TW202045640A - 切片製程用保護性塗層劑 - Google Patents

切片製程用保護性塗層劑 Download PDF

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Publication number
TW202045640A
TW202045640A TW109111606A TW109111606A TW202045640A TW 202045640 A TW202045640 A TW 202045640A TW 109111606 A TW109111606 A TW 109111606A TW 109111606 A TW109111606 A TW 109111606A TW 202045640 A TW202045640 A TW 202045640A
Authority
TW
Taiwan
Prior art keywords
chemical formula
weight
parts
compound represented
independently
Prior art date
Application number
TW109111606A
Other languages
English (en)
Chinese (zh)
Inventor
吳承燦
金昶圭
Original Assignee
南韓商Ｍｔｉ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020180007028A external-priority patent/KR101928831B1/ko
Priority claimed from KR1020180148346A external-priority patent/KR102094404B1/ko
Application filed by 南韓商Ｍｔｉ股份有限公司 filed Critical 南韓商Ｍｔｉ股份有限公司
Publication of TW202045640A publication Critical patent/TW202045640A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Paints Or Removers (AREA)
  • Dicing (AREA)
TW109111606A 2018-01-19 2019-01-18 切片製程用保護性塗層劑 TW202045640A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2018-0148346 2018-01-19
KR1020180007028A KR101928831B1 (ko) 2018-01-19 2018-01-19 웨이퍼 가공용 보호코팅제 조성물, 이를 포함하는 웨이퍼 가공용 보호코팅제 및 이의 제조방법
KR10-2018-0007028 2018-01-19
KR1020180148346A KR102094404B1 (ko) 2018-11-27 2018-11-27 다이싱 공정용 보호코팅제

Publications (1)

Publication Number Publication Date
TW202045640A true TW202045640A (zh) 2020-12-16

Family

ID=67302381

Family Applications (2)

Application Number Title Priority Date Filing Date
TW108102048A TWI711675B (zh) 2018-01-19 2019-01-18 切片工藝用保護性塗層劑
TW109111606A TW202045640A (zh) 2018-01-19 2019-01-18 切片製程用保護性塗層劑

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW108102048A TWI711675B (zh) 2018-01-19 2019-01-18 切片工藝用保護性塗層劑

Country Status (4)

Country Link
JP (1) JP6862028B2 (ko)
CN (1) CN111630113B (ko)
TW (2) TWI711675B (ko)
WO (1) WO2019143203A1 (ko)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04323279A (ja) * 1991-04-23 1992-11-12 Asahi Denka Kogyo Kk 電子部品のコーティング剤
DE19943933A1 (de) * 1999-07-30 2001-02-01 Bayer Ag Lichtechte Beschichtungsmittel
JP4571850B2 (ja) * 2004-11-12 2010-10-27 東京応化工業株式会社 レーザーダイシング用保護膜剤及び該保護膜剤を用いたウエーハの加工方法
JP4865312B2 (ja) * 2005-12-05 2012-02-01 古河電気工業株式会社 チップ用保護膜形成用シート
JP4886429B2 (ja) * 2006-08-30 2012-02-29 関西ペイント株式会社 水性樹脂組成物及びこれを含む水性塗料組成物
KR101413380B1 (ko) * 2007-08-28 2014-06-30 쓰리엠 이노베이티브 프로퍼티즈 캄파니 반도체 다이의 제조방법, 상기 방법으로 제조된 반도체다이를 포함하는 반도체 소자
JP4851434B2 (ja) * 2007-12-18 2012-01-11 古河電気工業株式会社 チップ保護用フィルム
KR101539762B1 (ko) * 2008-05-29 2015-07-27 동우 화인켐 주식회사 웨이퍼 다이싱용 보호막 조성물
CN102077326B (zh) * 2008-05-29 2014-04-16 东友Fine-Chem股份有限公司 用于晶片切割的保护膜组合物
US8991329B1 (en) * 2014-01-31 2015-03-31 Applied Materials, Inc. Wafer coating
KR101860549B1 (ko) * 2016-07-22 2018-05-24 (주)엠티아이 웨이퍼 가공용 보호 코팅제 조성물 및 이를 포함하는 보호 코팅제
KR101764167B1 (ko) * 2017-01-26 2017-08-02 (주)엠티아이 레이저 스크라이빙 공정의 웨이퍼 보호용 코팅제 조성물
CN106883778A (zh) * 2017-03-24 2017-06-23 东莞市吉晨胶粘制品有限公司 一种晶圆高温保护膜及其制作方法、使用方法

Also Published As

Publication number Publication date
CN111630113A (zh) 2020-09-04
CN111630113B (zh) 2022-02-08
TW201932553A (zh) 2019-08-16
TWI711675B (zh) 2020-12-01
WO2019143203A1 (ko) 2019-07-25
JP6862028B2 (ja) 2021-04-21
JP2020532881A (ja) 2020-11-12

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