TW201932553A - Protected coating material for dicing process - Google Patents

Abstract

The present invention relates to a protective coating agent for a dicing process for manufacturing a semiconductor and, more specifically, to a protective coating agent for a dicing process, which is applied on a surface of a wafer or the like to protect the surface of the wafer during a manufacturing process.

Description

Protective coating agent for slicing process

The invention relates to a protective coating agent for slicing process for preparing semiconductors, in particular to a protective coating agent for slicing process, which can be coated on the surface of wafers and the like to protect crystals in the semiconductor manufacturing process The surface of wafers, etc.

In the semiconductor wafer processing process, the slicing process, that is, the sawing process, is a process between the wafer preparation process and the packaging process and separating the wafers in individual chip units.

Among them, in the process of separating the individual chips of the semiconductor wafer from each other with a blade, the debris falling on the surface of the chip may cause defects. In order to solve the problem, the method used in the past is to arrange the nozzles along both sides of the blade and the horizontal direction of the wafer, and spray a large amount of water under high pressure to immediately remove the debris falling on the surface of the chip. The method is useful when the size of the semiconductor chip is large, the processing time is short, and the amount of debris is small. However, when the size of the semiconductor chip decreases, the processing time increases, and the yield of debris increases, the debris cannot be removed immediately.

In order to overcome this problem, Korean Patent Application No. 10-2009-0066314 discloses the use of polyethylene oxide / polypropylene oxide (Polyethyleneoxide / Polypropyleneoxide, PEO-PPO), polyethylene glycol (Polyethyleneglycol, PEG) As well as other detergent compositions prepared immediately after addition, the polyethylene oxide / polypropylene oxide and polyethylene glycol are nonionic surfactants.

However, when the composition is used for the sawing process, fragments of a certain size can be removed, but minute fragments cannot be completely removed. As a result, scratches, gouges, and other defects caused by the remaining minute debris remain unresolved.

Therefore, there is still a need for a protective coating agent for the slicing process, which can be coated on the surface of the wafer to prevent scratches, chisels, and stains that occur during the slicing process and other processing processes. Defects such as whitening or corrosion.

[technical problem]

The present invention is made in consideration of the foregoing, and its object is to provide a protective coating agent for a dicing process, which protects the surface and prevents surface damage due to the inflow of impurities during the processing of wafers and the like in the semiconductor manufacturing process.
[Technical solutions]

In order to solve the technical problem, the protective coating agent composition for slicing process of the present invention includes the compound represented by the following Chemical Formula 1 and the compound represented by the following Chemical Formula 2.
[Chemical Formula 1]

In the chemical formula 1, R ₁₃ and R ₁₄ are each independently C1-C10 alkylene, R15 is C1-C10 alkyl, and R ₂₄ and R ₂₅ are each independently or , R ₀ is , or , R ₉ , R ₁₀ , R ₁₁ and R ₃₂ are each independently C1-C10 alkyl, R ₁₂ is C1-C10 alkylene, R ₁ is , or , R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ and R ₈ are each independently a C1 to C15 alkylene group, n, m and l are each independently a rational number of 1 to 50, and R ₂₀ is C1 ~ C10 alkylene, or , R ₂₇ , R ₂₈ , R ₂₉ , R ₃₀ and R ₃₁ are each independently C1 to C10 alkylene, R ₂₁ , R ₂₂ and R ₂₃ are each independently C1 to C10 alkyl, and R ₁₆ is C1 to C10 alkyl,
[Chemical Formula 2]

In the chemical formula 2, R ₁₇ , R ₁₈ and R ₁₉ are each independently hydrogen, aryl or C1-C10 alkyl.

As a preferred embodiment of the present invention, R ₂₄ and R ₂₅ of the compound represented by the chemical formula 1 may be .

As a preferred embodiment of the present invention, R ₂₄ of the compound represented by the chemical formula 1 may be , R ₂₅ can be .

As a preferred embodiment of the present invention, the protective coating agent composition of the present invention may further include one or more of a polar organic solvent, an additive for surface adjustment, a fluidity additive, and an adhesion promoter.

The protective coating agent for the slicing process of the present invention may include a compound represented by Chemical Formula 10 below.
[Chemical Formula 10]

In the above chemical formula 10, R ₁₃ and 및 R ₁₄ are each independently C1-C10 alkylene, R ₁₅ is C1-C10 alkyl, and R ₂₄ and R ₂₅ are each independently or , R ₀ is , or , R ₉ , R ₁₀ , R ₁₁ and R ₃₂ are each independently hydrogen or C1-C10 alkyl, R ₁₂ is C1-C10 alkylene, R ₁ is , or , R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ and R ₈ are each independently a C1 to C15 alkylene group, n, m and l are each independently a rational number of 1 to 50, and R ₁₆ is C1 ~ C10 alkyl, R ₂₀ is C1 ~ C10 alkylene, or , R ₂₇ , R ₂₈ , R ₂₉ , R ₃₀ and R ₃₁ are each independently C1-C10 alkylene, R ₂₁ , R ₂₂ and R ₂₃ are each independently C1-C10 alkyl, A ⁺ is , R ₁₇ , R ₁₈ and R ₁₉ are each independently hydrogen, aryl or C1-C10 alkyl.

As a preferred embodiment of the present invention, R ₂₄ and R ₂₅ of the compound represented by the chemical formula 10 may be .

As a preferred embodiment of the present invention, R ₂₄ of the compound represented by the chemical formula 10 may be , R ₂₅ can be .

As a preferred embodiment of the present invention, for 100 parts by weight of the compound represented by the chemical formula 10, the protective coating agent of the present invention may further include 8 to 500 parts by weight of a polar organic solvent, and 0.08 to 100 parts by weight of an additive for surface adjustment Parts, fluidity adjuster 0.4 ~ 200 parts by weight and adhesion promoter 0.32 ~ 250 parts by weight.

Furthermore, the preparation method of the protective coating agent for slicing process of the present invention may include: a first step, for the compound represented by the following chemical formula 7, the compound represented by the following chemical formula 8, the compound represented by the following chemical formula 9 And the solvent is mixed and polymerized to prepare the first polymer; in the second step, the prepared first polymer is mixed and reacted with more than one of the compound represented by the following chemical formula 6 and the compound represented by the following chemical formula 4 The second polymer or the third polymer is prepared; and the third step is to mix and react the prepared second polymer or the third polymer with the compound represented by the following Chemical Formula 2 and water to prepare the following polymer The compound represented by Chemical Formula 10.
[Chemical Formula 7]

In the chemical formula 7, R ₁ is , or , R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ and R ₈ are each independently a C1 to C15 alkylene group, n, m and l are each independently a rational number of 1 to 50,
[Chemical Formula 8]

In the chemical formula 8, R ₀ is , or , R ₉ , R ₁₀ , R ₁₁ and R ₃₂ are each independently hydrogen or C1-C10 alkyl, R ₁₂ is C1-C10 alkylene,
[Chemical Formula 9]

