CN106883778A - A kind of wafer pyrometer diaphragm and preparation method thereof, application method - Google Patents
A kind of wafer pyrometer diaphragm and preparation method thereof, application method Download PDFInfo
- Publication number
- CN106883778A CN106883778A CN201710181188.8A CN201710181188A CN106883778A CN 106883778 A CN106883778 A CN 106883778A CN 201710181188 A CN201710181188 A CN 201710181188A CN 106883778 A CN106883778 A CN 106883778A
- Authority
- CN
- China
- Prior art keywords
- adhesive tape
- wafer
- coating
- membrane adhesive
- pyrometer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a kind of wafer pyrometer protection membrane adhesive tape and the preparation method and application method of adhesive tape, its be one side for polyimide film, another side be solvent-type acrylic ester adhesive and its crosslinking copolymerization dosage form into gluing oxidant layer.Processing the method for the adhesive tape includes that glue preparation, equipment debugging, parameter setting, examination are applied, are formally coated with several steps.Adhesive tape of the invention can be applied to：The cutting of semiconductor crystal wafer; the spraying of the metal surfaces such as computer housing, baking vanish masking protection; the masking protection and insulation of electronic circuit processing technology; and the fixation during production of printed circuit board (PCB), electronic component, resistor- capacitor; golden finger part is covered during pcb board impregnation and prevent electroplate liquid from immersing and polluting, gold-plated masking protection of printed circuit board (PCB) etc..
Description
Technical field
The present invention relates to chemical field, more particularly to a kind of wafer pyrometer diaphragm and preparation method thereof, application method.
Background technology
Wafer is to make the silicon chip used by silicon semiconductor, and shape claims wafer like circle.Silicon single crystal bar is prepared into silicon wafer
The technique of disk is wafer shaping.Wafer cutting diaphragm is exactly to be played a protective role in semiconductor process.
SOI technology is the effective measures for reducing transistor drain current, and strained silicon technology is to improve having for transistor speed
Effect approach.The method of currently manufactured SOI wafer mainly has two kinds：One is note oxygen isolation method, and another kind is smart peeling method, notes oxygen
Isolation method is, in O +ion implanted to Silicon Wafer, then to be carried out in inert gas using the special O +ion implanted machine of big line
Not less than 1300 DEG C of high annealings, so as to form very thin surface silicon layer in uniform thickness and Sio2 buried regions at the top of Silicon Wafer.This
The advantage of two methods is that the thickness of silicon thin layer and Sio2 buried regions is accurately controlled, and shortcoming is because oxygen injection can cause to silicon
The destruction of lattice, causes silicon thin layer defect concentration to increase.In both approaches, if wafer is not fixed when cutting, hold
It is also easy to produce and flies material, carries on the back the problem for collapsing, and is also not easy pickup after product cutting.
The content of the invention
The main object of the present invention is to propose a kind of diaphragm suitable for semiconductor fabrication and preparation method thereof, it is intended to solved
Certainly wafer cutting when fixation problem.
To achieve the above object, the present invention proposes a kind of wafer pyrometer protection membrane adhesive tape, for the cutting technique of wafer, its
For one side is polyimide film, another side be solvent-type acrylic ester adhesive and its crosslinking copolymerization dosage form into gluing oxidant layer.
The present invention is applied in the cutting technique of semiconductor or optics and electrical equipment manufacturing process, its effect for fixing workpiece, can be protected
It is complete after barrier protection product cutting, prevent product from winged material, the back of the body occurring in cutting process and collapse；And easily picked up after product cutting
Take, not cull.
Wafer pyrometer of the invention protects membrane adhesive tape, and the present invention also proposes a kind of processing wafer pyrometer diaphragm
The method of adhesive tape, it comprises the following steps：
Step one：Glue prepares, and solvent-type acrylic ester adhesive and its crosslinking copolymerization agent are mixed, and amount of agitation is
Each 40-60KG, standing 20min is stand-by after the completion of stirring, and is finished in 2 hours；
Step 2：Install hopper, the baffle plate of comma scraper formula coating machine；Polyimide film from unwinding device material；To be stirred
Glue material imported in the hopper by 400 mesh sieve net filtrations, and keep seven points of hopper full；
Step 3：Coating temperature, air quantity, speed ratio, coating tension force, speed are set on baking box and coating apparatus controller；
Step 4：Examination is applied, and examination applies two sections of polyimide films, and length is respectively 5M-7M；Painting is dried and checked using the baking box
Length, Tu Kuan, gap, thickness；
Step 5：Formal coating, examination applies the formal coating of qualified beginning, the polyimide film in the unwinding device, through described funny
After the scraper of number scraper coating machine coats the glue prepared in step one, finished product coiled material is wound into after the oven cooking cycle.
