TWI685026B - 剝離方法 - Google Patents

剝離方法 Download PDF

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Publication number
TWI685026B
TWI685026B TW107130688A TW107130688A TWI685026B TW I685026 B TWI685026 B TW I685026B TW 107130688 A TW107130688 A TW 107130688A TW 107130688 A TW107130688 A TW 107130688A TW I685026 B TWI685026 B TW I685026B
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TW
Taiwan
Prior art keywords
layer
peeling
substrate
light
peeled
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TW107130688A
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English (en)
Chinese (zh)
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TW201901765A (zh
Inventor
青山智哉
千田章裕
小松立
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日商半導體能源研究所股份有限公司
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Electroluminescent Light Sources (AREA)
  • Liquid Crystal (AREA)
  • Thin Film Transistor (AREA)
TW107130688A 2013-08-06 2014-07-29 剝離方法 TWI685026B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-163029 2013-08-06
JP2013163029 2013-08-06

Publications (2)

Publication Number Publication Date
TW201901765A TW201901765A (zh) 2019-01-01
TWI685026B true TWI685026B (zh) 2020-02-11

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TW107130688A TWI685026B (zh) 2013-08-06 2014-07-29 剝離方法
TW103125864A TWI642094B (zh) 2013-08-06 2014-07-29 剝離方法

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US (2) US9735398B2 (cg-RX-API-DMAC7.html)
JP (3) JP2015053479A (cg-RX-API-DMAC7.html)
KR (1) KR102224416B1 (cg-RX-API-DMAC7.html)
CN (2) CN105474355B (cg-RX-API-DMAC7.html)
TW (2) TWI685026B (cg-RX-API-DMAC7.html)
WO (1) WO2015019971A1 (cg-RX-API-DMAC7.html)

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