In the chemical formula 9, R ₁₃ and R ₁₄ are each independently C1-C10 alkylene, and R ₁₅ is C1-C10 alkyl,
[Chemical Formula 6]

In the chemical formula 6, R ₂₀ is a C1-C10 alkylene group, or , R ₂₇ , R ₂₈ , R ₂₉ , R ₃₀ and R ₃₁ are each independently C1-C10 alkylene, R ₂₁ , R ₂₂ and R ₂₃ are independently C1-C10 alkyl,
[Chemical Formula 4]

In the chemical formula 4, R ₁₆ is a C1 ~ C10 alkyl group,
[Chemical Formula 2]

In the chemical formula 2, R ₁₇ , R ₁₈ and R ₁₉ are each independently hydrogen, aryl or C1-C10 alkyl,
[Chemical Formula 10]

In the chemical formula 10, R ₁₃ and R ₁₄ are each independently C1-C10 alkylene, R ₁₅ is C1-C10 alkyl, and R ₂₄ and R ₂₅ are each independently or , R ₀ is , or , R ₉ , R ₁₀ , R ₁₁ and R ₃₂ are each independently hydrogen or C1-C10 alkyl, R ₁₂ is C1-C10 alkylene, R ₁ is , or , R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ and R ₈ are each independently a C1 to C15 alkylene group, n, m and l are each independently a rational number of 1 to 50, and R ₁₆ is C1 ~ C10 alkyl, R ₂₀ is C1 ~ C10 alkylene, or , R ₂₇ , R ₂₈ , R ₂₉ , R ₃₀ and R ₃₁ are each independently C1-C10 alkylene, R ₂₁ , R ₂₂ and R ₂₃ are independently C1-C10 alkyl, and A ⁺ is , R ₁₇ , R ₁₈ and R ₁₉ are each independently hydrogen, aryl or C1-C10 alkyl.

As a preferred embodiment of the present invention, in the second step, the prepared first polymer can be mixed and reacted with the compound represented by the following Chemical Formula 4 to prepare a second polymer, and in the third step The prepared second polymer and the compound represented by the chemical formula 2 are mixed with and reacted with water to prepare a compound represented by the chemical formula 10 below.
[Chemical Formula 10]

In the chemical formula 10, R ₁₃ and R ₁₄ are each independently C1-C10 alkylene, R ₁₅ is C1-C10 alkyl, R ₂₄ and R ₂₅ are , R ₀ is , or , R ₉ , R ₁₀ , R ₁₁ and R ₃₂ are each independently C1-C10 alkyl, R ₁₂ is C1-C10 alkylene, R ₁ is , or , R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ and R ₈ are each independently a C1 to C15 alkylene group, n, m and l are each independently a rational number of 1 to 50, and R ₁₆ is C1 ~ C10 alkyl, A ⁺ is , R ₁₇ , R ₁₈ and R ₁₉ are each independently hydrogen, aryl or C1-C10 alkyl.

As a preferred embodiment of the present invention, the second step may include steps 2-1 and 2-2. In step 2-1, the prepared first polymer and the compound represented by the chemical formula 6 are carried out Mix and react to prepare a third intermediate polymer. In step 2-2, mix and react the prepared third intermediate polymer with the compound represented by the chemical formula 4 to prepare a third polymer. In the third step, a compound represented by the chemical formula 10 may be prepared by mixing and reacting the prepared third polymer with the compound represented by the chemical formula 2 and water.
[Chemical Formula 10]

In the chemical formula 10, R ₁₃ and R ₁₄ are each independently C1-C10 alkylene, R ₁₅ is C1-C10 alkyl, and R ₂₄ is , R ₂₅ is , R ₀ is , or , R ₉ , R ₁₀ , R ₁₁ and R ₃₂ are each independently C1-C10 alkyl, R ₁₂ is C1-C10 alkylene, R ₁ is , or , R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ and R ₈ are each independently a C1 to C15 alkylene group, n, m and l are each independently a rational number of 1 to 50, and R ₁₆ is C1 ~ C10 alkyl, R ₂₀ is C1 ~ C10 alkylene, or , R ₂₇ , R ₂₈ , R ₂₉ , R ₃₀ and R ₃₁ are each independently C1-C10 alkylene, R ₂₁ , R ₂₂ and R ₂₃ are independently C1-C10 alkyl, and A ⁺ is , R ₁₇ , R ₁₈ and R ₁₉ are each independently hydrogen, aryl, or C1-C10 alkyl.

As a preferred embodiment of the present invention, for 100 parts by weight of the compound represented by the chemical formula 7, the protective coating agent may include 101 to 153 parts by weight of the compound represented by the chemical formula 8 represented by the chemical formula 9 11 to 18 parts by weight of the compound, 29 to 45 parts by weight of the compound represented by the chemical formula 4, 8 to 13 parts by weight of the compound represented by the chemical formula 5, and 33 to 51 parts by weight of the compound represented by the chemical formula 6.

In the compounds of the present invention, said symbol * refers to a chemical bond site of the compound represented by the Chemical Formula 7 an example will be described, the configuration of R ₁ In the formula, the * symbol refers to a part that is linked to the -OH of Chemical Formula 7.
[Effect of invention]

The protective coating agent for the slicing process of the present invention can substantially prevent the damage that occurs on the surface of the wafer or the contamination due to impurities in the semiconductor manufacturing process including the wafer cutting process.

In addition, the protective coating agent has the property of being hardened by heat or ultraviolet rays (UV), however, it is not affected by heat or ultraviolet rays after hardening, and because the protective coating agent has water resistance and hardness, The preparation process is not affected by water and can prevent the wafer surface from being injured by debris. After the preparation process is completed, it can also be easily removed by the alkaline solution.

[detailed description]

Hereinafter, the embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that persons of ordinary knowledge in the field to which the present invention pertains can easily implement the embodiments of the present invention, and the present invention can be implemented in many different types without being limited to the description in the present invention的 实施 例。 Examples.

The protective coating agent for the slicing process of the present invention may include the compound represented by the following Chemical Formula 1 and the compound represented by the following Chemical Formula 2.
[Chemical Formula 1]

In the chemical formula 1, R ₁₃ and R ₁₄ may each independently be a C1 to C10 alkylene group, and preferably may be a C1 to C5 alkylene group.

In addition, in the chemical formula 1, R ₁₅ may be a C1 to C10 alkyl group, preferably a C1 to C5 alkyl group.

Also, in the chemical formula 1, R ₂₄ and R ₂₅ may each independently be or .

In the chemical formula 1, R ₀ may be , or , Preferably can be , R ₉ , R ₁₀ , R ₁₁ and R ₃₂ may each independently be hydrogen or C1-C10 alkyl, preferably C1-C5 alkyl, R ₁₂ may be C1-C10 alkylene, preferably C1- C5 alkylene.

Also, in the chemical formula 1, R ₁ may be , or , Preferably can be .

In addition, in the chemical formula 1, R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ and R ₈ may each independently be C1 to C15 alkylene, preferably C1 to C10 alkylene , N, m, and l can each independently be a rational number of 1 ~ 50, and can be independently a rational number of 1 ~ 20.