Preferably, the dosage of the crosslinking copolymerization agent in step one is the 0.5%-1% of glue total amount.
Preferably, the baking box is the baking box that six sections can individually control temperature.
Preferably, the temperature of six section baking spaces in the baking box respectively is：55℃-70℃、80℃-100℃、
100℃-120℃、120℃-140℃、120℃-100℃、100℃-80℃。
Wafer pyrometer of the invention protects membrane adhesive tape, present invention further propose that a kind of application method：To not cut
Wafer be bonded in the gluing oxidant layer that the wafer pyrometer protects membrane adhesive tape, before cutting crystal wafer, tear the wafer pyrometer off and protect
The polyimide film of cuticula adhesive tape, cutting work station is bonded in by uncut wafer.
By diaphragm of the invention, the cutting work station of wafer can be fixed, ensure complete after protection product cutting, prevented
Fly material, carry on the back the problems such as collapsing.In addition to the cutting technique of wafer, the present disclosure additionally applies for following field：
1st, the high temperature powder spraying of the metal surface such as computer housing, rack, baking vanish masking protection；
2nd, masking protection and insulation during the product pyrolytic coating such as electronic product, automobile industry, application etc.；
3rd, golden finger is covered during fixation when printed circuit board (PCB), electronic component, resistor- capacitor are produced, and pcb board impregnation
Part and prevent electroplate liquid immerse and pollute, printed circuit board (PCB) it is gold-plated masking protection use；
4th, the industry such as household electrical appliances, machinery, electronics needs high-temperature coating spray painting protection, high temperature binding fixation.
Brief description of the drawings
Fig. 1 is the structural representation that wafer pyrometer of the present invention protects membrane adhesive tape.
Specific embodiment
Below in conjunction with accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that institute
The embodiment of description is only a part of embodiment of the invention, rather than whole embodiments.Based on the implementation in the present invention
Example, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made is belonged to
The scope of protection of the invention.
The present invention proposes a kind of wafer pyrometer protection membrane adhesive tape, and it is that one side is polyimide film 1, and another side is solvent-borne type
Acrylate adhesive and its crosslinking copolymerization dosage form into gluing oxidant layer 2；The diaphragm tape applications are in semiconductor process
In, silicon is played a protective role.
Membrane adhesive tape is protected according to this wafer pyrometer, the present invention also proposes that this wafer pyrometer protects the processing side of membrane adhesive tape
Method, it comprises the following steps：
Step one：Glue prepares, and solvent-type acrylic ester adhesive and its crosslinking copolymerization agent are mixed, and amount of agitation is
Each 40-60KG, wherein 0.5%-1% of the dosage of the crosslinking copolymerization agent for glue total amount.Detail parameters see the table below one, stirring
After the completion of to stand 20min stand-by, and be finished in 2 hours；
The parameter that the glue of table one prepares
Step 2：Install hopper, the baffle plate of comma scraper formula coating machine；Polyimide film from unwinding device material；To be stirred
Glue material imported in hopper by 400 mesh sieve net filtrations, and keep seven points of hopper full；The comma scraper formula coating machine
Coating blade can control the thickness of coating, and polyimide film is the coiled strip for tearing back side release layer off.
Step 3：Coating temperature, air quantity, speed ratio, coating tension force, speed are set on baking box and coating apparatus controller；
The baking box is preferably six sections and can individually control the baking box of temperature.Its design parameter is as follows：
The oven temperature parameters of table two
| Baking box joint number | First segment | Second section | Section three, | Section four, | Section five, | Section six, |
| Temperature | 55-70℃ | 80-100℃ | 100-120℃ | 120-140℃ | 120-100℃ | 100-80℃ |
| Air quantity | 70±10% | 60±10% | 50±10% | 50±10% | 60±10% | 60±10% |
The coating machine parameters of table three
| Project | Speed ratio | Tension force | Speed |
| Numerical value | 90-95% | 20-30kgf | 20-25M/min |
Step 4：Examination is applied, and examination applies two sections of polyimide films, and length is respectively 5M-7M；Painting length is dried and checked using baking box, applied
Width, gap, thickness；The painting of initial workpiece is grown, Tu Kuan, gap, thickness etc. relevant parameter, changed if technological requirement is not met to symbol
Requirement is closed to stop；Examination applies a length of 5M-7M, and the Tu Changke of normal volume production presses instruction sheet quantity, generally 6000M, applies standard wide and is
1000MM, thickness range is 20-25um.
