R 15 is a C1~C10 alkyl group, and R 24 is
Figure 02_image003
, R 25 is
Figure 02_image005
, R 0 is
Figure 02_image007
,
Figure 02_image009
or
Figure 02_image011
, R 9 , R 10 , R 11 and R 32 are each independently C1~C10 alkyl, R 12 is C1~C10 alkylene, R 1 is
Figure 02_image013
,
Figure 02_image015
or
Figure 02_image017
, R 2 , R 3 , R 4 , R 5 , R 6 , R 7 and R 8 are each independently a C1~C15 alkylene group, n, m and l are each independently a rational number from 1 to 50, and R 16 is C1~C10 alkyl, R 20 is C1~C10 alkylene,
Figure 02_image019
or
Figure 02_image021
, R 27 , R 28 , R 29 , R 30 and R 31 are each independently a C1~C10 alkylene group, R 21 , R 22 and R 23 are each independently a C1~C10 alkyl group, and A + is
Figure 02_image037
, R 17 , R 18 and R 19 are each independently hydrogen, aryl, or C1-C10 alkyl.

作為本發明的一個優選實施例，對由所述化學式7表示的化合物100重量，所述保護性塗層劑可以包括由所述化學式8表示的化合物101~153重量份，由所述化學式9表示的化合物11~18重量，由所述化學式4表示的化合物29~45重量份，由所述化學式5表示的化合物8~13重量，由所述化學式6表示的化合物33~51重量份。As a preferred embodiment of the present invention, for 100 parts by weight of the compound represented by the chemical formula 7, the protective coating agent may include 101 to 153 parts by weight of the compound represented by the chemical formula 8, which is represented by the chemical formula 9 By weight of the compound 11-18 parts by weight, 29~45 parts by weight of the compound represented by the chemical formula 4, 8-13 parts by weight of the compound represented by the chemical formula 5, and 33~51 parts by weight of the compound represented by the chemical formula 6.

在表示本發明的化合物，*記號指的是化學鍵部位，對由所述化學式7表示的化合物舉一個例子來說明，在構成R1 的

Figure 02_image013
中，*記號指的是與化學式7的-OH互相連結的部分。 [發明效果]In the compounds of the present invention, said symbol * refers to a chemical bond site of the compound represented by the Chemical Formula 7 an example will be described, the configuration of R 1
Figure 02_image013
Among them, the * mark refers to the part connected to -OH of Chemical Formula 7. [Invention Effect]

本發明的切片工藝用保護性塗層劑在半導體製備工藝的包括晶圓片切削工藝的加工工藝中可以基本上防止在晶圓片表面上發生的損傷或由於雜質發生的污染。The protective coating agent for the slicing process of the present invention can basically prevent damage to the surface of the wafer or contamination due to impurities in the processing process of the semiconductor manufacturing process including the wafer cutting process.

還有，所述保護性塗層劑具有被熱或紫外線(UV)所硬化的性質，然而硬化後不受熱或紫外線的影響，而且，所述保護性塗層劑因具有耐水性與硬度，在製備工藝中不受水的影響而可以防止晶圓片表面被碎片受傷，製備工藝結束後也可以由碱性溶液容易被去除。In addition, the protective coating agent has the property of being hardened by heat or ultraviolet (UV), but after hardening, it is not affected by heat or ultraviolet rays. Moreover, the protective coating agent has water resistance and hardness, so The preparation process is not affected by water and can prevent the surface of the wafer from being damaged by fragments, and it can also be easily removed by the alkaline solution after the preparation process.

[具體實施方式][Detailed ways]

以下，配合附圖而詳細說明本發明的實施例，以便本發明所屬領域的通常知識者可以容易實施本發明的實施例，本發明可以以多種不同的型態實現而不局限於本發明中說明的實施例。Hereinafter, the embodiments of the present invention will be described in detail in conjunction with the accompanying drawings, so that those skilled in the art to which the present invention belongs can easily implement the embodiments of the present invention. The present invention can be implemented in many different forms and is not limited to the description in the present invention.的实施例。 Example.

本發明的切片工藝用保護性塗層劑可以包括由下面的化學式1表示的化合物以及由下面的化學式2表示的化合物。 [化學式1]

Figure 02_image001
The protective coating agent for the slicing process of the present invention may include a compound represented by the following Chemical Formula 1 and a compound represented by the following Chemical Formula 2. [Chemical formula 1]
Figure 02_image001

在所述化學式1，R13 與R14 可以各自獨立地為C1~C10亞烷基，優選可以為C1~C5亞烷基。In the chemical formula 1, R 13 and R 14 may each independently be a C1-C10 alkylene group, and preferably may be a C1-C5 alkylene group.

還有，在所述化學式1，R15 可以為C1~C10烷基，優選可以為C1~C5烷基。In addition, in the chemical formula 1, R 15 may be a C1-C10 alkyl group, preferably a C1-C5 alkyl group.

還有，在所述化學式1，R24 與R25 可以各自獨立地為

Figure 02_image003
或
Figure 02_image005
。Also, in the chemical formula 1, R 24 and R 25 may each independently be
Figure 02_image003
or
Figure 02_image005
.

在所述化學式1，R0 可以為

Figure 02_image007
，
Figure 02_image009
或
Figure 02_image011
，優選可以為
Figure 02_image007
，R9 ，R10 ，R11 以及R32 可以各自獨立地為氫或C1~C10烷基，優選可以為C1~C5烷基，R12 可以為C1~C10亞烷基，優選可以為C1~C5亞烷基。In the chemical formula 1, R 0 can be
Figure 02_image007
,
Figure 02_image009
or
Figure 02_image011
, Preferably can be
Figure 02_image007
, R 9 , R 10 , R 11 and R 32 can each independently be hydrogen or C1~C10 alkyl, preferably C1~C5 alkyl, R 12 can be C1~C10 alkylene, preferably C1~ C5 alkylene.

還有，在所述化學式1，R1 可以為

Figure 02_image013
，
Figure 02_image015
或
Figure 02_image017
，優選可以為
Figure 02_image013
。Also, in the chemical formula 1, R 1 may be
Figure 02_image013
,
Figure 02_image015
or
Figure 02_image017
, Preferably can be
Figure 02_image013
.

還有，在所述化學式1，R2 ，R3 ，R4 ，R5 ，R6 ，R7 以及R8 可以各自獨立地為C1~C15亞烷基，優選可以為C1~ C10亞烷基，n，m，以及l可以各自獨立地為1~50的有理數，可以各自獨立地為1~20的有理數。In addition, in the chemical formula 1, R 2 , R 3 , R 4 , R 5 , R 6 , R 7 and R 8 may each independently be a C1~C15 alkylene group, preferably a C1~C10 alkylene group , N, m, and l can each independently be a rational number from 1 to 50, and can each independently be a rational number from 1 to 20.

還有，在所述化學式1，R16 可以為C1~C10烷基，優選可以為C1~C5烷基，R20 可以為C1~C10亞烷基，

Figure 02_image019
或
Figure 02_image021
，優選可以為C1~C10亞烷基，更加優選可以為C1~C5亞烷基，R27 ，R28 ，R29 ，R30 以及R31 可以各自獨立地為C1~C10亞烷基，優選可以為C1~C10亞烷基，R21 ，R22 以及R23 可以各自獨立地為C1~C10烷基，優選可以為C1~C5烷基。 [化學式2]
Figure 02_image023
Also, in the chemical formula 1, R 16 can be a C1~C10 alkyl group, preferably a C1~C5 alkyl group, and R 20 can be a C1~C10 alkylene group,
Figure 02_image019
or
Figure 02_image021
, Preferably can be C1~C10 alkylene, more preferably can be C1~C5 alkylene, R 27 , R 28 , R 29 , R 30 and R 31 can each independently be C1~C10 alkylene, preferably It is a C1-C10 alkylene group, and R 21 , R 22 and R 23 may each independently be a C1-C10 alkyl group, and preferably may be a C1-C5 alkyl group. [Chemical formula 2]
Figure 02_image023

在所述化學式2，R17 ，R18 以及R19 可以各自獨立地為氫，芳基或C1~C10烷基，優選可以為C1~C5烷基。In the chemical formula 2, R 17 , R 18 and R 19 may each independently be hydrogen, an aryl group or a C1~C10 alkyl group, preferably a C1~C5 alkyl group.

還有，在所述化學式1表示的化合物，優選地，R24 與R25 可以為

Figure 02_image003
， 在所述化學式1表示的化合物，優選地，R24 可以為
Figure 02_image003
，R25 可以為
Figure 02_image005
。Also, in the compound represented by the chemical formula 1, preferably, R 24 and R 25 may be
Figure 02_image003
In the compound represented by the chemical formula 1, preferably, R 24 may be
Figure 02_image003
, R 25 can be
Figure 02_image005
.

還有，本發明的保護性塗層劑組合物還可以包括極性有機溶劑，表面調節用添加劑，流動性調整劑以及附著促進劑中一種以上，優選地，所述保護性塗層劑組合物還可以包括極性有機溶劑，表面調節用添加劑，流動性添加劑以及附著促進劑。In addition, the protective coating composition of the present invention may also include at least one of polar organic solvents, surface adjustment additives, fluidity regulators and adhesion promoters. Preferably, the protective coating composition also It may include polar organic solvents, surface conditioning additives, fluidity additives and adhesion promoters.

本發明的切片工藝用保護性塗層劑可以包括由下面的化學式10表示的化合物。 [化學式10]

Figure 02_image026
The protective coating agent for the slicing process of the present invention may include a compound represented by Chemical Formula 10 below. [Chemical formula 10]
Figure 02_image026

在所述化學式10，R13 與R14 分別各自獨立地為C1~C10亞烷基，優選可以為C1~C5亞烷基，R15 可以為C1~C10烷基，優選可以為C1~C5烷基。In the chemical formula 10, R 13 and R 14 are each independently a C1~C10 alkylene group, preferably a C1~C5 alkylene group, R 15 can be a C1~C10 alkyl group, preferably a C1~C5 alkylene group base.

還有，在所述化學式10，R24 與R25 可以各自獨立地為

Figure 02_image003
或
Figure 02_image005
。Also, in the chemical formula 10, R 24 and R 25 may each independently be
Figure 02_image003
or
Figure 02_image005
.

還有，在所述化學式10，R0 可以為

Figure 02_image007
，
Figure 02_image009
或
Figure 02_image011
，優選可以為
Figure 02_image007
，R9 ，R10 ，R11 以及R32 可以各自獨立地為氫或C1~C10烷基，優選可以為C1~C5烷基，R12 可以為C1~C10亞烷基，優選可以為C1~C5亞烷基。Also, in the chemical formula 10, R 0 can be
Figure 02_image007
,
Figure 02_image009
or
Figure 02_image011
, Preferably can be
Figure 02_image007
, R 9 , R 10 , R 11 and R 32 can each independently be hydrogen or C1~C10 alkyl, preferably C1~C5 alkyl, R 12 can be C1~C10 alkylene, preferably C1~ C5 alkylene.

