TWI681026B - 黏著劑組成物及使用其之黏著膜 - Google Patents
黏著劑組成物及使用其之黏著膜 Download PDFInfo
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- TWI681026B TWI681026B TW104103431A TW104103431A TWI681026B TW I681026 B TWI681026 B TW I681026B TW 104103431 A TW104103431 A TW 104103431A TW 104103431 A TW104103431 A TW 104103431A TW I681026 B TWI681026 B TW I681026B
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- Prior art keywords
- adhesive composition
- adhesive
- acrylate
- resin
- acrylic resin
- Prior art date
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- 239000000853 adhesive Substances 0.000 title claims abstract description 95
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 94
- 239000000203 mixture Substances 0.000 title claims abstract description 62
- 239000002313 adhesive film Substances 0.000 title claims description 34
- 229920005989 resin Polymers 0.000 claims abstract description 62
- 239000011347 resin Substances 0.000 claims abstract description 62
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 52
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 52
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 26
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 10
- 238000001723 curing Methods 0.000 claims abstract description 6
- 238000000016 photochemical curing Methods 0.000 claims abstract description 3
- -1 isocyanate compound Chemical class 0.000 claims description 62
- 239000000758 substrate Substances 0.000 claims description 38
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 30
- 239000012790 adhesive layer Substances 0.000 claims description 28
- 238000000576 coating method Methods 0.000 claims description 20
- 239000011248 coating agent Substances 0.000 claims description 17
- 150000001875 compounds Chemical class 0.000 claims description 16
- 230000009477 glass transition Effects 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 6
- 239000012948 isocyanate Substances 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 5
- 229920000728 polyester Polymers 0.000 claims description 4
- 229920005862 polyol Polymers 0.000 claims description 4
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 4
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- 229920000570 polyether Polymers 0.000 claims description 3
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 claims 1
- 238000004132 cross linking Methods 0.000 abstract description 7
- 238000011109 contamination Methods 0.000 abstract description 6
- 239000000178 monomer Substances 0.000 description 24
- 206010040844 Skin exfoliation Diseases 0.000 description 14
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 10
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 10
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 10
- 230000001681 protective effect Effects 0.000 description 10
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 8
- 238000007667 floating Methods 0.000 description 8
- 239000003999 initiator Substances 0.000 description 7
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 7
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 5
- 229920006243 acrylic copolymer Polymers 0.000 description 5
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- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N Propionic acid Chemical compound CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 238000007334 copolymerization reaction Methods 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 4
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- 229920001519 homopolymer Polymers 0.000 description 4
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 4