In addition, in the chemical formula 1, R ₁₆ may be a C1-C10 alkyl group, preferably a C1-C5 alkyl group, and R ₂₀ may be a C1-C10 alkylene group, or , Preferably C1 to C10 alkylene, more preferably C1 to C5 alkylene, R ₂₇ , R ₂₈ , R ₂₉ , R ₃₀ and R ₃₁ may each independently be C1 to C10 alkylene, preferably It is a C1-C10 alkylene group, and R ₂₁ , R ₂₂ and R ₂₃ may each independently be a C1-C10 alkyl group, preferably a C1-C5 alkyl group.
[Chemical Formula 2]

In the chemical formula 2, R ₁₇ , R ₁₈ and R ₁₉ may each independently be hydrogen, aryl or C1-C10 alkyl, preferably C1-C5 alkyl.

Also, in the compound represented by the chemical formula 1, preferably, R ₂₄ and R ₂₅ may be ,
In the compound represented by the chemical formula 1, preferably, R ₂₄ may be , R ₂₅ can be .

In addition, the protective coating agent composition of the present invention may further include one or more of a polar organic solvent, an additive for surface adjustment, a fluidity adjusting agent, and an adhesion promoter. Preferably, the protective coating agent composition further includes It may include polar organic solvents, additives for surface adjustment, fluidity additives, and adhesion promoters.

The protective coating agent for the slicing process of the present invention may include a compound represented by Chemical Formula 10 below.
[Chemical Formula 10]

In the chemical formula 10, R ₁₃ and R ₁₄ are each independently C1-C10 alkylene, preferably C1-C5 alkylene, R ₁₅ may be C1-C10 alkyl, preferably C1-C5 alkyl base.

Also, in the chemical formula 10, R ₂₄ and R ₂₅ may each independently be or .

Also, in the chemical formula 10, R ₀ may be , or , Preferably can be , R ₉ , R ₁₀ , R ₁₁ and R ₃₂ may each independently be hydrogen or C1-C10 alkyl, preferably C1-C5 alkyl, R ₁₂ may be C1-C10 alkylene, preferably C1- C5 alkylene.

Also, in the chemical formula 10, R ₁ may be , or , Preferably can be .

In addition, in the chemical formula 10, R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ and R ₈ may each independently be C1 to C15 alkylene, preferably C1 to C10 alkylene , N, m and l may each independently be a rational number of 1-50, preferably a rational number of 1-20.

In addition, in the chemical formula 10, R ₁₆ may be a C1-C10 alkyl group, preferably a C1-C5 alkyl group, and R ₂₀ may be a C1-C10 alkylene group, or , Preferably C1 to C10 alkylene, more preferably C1 to C5 alkylene, R ₂₇ , R ₂₈ , R ₂₉ , R ₃₀ and R ₃₁ may each independently be C1 to C10 alkylene, R ₂₁ R ₂₂ and R ₂₃ may each independently be C1 to C10 alkyl, preferably C1 to C5 alkyl.

Also, in the chemical formula 10, A ⁺ may be , R ₁₇ , R ₁₈ and R ₁₉ may each independently be hydrogen, aryl or C1-C10 alkyl, preferably C1-C5 alkyl.

Also, in the compound represented by Chemical Formula 10, preferably, R ₂₄ and R ₂₅ may be , In the compound represented by Chemical Formula 10, preferably, R ₂₄ may be , R ₂₅ can be .

Furthermore, the protective coating agent for the slicing process of the present invention may further include one or more of polar organic solvents, additives for surface adjustment, fluidity modifiers, and adhesion promoters, and preferably may include polar organic solvents, additives for surface adjustment, flow Property adjusting agent and adhesion promoter, and the protective coating agent for slicing process of the present invention may further include water.

First, the polar organic solvent is used to dissolve the compound represented by Chemical Formula 10, and may include one or more of alcohol solvents, ketone solvents, and glycol ether solvents, preferably may include more than one alcohol solvent and ketone solvents, and more preferably It may include C1-C10 alcohol solvents.

Furthermore, for 100 parts by weight of the compound represented by Chemical Formula 10, the polar organic solvent may account for 8 to 500 parts by weight, preferably 8 to 36 parts by weight, and more preferably 9 to 33 parts by weight. If the content of the compound represented by Chemical Formula 10 is less than 8 parts by weight, the compound will be precipitated; if the content of the compound represented by Chemical Formula 10 exceeds 500 parts by weight, there will be a coating when coated with the protective coating agent of the present invention The problem of bad state.

Secondly, the additive for surface adjustment is used to give the surface slip properties after coating with the protective coating agent of the present invention, and may include an additive for silicon-based surface adjustment, and preferably may include MODAREZ K-SE 305, MODAREZ of PROTEX International More than one of K-SL 106, MODAREZ K-SL 107, BYK-BYK-331, BYK-333, BYK-348 and BYK-3455.

Furthermore, for 100 parts by weight of the compound represented by Chemical Formula 10, the surface-adjusting additive may account for 0.08 to 100 parts by weight, preferably 0.08 to 0.6 parts by weight, and more preferably 0.09 to 0.55 parts by weight. When the weight part of the surface adjustment additive is less than 0.08 parts by weight, the problem of adhesion of impurities may occur due to insufficient slip characteristics; when the weight part of the surface adjustment additive exceeds 100 parts by weight, the adhesion force will be reduced.

Secondly, the fluidity adjusting agent is used to adjust the viscosity of the protective coating agent of the present invention, and may include PROX A 300, PROX AM 162 S, SYNTHRO THIX 608 of PROTEX international, BYK-405, BYK-420 and BYK of BYK. -More than one of 7420 ES.

Furthermore, for 100 parts by weight of the compound represented by Chemical Formula 10, the fluidity adjuster may account for 0.4 to 200 parts by weight, preferably 0.4 to 0.6 parts by weight, and more preferably 0.45 to 0.55 parts by weight. When the weight adjustment agent accounts for less than 0.4 parts by weight, the coating thickness will be thinner when the protective coating agent of the present invention is used for coating due to the low viscosity, and the weight adjustment agent accounts for more than 200 parts by weight At this time, because of the high viscosity, the coating will lack uniformity.

Third, the adhesion promoter is used to improve the adhesion of the protective coating agent of the present invention, and may include more than one of BYK Corporation's BYK-4509 and BYK-4500.

Furthermore, for 100 parts by weight of the compound represented by Chemical Formula 10, the adhesion promoter may account for 0.32 to 250 parts by weight, preferably 0.32 to 1.2 parts by weight, and more preferably 0.36 to 1.1 parts by weight. When the weight part of the adhesion promoter is less than 0.32 parts by weight, the adhesion will decrease; when the weight part of the adhesion promoter exceeds 250 parts by weight, the slip characteristics will be reduced.