Step 5：Formal coating, examination applies the formal coating of qualified beginning, the polyimide film 1 in the unwinding device, through described funny
After the scraper of number scraper coating machine coats the glue prepared in step one, traction to the baking box that parameter is set by above-mentioned requirements
Middle baking, is checked after drying, and finished product coiled material is wound into after the oven cooking cycle.Check glue surface at any time in coating process, dry
The phenomenons such as roasting degree, rubberization thickness bubble；Until coating is completed.
Rewinding step is finally carried out, material is divided into the ramuscule gauge lattice of needs, such as width 1000mm* length 50M's
Small coiled strip, is closely combined in the material good to bundling, forms the finished product on the more surface of flat smooth.
Specifically used method of the invention is as follows：Uncut wafer is positioned in gluing oxidant layer 2, wafer is bonded in
On adhesive；During cutting crystal wafer, the polyimide film 1 at the diaphragm back side is torn off, cut so that uncut wafer is bonded in
Station is cut, wafer is not shifted in cutting process, improve cutting accuracy, and adsorb a certain amount of cutting chip.
When diaphragm of the invention is applied to the techniques such as other masking protections, first can fit in diaphragm needs protection
Region, to be cut, spraying, corrosion etc. tear the polyimide film at the back side after the completion of technique off, can reach preferably protection effect again
Really.
The preferred embodiments of the present invention are the foregoing is only, the scope of the claims of the invention is not thereby limited, it is every at this
Under the inventive concept of invention, the equivalent structure transformation made using description of the invention and accompanying drawing content, or directly/use indirectly
It is included in scope of patent protection of the invention in other related technical fields.
Claims (6)
1. a kind of wafer pyrometer protects membrane adhesive tape, it is characterised in that：It is that one side is polyimide film, and another side is solvent-borne type third
Olefin(e) acid ester adhesive and its crosslinking copolymerization dosage form into gluing oxidant layer.
2. a kind of method that wafer pyrometer processed described in claim 1 protects membrane adhesive tape, it is characterised in that：It includes following step
Suddenly：
Step one：Glue prepares, and solvent-type acrylic ester adhesive and its crosslinking copolymerization agent are mixed, and amount of agitation is
Each 40-60KG, standing 20min is stand-by after the completion of stirring, and is finished in 2 hours；
Step 2：Install hopper, the baffle plate of comma scraper formula coating machine；Polyimide film from unwinding device material；To be stirred
Glue material imported in the hopper by 400 mesh sieve net filtrations, and keep seven points of hopper full；
Step 3：Coating temperature, air quantity, speed ratio, coating tension force, speed are set on baking box and coating apparatus controller；
Step 4：Examination is applied, and examination applies two sections of polyimide films, and length is respectively 5M-7M；Painting is dried and checked using the baking box
Length, Tu Kuan, gap, thickness；
Step 5：Formal coating, examination applies the formal coating of qualified beginning, the polyimide film in the unwinding device, through described funny
After the scraper of number scraper coating machine coats the glue prepared in step one, finished product coiled material is wound into after the oven cooking cycle.
3. the method that wafer pyrometer as claimed in claim 2 protects membrane adhesive tape, it is characterised in that：The copolymerization in step one
The dosage of crosslinking agent is the 0.5%-1% of glue total amount.
4. the method that wafer pyrometer as claimed in claim 2 protects membrane adhesive tape, it is characterised in that：The baking box is that six sections can be single
Solely control the baking box of temperature.