- 239000005056 polyisocyanate Substances 0.000 description 4
- 229920001228 polyisocyanate Polymers 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- 125000004386 diacrylate group Chemical group 0.000 description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 3
- 239000011976 maleic acid Substances 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 3
- HMEGGKJXNDSHHA-ODZAUARKSA-N (z)-but-2-enedioic acid;2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.OC(=O)\C=C/C(O)=O HMEGGKJXNDSHHA-ODZAUARKSA-N 0.000 description 2
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 2
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- RYCHOYFETYRVLW-UHFFFAOYSA-N 3,3-dihydroxy-2-methylprop-2-enoic acid Chemical compound OC(O)=C(C)C(O)=O RYCHOYFETYRVLW-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
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- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
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- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 2
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 2
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- 230000001588 bifunctional effect Effects 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
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- PRBBFHSSJFGXJS-UHFFFAOYSA-N (2,2-dimethyl-3-prop-2-enoyloxypropyl) prop-2-enoate;3-hydroxy-2,2-dimethylpropanoic acid Chemical compound OCC(C)(C)C(O)=O.C=CC(=O)OCC(C)(C)COC(=O)C=C PRBBFHSSJFGXJS-UHFFFAOYSA-N 0.000 description 1
- YLCILCNDLBSOIO-UHFFFAOYSA-N (3-prop-2-enoyloxyphenyl) prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC(OC(=O)C=C)=C1 YLCILCNDLBSOIO-UHFFFAOYSA-N 0.000 description 1
- JMMVHMOAIMOMOF-UHFFFAOYSA-N (4-prop-2-enoyloxyphenyl) prop-2-enoate Chemical compound C=CC(=O)OC1=CC=C(OC(=O)C=C)C=C1 JMMVHMOAIMOMOF-UHFFFAOYSA-N 0.000 description 1
- QWQFVUQPHUKAMY-UHFFFAOYSA-N 1,2-diphenyl-2-propoxyethanone Chemical compound C=1C=CC=CC=1C(OCCC)C(=O)C1=CC=CC=C1 QWQFVUQPHUKAMY-UHFFFAOYSA-N 0.000 description 1
- HGCMSCWGVAYWHR-UHFFFAOYSA-N 1,3,5-trimethyl-2-[[phenyl-[(2,4,6-trimethylphenyl)methyl]phosphoryl]methyl]benzene Chemical compound CC1=CC(C)=CC(C)=C1CP(=O)(C=1C=CC=CC=1)CC1=C(C)C=C(C)C=C1C HGCMSCWGVAYWHR-UHFFFAOYSA-N 0.000 description 1
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- OHLKMGYGBHFODF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=C(CN=C=O)C=C1 OHLKMGYGBHFODF-UHFFFAOYSA-N 0.000 description 1
- FWWWRCRHNMOYQY-UHFFFAOYSA-N 1,5-diisocyanato-2,4-dimethylbenzene Chemical compound CC1=CC(C)=C(N=C=O)C=C1N=C=O FWWWRCRHNMOYQY-UHFFFAOYSA-N 0.000 description 1
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 description 1
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- HROBBUFVRGGXBM-UHFFFAOYSA-N 2,2-dimethylpropane-1,3-diol hexanedioic acid prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OCC(C)(C)CO.OC(=O)CCCCC(O)=O HROBBUFVRGGXBM-UHFFFAOYSA-N 0.000 description 1
- OWPUOLBODXJOKH-UHFFFAOYSA-N 2,3-dihydroxypropyl prop-2-enoate Chemical compound OCC(O)COC(=O)C=C OWPUOLBODXJOKH-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
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- NPSJHQMIVNJLNN-UHFFFAOYSA-N 2-ethylhexyl 4-nitrobenzoate Chemical compound CCCCC(CC)COC(=O)C1=CC=C([N+]([O-])=O)C=C1 NPSJHQMIVNJLNN-UHFFFAOYSA-N 0.000 description 1
- 239000004808 2-ethylhexylester Substances 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 description 1
- AGBXYHCHUYARJY-UHFFFAOYSA-N 2-phenylethenesulfonic acid Chemical compound OS(=O)(=O)C=CC1=CC=CC=C1 AGBXYHCHUYARJY-UHFFFAOYSA-N 0.000 description 1