Finally, for 100 parts by weight of the compound represented by Chemical Formula 10, water may account for 24 to 48 parts by weight, preferably 27 to 44 parts by weight, and more preferably 28.5 to 42 parts by weight. When the weight of water is less than 24 parts by weight, when the protective coating agent is used to coat the wafer, the thickness of the coating will become thicker, and it will be difficult to peel off; when the weight of water exceeds 48 parts by weight , There will be problems in hardening work.

The preparation method of the protective coating agent for slicing process of the present invention includes the first step to the third step.

First, in the first step, the first polymer can be prepared by mixing and polymerizing the compound represented by the following Chemical Formula 7, the compound represented by the following Chemical Formula 8, the compound represented by the Chemical Formula 9, and the solvent.
[Chemical Formula 7]

In the chemical formula 7, R ₁ may be , or , Preferably can be .

In addition, in the chemical formula 7, R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ and R ₈ may each independently be C1 to C15 alkylene, preferably C1 to C10 alkylene .

In addition, in the chemical formula 7, n, m, and l may each independently be a rational number of 1 to 50, and preferably may be a rational number of 1 to 20.
[Chemical Formula 8]

In the chemical formula 8, R ₀ may be , or , Preferably can be .

In addition, in the chemical formula 8, R ₉ , R ₁₀ , R ₁₁ and R ₃₂ may each independently be hydrogen or C1-C10 alkyl, and preferably may be C1-C5 alkyl.

In addition, in Chemical Formula 8, R ₁₂ may be a C1 to C10 alkylene group, and preferably may be a C1 to C5 alkylene group.
[Chemical Formula 9]

In the chemical formula 9, R ₁₃ and R ₁₄ may each independently be a C1 to C10 alkylene group, and preferably may be a C1 to C5 alkylene group.

In addition, in the chemical formula 9, R ₁₅ may be a C1 to C10 alkyl group, and preferably may be a C1 to C5 alkyl group.

The solvent used in the first step may include more than one of NMP (N-methylpyrrolidone), DMF (N, N-dimethylformamide), DMA (N, N-dimethylacetamide) and MEK (methyl ethyl ketone), preferably NMP (N -methylpyrrolidone).

In addition, in the first step, the compound represented by the chemical formula 8 may account for 101 to 153 parts by weight, preferably 114 to 140 parts by weight, and more preferably 120 to 100 parts by weight of the compound represented by the chemical formula 7. 134 parts by weight. When the weight of the compound represented by Chemical Formula 8 is less than 101 parts by weight, the adhesion after hardening will become weak; when the weight of the compound represented by Chemical Formula 8 exceeds 153 parts by weight, the surface of the wafer after coating is visible Sex will be reduced.

In addition, in the first step, for 100 parts by weight of the compound represented by Chemical Formula 7, the compound represented by Chemical Formula 9 may account for 11 to 18 parts by weight, optionally 13 to 17 parts by weight, and more preferably 14 to 16 parts. Parts by weight. When the weight of the compound represented by Chemical Formula 9 is less than 11 parts by weight, the dispersibility to water will be reduced; when the weight of the compound represented by Chemical Formula 9 exceeds 18 parts by weight, the water resistance will become weak after hardening .

Also, in the first step, for 100 parts by weight of the compound represented by Chemical Formula 7, the solvent may account for 40 to 61 parts by weight, preferably 45 to 56 parts by weight, and more preferably 39 to 45 parts by weight. When the weight part of the solvent is less than 40 parts by weight, the coating will lack uniformity because the viscosity is too high. When the weight part of the solvent exceeds 61 parts by weight, the coating will be difficult because the viscosity is too low.

Also, in the first step, it can be carried out at a temperature of 80 to 150 ° C, preferably at a temperature of 80 to 140 ° C, at 150 to 250 rpm, preferably at 170 to 230 rpm, for 1 hour to 3 hours, preferably 1.5 hours The first polymer is prepared by mixing and / or polymerizing up to 2.5 hours.

At this time, the first polymer prepared may be a compound represented by Chemical Formula 5 below.
[Chemical Formula 5]

In the above chemical formula 5, R ₁₃ and R ₁₄ may each independently be a C1-C10 alkylene group, and preferably may be a C1-C5 alkylene group.

Moreover, in the chemical formula 5, R ₁₅ may be a C1 to C10 alkyl group, and preferably may be a C1 to C5 alkyl group.

Also, in the chemical formula 5, R ₂₆ may be , R ₀ can be , or , Preferably can be , R ₉ , R ₁₀ , R ₁₁ and R ₃₂ may each independently be hydrogen or C1-C10 alkyl, preferably C1-C5 alkyl, R ₁₂ may be C1-C10 alkylene, preferably C1- C5 alkylene.

Also, in the chemical formula 5, R ₁ may be , or , Preferably can be _{, R 2, R 3, R} 4, R 5, R 6, R 7 and R ₈ are each independently a C1 ~ C15 alkylene group, preferably alkylene may be a C1 ~ C10 alkyl _group, n,, m and l are each Independently, it can be a rational number of 1 to 50, preferably a rational number of 1 to 20.

Secondly, in the second step of the preparation method of the protective coating agent for slicing process of the present invention, the first polymer prepared in the first step and the compound represented by the following Chemical Formula 6 and the following Chemical Formula 4 can be used One or more of the compounds are mixed and reacted to prepare a second polymer or a third polymer.
[Chemical Formula 6]

In the chemical formula 6, R ₂₀ may be C1 to C10 alkylene, or It is preferably C1-C10 alkylene, preferably C1-C5 alkylene. In addition, R ₂₇ , R ₂₈ , R ₂₉ , R ₃₀ and R ₃₁ are each independently a C1-C10 alkylene group, preferably a C1-C5 alkylene group.

In addition, in the chemical formula 6, R ₂₁ , R ₂₂ and R ₂₃ are each independently C1 to C10 alkyl groups, preferably C1 to C5 alkyl groups.
[Chemical Formula 4]

In the chemical formula 4, R ₁₆ may be a C1-C10 alkyl group, preferably a C1-C5 alkyl group.

The method for preparing the second polymer through the second step in the preparation method of the protective coating agent for the slicing process of the present invention can be mixed and reacted with the compound represented by the chemical formula 4 While the second polymer is prepared, the prepared second polymer may be a compound represented by the following Chemical Formula 1-1.
[Chemical Formula 1-1]

In the chemical formula 1-1, R ₁₃ and R ₁₄ are each independently a C1 to C10 alkylene group, preferably a C1 to C5 alkylene group.

In addition, in the chemical formula 1-1, R ₁₅ may be a C1 to C10 alkyl group, and preferably may be a C1 to C5 alkyl group.

Also, in the chemical formula 1-1, R ₂₄ and R ₂₅ may be .

Also, in the chemical formula 1-1, R ₀ may be , or , Preferably can be , R ₉ , R ₁₀ , R ₁₁ and R ₃₂ are each independently hydrogen or C1-C10 alkyl, preferably C1-C5 alkyl, R ₁₂ may be C1-C10 alkylene, preferably C1- C5 alkylene.

Also, in the chemical formula 1-1, R ₁ may be , or , Preferably can be .