還有，在所述化學式10，R1 可以為

Figure 02_image013
，
Figure 02_image015
或
Figure 02_image017
，優選可以為
Figure 02_image013
。Also, in the chemical formula 10, R 1 may be
Figure 02_image013
,
Figure 02_image015
or
Figure 02_image017
, Preferably can be
Figure 02_image013
.

還有，在所述化學式10，R2 ，R3 ，R4 ，R5 ，R6 ，R7 以及R8 可以各自獨立地為C1~C15亞烷基，優選可以為C1~C10亞烷基，n，m以及l可以各自獨立地為1~50的有理數，優選可以為1~20的有理數。In addition, in the chemical formula 10, R 2 , R 3 , R 4 , R 5 , R 6 , R 7 and R 8 may each independently be a C1-C15 alkylene group, preferably a C1-C10 alkylene group , N, m, and l may each independently be a rational number from 1 to 50, preferably a rational number from 1 to 20.

還有，在所述化學式10，R16 可以為C1~C10烷基，優選可以為C1~C5烷基，R20 可以為C1~C10亞烷基，

Figure 02_image019
或
Figure 02_image021
，優選可以為C1~C10亞烷基，更加優選可以為C1~C5亞烷基，R27 ，R28 ，R29 ，R30 以及R31 可以各自獨立地為C1~C10亞烷基，R21 ，R22 以及R23 可以各自獨立地為C1~C10烷基，優選可以為C1~C5烷基。Also, in the chemical formula 10, R 16 can be a C1~C10 alkyl group, preferably a C1~C5 alkyl group, and R 20 can be a C1~C10 alkylene group,
Figure 02_image019
or
Figure 02_image021
, Preferably can be C1~C10 alkylene, more preferably can be C1~C5 alkylene, R 27 , R 28 , R 29 , R 30 and R 31 can each independently be C1~C10 alkylene, R 21 , R 22 and R 23 may each independently be a C1-C10 alkyl group, and preferably may be a C1-C5 alkyl group.

還有，在所述化學式10，A+ 可以為

Figure 02_image037
，R17 ，R18 以及R19 可以各自獨立地為氫，芳基或C1~C10烷基，優選可以為C1~C5烷基。Also, in the chemical formula 10, A + can be
Figure 02_image037
, R 17 , R 18 and R 19 may each independently be hydrogen, an aryl group or a C1~C10 alkyl group, preferably a C1~C5 alkyl group.

還有，在由化學式10表示的化合物，優選地，R24 與R25 可以為

Figure 02_image003
，在由化學式10表示的化合物中，優選地，R24 可以為
Figure 02_image003
，R25 可以為
Figure 02_image005
。Also, in the compound represented by Chemical Formula 10, preferably, R 24 and R 25 may be
Figure 02_image003
, In the compound represented by Chemical Formula 10, preferably, R 24 may be
Figure 02_image003
, R 25 can be
Figure 02_image005
.

進而，本發明的切片工藝用保護性塗層劑還可以包括極性有機溶劑，表面調節用添加劑，流動性調整劑以及附著促進劑中一種以上，優選可以包括極性有機溶劑，表面調節用添加劑，流動性調整劑以及附著促進劑，而且，本發明的切片工藝用保護性塗層劑還可以包括水。Furthermore, the protective coating agent for the slicing process of the present invention may also include at least one of a polar organic solvent, an additive for surface adjustment, a fluidity adjuster, and an adhesion promoter, and preferably may include a polar organic solvent, an additive for surface adjustment, and flowability. In addition, the protective coating agent for the slicing process of the present invention may also include water.

首先，極性有機溶劑用於溶解由化學式10表示的化合物，可以包括醇類溶劑，酮類溶劑以及二醇醚系溶劑中一種以上，優選可以包括醇類溶劑與酮類溶劑中一種以上，更加優選可以包括C1~C10醇類溶劑。First, the polar organic solvent is used to dissolve the compound represented by Chemical Formula 10, and may include one or more of alcohol solvents, ketone solvents and glycol ether solvents, and preferably may include at least one of alcohol solvents and ketone solvents, more preferably Can include C1~C10 alcohol solvents.

而且，對由化學式10表示的化合物100重量份，極性有機溶劑可以占8~500重量份，優選可以占8~36重量份，更加優選可以占9~33重量份。由化學式10表示的化合物的含量少於8重量份，所述化合物會被析出；由化學式10表示的化合物的含量超過500重量份，用本發明的保護性塗層劑進行塗布時會有塗層狀態不良的問題。Moreover, for 100 parts by weight of the compound represented by Chemical Formula 10, the polar organic solvent may account for 8 to 500 parts by weight, preferably 8 to 36 parts by weight, and more preferably 9 to 33 parts by weight. If the content of the compound represented by chemical formula 10 is less than 8 parts by weight, the compound will be precipitated; if the content of the compound represented by chemical formula 10 exceeds 500 parts by weight, there will be a coating when coated with the protective coating agent of the present invention Poor state issues.

其次，表面調節用添加劑用於給用本發明的保護性塗層劑來塗布後的表面滑移特性，可以包括硅系表面調節用添加劑，優選可以包括PROTEX International社的MODAREZ K-SE 305，MODAREZ K-SL 106，MODAREZ K-SL 107，BYK社的BYK-331，BYK-333，BYK-348以及BYK-3455中一種以上。Secondly, the surface adjustment additive is used to give the surface slip characteristics after coating with the protective coating agent of the present invention. It may include a silicon-based surface adjustment additive, and preferably may include MODAREZ K-SE 305, MODAREZ from PROTEX International. One or more of K-SL 106, MODAREZ K-SL 107, BYK-331, BYK-333, BYK-348 and BYK-3455 of BYK.

而且，對由化學式10表示的化合物100重量份，表面調節用添加劑可以占0.08~100重量份，優選可以占0.08~0.6重量份，更加優選可以包括0.09~0.55重量份。表面調節用添加劑的重量份小於0.08重量份時，因滑移特性的不足而會發生雜質附著的問題；表面調節用添加劑的重量份超過100重量份時，密著力會減少。Furthermore, for 100 parts by weight of the compound represented by Chemical Formula 10, the surface adjustment additive may account for 0.08-100 parts by weight, preferably may account for 0.08-0.6 parts by weight, and more preferably may include 0.09-0.55 parts by weight. When the part by weight of the surface conditioning additive is less than 0.08 parts by weight, the problem of adhesion of impurities may occur due to insufficient slip properties; when the weight part of the surface conditioning additive exceeds 100 parts by weight, the adhesion force will decrease.

其次，流動性調整劑用於調節本發明保護性塗層劑的黏度，可以包括PROTEX international社的PROX A 300，PROX AM 162 S，SYNTHRO THIX 608，BYK社的BYK-405，BYK-420以及BYK-7420 ES中一種以上。Secondly, the fluidity regulator is used to adjust the viscosity of the protective coating agent of the present invention. It can include PROX A 300, PROX AM 162 S, SYNTHRO THIX 608, BYK BYK-405, BYK-420 and BYK from PROTEX international. -7420 ES more than one kind.

而且，對化學式10表示的化合物100重量份，流動性調整劑可以占0.4~200重量份，優選可以占0.4~0.6重量份，更加優選可以占0.45~0.55重量份。流動性調整劑占的重量份小於0.4重量份時，因為黏度低，用本發明的保護性塗層劑進行塗層時塗層厚度會變薄，流動性調整劑占的重量份超過200重量份時，因為黏度高，塗層會缺乏均勻性。Moreover, for 100 parts by weight of the compound represented by Chemical Formula 10, the fluidity regulator may account for 0.4 to 200 parts by weight, preferably 0.4 to 0.6 parts by weight, and more preferably 0.45 to 0.55 parts by weight. When the part by weight of the fluidity regulator is less than 0.4 parts by weight, because of the low viscosity, the coating thickness will become thinner when the protective coating agent of the present invention is used for coating, and the part by weight of the fluidity regulator exceeds 200 parts by weight When the viscosity is high, the coating will lack uniformity.

再次，附著促進劑用於提高本發明的保護性塗層劑的密著力，可以包括BYK社的BYK-4509與BYK-4500中一種以上。Thirdly, the adhesion promoter is used to improve the adhesion of the protective coating agent of the present invention, and may include at least one of BYK-4509 and BYK-4500.

而且，對由化學式10表示的化合物100重量份，附著促進劑可以占0.32~250重量份，優選可以占0.32~1.2重量份，更加優選可以占0.36~1.1重量份。附著促進劑占的重量份小於0.32重量份時，密著力會降低；附著促進劑占的重量份超過250重量份時，滑移特性會降低。Furthermore, for 100 parts by weight of the compound represented by Chemical Formula 10, the adhesion promoter may account for 0.32 to 250 parts by weight, preferably 0.32 to 1.2 parts by weight, and more preferably 0.36 to 1.1 parts by weight. When the part by weight of the adhesion promoter is less than 0.32 parts by weight, the adhesion force will be reduced; when the part by weight of the adhesion promoter exceeds 250 parts by weight, the slip characteristic will be reduced.

最後，對由化學式10表示的化合物100重量份，水可以占24~48重量份，優選可以占27~44重量份，更加優選可以占28.5~42重量份。水占的重量份小於24重量份時，在晶圓片上用保護性塗層劑進行塗層時，塗層厚度會變厚，在剝離時會有困難；水占的重量份超過48重量份時，硬化工作上會有問題。Finally, for 100 parts by weight of the compound represented by Chemical Formula 10, water may account for 24 to 48 parts by weight, preferably 27 to 44 parts by weight, and more preferably 28.5 to 42 parts by weight. When the weight of water is less than 24 weight parts, when the protective coating agent is used for coating on the wafer, the thickness of the coating will become thicker and it will be difficult to peel off; when the weight of water exceeds 48 weight parts , There will be problems in hardening work.

本發明的切片工藝用保護性塗層劑的製備方法包括第一步骤至第三步骤。The preparation method of the protective coating agent for the slicing process of the present invention includes the first step to the third step.

首先，在第一步骤可以對由下面的化學式7表示的化合物，由下面的化學式8表示的化合物，由所述化學式9表示的化合物以及溶劑進行混合與聚合反應而製備第一聚合物。 [化學式7]

Figure 02_image039
First, in the first step, the compound represented by the following chemical formula 7, the compound represented by the following chemical formula 8, the compound represented by the chemical formula 9, and a solvent may be mixed and polymerized to prepare a first polymer. [Chemical formula 7]
Figure 02_image039

在所述化學式7， R1 可以為

Figure 02_image013
，
Figure 02_image015
或
Figure 02_image017
，優選可以為
Figure 02_image013
。In the chemical formula 7, R 1 can be
Figure 02_image013
,
Figure 02_image015
or
Figure 02_image017
, Preferably can be
Figure 02_image013
.

還有，在所述化學式7，R2 ，R3 ，R4 ，R5 ，R6 ，R7 以及R8 可以各自獨立地為C1~C15亞烷基，優選可以為C1~C10亞烷基。In addition, in the chemical formula 7, R 2 , R 3 , R 4 , R 5 , R 6 , R 7 and R 8 may each independently be a C1-C15 alkylene group, preferably a C1-C10 alkylene group .