5. the method that wafer pyrometer as claimed in claim 4 protects membrane adhesive tape, it is characterised in that：Six sections in the baking box dry
The temperature in roasting space respectively is：55℃-70℃、80℃-100℃、100℃-120℃、120℃-140℃、120℃-100
℃、100℃-80℃。
6. a kind of wafer pyrometer protects the application method of membrane adhesive tape, it is characterised in that：Uncut wafer is bonded in the crystalline substance
The gluing oxidant layer of circle high temperature protection membrane adhesive tape, before cutting crystal wafer, tears the polyimides that the wafer pyrometer protects membrane adhesive tape off
Film, cutting work station is bonded in by uncut wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710181188.8A CN106883778A (en) | 2017-03-24 | 2017-03-24 | A kind of wafer pyrometer diaphragm and preparation method thereof, application method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710181188.8A CN106883778A (en) | 2017-03-24 | 2017-03-24 | A kind of wafer pyrometer diaphragm and preparation method thereof, application method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106883778A true CN106883778A (en) | 2017-06-23 |
Family
ID=59181438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710181188.8A Pending CN106883778A (en) | 2017-03-24 | 2017-03-24 | A kind of wafer pyrometer diaphragm and preparation method thereof, application method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106883778A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108329849A (en) * | 2018-01-17 | 2018-07-27 | 江西省台辰新材料有限公司 | Production method without base material OCA adhesive tapes |
| CN111630113A (en) * | 2018-01-19 | 2020-09-04 | Mti株式会社 | Protective coating agent for cutting process |
-
2017
- 2017-03-24 CN CN201710181188.8A patent/CN106883778A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108329849A (en) * | 2018-01-17 | 2018-07-27 | 江西省台辰新材料有限公司 | Production method without base material OCA adhesive tapes |
| CN111630113A (en) * | 2018-01-19 | 2020-09-04 | Mti株式会社 | Protective coating agent for cutting process |
| CN111630113B (en) * | 2018-01-19 | 2022-02-08 | Mti株式会社 | Protective coating agent for cutting process |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5820762B2 (en) | Surface protective film for transparent conductive film and transparent conductive film using the same | |
| CN109266236B (en) | High-temperature viscosity-reducing adhesive tape and preparation method thereof | |
| CN108753193B (en) | A kind of blue light-UV absorption adhesive tape and its with glue and preparation method | |
| TWI593551B (en) | Surface treating film, surface protection film, and precision electrical and electronic components attached with the same | |
| DE112006003042T5 (en) | Adhesive composition and adhesive film | |
| CN106883778A (en) | A kind of wafer pyrometer diaphragm and preparation method thereof, application method | |
| DE102012102131A1 (en) | Method for producing a flexible component | |
| CN106687892A (en) | Touch input sensor manufacturing method and photosensitive conductive film | |
| WO2013168773A1 (en) | Laminate of conductive film, touch panel, wiring board, electronic appliance, transparent double-faced pressure-sensitive adhesive sheet, and transparent pressure-sensitive adhesive sheet | |
| CN107160746B (en) | A kind of thermotropic inharmonious reticulate protective film | |
| CN103458621B (en) | The spraying method of thick copper circuit board | |
| JP2004059776A (en) | Anisotropic conductive material tape | |
| CN108285747B (en) | Production process of antistatic protective film | |
| CN110488407B (en) | Polarizer with local polarization difference and preparation method thereof | |
| CN106497446B (en) | Preparation method of adhesive tape | |
| TW200305621A (en) | A method for coating a semiconductor substrate with a mixture containing an adhesion promoter | |
| KR100615217B1 (en) | Method of manufacturing flat panel display device | |
| CN111234725A (en) | PU protective film with extremely low film tearing voltage and preparation method thereof | |
| US10603686B2 (en) | Manufacturing method for ultrathin white covering film | |
| JP3029891B2 (en) | Heat resistant cover tape | |
| KR101925305B1 (en) | Method for forming conducting polymer electrode containing metal nano particle and the etching liquid | |
| CN107275016B (en) | The method of formation protective layer and resistor obtained by this method on a resistor | |
| CN110576628A (en) | Non-silicon matte double-sided release film and preparation process thereof | |
| KR101655847B1 (en) | Manufacturing method for 1-layer anti-acid protective film, the anti-acid protective film using the manufacturing method, and the display panel including the anti-acid protective film | |
| CN209964356U (en) | Flexible circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170623 |
|
| WD01 | Invention patent application deemed withdrawn after publication |