In addition, in the above chemical formula 1-1, R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ and R _{8 may} each independently be a C1 to C15 alkylene group, preferably a C1 to C10 subgroup The alkyl group, n, m, and l can each independently be a rational number of 1 to 50, preferably a rational number of 1 to 20.

In addition, in the above chemical formula 1-1, R ₁₆ may be a C1-C10 alkyl group, preferably a C1-C5 alkyl group, and R ₂₀ may be a C1-C10 alkylene group, or , Preferably C1 to C10 alkylene, more preferably C1 to C5 alkylene, R ₂₇ , R ₂₈ , R ₂₉ , R ₃₀ and R ₃₁ each independently can be C1 to C10 alkylene, preferably It is a C1-C5 alkylene group, and R ₂₁ , R ₂₂ and R ₂₃ each independently may be a C1-C10 alkyl group, preferably a C1-C5 alkyl group.

In addition, when preparing the second polymer in the second step, for 100 parts by weight of the compound represented by Chemical Formula 7, the compound represented by Chemical Formula 4 may account for 29 to 45 parts by weight, preferably 33 to 41 parts by weight, and more preferably It can account for 34 to 39 parts by weight. When the weight of the compound represented by Chemical Formula 4 is less than 29 parts by weight, there will be stickiness after curing; when the weight of the compound represented by Chemical Formula 4 exceeds 45 parts by weight, the thickness of the coating after hardening will become thin.

In addition, when preparing the second polymer in the second step, it may be performed at a temperature of 70 to 110 ° C, preferably at a temperature of 80 to 100 ° C, at 150 to 250 rpm, preferably at 170 to 230 rpm for 10 to 40 minutes , It is preferable to mix and / or react for 20 minutes to 30 minutes to prepare the second polymer.

The method for preparing the third polymer by the second step in the preparation method of the protective coating agent for the slicing process of the present invention is specifically described, and the second step may include a step 2-1 and a step 2-2.

In step 2-1 of the method for preparing the protective coating agent for the slicing process of the present invention, a third intermediate polymerization can be prepared by mixing and reacting the prepared first polymer with the compound represented by the chemical formula 6 The third intermediate polymer prepared may be a compound represented by Chemical Formula 3 below.
[Chemical Formula 3]

In the chemical formula 3, R ₁₃ and R ₁₄ each independently may be a C1-C10 alkylene group, and preferably may be a C1-C5 alkylene group.

In addition, in the chemical formula 3, R ₁₅ may be a C1-C10 alkyl group, and preferably may be a C1-C5 alkyl group.

Also, in the chemical formula 3, R ₂₆ may be , R ₂₅ can be .

Also, in the chemical formula 3, R ₀ may be , or , Preferably can be , R ₉ , R ₁₀ , R ₁₁ and R ₃₂ each independently can be hydrogen or C1-C10 alkyl, preferably C1-C5 alkyl, R ₁₂ can be C1-C10 alkylene, preferably C1- C5 alkylene.

Also, in the chemical formula 3, R ₁ may be , or , Preferably can be .

In addition, in the chemical formula 3, R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ and R _{8 may} each independently be a C1-C15 alkylene group, preferably a C1-C10 alkylene group , N, m and l can each independently be a rational number of 1-50, preferably a rational number of 1-20.

In addition, in the chemical formula 3, R ₂₀ may be a C1 to C10 alkylene group, or , Preferably C1 to C10 alkylene, more preferably C1 to C5 alkylene, R ₂₇ , R ₂₈ , R ₂₉ , R ₃₀ and R ₃₁ each independently can be C1 to C10 alkylene, preferably It is a C1-C5 alkylene group, and R ₂₁ , R ₂₂ and R ₂₃ each independently may be a C1-C10 alkyl group, preferably a C1-C5 alkyl group.

In addition, in the preparation of the third intermediate polymer in the step 2-1, for 100 parts by weight of the compound represented by Chemical Formula 7, the compound represented by Chemical Formula 6 may account for 33 to 51 parts by weight, preferably 37 to 47 parts The part by weight is more preferably 39 to 45 parts by weight. When the content of the compound represented by the chemical formula 6 is less than 33 parts by weight, the uniformity of the coating surface after hardening may be poor, and when the content of the compound represented by the chemical formula 6 exceeds 51 parts by weight, precipitation may occur after preparation.

In addition, when preparing the third intermediate polymer in the second step, it can be performed at a temperature of 80 ° C to 150 ° C, preferably at a temperature of 80 ° C to 140 ° C, at 150 to 250 rpm, preferably at 170 rpm to 230 rpm for 60 minutes ~ 120 minutes, preferably 75 minutes ~ 105 minutes of mixing and / or reaction to prepare the third intermediate polymer.

In step 2-2 of the method for preparing the protective coating agent for slicing process of the present invention, the third intermediate polymerization system prepared in step 2-1 and the compound represented by the chemical formula 4 may be mixed with The third polymer is prepared by the reaction, and the prepared third polymer may be a compound represented by the following Chemical Formula 1-2.
[Chemical Formula 1-2]

In the chemical formula 1-2, R ₁₃ and R ₁₄ each independently may be a C1-C10 alkylene group, and preferably may be a C1-C5 alkylene group.

In addition, in the chemical formula 1-2, R ₁₅ may be a C1 to C10 alkyl group, and preferably may be a C1 to C5 alkyl group.

Also, in the chemical formula 1-2, R ₂₄ may be , R ₂₅ can be .

Also, in the chemical formula 1-2, R ₀ may be , or , Preferably can be , R ₉ , R ₁₀ , R ₁₁ and R ₃₂ each independently can be hydrogen or C1-C10 alkyl, preferably C1-C5 alkyl, R ₁₂ can be C1-C10 alkylene, preferably C1- C5 alkylene.

Also, in the chemical formula 1-2, R ₁ may be , or , Preferably can be .

In addition, in the chemical formula 1-2, R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ and R _{8 may} each independently be a C1 to C15 alkylene group, preferably a C1 to C10 subgroup The alkyl group, n, m, and l can each independently be a rational number of 1 to 50, preferably a rational number of 1 to 20.

In addition, in the chemical formula 1-2, R ₁₆ may be a C1-C10 alkyl group, preferably a C1-C5 alkyl group, and R ₂₀ may be a C1-C10 alkylene group, or , Preferably C1 to C10 alkylene, more preferably C1 to C5 alkylene, R ₂₇ , R ₂₈ , R ₂₉ , R ₃₀ and R ₃₁ each independently can be C1 to C10 alkylene, R ₂₁ R ₂₂ and R _{23 may} each independently be C1 to C10 alkyl, preferably C1 to C5 alkyl.

In addition, in the preparation of the third polymer in step 2-2, for 100 parts by weight of the compound represented by Chemical Formula 7, the compound represented by Chemical Formula 4 may account for 29 to 45 parts by weight, and optionally may account for 33 to 41 parts by weight. More preferably, it may account for 34 to 39 parts by weight. When the content of the compound represented by Chemical Formula 4 is less than 29 parts by weight, the viscosity will remain after curing, and when the content of the compound represented by Chemical Formula 4 exceeds 45 parts by weight, the thickness of the coating after hardening will become thin.