還有，在所述化學式7，n，m以及l可以各自獨立地為1~50的有理數，優選可以為1~20的有理數。 [化學式8]

Figure 02_image044
In addition, in the chemical formula 7, n, m, and l may each independently be a rational number of 1-50, and preferably may be a rational number of 1-20. [Chemical formula 8]
Figure 02_image044

在所述化學式8，R0 可以為

Figure 02_image007
，
Figure 02_image009
或
Figure 02_image011
，優選可以為
Figure 02_image007
。In the chemical formula 8, R 0 can be
Figure 02_image007
,
Figure 02_image009
or
Figure 02_image011
, Preferably can be
Figure 02_image007
.

還有，在所述化學式8，R9 ，R10 ，R11 以及R32 可以各自獨立地為氫或C1~C10烷基，優選可以為C1~C5烷基。In addition, in the chemical formula 8, R 9 , R 10 , R 11 and R 32 may each independently be hydrogen or a C1-C10 alkyl group, and preferably may be a C1-C5 alkyl group.

還有，在化學式8，R12 可以為C1~C10亞烷基，優選可以為C1~C5亞烷基。 [化學式9]

Figure 02_image047
In addition, in the chemical formula 8, R 12 may be a C1-C10 alkylene group, and preferably may be a C1-C5 alkylene group. [Chemical formula 9]
Figure 02_image047

在所述化學式9，R13 與R14 可以各自獨立地為C1~C10亞烷基，優選可以為C1~C5亞烷基。In the chemical formula 9, R 13 and R 14 may each independently be a C1-C10 alkylene group, and preferably may be a C1-C5 alkylene group.

還有，在所述化學式9，R15 可以為C1~C10烷基，優選可以為C1~C5烷基。In addition, in the chemical formula 9, R 15 may be a C1-C10 alkyl group, preferably a C1-C5 alkyl group.

在第一步骤使用的溶劑可以包括NMP(N-methylpyrrolidone)，DMF(N,N-dimethylformamide)，DMA(N,N-dimethylacetamide)以及MEK(methyl ethyl ketone)中一種以上，優選可以包括NMP(N-methylpyrrolidone)。The solvent used in the first step may include one or more of NMP (N-methylpyrrolidone), DMF (N, N-dimethylformamide), DMA (N, N-dimethylacetamide) and MEK (methyl ethyl ketone), and preferably may include NMP (N -methylpyrrolidone).

還有，在第一步骤，對由化學式7表示的化合物100重量份，由所述化學式8表示的化合物可以占101~153重量份，優選可以占114~140重量份，更加優選可以占120~134重量份。由化學式8表示的化合物占的重量份小於101重量份時，硬化後的附著力會變弱；由化學式8表示的化合物占的重量份超過153重量份時，塗層後晶圓片表面的可見性會降低。Also, in the first step, for 100 parts by weight of the compound represented by the chemical formula 7, the compound represented by the chemical formula 8 may account for 101 to 153 parts by weight, preferably 114 to 140 parts by weight, and more preferably 120 to 120 parts by weight. 134 parts by weight. When the compound represented by chemical formula 8 accounts for less than 101 parts by weight, the adhesion after curing will become weak; when the compound represented by chemical formula 8 accounts for more than 153 parts by weight, the surface of the wafer after coating is visible Sex will decrease.

還有，在第一步骤，對由化學式7表示的化合物100重量份，由化學式9表示的化合物可以占11~18重量份，由選可以占13~17重量份，更加優選可以占14~16重量份。由化學式9表示的化合物占的重量份小於11重量份時，對水的可分散性會降低；由化學式9表示的化合物占的重量份超過18重量份時，在硬化後，耐水性會變弱。Also, in the first step, for 100 parts by weight of the compound represented by Chemical Formula 7, the compound represented by Chemical Formula 9 may account for 11-18 parts by weight, optionally may account for 13-17 parts by weight, and more preferably may account for 14-16 Parts by weight. When the compound represented by chemical formula 9 accounts for less than 11 parts by weight, the dispersibility to water will decrease; when the compound represented by chemical formula 9 accounts for more than 18 parts by weight, the water resistance will become weak after hardening .

還有，在第一步骤，對由化學式7表示的化合物100重量份，溶劑可以占40~61重量份，優選可以占45~56重量份，更加優選可以占39~45重量份。溶劑占的重量份小於40重量份時，因為黏度太高而塗層會缺乏均勻性，溶劑占的重量份超過61重量份時，因為黏度太低而塗層時會有困難。Also, in the first step, for 100 parts by weight of the compound represented by Chemical Formula 7, the solvent may account for 40 to 61 parts by weight, preferably 45 to 56 parts by weight, and more preferably 39 to 45 parts by weight. When the solvent accounts for less than 40 parts by weight, the coating will lack uniformity because the viscosity is too high. When the solvent accounts for more than 61 parts by weight, the coating will be difficult because of the low viscosity.

還有，在第一步骤中，可以通過在80~150℃的溫度下，優選在80~140℃的溫度下，以150~250rpm，優選以170~230rpm進行1小時至3小時，優選1.5小時至2.5小時進行混合和/或聚合反應製備第一聚合物。Also, in the first step, it can be carried out at a temperature of 80 to 150°C, preferably at a temperature of 80 to 140°C, at 150 to 250 rpm, preferably at 170 to 230 rpm, for 1 hour to 3 hours, preferably 1.5 hours The first polymer is prepared by mixing and/or polymerization reaction to 2.5 hours.

這時，被製備的第一聚合物可以為由下面的化學式5表示的化合物。 [化學式5]

Figure 02_image102
At this time, the first polymer to be prepared may be a compound represented by Chemical Formula 5 below. [Chemical formula 5]
Figure 02_image102

在所述化學式5，R13 與R14 可以各自獨立地為C1~C10亞烷基，優選可以為C1~C5亞烷基。In the chemical formula 5, R 13 and R 14 may each independently be a C1-C10 alkylene group, and preferably may be a C1-C5 alkylene group.

而且，在所述化學式5，R15 可以為C1~C10烷基，優選可以為C1~C5烷基。Moreover, in the chemical formula 5, R 15 may be a C1-C10 alkyl group, and preferably may be a C1-C5 alkyl group.

還有，在所述化學式5，R26 可以為

Figure 02_image104
，R0 可以為
Figure 02_image007
，
Figure 02_image009
或
Figure 02_image011
，優選可以為
Figure 02_image007
，R9 ，R10 ，R11 以及R32 可以各自獨立地為氫或C1~C10烷基，優選可以為C1~C5烷基，R12 可以為C1~C10亞烷基，優選可以為C1~C5亞烷基。Also, in the chemical formula 5, R 26 may be
Figure 02_image104
, R 0 can be
Figure 02_image007
,
Figure 02_image009
or
Figure 02_image011
, Preferably can be
Figure 02_image007
, R 9 , R 10 , R 11 and R 32 can each independently be hydrogen or C1~C10 alkyl, preferably C1~C5 alkyl, R 12 can be C1~C10 alkylene, preferably C1~ C5 alkylene.

還有，在所述化學式5中，R1 可以為

Figure 02_image013
，
Figure 02_image015
或
Figure 02_image017
，優選可以為
Figure 02_image013
，R2 ，R3 ，R4 ，R5 ，R6 ，R7 以及R8 可以各自獨立地為C1~C15亞烷基，優選可以為C1~C10亞烷基，n， ，m以及l各自獨立地為可以為1~50的有理數，優選可以為1~20的有理數。Also, in the chemical formula 5, R 1 may be
Figure 02_image013
,
Figure 02_image015
or
Figure 02_image017
, Preferably can be
Figure 02_image013
, R 2, R 3, R 4, R 5, R 6, R 7 and R 8 are each independently a C1 ~ C15 alkylene group, preferably alkylene may be a C1 ~ C10 alkyl group, n,, m and l are each It is independently a rational number that can be 1 to 50, and preferably a rational number that can be 1 to 20.

其次，在本發明的切片工藝用保護性塗層劑的製備方法中第二步骤，可以通過在第一步骤製備的第一聚合物與由下面的化學式6表示的化合物以及由下面的化學式4表示的化合物中一種以上進行混合與反應而製備第二聚合物或第三聚合物。 [化學式6]

Figure 02_image049
Secondly, in the second step of the preparation method of the protective coating agent for the slicing process of the present invention, the first polymer prepared in the first step and the compound represented by the following chemical formula 6 and represented by the following chemical formula 4 One or more of the compounds are mixed and reacted to prepare the second polymer or the third polymer. [Chemical formula 6]
Figure 02_image049

在所述化學式6，R20 可以為C1~C10亞烷基，

Figure 02_image019
或
Figure 02_image021
，優選可以為C1~C10亞烷基，優選可以為C1~C5亞烷基。還有，R27 ，R28 ，R29 ，R30 以及R31 各自獨立地為可以C1~C10亞烷基，優選可以為C1~C5亞烷基。In the chemical formula 6, R 20 can be a C1~C10 alkylene group,
Figure 02_image019
or
Figure 02_image021
, Preferably a C1~C10 alkylene group, preferably a C1~C5 alkylene group. In addition, R 27 , R 28 , R 29 , R 30 and R 31 are each independently a C1 to C10 alkylene group, preferably a C1 to C5 alkylene group.

還有，在所述化學式6，R21 ，R22 以及R23­ 各自獨立地為可以C1~C10烷基，優選可以為C1~C5烷基。 [化學式4]

Figure 02_image052
In addition, in the chemical formula 6, R 21 , R 22 and R 23 are each independently a C1 to C10 alkyl group, preferably a C1 to C5 alkyl group. [Chemical formula 4]
Figure 02_image052

在所述化學式4，R16 可以為C1~C10烷基，優選可以為C1~C5烷基。In the chemical formula 4, R 16 can be a C1~C10 alkyl group, preferably a C1~C5 alkyl group.

具體說明通過本發明的切片工藝用保護性塗層劑的製備方法中第二步骤製備第二聚合物的方法，可以對製備的第一聚合物與由所述化學式4表示的化合物進行混合與反應而製備第二聚合物，而被製備的第二聚合物可以為由下面的化學式1-1表示的化合物。 [化學式1-1]

Figure 02_image001
Specifically, the method for preparing the second polymer in the second step of the preparation method of the protective coating agent for the slicing process of the present invention can be mixed and reacted with the prepared first polymer and the compound represented by the chemical formula 4 While the second polymer is prepared, the prepared second polymer may be a compound represented by the following Chemical Formula 1-1. [Chemical formula 1-1]
Figure 02_image001

在所述化學式1-1，R13 與R14 各自獨立地為可以為C1~C10亞烷基，優選可以為C1~C5亞烷基。In the chemical formula 1-1, R 13 and R 14 are each independently a C1 to C10 alkylene group, preferably a C1 to C5 alkylene group.

還有，在所述化學式1-1，R15 可以為C1~C10烷基，優選可以為C1~C5烷基。In addition, in the chemical formula 1-1, R 15 may be a C1-C10 alkyl group, preferably a C1-C5 alkyl group.

還有，在所述化學式1-1，R24 與R25 可以為

Figure 02_image003
。Also, in the chemical formula 1-1, R 24 and R 25 may be
Figure 02_image003
.