In addition, when preparing the third polymer in step 2-2, it can be carried out at a temperature of 70 ° C to 110 ° C, preferably at a temperature of 80 ° C to 110 ° C, at 150 to 250 rpm, preferably at 170 to 230 rpm The third polymer is prepared by mixing and / or reacting for 10 minutes to 40 minutes, preferably 20 minutes to 30 minutes.

Finally, in the third step of the method for preparing the protective coating agent for the slicing process, the prepared second polymer or the third polymer can be prepared by mixing and reacting the compound represented by the following Chemical Formula 2 with water The compound represented by Chemical Formula 10 below.
[Chemical Formula 2]

In the chemical formula 2, R ₁₇ , R ₁₈ and R _{19 may} each independently be hydrogen, aryl or C1-C10 alkyl, preferably C1-C5 alkyl.
[Chemical Formula 10]

In the chemical formula 10, R ₁₃ and R _{14 may} each independently be C1 to C10 alkylene, preferably C1 to C5 alkylene, and R ₁₅ may be C1 to C10 alkyl, preferably C1 to C5 alkyl base.

Also, in the chemical formula 10, R ₂₄ and R ₂₅ each independently may be or .

Also, in the chemical formula 10, R ₀ may be , or , Preferably can be , R ₉ , R ₁₀ , R ₁₁ and R ₃₂ each independently can be hydrogen or C1-C10 alkyl, preferably C1-C5 alkyl, R ₁₂ can be C1-C10 alkylene, preferably C1- C5 alkylene.

Also, in the chemical formula 10, R ₁ may be , or , Preferably can be .

In addition, in the chemical formula 10, R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ and R _{8 may} each independently be a C1 to C15 alkylene group, preferably a C1 to C10 alkylene group , N, m and l can each independently be a rational number of 1-50, preferably a rational number of 1-20.

In addition, in the chemical formula 10, R ₁₆ may be a C1-C10 alkyl group, preferably a C1-C5 alkyl group, and R ₂₀ may be a C1-C10 alkylene group, or It is preferably a C1 to C10 alkylene group, and more preferably a C1 to C5 alkylene group, R ₂₇ , R ₂₈ and R ₂₉ . R ₃₀ and R _{31 may} each independently be C1 to C10 alkylene, and R ₂₁ , R ₂₂ and R _{23 may} each independently be C1 to C10 alkyl, preferably C1 to C5 alkyl.

Also, in the chemical formula 10, A ⁺ may be , R ₁₇ , R ₁₈ and R ₁₉ each independently may be hydrogen, aryl or C1-C10 alkyl, preferably C1-C5 alkyl.

Further specifically explaining the third step in the preparation method of the protective coating agent for the slicing process, it is prepared by mixing and reacting the second polymer prepared in the second step with the compound represented by the chemical formula 2 and water Of the compound represented by the following chemical formula 10, R ₂₄ and R ₂₅ may be ,
Prepared by mixing the compound with water and reacted by third polymer prepared by the second step of the chemical compounds represented by Formula 2, R represented by the following Chemical Formula 10 may be represented by ₂₄ , R ₂₅ can be .

In addition, when preparing the compound represented by the chemical formula 10 in the third step, the compound represented by the chemical formula 2 may account for 8 to 13 parts by weight, preferably 9 to 12 parts by weight for 100 parts by weight of the compound represented by the chemical formula 7. Parts, more preferably 9.5 to 11 parts by weight. When the content of the compound represented by the chemical formula 2 is less than 8 parts by weight, there will be difficulty in water dispersion; when the content of the compound represented by the chemical formula 2 exceeds 11 parts by weight, the compound represented by the chemical formula 2 will also Will remain.

In addition, when preparing the compound represented by the chemical formula 10 in the third step, for 100 parts by weight of the compound represented by the chemical formula 7, water may account for 533 to 800 parts by weight, preferably 600 to 733 parts by weight, and more preferably Accounted for 632 ~ 700. When the content of water is less than 533 parts by weight, the viscosity will be too strong; when the content of water exceeds 800 parts by weight, the content of the compound represented by Chemical Formula 1 will be greatly reduced and the thickness of the coating will become thin.

Also, in the fourth step, the compound represented by the chemical formula 2 and water may be at a temperature of 10 ° C to 50 ° C, preferably at a temperature of 15 ° C to 30 ° C, at 400 rpm to 700 rpm, preferably at 500 rpm The mixture is prepared by mixing at 600 rpm for 10 minutes to 120 minutes, preferably 10 minutes to 60 minutes. The prepared mixture is subjected to the second polymer or the third polymer at a temperature of 10 ° C to 50 ° C, preferably at a temperature of 15 ° C to 30 ° C, at 400 rpm to 700 rpm, preferably at 500 rpm to 600 rpm, for 1 hour to The compound represented by the chemical formula 10 is prepared by mixing and reacting for 5 hours, preferably 1 hour to 2 hours.

In the manufacturing method of the protective coating agent for the slicing process of the present invention, a polar organic solvent, an additive for surface adjustment, a fluidity adjusting agent, an adhesion promoter, and water may be mixed with the compound represented by Chemical Formula 10 that has been prepared.

As an example, the thus-prepared protective coating agent for slicing process can be applied to the following wafer processing process.

The wafer processing process may include a first step, which is to coat the surface of the wafer with the protective coating agent of the present invention; a second step, which is to dispose the wafer on the pull-up device; Three steps, which perform a dicing process on the wafer; a fourth step, which selects only good products from the parts cut in the slicing process and arranges good products; a fifth process, which selects from the selected good products Peeling off the protective coating agent for the slicing process of the present invention; and a sixth step of inspecting the good product after the protective coating agent for the slicing process is peeled off.

The first step may be performed at a temperature of 0 ° C to 50 ° C for 1 second to 60 seconds, preferably at a temperature of 15 ° C to 35 ° C for 20 seconds to 50 seconds.

The scope of application of the coating agent for the slicing process of the present invention is not limited to the semiconductor preparation process, but can also be preferably used in the glass preparation process, in which damage caused by scratches on the surface or pollution caused by impurities may occur .

Although the present invention has been disclosed as above with the embodiments, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some changes and modifications within the scope of the basic characteristics of the present invention. . For example, in the embodiments of the present invention, various structural elements of the concrete solution building can be modified and implemented. Differences related to these changes and retouching should be interpreted as being included in the scope defined by the scope of the patent application appended to the present invention.

Example 1 : Preparation of protective coating agent for slicing process

(1) After putting the compound represented by the following chemical formula 7-1, the compound represented by the following chemical formula 8-1, the compound represented by the following chemical formula 9-1 and NMP (N-methlpyrrolidone) into the reactor, The reactor was heated to adjust the temperature inside the reactor to 100 ° C. Then, the first polymer was prepared by mixing and polymerizing at a stirring speed of 200 rpm for two hours.