還有，在所述化學式1-1，R0 可以為

Figure 02_image007
，
Figure 02_image009
或
Figure 02_image011
，優選可以為
Figure 02_image007
，R9 ，R10 ，R11 以及R32 各自獨立地為可以氫或C1~C10烷基，優選可以為C1~C5烷基，R12 可以為C1~C10亞烷基，優選可以為C1~C5亞烷基。Also, in the chemical formula 1-1, R 0 can be
Figure 02_image007
,
Figure 02_image009
or
Figure 02_image011
, Preferably can be
Figure 02_image007
, R 9 , R 10 , R 11 and R 32 are each independently hydrogen or C1~C10 alkyl, preferably C1~C5 alkyl, R 12 can be C1~C10 alkylene, preferably C1~ C5 alkylene.

還有，在所述化學式1-1，R1 可以為

Figure 02_image013
，
Figure 02_image015
或
Figure 02_image017
，優選可以為
Figure 02_image013
。Also, in the chemical formula 1-1, R 1 may be
Figure 02_image013
,
Figure 02_image015
or
Figure 02_image017
, Preferably can be
Figure 02_image013
.

還有，在所述化學式1-1，R2 ，R3 ，R4 ，R5 ，R6 ，R7 以及R8 各自獨立地可以為C1~C15亞烷基，優選可以為C1~C10亞烷基，n，m以及l各自獨立地可以為1~50的有理數，優選可以為1~20的有理數。In addition, in the chemical formula 1-1, R 2 , R 3 , R 4 , R 5 , R 6 , R 7 and R 8 may each independently be a C1-C15 alkylene group, preferably a C1-C10 alkylene group. The alkyl group, n, m, and l may each independently be a rational number of 1-50, and preferably may be a rational number of 1-20.

還有，在所述化學式1-1，R16 可以為C1~C10烷基，優選可以為C1~C5烷基，R20 可以為C1~C10亞烷基，

Figure 02_image019
或
Figure 02_image021
，優選可以為C1~C10亞烷基，更加優選可以為C1~C5亞烷基，R27 ，R28 ，R29 ，R30 以及R31 各自獨立地可以為C1~C10亞烷基，優選可以為C1~C5亞烷基，R21 ，R22 以及R23 各自獨立地可以為C1~C10烷基，優選可以為C1~C5烷基。Also, in the chemical formula 1-1, R 16 can be a C1~C10 alkyl group, preferably a C1~C5 alkyl group, and R 20 can be a C1~C10 alkylene group,
Figure 02_image019
or
Figure 02_image021
, Preferably can be C1~C10 alkylene, more preferably can be C1~C5 alkylene, R 27 , R 28 , R 29 , R 30 and R 31 each independently can be C1~C10 alkylene, preferably It is a C1-C5 alkylene group, and R 21 , R 22 and R 23 may each independently be a C1-C10 alkyl group, and preferably may be a C1-C5 alkyl group.

還有，在第二步骤製備第二聚合物時，對由化學式7表示的化合物100重量份，由化學式4表示的化合物可以占29~45重量份，優選可以占33~41重量份，更加優選可以占34~39重量份。由化學式4表示的化合物占的重量份小於29重量份時，硬化後還會有黏性；由化學式4表示的化合物的重量份超過45重量份時，硬化後塗層的厚度會變薄。Also, when preparing the second polymer in the second step, for 100 parts by weight of the compound represented by chemical formula 7, the compound represented by chemical formula 4 may account for 29 to 45 parts by weight, preferably 33 to 41 parts by weight, and more preferably It can account for 34 to 39 parts by weight. When the weight of the compound represented by Chemical Formula 4 is less than 29 parts by weight, there will still be stickiness after curing; when the weight of the compound represented by Chemical Formula 4 exceeds 45 parts by weight, the thickness of the coating after curing will be thinner.

還有，在第二步骤製備第二聚合物時，可以在70~110℃的溫度下，優選在80~100℃的溫度下，以150~250rpm，優選以170~230rpm進行10分鐘~40分鐘，優選20分鐘~30分鐘混合和/或反應而製備第二聚合物。Also, when preparing the second polymer in the second step, it can be carried out at a temperature of 70 to 110°C, preferably at a temperature of 80 to 100°C, at 150 to 250 rpm, preferably at 170 to 230 rpm, for 10 minutes to 40 minutes , Preferably 20 minutes to 30 minutes to mix and/or react to prepare the second polymer.

具體說明通過本發明切片工藝用保護性塗層劑的製備方法中第二步骤而製備第三聚合物的方法，所述第二步骤可以包括第2-1步骤以及第2-2步骤。The method for preparing the third polymer through the second step of the method for preparing the protective coating agent for the slicing process of the present invention is specifically described. The second step may include the step 2-1 and the step 2-2.

在本發明的切片工藝用保護性塗層劑的製備方法的第2-1步骤，可以對已製備的第一聚合物與由所述化學式6表示的化合物進行混合與反應而製備第三中間聚合物，而製備的第三中間聚合物可以為由下面的化學式3表示的化合物。 [化學式3]

Figure 02_image115
In step 2-1 of the preparation method of the protective coating agent for the slicing process of the present invention, the prepared first polymer and the compound represented by the chemical formula 6 can be mixed and reacted to prepare the third intermediate polymer The prepared third intermediate polymer may be a compound represented by Chemical Formula 3 below. [Chemical formula 3]
Figure 02_image115

在所述化學式3，R13 與R14 各自獨立地可以為C1~C10亞烷基，優選可以為C1~C5亞烷基。In the chemical formula 3, R 13 and R 14 may each independently be a C1-C10 alkylene group, and preferably may be a C1-C5 alkylene group.

還有，在所述化學式3，R15 可以為C1~C10烷基，優選可以為C1~C5烷基。In addition, in the chemical formula 3, R 15 may be a C1-C10 alkyl group, preferably a C1-C5 alkyl group.

還有，在所述化學式3，R26 可以為

Figure 02_image104
，R25 可以為
Figure 02_image005
。Also, in the chemical formula 3, R 26 may be
Figure 02_image104
, R 25 can be
Figure 02_image005
.

還有，在所述化學式3，R0 可以為

Figure 02_image007
，
Figure 02_image009
或
Figure 02_image011
，優選可以為
Figure 02_image007
，R9 ，R10 ，R11 以及R32 各自獨立地可以為氫或C1~C10烷基，優選可以為C1~C5烷基，R12 可以是C1~C10亞烷基，優選可以為C1~C5亞烷基。Also, in the chemical formula 3, R 0 can be
Figure 02_image007
,
Figure 02_image009
or
Figure 02_image011
, Preferably can be
Figure 02_image007
, R 9 , R 10 , R 11 and R 32 each independently can be hydrogen or C1~C10 alkyl, preferably C1~C5 alkyl, R 12 can be C1~C10 alkylene, preferably C1~ C5 alkylene.

還有，在所述化學式3，R1 可以為

Figure 02_image013
，
Figure 02_image015
或
Figure 02_image017
，優選可以為
Figure 02_image013
。Also, in the chemical formula 3, R 1 may be
Figure 02_image013
,
Figure 02_image015
or
Figure 02_image017
, Preferably can be
Figure 02_image013
.

還有，在所述化學式3，R2 ，R3 ，R4 ，R5 ，R6 ，R7 以及R8 各自獨立地可以為C1~C15亞烷基，優選可以是C1~C10亞烷基，n，m以及l各自獨立地可以為1~50的有理數，優選可以為1~20的有理數。In addition, in the chemical formula 3, R 2 , R 3 , R 4 , R 5 , R 6 , R 7 and R 8 may each independently be a C1-C15 alkylene group, preferably a C1-C10 alkylene group , N, m, and l each independently can be a rational number from 1 to 50, preferably a rational number from 1 to 20.

還有，在所述化學式3，R20 可以為C1~C10亞烷基，

Figure 02_image019
或
Figure 02_image021
，優選可以為C1~C10亞烷基，更加優選可以為C1~C5亞烷基，R27 ，R28 ，R29 ，R30 以及R31 各自獨立地可以為C1~C10亞烷基，優選可以為C1~C5亞烷基，R21 ，R22 以及R23 各自獨立地可以為C1~C10烷基，優選可以為C1~C5烷基。Also, in the chemical formula 3, R 20 may be a C1~C10 alkylene group,
Figure 02_image019
or
Figure 02_image021
, Preferably can be C1~C10 alkylene, more preferably can be C1~C5 alkylene, R 27 , R 28 , R 29 , R 30 and R 31 each independently can be C1~C10 alkylene, preferably It is a C1-C5 alkylene group, and R 21 , R 22 and R 23 may each independently be a C1-C10 alkyl group, and preferably may be a C1-C5 alkyl group.

還有，在第2-1步骤製備第三中間聚合物時，對由化學式7表示的化合物100重量份，由所述化學式6表示的化合物可以占33~51重量份，優選可以占37~47重量份，更加優選可以占39~45重量份。由所述化學式6表示的化合物的含量少與33重量份時，硬化後塗層表面的均勻性會差，由所述化學式6表示的化合物的含量超過51重量份時，製備後會產生沉澱。Also, when preparing the third intermediate polymer in step 2-1, for 100 parts by weight of the compound represented by Chemical Formula 7, the compound represented by Chemical Formula 6 may account for 33 to 51 parts by weight, preferably 37 to 47 parts by weight. Parts by weight, more preferably 39 to 45 parts by weight. When the content of the compound represented by the chemical formula 6 is less than 33 parts by weight, the uniformity of the coating surface after hardening will be poor, and when the content of the compound represented by the chemical formula 6 exceeds 51 parts by weight, precipitation may occur after preparation.

還有，在第二步骤製備第三中間聚合物時，可以在80℃~150℃的溫度下，優選在80℃~140℃的溫度下，以150~250rpm，優選以170rpm~230rpm進行60分鐘~120分鐘，優選75分鐘~105分鐘的混合和/或反應而製備第三中間聚合物。Also, when preparing the third intermediate polymer in the second step, it can be carried out at a temperature of 80°C to 150°C, preferably at a temperature of 80°C to 140°C, at 150 to 250 rpm, preferably at 170 rpm to 230 rpm for 60 minutes ~120 minutes, preferably 75 minutes to 105 minutes of mixing and/or reaction to prepare the third intermediate polymer.

在本發明的切片工藝用保護性塗層劑的製備方法的第2-2步骤中，可以對在第2-1步骤製備的第三中間聚合製與由所述化學式4表示的化合物進行混合與反應而製備第三聚合物，被製備的第三聚合物可以為由下面的化學式1-2表示的化合物。 [化學式1-2]

Figure 02_image001
In the 2-2 step of the method for preparing the protective coating agent for the slicing process of the present invention, the third intermediate polymerization system prepared in the 2-1 step can be mixed with the compound represented by the chemical formula 4 The third polymer is prepared by reaction, and the prepared third polymer may be a compound represented by the following Chemical Formula 1-2. [Chemical formula 1-2]
Figure 02_image001

在所述化學式1-2，R13 與R14 各自獨立地可以為C1~C10亞烷基，優選可以為C1~C5亞烷基。In the chemical formula 1-2, R 13 and R 14 may each independently be a C1-C10 alkylene group, and preferably may be a C1-C5 alkylene group.