At this time, for 100 parts by weight of the compound represented by the following chemical formula 7-1, 126.7 parts by weight of the compound represented by the following chemical formula 8-1, 14.8 parts by weight of the compound represented by the following chemical formula 9-1 and NMP (N -methlpyrrolidone) 50.5 parts by weight.
[Chemical Formula 7-1]

In the chemical formula 7-1, R ₁ is , R ₂ is –CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH _2- , R ₃ is –CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ , n is 7.
[Chemical Formula 8-1]

In the chemical formula 8-1, R ₀ is , R ₉ , R ₁₀ and R ₁₁ are methyl, and R ₁₂ is methylene.
[Chemical Formula 9-1]

In the chemical formula 9-1, R ₁₃ and R ₁₄ are methylene groups, and R ₁₅ is an ethyl group.

(2) A compound represented by the following Chemical Formula 6-1 was put into the prepared first polymer, and a third intermediate was prepared by mixing and reacting at a temperature of 90 ° C. with a stirring speed of 200 rpm for 90 minutes. polymer.

At this time, for 100 parts by weight of the compound represented by the chemical formula 7-1, 42 parts by weight of the compound represented by the following chemical formula 6-1 was used.
[Chemical Formula 6-1]

In the chemical formula 6-1, R ₂₀ is -CH ₂ CH ₂ CH _2- , R ₂₁ , R ₂₂ and R ₂₃ are methyl groups.

(3) At a temperature of 90 ° C., the compound represented by the following Chemical Formula 4-1 was put into the prepared third intermediate polymer, and mixed and reacted at a stirring speed of 200 rpm for 25 minutes to prepare the first Three polymers.

At this time, for 100 parts by weight of the compound represented by the chemical formula 7-1, 36.8 parts by weight of the compound represented by the following chemical formula 4-1 was used.
[Chemical Formula 4-1]

In the chemical formula 4-1, R ₁₆ is an ethyl group.

(4) The compound represented by the following Chemical Formula 2-1 and water were mixed at a temperature of 25 ° C. at a stirring speed of 550 rpm for 1 hour to prepare a mixture. The mixture was added to the prepared third polymer, and the compound represented by the following chemical formula 10-1 was prepared by mixing and reacting at a temperature of 25 ° C. at a stirring speed of 550 rpm for 1 hour.

At this time, for 100 parts by weight of the compound represented by the chemical formula 7-1, 10.1 parts by weight of the compound represented by the following chemical formula 2-1 and 666.3 parts by weight of water were used.
[Chemical Formula 2-1]

In the chemical formula 2-1, R ₁₇ , R ₁₈ and R ₁₉ are ethyl groups.
[Chemical Formula 10-1]

In the chemical formula 10-1, R ₁₃ and R ₁₄ are methylene groups, R ₁₅ is an ethyl group, and R ₂₄ is , R ₂₅ is , R ₀ is , R ₉ , R ₁₀ and R ₁₁ are methyl, R ₁₂ is methylene and R ₁ is , R ₂ is –CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH _2- , R ₃ is –CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH _2- , n is 7, R ₁₆ is Ethyl. , R ₂₀ is -CH2CH2CH2-, R ₂₁ , R ₂₂ and R ₂₃ are methyl groups, A ⁺ is , R ₁₇ , R ₁₈ and R ₁₉ are ethyl groups.
Examples 2 to 13 : Preparation of protective coating agent for slicing process

The protective coating agent for the slicing process was prepared according to the same method as Example 1. However, as described in Table 1 below, the amount of the compound used was changed to prepare a protective coating agent for slicing process.

[Table 1]

Example 14 : Preparation of protective coating agent for slicing process

(1) After putting the compound represented by the following chemical formula 7-1, the compound represented by the following chemical formula 8-1, the compound represented by the following chemical formula 9-1 and NMP (N-methlpyrrolidone) into the reactor, The reactor was heated to adjust the temperature inside the reactor to 100 ° C. Then, the first polymer was prepared by mixing and polymerizing at a stirring speed of 200 rpm for 2 hours.

At this time, for 100 parts by weight of the compound represented by the following chemical formula 7-1, 126.7 parts by weight of the compound represented by the following chemical formula 8-1, 14.8 parts by weight of the compound represented by the following chemical formula 9-1, and NMP (N -methlpyrrolidone) 50.5 parts by weight.
[Chemical Formula 7-1]

In the chemical formula 7-1, R ₁ is , R ₂ is –CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH _2- , R ₃ is –CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH _2- , n is 9.
[Chemical Formula 8-1]

In the chemical formula 8-1, R ₀ is , R ₉ , R ₁₀ and R ₁₁ are methyl, and R ₁₂ is methylene.
[Chemical Formula 9-1]

In the chemical formula 9-1, R ₁₃ and R ₁₄ are methylene groups, and R ₁₅ is an ethyl group.

(2) At a temperature of 90 ° C., the compound represented by the following Chemical Formula 4-1 was put into the prepared first polymer, and the mixture was reacted at a stirring speed of 200 rpm for 25 minutes to prepare a second polymer.

At this time, for 100 parts by weight of the compound represented by the chemical formula 7-1, 36.8 parts by weight of the compound represented by the following chemical formula 4-1 was used.
[Chemical Formula 4-1]

In the chemical formula 4-1, R ₁₆ is an ethyl group.

(3) The compound represented by the following Chemical Formula 2-1 and water were mixed at a temperature of 25 ° C. for one hour at a stirring speed of 550 RPM to prepare a mixture. The mixture was put into the prepared second polymer and mixed and reacted at a temperature of 25 ° C. at a stirring speed of 550 RPM for one hour to prepare a compound represented by the following Chemical Formula 10-2.

At this time, for 100 parts by weight of the compound represented by the chemical formula 7-1, 10.1 parts by weight of the compound represented by the following chemical formula 2-1 and 666.3 parts by weight of water were used.
[Chemical Formula 2-1]

In the chemical formula 2-1, R ₁₇ , R ₁₈ and R ₁₉ are ethyl groups.
[Chemical Formula 10-2]

In the chemical formula 10-2, R ₁₃ and R ₁₄ are methyl groups, R ₁₅ is an ethyl group, R ₂₄ and R ₂₅ are , R ₀ is , R ₉ , R ₁₀ and R ₁₁ are methyl, R ₁₂ is methylene and R ₁ is , R ₂ is –CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH _2- , R ₃ is –CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH ₂ CH _2- , n is 9, R ₁₆ is Ethyl, R ₂₀ is -CH ₂ CH ₂ CH _2- , R ₂₁ , R ₂₂ and R ₂₃ are methyl, A ⁺ is , R ₁₇ , R ₁₈ and R ₁₉ are ethyl groups.
Preparation Examples 1 ~ 13

To 100 parts by weight of the compound represented by Chemical Formula 10-1 prepared in Example 1-13, 10 parts by weight of isopropyl alcohol as a polar organic solvent, and 0.1 parts by weight of an additive for surface adjustment (BYK Corporation, BYK-333) Flowability adjuster (PROTEX international, PROX A 300) 0.5 parts by weight, adhesion promoter (BYK company, BYK-4509) 0.4 parts by weight, and water 30 parts by weight. Then, the protective coating agent used for the slicing process was prepared by mixing at a stirring speed of 500 RPM for 60 minutes at a temperature of 25 ° C.
Preparation Example 14