還有，在所述化學式1-2，R15 可以為C1~C10烷基，優選可以為C1~C5烷基。In addition, in the chemical formula 1-2, R 15 may be a C1-C10 alkyl group, and preferably may be a C1-C5 alkyl group.

還有，在所述化學式1-2，R24 可以為

Figure 02_image003
，R25 可以為
Figure 02_image005
。Also, in the chemical formula 1-2, R 24 may be
Figure 02_image003
, R 25 can be
Figure 02_image005
.

還有，在所述化學式1-2，R0 可以為

Figure 02_image007
，
Figure 02_image009
或
Figure 02_image011
，優選可以為
Figure 02_image007
，R9 ，R10 ，R11 以及R32 各自獨立地可以為氫或C1~C10烷基，優選可以為C1~C5烷基，R12 可以為C1~C10亞烷基，優選可以為C1~C5亞烷基。Also, in the chemical formula 1-2, R 0 can be
Figure 02_image007
,
Figure 02_image009
or
Figure 02_image011
, Preferably can be
Figure 02_image007
, R 9 , R 10 , R 11 and R 32 each independently can be hydrogen or C1~C10 alkyl, preferably C1~C5 alkyl, R 12 can be C1~C10 alkylene, preferably C1~ C5 alkylene.

還有，在所述化學式1-2，R1 可以為

Figure 02_image013
，
Figure 02_image015
或
Figure 02_image017
，優選可以為
Figure 02_image013
。Also, in the chemical formula 1-2, R 1 can be
Figure 02_image013
,
Figure 02_image015
or
Figure 02_image017
, Preferably can be
Figure 02_image013
.

還有，在所述化學式1-2，R2 ，R3 ，R4 ，R5 ，R6 ，R7 以及R8 各自獨立地可以為C1~C15亞烷基，優選可以為C1~C10亞烷基，n，m以及l各自獨立地可以為1~50的有理數，優選可以為1~20的有理數。In addition, in the chemical formula 1-2, R 2 , R 3 , R 4 , R 5 , R 6 , R 7 and R 8 may each independently be a C1-C15 alkylene group, preferably a C1-C10 alkylene group. The alkyl group, n, m, and l may each independently be a rational number of 1-50, and preferably may be a rational number of 1-20.

還有，在所述化學式1-2，R16 可以為C1~C10烷基，優選可以為C1~C5烷基，R20 可以為C1~C10亞烷基，

Figure 02_image019
或
Figure 02_image021
，優選可以為C1~C10亞烷基，更加優選可以為C1~C5亞烷基，R27 ，R28 ，R29 ，R30 以及R31 各自獨立地可以為C1~C10亞烷基，R21 ，R22 以及R23 各自獨立地可以為C1~C10烷基，優選可以為C1~C5烷基。Also, in the chemical formula 1-2, R 16 can be a C1~C10 alkyl group, preferably a C1~C5 alkyl group, and R 20 can be a C1~C10 alkylene group,
Figure 02_image019
or
Figure 02_image021
, Preferably can be C1~C10 alkylene, more preferably can be C1~C5 alkylene, R 27 , R 28 , R 29 , R 30 and R 31 can each independently be C1~C10 alkylene, R 21 , R 22 and R 23 may each independently be a C1 to C10 alkyl group, and preferably may be a C1 to C5 alkyl group.

還有，在第2-2步骤製備第三聚合物，對由化學式7表示的化合物100重量份，由化學式4表示的化合物可以占29~45重量份，由選可以占33~41重量份，更加優選可以占34~39重量份。由化學式4表示的化合物的含量少於29重量份時，硬化後還會留下黏性，由化學式4表示的化合物的含量超過45重量份時，硬化後塗層的厚度會變薄。In addition, the third polymer is prepared in step 2-2. For 100 parts by weight of the compound represented by chemical formula 7, the compound represented by chemical formula 4 may account for 29 to 45 parts by weight, and optionally 33 to 41 parts by weight, More preferably, it can account for 34 to 39 parts by weight. When the content of the compound represented by Chemical Formula 4 is less than 29 parts by weight, stickiness will remain after hardening, and when the content of the compound represented by Chemical Formula 4 exceeds 45 parts by weight, the thickness of the coating after hardening will become thin.

還有，在第2-2步骤中製備第三聚合物時，可以在70℃~110℃的溫度下，優選在80℃~110℃的溫度下，以150~250rpm， 優選以170~230rpm進行10分鐘~40分鐘，優選20分鐘~30分鐘的混合和/或反應而製備第三聚合物。Also, when preparing the third polymer in step 2-2, it can be carried out at a temperature of 70°C to 110°C, preferably at a temperature of 80°C to 110°C, at 150 to 250 rpm, preferably at 170 to 230 rpm The third polymer is prepared by mixing and/or reacting for 10 minutes to 40 minutes, preferably 20 minutes to 30 minutes.

最後，切片工藝用保護性塗層劑的製備方法的第三步骤中，可以對 已製備的第二聚合物或第三聚合物與由下面的化學式2表示的化合物與水進行混合和反應而製備由下面的化學式10表示的化合物。 [化學式2]

Figure 02_image023
Finally, in the third step of the preparation method of the protective coating agent for the slicing process, the prepared second polymer or third polymer and the compound represented by the following chemical formula 2 and water can be mixed and reacted to prepare A compound represented by Chemical Formula 10 below. [Chemical formula 2]
Figure 02_image023

在所述化學式2，R17 ，R18 以及R19 各自獨立地可以為氫，芳基或C1~C10烷基，優選可以為C1~C5烷基。 [化學式10]

Figure 02_image026
In the chemical formula 2, R 17 , R 18 and R 19 may each independently be hydrogen, an aryl group or a C1~C10 alkyl group, preferably a C1~C5 alkyl group. [Chemical formula 10]
Figure 02_image026

在所述化學式10，R13 與R14 各自獨立地可以為C1~C10亞烷基，優選可以為C1~C5亞烷基，R15 可以為C1~C10烷基，優選可以為C1~C5烷基。In the chemical formula 10, R 13 and R 14 each independently can be a C1~C10 alkylene group, preferably a C1~C5 alkylene group, R 15 can be a C1~C10 alkyl group, preferably a C1~C5 alkylene group base.

還有，在所述化學式10，R24 與R25 各自獨立地可以為

Figure 02_image003
或
Figure 02_image005
。Also, in the chemical formula 10, R 24 and R 25 may each independently be
Figure 02_image003
or
Figure 02_image005
.

還有，在所述化學式10，R0 可以為

Figure 02_image007
，
Figure 02_image009
或
Figure 02_image011
，優選可以為
Figure 02_image007
，R9 ，R10 ，R11 以及R32 各自獨立地可以為氫或C1~C10烷基，優選可以為C1~C5烷基，R12 可以為C1~C10亞烷基，優選可以為C1~C5亞烷基。Also, in the chemical formula 10, R 0 can be
Figure 02_image007
,
Figure 02_image009
or
Figure 02_image011
, Preferably can be
Figure 02_image007
, R 9 , R 10 , R 11 and R 32 each independently can be hydrogen or C1~C10 alkyl, preferably C1~C5 alkyl, R 12 can be C1~C10 alkylene, preferably C1~ C5 alkylene.

還有，在所述化學式10，R1 可以為

Figure 02_image013
，
Figure 02_image015
或
Figure 02_image017
，優選可以為
Figure 02_image013
。Also, in the chemical formula 10, R 1 may be
Figure 02_image013
,
Figure 02_image015
or
Figure 02_image017
, Preferably can be
Figure 02_image013
.

還有，在所述化學式10，R2 ，R3 ，R4 ，R5 ，R6 ，R7 以及R8 各自獨立地可以為C1~C15亞烷基，優選可以為C1~C10亞烷基，n，m以及l各自獨立地可以為1~50的有理數，優選可以為1~20的有理數。In addition, in the chemical formula 10, R 2 , R 3 , R 4 , R 5 , R 6 , R 7 and R 8 may each independently be a C1-C15 alkylene group, preferably a C1-C10 alkylene group , N, m, and l each independently can be a rational number from 1 to 50, preferably a rational number from 1 to 20.

還有，在所述化學式10，R16 可以為C1~C10烷基，優選可以為C1~C5烷基，R20 可以為C1~C10亞烷基，

Figure 02_image019
或
Figure 02_image021
，優選可以為C1~C10亞烷基，更加優選可以為C1~C5亞烷基，R27 ，R28 ，R29 。R30 以及R31 各自獨立地可以為C1~C10亞烷基，R21 ，R22 以及R23 各自獨立地可以為C1~C10烷基，優選可以為C1~C5烷基。Also, in the chemical formula 10, R 16 can be a C1~C10 alkyl group, preferably a C1~C5 alkyl group, and R 20 can be a C1~C10 alkylene group,
Figure 02_image019
or
Figure 02_image021
, Preferably can be C1~C10 alkylene, more preferably can be C1~C5 alkylene, R 27 , R 28 , R 29 . R 30 and R 31 may each independently be a C1-C10 alkylene group, and R 21 , R 22 and R 23 may each independently be a C1-C10 alkyl group, and preferably may be a C1-C5 alkyl group.

還有，在所述化學式10，A+ 可以為

Figure 02_image037
，R17 ，R18 以及R19 各自獨立地可以為氫，芳基或C1~C10烷基，優選可以為C1~C5烷基。Also, in the chemical formula 10, A + can be
Figure 02_image037
, R 17 , R 18 and R 19 each independently may be hydrogen, an aryl group or a C1-C10 alkyl group, and preferably may be a C1-C5 alkyl group.

進一步具體說明切片工藝用保護性塗層劑的製備方法中的第三步骤，在通過對在第二步骤製備的第二聚合物與由所述化學式2表示的化合物與水進行混合和反應而製備的由下面的化學式10表示的化合物，R24 與R25 可以為

Figure 02_image003
， 在通過第二步骤製備的第三聚合物與由所述化學式2表示的化合物與水進行混合和反應而製備的由下面的化學式10表示的化合物，R24 可以為
Figure 02_image003
，R25 可以為
Figure 02_image005
。The third step in the preparation method of the protective coating agent for the slicing process is further explained in detail, which is prepared by mixing and reacting the second polymer prepared in the second step with the compound represented by the chemical formula 2 and water The compound represented by the following chemical formula 10, R 24 and R 25 can be
Figure 02_image003
In the compound represented by the following chemical formula 10 prepared by mixing and reacting the third polymer prepared by the second step with the compound represented by the chemical formula 2 and water, R 24 may be
Figure 02_image003
, R 25 can be
Figure 02_image005
.

還有，在第三步骤製備由所述化學式10表示的化合物時，對由化學式7表示的化合物100重量份，由化學式2表示的化合物可以占8~13重量份，優選可以占9~12重量份，更加優選可以占9.5~11重量份。由化學式2表示的化合物的含量少於8重量份時，在水分散作用上會有困難；由化學式2表示的化合物的含量超過11重量份時，由化學式2表示的化合物在去除塗層後也會殘留。Also, when preparing the compound represented by the chemical formula 10 in the third step, for 100 parts by weight of the compound represented by chemical formula 7, the compound represented by chemical formula 2 may account for 8 to 13 parts by weight, preferably 9 to 12 parts by weight Parts, more preferably 9.5 to 11 parts by weight. When the content of the compound represented by Chemical Formula 2 is less than 8 parts by weight, it may be difficult to disperse in water; when the content of the compound represented by Chemical Formula 2 exceeds 11 parts by weight, the compound represented by Chemical Formula 2 is also difficult to remove the coating. Will remain.

還有，在第三步骤製備由所述化學式10表示的化合物時，對由化學式7表示的化合物100重量份，水可以占533~800重量份，優選可以占600~733重量份，更加優選可以占632~700。水的含量少於533重量份時，黏性會太強；水的含量超過800重量份時，由化學式1表示的化合物含量會大幅降低而塗層厚度會變薄。Also, when preparing the compound represented by the chemical formula 10 in the third step, for 100 parts by weight of the compound represented by the chemical formula 7, water may account for 533 to 800 parts by weight, preferably 600 to 733 parts by weight, and more preferably Accounted for 632~700. When the water content is less than 533 parts by weight, the viscosity will be too strong; when the water content exceeds 800 parts by weight, the content of the compound represented by Chemical Formula 1 will be greatly reduced and the coating thickness will be thinner.

還有，在第四步骤，可以通過對由所述化學式2表示的化合物與水在10℃~50℃的溫度下，優選在15℃~30℃的溫度下，以400rpm至700rpm，優選以500rpm至600rpm，進行10分鐘至120分鐘，優選10分鐘至60分鐘的混合而製備混合物。對製備的混合物在10℃~50℃的溫度下，優選在15℃至30℃的溫度下，以400rpm至700rpm，優選以500rpm至600rpm，與第二聚合物或第三聚合物進行1小時至5小時，優選1小時至2小時的混合和反應而製備由所述化學式10表示的化合物。Also, in the fourth step, the compound represented by the chemical formula 2 and water at a temperature of 10°C to 50°C, preferably at a temperature of 15°C to 30°C, at 400rpm to 700rpm, preferably at 500rpm The mixture is prepared by mixing at 600 rpm for 10 minutes to 120 minutes, preferably 10 minutes to 60 minutes. Perform the mixture with the second polymer or the third polymer at a temperature of 10°C to 50°C, preferably at a temperature of 15°C to 30°C, at 400 rpm to 700 rpm, preferably at 500 rpm to 600 rpm, for 1 hour to 5 hours, preferably 1 hour to 2 hours of mixing and reaction to prepare the compound represented by the chemical formula 10.

在本發明的切片工藝用保護性塗層劑的製造方法，極性有機溶劑，表面調節用添加劑，流動性調整劑，附著促進劑以及水可以與已製備的由化學式10表示的化合物混合。In the manufacturing method of the protective coating agent for the slicing process of the present invention, the polar organic solvent, the additive for surface adjustment, the fluidity regulator, the adhesion promoter, and water can be mixed with the compound represented by Chemical Formula 10 that has been prepared.

作為一個例子，如此製備的切片工藝用保護性塗層劑可以適用於如下的晶圓片加工工藝。As an example, the thus prepared protective coating agent for the slicing process can be applied to the following wafer processing process.

晶圓片加工工藝可以包括第一工序，其在晶圓片表面用所述本發明的保護性塗層劑進行塗層；第二工序，其在引上裝置上配置所述晶圓片；第三工序，其對所述晶圓片進行切削工藝(dicing)；第四工序，從切片工藝中被切削的部品中僅選別良品而排列良品；第五工序，其從所述被選別的良品中剝離本發明的切片工藝用保護性塗層劑；以及第六工序，其對所述切片工藝用保護性塗層劑被剝離後的良品進行檢查。The wafer processing process may include a first step, which is to coat the surface of the wafer with the protective coating agent of the present invention; a second step, which is to arrange the wafer on the lead-up device; The third step is to perform a cutting process (dicing) on the wafer; the fourth step is to select only good products from the parts cut in the slicing process and arrange the good products; the fifth step is to select from the selected good products The protective coating agent for the slicing process of the present invention is peeled off; and the sixth step is to inspect the good product after the protective coating agent for the slicing process is peeled off.

所述第一工序可以在0℃~50℃的溫度下進行1秒~60秒，優選可以在15℃~35℃溫度下進行20秒~50秒。The first step can be performed at a temperature of 0°C to 50°C for 1 second to 60 seconds, and preferably can be performed at a temperature of 15°C to 35°C for 20 seconds to 50 seconds.

本發明的切片工藝用塗層劑的适用範圍不局限於半導體製備工藝，也可以較佳使用於玻璃製備工藝，在其製備工藝中會發生由表面的刮痕造成的損傷或因雜質造成的污染。The scope of application of the coating agent for the slicing process of the present invention is not limited to the semiconductor preparation process, but can also be preferably used in the glass preparation process. In the preparation process, damage caused by surface scratches or contamination caused by impurities may occur. .

雖然本發明已以實施例揭露如上，然而其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的基本特性的範圍之內，當可做些許的更動與潤飾。比如說，在本發明的實施例中具體解樓的各種構成要素可以變形實施的。與這些更動與潤飾有關的區別都應解釋為包括於本發明後附的申請專利範圍所限定的範圍。實施例 1 ：製備切片工藝用保護性塗層劑 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the basic characteristics of the present invention. . For example, in the embodiment of the present invention, various components of the concrete solution can be implemented in a modified manner. The differences related to these changes and modifications should be interpreted as being included in the scope defined by the scope of the patent application attached to the present invention. Example 1 : Preparation of protective coating agent for slicing process

(1) 在反應器內投入了由下面的化學式7-1表示的化合物，由下面的化學式8-1表示的化合物，由下面的化學式9-1表示的化合物以及NMP(N-methlpyrrolidone)後，加熱反應器而將反應器內部的溫度調節為100℃。然後，以200rpm的攪拌速度進行兩個小時的混合與聚合反應而製備了第一聚合物。(1) After putting the compound represented by the following chemical formula 7-1, the compound represented by the following chemical formula 8-1, the compound represented by the following chemical formula 9-1 and NMP (N-methlpyrrolidone) into the reactor, The reactor was heated to adjust the temperature inside the reactor to 100°C. Then, mixing and polymerization were performed at a stirring speed of 200 rpm for two hours to prepare the first polymer.

這時，對由下面的化學式7-1表示的化合物100重量份，使用了由下面的化學式8-1表示的化合物126.7重量份，由下面的化學式9-1表示的化合物14.8重量份以及 NMP(N-methlpyrrolidone)50.5重量份。 [化學式7-1]

Figure 02_image039
At this time, for 100 parts by weight of the compound represented by the following chemical formula 7-1, 126.7 parts by weight of the compound represented by the following chemical formula 8-1, 14.8 parts by weight of the compound represented by the following chemical formula 9-1, and NMP(N -methlpyrrolidone) 50.5 parts by weight. [Chemical formula 7-1]
Figure 02_image039

在所述化學式7-1，R1 為

Figure 02_image013
，R2 為–CH2 CH2 CH2 CH2 CH2 CH2 CH2 -，R3 為–CH2 CH2 CH2 CH2 CH2 CH2 CH2 CH2 ，n為7。 [化學式8-1]
Figure 02_image044
In the chemical formula 7-1, R 1 is
Figure 02_image013
, R 2 is -CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 -, R 3 is -CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 , and n is 7. [Chemical formula 8-1]
Figure 02_image044

在所述化學式8-1，R0 為

Figure 02_image007
，R9 ，R10 以及R11 為甲基，R12 為亞甲基。 [化學式9-1]
Figure 02_image047
In the chemical formula 8-1, R 0 is
Figure 02_image007
, R 9 , R 10 and R 11 are methyl groups, and R 12 is methylene. [Chemical formula 9-1]
Figure 02_image047

在所述化學式9-1，R13 與R14 為亞甲基，R15 為乙烷基。In the chemical formula 9-1, R 13 and R 14 are methylene groups, and R 15 is an ethyl group.

(2) 在已製備的第一聚合物中投入了由下面的化學式6-1表示的化合物，並在90℃的溫度下以200rpm的攪拌速度進行90分鐘的混合與反應而製備了第三中間聚合物。(2) The compound represented by the following chemical formula 6-1 was put into the prepared first polymer, and the third intermediate was prepared by mixing and reacting for 90 minutes at a temperature of 90°C at a stirring speed of 200 rpm. polymer.

這時，對由所述化學式7-1表示的化合物100重量份，使用了由下面的化學式6-1表示的化合物42重量份。 [化學式6-1]

Figure 02_image049
At this time, for 100 parts by weight of the compound represented by the chemical formula 7-1, 42 parts by weight of the compound represented by the following chemical formula 6-1 was used. [Chemical formula 6-1]
Figure 02_image049

在所述化學式6-1，R20 為–CH2 CH2 CH2 -，R21 ，R22 以及R23 為甲基。In the chemical formula 6-1, R 20 is -CH 2 CH 2 CH 2 -, and R 21 , R 22 and R 23 are methyl groups.

(3) 在90℃的溫度下，在已製備的第三中間聚合物中投入了由下面的化學式4-1表示的化合物，並以200rpm的攪拌速度進行25分鐘的混合與反應而製備了第三聚合物。(3) At a temperature of 90°C, the compound represented by the following chemical formula 4-1 was added to the prepared third intermediate polymer, and the mixing and reaction were performed at a stirring speed of 200 rpm for 25 minutes to prepare the third intermediate polymer Three polymers.

這時，對由所述化學式7-1表示的化合物100重量份，使用了由下面的化學式4-1表示的化合物36.8重量份。 [化學式4-1]

Figure 02_image052
At this time, for 100 parts by weight of the compound represented by the chemical formula 7-1, 36.8 parts by weight of the compound represented by the following chemical formula 4-1 was used. [Chemical formula 4-1]
Figure 02_image052

在所述化學式4-1，R16 為乙烷基。In the chemical formula 4-1, R 16 is an ethyl group.

(4) 對由下面的化學式2-1表示的化合物與水在25℃的溫度下，以550rpm的攪拌速度進行1個小時的混合而製備了混合物。在已製備的第三聚合物投入了所述混合物，在25℃的溫度下，以550rpm的攪拌速度進行1個小時的混合與反應而製備了由下面的化學式10-1表示的化合物。(4) The compound represented by the following chemical formula 2-1 and water were mixed at a temperature of 25° C. at a stirring speed of 550 rpm for 1 hour to prepare a mixture. The prepared third polymer was put into the mixture, and mixed and reacted at a temperature of 25° C. at a stirring speed of 550 rpm for 1 hour to prepare a compound represented by the following chemical formula 10-1.