To 100 parts by weight of the compound represented by Chemical Formula 10-2 prepared in Example 14, 30 parts by weight of tetrahydrofurfuryl alcohol as a polar organic solvent, 0.5 parts by weight of an additive for surface adjustment (BYK Corporation, BYK-331), and flow 0.5 parts by weight of a property adjuster (PROTEX international company, PROX AM 162 S), 1 part by weight of an adhesion promoter (BYK company, BYK-4500), and 40 parts by weight of water. Then, the protective coating agent used for the slicing process was prepared by mixing at a stirring speed of 500 RPM for 60 minutes at a temperature of 25 ° C.
Experimental Example 1

The wafer was spin-coated with a protective coating agent for the slicing process prepared in Preparation Examples 1-14. Then, heat curing was performed at 120 ° C for one hour. For this, the following physical properties were measured, and the measurement results are shown in Table 2.
(1) Pencil hardness

A pencil for measuring the hardness of the pencil was inserted into the pencil hardness tester (CORE TECH) at an angle of 45 ° and a certain load was applied to the thermosetting coating, and the pencil was measured by pushing the pencil. The pencil used is a pencil manufactured by Mitsubishi Corporation, which is a pencil representing hardness of H to 9H, F, HB, B to 6B.
(2) Adhesion

According to ASTM D 3359, after forming a grid-shaped groove with a cutter on the hardened coating and firmly adhering 3M tape on it, the tape was peeled off several times with a certain force and observed The degree of adhesion between the coating and the substrate (wafer). At this time, 11X11 cross-shaped openings were formed on the surface of the coating at 1 mm intervals and 100 squares were formed, and the tape (3M tape) was attached to the tape and then pulled down sharply to evaluate the surface. At this time, when the remaining square eyes are 100, they are represented by 5B, 95 or more are represented by 4B, 85 or more are represented by 3B, 65 or more are represented by 2B, 35 or more are represented by 1B, and the following are represented by 0B.
3. Abrasion resistance (%)

In order to determine the abrasion resistance of the coating film, Taber Type Abrasion Tester (QM600T, Qmesys) was used to apply a load of 500 g to each coating film and subjected to abrasion from 50 to 300 times at a speed of 70 rpm. Then, the UV-Visible Spectrometer (UV-2450, Shimadzu) was used to measure the transmittance in the 600 nm wavelength region to evaluate the abrasion resistance. The degree of abrasion resistance of the coating film is determined by defining the% Transmittance Loss (Transmittance Loss%) as follows.
Transmittance Loss% = 100 (BA) / B
A = Transmittance (%) at 600nm wavelength after measuring the abrasion resistance of the sample
B = Transmittance (%) at 600nm wavelength before measuring the abrasion resistance of the sample
[Table 2]

As described in Table 2, the protective coating agent for the slicing process prepared in Preparation Examples 1 and 14 not only has excellent pencil hardness and adhesion, but also has a lower transmission loss (better resistance Abrasive).

In addition, the protective coating agent for slicing process prepared in Preparation Examples 1-3 has more excellent pencil hardness and adhesion than the protective coating agent for slicing process prepared in Preparation Examples 4-5. It also has a lower transmission loss.

Also, the protective coating agent for slicing process prepared in Preparation Examples 1, 6 to 7 has more excellent pencil hardness and adhesion than the protective coating agent for slicing process prepared in Preparation Examples 8 to 9. Force, also has a lower transmission loss.

In addition, the protective coating agent for slicing process prepared in Preparation Examples 1 and 10 to 11 has higher pencil hardness and adhesion than the protective coating agent for slicing process prepared in Preparation Examples 12 to 13 Force, there is also a lower loss rate loss.

A person with ordinary knowledge in the art can easily implement a simple modification or retouching of the present invention, and the modification or retouching can be interpreted as being included in the field to which the present invention belongs.

Claims (10)

A protective coating agent for slicing process, which is coated on the surface of a wafer. The protective coating agent for slicing process as described in item 1 of the patent application scope, wherein the protective coating agent has a pencil hardness of 2H-5H, an adhesion force of 2B ~ 5B and an abrasion resistance of 8 ~ 35% (wear resistance). The protective coating agent for slicing process as described in item 2 of the patent application scope, wherein the protective coating agent includes a compound represented by the following chemical formula 10: [Chemical formula 10] In the chemical formula 10, R ₁₃ and R ₁₄ are each independently C1-C10 alkylene, R ₁₅ is C1-C10 alkyl, and R ₂₄ and R ₂₅ are each independently or , R ₀ is , or , R ₉ , R ₁₀ , R ₁₁ and R ₃₂ are each independently hydrogen or C1-C10 alkyl, R ₁₂ is C1-C10 alkylene, R ₁ is , or , R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ and R ₈ are each independently a C1 to C15 alkylene group, n, m and l are each independently a rational number of 1 to 50, and R ₁₆ is C1 ~ C10 alkyl, R ₂₀ is C1 ~ C10 alkylene, or , R ₂₇ , R ₂₈ , R ₂₉ , R ₃₀ and R ₃₁ are each independently C1-C10 alkylene, R ₂₁ , R ₂₂ and R ₂₃ are independently C1-C10 alkyl, and A ⁺ is , R ₁₇ , R ₁₈ and R ₁₉ are each independently hydrogen, aryl or C1-C10 alkyl. The protective coating agent for slicing process as described in item 3 of the patent application scope, wherein the protective coating agent further includes more than one of polar organic solvents, additives for surface adjustment, fluidity adjustment agents and adhesion promoters . The protective coating agent for slicing process as described in item 4 of the patent application scope, wherein the protective coating agent includes a polar organic solvent, an additive for surface adjustment, a fluidity adjustment agent, and an adhesion promoter. The protective coating agent for the slicing process as described in item 5 of the patent application scope, the protective coating agent includes 8 to 500 parts by weight of polar organic solvent for 100 parts by weight of the compound represented by the chemical formula 10, and the surface is adjusted The additive is 0.08 to 100 parts by weight, the fluidity adjuster is 0.4 to 200 parts by weight, and the adhesion promoter is 0.32 to 250 parts by weight. The protective coating agent for slicing process as described in item 3 of the patent application scope, wherein R ₂₄ and R ₂₅ of the compound represented by the chemical formula 10 are . The protective coating agent for slicing process as described in item 3 of the patent application, wherein R ₂₄ of the compound represented by the chemical formula 10 is , R ₂₅ is . Wafer slicing process, including: The first step is to apply the protective coating agent for the slicing process described in any one of items 1 to 8 on the surface of the wafer; the second step is to dispose the wafer on the substrate On device; and In the third step, the wafer is diced. The wafer slicing process as described in item 9 of the patent application range, wherein the first step is performed at 0-50 ° C for 1-60 seconds.