這時，對由所述化學式7-1表示的化合物100重量份，使用了由下面的化學式2-1表示的化合物10.1重量份以及水666.3重量份。 [化學式2-1]

Figure 02_image023
At this time, for 100 parts by weight of the compound represented by the chemical formula 7-1, 10.1 parts by weight of the compound represented by the following chemical formula 2-1 and 666.3 parts by weight of water were used. [Chemical formula 2-1]
Figure 02_image023

在所述化學式2-1，R17 ，R18 以及R19 為乙烷基。 [化學式10-1]

Figure 02_image026
In the chemical formula 2-1, R 17 , R 18 and R 19 are ethyl groups. [Chemical formula 10-1]
Figure 02_image026

在所述化學式10-1，R13 與R14 為亞甲基，R15 為乙烷基，R24 為

Figure 02_image003
，R25 為
Figure 02_image005
，R0 為
Figure 02_image007
，R9 ，R10 以及R11 為甲基，R12 為亞甲基，R1 為
Figure 02_image013
，R2 為–CH2 CH2 CH2 CH2 CH2 CH2 CH2 -，R3 為–CH2 CH2 CH2 CH2 CH2 CH2 CH2 CH2 -，n為7，R16 為乙烷基。，R20 為–CH2CH2CH2-，R21 ，R22 以及R23 為甲基，A+ 為
Figure 02_image037
，R17 ，R18 以及R19 為乙烷基。實施例 2~13 ：製備切片工藝用保護性塗層劑 In the chemical formula 10-1, R 13 and R 14 are methylene groups, R 15 is an ethyl group, and R 24 is
Figure 02_image003
, R 25 is
Figure 02_image005
, R 0 is
Figure 02_image007
, R 9 , R 10 and R 11 are methyl, R 12 is methylene, R 1 is
Figure 02_image013
, R 2 is -CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 -, R 3 is -CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 -, n is 7, R 16 is Ethyl. , R 20 is -CH2CH2CH2-, R 21 , R 22 and R 23 are methyl, A + is
Figure 02_image037
, R 17 , R 18 and R 19 are ethyl groups. Examples 2-13 : Preparation of protective coating agent for slicing process

根據與實施例1相同的方法製備了切片工藝用保護性塗層劑。但是，如下面的表1中所記載的，變更所使用的化合物的量而製備了切片工藝用保護性塗層劑。 [表1]

Figure 108102048-A0304-0001
實施例 14 ： 製備切片工藝用保護性塗層劑 According to the same method as in Example 1, a protective coating agent for the slicing process was prepared. However, as described in Table 1 below, the amount of the compound used was changed to prepare a protective coating agent for the slicing process. [Table 1]
Figure 108102048-A0304-0001
 Example 14 : Preparation of protective coating agent for slicing process

(1) 在反應器內投入了由下面的化學式7-1表示的化合物，由下面的化學式8-1表示的化合物，由下面的化學式9-1表示的化合物以及NMP(N-methlpyrrolidone)後，加熱反應器而將反應器內部的溫度調節為100℃。然後，以200rpm的攪拌速度進行2個小時的混合與聚合反應而製備了第一聚合物。(1) After putting the compound represented by the following chemical formula 7-1, the compound represented by the following chemical formula 8-1, the compound represented by the following chemical formula 9-1 and NMP (N-methlpyrrolidone) into the reactor, The reactor was heated to adjust the temperature inside the reactor to 100°C. Then, mixing and polymerization were performed at a stirring speed of 200 rpm for 2 hours to prepare the first polymer.

這時，對由下面的化學式7-1表示的化合物100重量份，使用了由下面的化學式8-1表示的化合物126.7重量份，由下面的化學式9-1表示的化合物14.8重量份以及NMP(N-methlpyrrolidone)50.5重量份。 [化學式7-1]

Figure 02_image039
At this time, for 100 parts by weight of the compound represented by the following chemical formula 7-1, 126.7 parts by weight of the compound represented by the following chemical formula 8-1, 14.8 parts by weight of the compound represented by the following chemical formula 9-1, and NMP(N -methlpyrrolidone) 50.5 parts by weight. [Chemical formula 7-1]
Figure 02_image039

在所述化學式7-1，R1 為

Figure 02_image013
，R2 為–CH2 CH2 CH2 CH2 CH2 CH2 CH2 CH2 -，R3 為–CH2 CH2 CH2 CH2 CH2 CH2 CH2 -，n為9。 [化學式8-1]
Figure 02_image044
In the chemical formula 7-1, R 1 is
Figure 02_image013
, R 2 is -CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 -, R 3 is -CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 -, n is 9. [Chemical formula 8-1]
Figure 02_image044

在所述化學式8-1，R0 為

Figure 02_image007
，R9 ，R10 以及R11 為甲基，R12 為亞甲基。 [化學式9-1]
Figure 02_image047
In the chemical formula 8-1, R 0 is
Figure 02_image007
, R 9 , R 10 and R 11 are methyl groups, and R 12 is methylene. [Chemical formula 9-1]
Figure 02_image047

在所述化學式9-1，R13 與R14 為亞甲基，R15 為乙烷基。In the chemical formula 9-1, R 13 and R 14 are methylene groups, and R 15 is an ethyl group.

(2) 在90℃的溫度下，在已製備的第一聚合物中投入了由下面的化學式4-1表示的化合物，並以200rpm的攪拌速度進行25分鐘的混合與反應而製備了第二聚合物。(2) At a temperature of 90°C, a compound represented by the following chemical formula 4-1 was added to the prepared first polymer, and mixed and reacted at a stirring speed of 200 rpm for 25 minutes to prepare the second polymer polymer.

這時，對由所述化學式7-1表示的化合物100重量份，使用了由下面的化學式4-1表示的化合物36.8重量份。 [化學式4-1]

Figure 02_image052
At this time, for 100 parts by weight of the compound represented by the chemical formula 7-1, 36.8 parts by weight of the compound represented by the following chemical formula 4-1 was used. [Chemical formula 4-1]
Figure 02_image052

在所述化學式4-1，R16 為乙烷基。In the chemical formula 4-1, R 16 is an ethyl group.

(3) 對由下面的化學式2-1表示的化合物與水在25℃的溫度下以550RPM的攪拌速度進行一個小時的混合而製備了混合物。在已製備的第二聚合物中投入所述混合物並在25℃的溫度下以550RPM的攪拌速度進行一個小時的混合與反應而製備了由下面的化學式10-2表示的化合物。(3) The compound represented by the following chemical formula 2-1 and water were mixed at a temperature of 25° C. at a stirring speed of 550 RPM for one hour to prepare a mixture. The mixture was put into the prepared second polymer and mixed and reacted at a temperature of 25° C. at a stirring speed of 550 RPM for one hour to prepare a compound represented by the following chemical formula 10-2.

這時，對由所述化學式7-1表示的化合物100重量份，使用了由下面的化學式2-1表示的化合物10.1重量份和水666.3重量份。 [化學式2-1]

Figure 02_image023
At this time, for 100 parts by weight of the compound represented by the chemical formula 7-1, 10.1 parts by weight of the compound represented by the following chemical formula 2-1 and 666.3 parts by weight of water were used. [Chemical formula 2-1]
Figure 02_image023

在所述化學式2-1，R17 ，R18 以及R19 為乙烷基。 [化學式10-2]

Figure 02_image026
In the chemical formula 2-1, R 17 , R 18 and R 19 are ethyl groups. [Chemical formula 10-2]
Figure 02_image026

在化學式10-2，R13 與R14 為甲基，R15 為乙烷基，R24 以及R25 為

Figure 02_image003
，R0 為
Figure 02_image007
，R9 ， R10 以及R11 為甲基，R12 為亞甲基，R1 為
Figure 02_image013
，R2 為–CH2 CH2 CH2 CH2 CH2 CH2 CH2 CH2 -，R3 為–CH2 CH2 CH2 CH2 CH2 CH2 CH2 -，n為9，R16 為乙烷基，R20 為–CH2 CH2 CH2 -，R21 ，R22 以及R23 為甲基，A+ 為
Figure 02_image037
，R17 ，R18 以及R19 為乙烷基。製備例 1~13 In chemical formula 10-2, R 13 and R 14 are methyl, R 15 is ethyl, R 24 and R 25 are
Figure 02_image003
, R 0 is
Figure 02_image007
, R 9 , R 10 and R 11 are methyl, R 12 is methylene, R 1 is
Figure 02_image013
, R 2 is -CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 -, R 3 is -CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 -, n is 9, R 16 is Ethyl, R 20 is -CH 2 CH 2 CH 2 -, R 21 , R 22 and R 23 are methyl, A + is
Figure 02_image037
, R 17 , R 18 and R 19 are ethyl groups. Preparation examples 1~13

對在實施例1-13製備的由化學式10-1表示的化合物100重量份，投入了作為極性有機溶劑的異丙醇10重量份，表面調節用添加劑(BYK社，BYK-333)0.1重量，流動性調整劑(PROTEX international社，PROX A 300)0.5重量份，附著促進劑(BYK社，BYK-4509)0.4重量份以及水30重量份。然後，在25℃的溫度下以500RPM的攪拌速度進行60分鐘的混合而製備了用於切片工藝的保護性塗層劑。製備例 14 To 100 parts by weight of the compound represented by the chemical formula 10-1 prepared in Example 1-13, 10 parts by weight of isopropanol as a polar organic solvent and 0.1 parts by weight of surface conditioning additives (BYK Corporation, BYK-333) were added, Fluidity regulator (PROTEX international, PROX A 300) 0.5 parts by weight, adhesion promoter (BYK, BYK-4509) 0.4 parts by weight, and 30 parts by weight of water. Then, mixing was performed for 60 minutes at a temperature of 25° C. at a stirring speed of 500 RPM to prepare a protective coating agent for the slicing process. Preparation Example 14

對在實施例14製備的由化學式10-2表示的化合物100重量份，投入了作為極性有機溶劑的四氫糠醇30重量份，表面調節用添加劑(BYK社，BYK-331)0.5重量份，流動性調整劑(PROTEX international社，PROX AM 162 S)0.5重量份，附著促進劑(BYK社，BYK-4500)1重量份以及水40重量份。然後，在25℃的溫度下以500RPM的攪拌速度進行60分鐘的混合而製備了用於切片工藝的保護性塗層劑。實驗例 1 To 100 parts by weight of the compound represented by the chemical formula 10-2 prepared in Example 14, 30 parts by weight of tetrahydrofurfuryl alcohol as a polar organic solvent and 0.5 parts by weight of additives for surface adjustment (BYK, BYK-331) were added to flow Property modifier (PROTEX international, PROX AM 162 S) 0.5 parts by weight, adhesion promoter (BYK, BYK-4500) 1 part by weight, and 40 parts by weight of water. Then, mixing was performed for 60 minutes at a temperature of 25° C. at a stirring speed of 500 RPM to prepare a protective coating agent for the slicing process. Experimental example 1

使用在製備例1~14製備的切片工藝用保護性塗層劑對晶圓片實施了旋塗。然後，在120℃的溫度下進行了一個小時的熱硬化。對此，測定如下的物性並在表2中顯示了所述測定結果。 (1) 鉛筆硬度The wafers were spin-coated using the protective coating agent for the slicing process prepared in Preparation Examples 1-14. Then, heat curing was performed at a temperature of 120°C for one hour. In response to this, the following physical properties were measured, and the measurement results are shown in Table 2. (1) Pencil hardness

將用於測定鉛筆硬度的鉛筆以45°的角度插入在鉛筆硬度測定器(CORE TECH)並施加著對被熱硬化的塗層一定的荷重的同時，推著所述鉛筆進行了鉛筆硬度測定。使用的鉛筆是由Mitsubishi社製造的鉛筆，其為表示H至9H，F，HB，B至6B硬度的鉛筆。 (2) 黏附力The pencil used for measuring the pencil hardness was inserted into a pencil hardness tester (CORE TECH) at an angle of 45° and a certain load was applied to the heat-hardened coating, and the pencil was pushed to measure the pencil hardness. The pencil used is a pencil manufactured by Mitsubishi Corporation, which is a pencil representing hardness of H to 9H, F, HB, and B to 6B. (2) Adhesion

根據ASTM D 3359，在被硬化的塗層上用切割器(cutter)形成格子形狀的凹槽後，並在其上堅固地粘附3M膠帶後，用一定的力將膠帶數次剝離並觀察了塗層與基材(晶圓片)之間的貼緊的程度。這時，在塗層的表面上以1mm間隔形成11X11的十字形狀口子並形成100個正方形，在其上附著所述膠帶(3M 膠帶)後急劇地拉下去而對其表面進行了評價。這時，剩下的方眼為100個時以5B表示，95個以上以4B表示85個以上以3B表示，65個以上以2B表示，35個以上以1B，其以下以0B表示。 3. 抗磨性(%)According to ASTM D 3359, after forming a grid-shaped groove with a cutter on the hardened coating, and firmly adhering 3M tape on it, the tape was peeled off several times with a certain force and observed The degree of adhesion between the coating and the substrate (wafer). At this time, 11×11 cross-shaped openings were formed on the surface of the coating layer at 1 mm intervals and 100 squares were formed, and the tape (3M tape) was attached to it and then pulled down sharply to evaluate the surface. At this time, when the remaining square eyes are 100, they are represented by 5B, 95 or more are represented by 4B, 85 or more are represented by 3B, 65 or more are represented by 2B, 35 or more are represented by 1B, and the following are represented by 0B. 3. Abrasion resistance (%)

為了測定塗層膜的抗磨性，用Taber Type Abrasion Tester(QM600T, Qmesys)對各塗層膜施加500g的荷重並以70rpm的速度進行從50次到300次的磨損。然後，將UV-Visible Spectrometer(UV-2450, Shimadzu)使用在600nm波長領域測定透過率而評價抗磨性。塗層膜的抗磨性程度是通過如下定義脫過率損失%(Transmittance Loss%)而決定的，脫過率損失%越大，是了的抗磨性越不佳。 Transmittance Loss % = 100(B-A) / B A = 測定試料的抗磨性後在600nm 波長的透過率(%) B = 測定試料的抗磨性前在600nm波長的透過率(%) [表2]

Figure 108102048-A0304-0002
In order to measure the abrasion resistance of the coating film, a Taber Type Abrasion Tester (QM600T, Qmesys) was used to apply a load of 500 g to each coating film and abrasion was performed from 50 to 300 times at a speed of 70 rpm. Then, the UV-Visible Spectrometer (UV-2450, Shimadzu) was used to measure the transmittance in the 600nm wavelength range to evaluate the abrasion resistance. The degree of abrasion resistance of the coating film is determined by the following definition of Transmittance Loss%. The greater the loss, the lower the abrasion resistance. Transmittance Loss% = 100(BA) / B A = Transmittance at 600nm wavelength (%) after measuring the abrasion resistance of the sample B = Transmittance at 600nm wavelength (%) before measuring the abrasion resistance of the sample [Table 2]
Figure 108102048-A0304-0002

如所述表2中的記載，在製備例1與14中被製備的切片工藝用保護性塗層劑不但具有優秀的鉛筆硬度與黏附力，而且其透過率損失也更低(更佳的抗磨性)。As described in Table 2, the protective coatings for the slicing process prepared in Preparation Examples 1 and 14 not only have excellent pencil hardness and adhesion, but also have lower transmittance loss (better resistance Abrasive).

還有，在製備例1-3中被製備的切片工藝用保護性塗層劑比在製備例4~5中被製備的切片工藝用保護性塗層劑具有更加優秀的鉛筆硬度與黏附力，還具有更低的透過率損失。In addition, the protective coating agent for the slicing process prepared in Preparation Examples 1-3 has better pencil hardness and adhesion than the protective coating agent for the slicing process prepared in Preparation Examples 4 to 5. It also has lower transmittance loss.

還有，在製備例1，6~7中被製備的切片工藝用保護性塗層劑比在製備例8~9中被製備的切片工藝用保護性塗層劑具有更加優秀的鉛筆硬度與黏附力，也具有更低的透過率損失。In addition, the protective coating agent for the slicing process prepared in Preparation Examples 1, 6~7 has better pencil hardness and adhesion than the protective coating agent for the slicing process prepared in Preparation Examples 8-9 It also has lower transmittance loss.

還有，在製備例1，10~11中被製備的切片工藝用保護性塗層劑比在製備例12~13中被製備的切片工藝用保護性塗層劑具有更高的鉛筆硬度與黏附力，還有更低的脫過率損失。In addition, the protective coating for the slicing process prepared in Preparation Examples 1, 10 to 11 has higher pencil hardness and adhesion than the protective coating for the slicing process prepared in Preparation Examples 12 to 13 Power, there is a lower loss of escape rate.

具有本領域的通常知識者可以容易實施對本發明的簡單更動或潤飾，而所述更動或潤飾都可以解釋為包括於本發明所屬的領域。Those with ordinary knowledge in the field can easily implement simple modifications or modifications to the present invention, and the modifications or modifications can be interpreted as being included in the field to which the present invention belongs.

Claims (6)

一種切片工藝用保護性塗層劑，其被塗布在晶圓片表面上，其中所述保護性塗層劑包括由以下的化學式10表示的化合物，以及以100重量份的由所述化學式10表示的化合物計，所述保護性塗層劑包括極性有機溶劑8~500重量份、表面調節用添加劑0.08~100重量份、流動性調整劑0.4~200重量份以及附著促進劑0.32~250重量份：
Figure 108102048-A0305-02-0053-1
 在化學式10中，R13與R14各自獨立地為C1~C10亞烷基，R15為C1~C10烷基，R24與R25各自獨立地為
Figure 108102048-A0305-02-0053-2
或
Figure 108102048-A0305-02-0053-3
， R0為
Figure 108102048-A0305-02-0053-4
、
Figure 108102048-A0305-02-0053-5
或
Figure 108102048-A0305-02-0053-6
，R9、R10、 R11以及R32各自獨立地為氫或C1~C10烷基，R12為C1~C10亞烷基，R1為
Figure 108102048-A0305-02-0054-7
、
Figure 108102048-A0305-02-0054-8
或
Figure 108102048-A0305-02-0054-9
，R2、R3、R4、R5、R6、R7以及R8各自獨立地為C1~C15亞烷基，n、m以及l各自獨立地為1~50的有理數，R16為C1~C10烷基，R20為C1~C10亞烷基、
Figure 108102048-A0305-02-0054-10
或
Figure 108102048-A0305-02-0054-11
，R27、R28、R29、R30以及R31各自獨立地為C1~C10亞烷基，R21、R22以及R23各自獨立地為C1~C10烷基，A+為
Figure 108102048-A0305-02-0054-12
，R17、R18以及R19各自獨立地為氫、芳基或C1~C10烷基。 A protective coating agent for a slicing process, which is coated on the surface of a wafer, wherein the protective coating agent includes a compound represented by the following chemical formula 10, and 100 parts by weight of the compound represented by the chemical formula 10 The protective coating agent includes 8~500 parts by weight of polar organic solvent, 0.08~100 parts by weight of surface adjustment additives, 0.4~200 parts by weight of fluidity regulator, and 0.32~250 parts by weight of adhesion promoter:
Figure 108102048-A0305-02-0053-1
 In chemical formula 10, R 13 and R 14 are each independently a C1~C10 alkylene group, R 15 is a C1~C10 alkyl group, and R 24 and R 25 are each independently
Figure 108102048-A0305-02-0053-2
or
Figure 108102048-A0305-02-0053-3
, R 0 is
Figure 108102048-A0305-02-0053-4
,
Figure 108102048-A0305-02-0053-5
or
Figure 108102048-A0305-02-0053-6
, R 9 , R 10 , R 11 and R 32 are each independently hydrogen or C1~C10 alkyl, R 12 is C1~C10 alkylene, R 1 is
Figure 108102048-A0305-02-0054-7
,
Figure 108102048-A0305-02-0054-8
or
Figure 108102048-A0305-02-0054-9
, R 2 , R 3 , R 4 , R 5 , R 6 , R 7 and R 8 are each independently a C1-C15 alkylene group, n, m and l are each independently a rational number from 1 to 50, and R 16 is C1~C10 alkyl, R 20 is C1~C10 alkylene,
Figure 108102048-A0305-02-0054-10
or
Figure 108102048-A0305-02-0054-11
, R 27 , R 28 , R 29 , R 30 and R 31 are each independently a C1~C10 alkylene group, R 21 , R 22 and R 23 are each independently a C1~C10 alkyl group, and A + is
Figure 108102048-A0305-02-0054-12
, R 17 , R 18 and R 19 are each independently hydrogen, an aryl group or a C1-C10 alkyl group. 如申請專利範圍第1項所述的切片工藝用保護性塗層劑，其中所述保護性塗層劑具有2H-5H的鉛筆硬度，2B~5B的黏附力以及8~35%的抗磨性(wear resistance)。 The protective coating agent for the slicing process as described in item 1 of the scope of patent application, wherein the protective coating agent has a pencil hardness of 2H-5H, an adhesion force of 2B-5B and abrasion resistance of 8-35% (wear resistance). 如申請專利範圍第1項所述的切片工藝用保護性塗層劑，其中，由所述化學式10表示的化合物的R24與R25為
Figure 108102048-A0305-02-0055-13
。 The protective coating agent for the slicing process described in the first item of the patent application, wherein R 24 and R 25 of the compound represented by the chemical formula 10 are
Figure 108102048-A0305-02-0055-13
. 如申請專利範圍第1項所述的切片工藝用保護性塗層劑，其中，由所述化學式10表示的化合物的R24為
Figure 108102048-A0305-02-0055-14
，R25為
Figure 108102048-A0305-02-0055-16
。 The protective coating agent for the slicing process as described in the first item of the patent application, wherein R 24 of the compound represented by the chemical formula 10 is
Figure 108102048-A0305-02-0055-14
, R 25 is
Figure 108102048-A0305-02-0055-16
. 一種晶圓片切片製程，其包括：第一工序，其在所述晶圓片表面上塗布在第1項至第4項中任何一項所述的切片工藝用保護性塗層劑；第二工序，其將所述晶圓片配置於引上裝置；以及第三工序，其將所述晶圓片切片(dicing)。 A wafer slicing process, comprising: a first step of coating the protective coating agent for the slicing process described in any one of items 1 to 4 on the surface of the wafer; and second A step of arranging the wafer in a lead-up device; and a third step of dicing the wafer. 如申請專利範圍第5項所述的晶圓片切片製程，其中，所述第一工序在0~50℃下進行1~60秒。The wafer slicing process described in item 5 of the scope of patent application, wherein the first step is performed at 0-50°C for 1-60 seconds.
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