- YYIOIHBNJMVSBH-UHFFFAOYSA-N 2-prop-2-enoyloxynaphthalene-1-sulfonic acid Chemical compound C1=CC=C2C(S(=O)(=O)O)=C(OC(=O)C=C)C=CC2=C1 YYIOIHBNJMVSBH-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
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- C08G18/622—Polymers of esters of alpha-beta ethylenically unsaturated carboxylic acids
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- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/80—Masked polyisocyanates
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- C08G18/8009—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32 with compounds of C08G18/3203
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- C08G18/8029—Masked aromatic polyisocyanates
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
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- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B2307/00—Properties of the layers or laminate
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B2457/00—Electrical equipment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
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Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
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- Polymers & Plastics (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
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| JP2014020236A JP5858347B2 (ja) | 2014-02-05 | 2014-02-05 | 粘着剤組成物およびそれを用いた粘着フィルム |
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| JPWO2017051683A1 (ja) | 2015-09-24 | 2018-07-12 | 荒川化学工業株式会社 | エマルジョン組成物及びその製造方法、並びに積層体及びその製造方法 |
| WO2017170175A1 (ja) | 2016-03-29 | 2017-10-05 | 日本ゼオン株式会社 | 複層光学フィルム及びその製造方法 |
| JP6813988B2 (ja) * | 2016-08-12 | 2021-01-13 | ニッタ株式会社 | 感温性粘着テープおよび感温性粘着シート |
| KR101924575B1 (ko) * | 2017-07-28 | 2019-02-27 | 이명철 | 윈도우 디자인패턴 형성용 uv 경화성 수지 조성물 |
| JP7416626B2 (ja) * | 2017-12-28 | 2024-01-17 | リンテック株式会社 | 粘着シート及び半導体装置の製造方法 |
| JP6995033B2 (ja) * | 2018-09-27 | 2022-01-14 | 日東電工株式会社 | 補強フィルム |
| CN113613897B (zh) * | 2019-03-26 | 2023-05-12 | 琳得科株式会社 | 剥离片 |
| WO2020226169A1 (ja) * | 2019-05-08 | 2020-11-12 | 王子ホールディングス株式会社 | 粘着シート、積層体の製造方法および積層体 |
| TWI875814B (zh) * | 2019-09-30 | 2025-03-11 | 日商太陽控股股份有限公司 | 積層結構 |
| KR102401141B1 (ko) * | 2019-11-12 | 2022-05-23 | 삼성에스디아이 주식회사 | 점착 시트, 이를 위한 점착제 조성물, 이를 포함하는 광학 부재 및 이를 포함하는 광학표시장치 |
| JP2021095526A (ja) * | 2019-12-18 | 2021-06-24 | ライオン・スペシャリティ・ケミカルズ株式会社 | 再剥離粘着剤組成物および粘着シート |
| CN113480945A (zh) * | 2021-07-23 | 2021-10-08 | 江苏斯迪克新材料科技股份有限公司 | 一种丙烯酸酯压敏胶及其制备方法 |
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| JPS59176370A (ja) * | 1983-03-28 | 1984-10-05 | Nitto Electric Ind Co Ltd | 感圧性接着剤組成物 |
| JP3506519B2 (ja) * | 1995-03-06 | 2004-03-15 | リンテック株式会社 | 粘接着テープおよびその使用方法 |
| JP3516384B2 (ja) * | 1998-07-31 | 2004-04-05 | 日本合成化学工業株式会社 | 再剥離型粘着剤組成物 |
| JP4823436B2 (ja) | 2001-05-29 | 2011-11-24 | リンテック株式会社 | 紫外線架橋型感圧接着剤組成物、感圧接着剤シート及び感圧接着剤シートの製造方法 |
| JP4969744B2 (ja) * | 2001-09-03 | 2012-07-04 | ソマール株式会社 | 粘着組成物及び粘着シート |
| JP2005307134A (ja) | 2004-04-19 | 2005-11-04 | Hitachi Kasei Polymer Co Ltd | 部品仮固定用複合体 |
| JP5164339B2 (ja) * | 2005-04-28 | 2013-03-21 | 日本合成化学工業株式会社 | 粘着剤層付き光学積層体 |
| JP5095926B2 (ja) * | 2005-06-01 | 2012-12-12 | 三菱樹脂株式会社 | 粘着剤及びこれを用いた粘着体 |
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| JP5560537B2 (ja) | 2007-07-10 | 2014-07-30 | 住友ベークライト株式会社 | 半導体ウエハ加工用粘着テープ |
| KR101542634B1 (ko) * | 2007-11-19 | 2015-08-06 | 닛폰고세이가가쿠고교 가부시키가이샤 | 점착제, 광학 부재용 점착제, 및 점착제층을 갖는 광학 부재 |
| JP4318743B1 (ja) * | 2008-10-07 | 2009-08-26 | 昭和高分子株式会社 | 紫外線硬化型再剥離性粘着剤組成物及びこれを用いた粘着シート |
| JP5455362B2 (ja) * | 2008-12-25 | 2014-03-26 | チェイル インダストリーズ インコーポレイテッド | 粘着剤組成物およびこれを用いた光学部材 |
| EP2397533B1 (en) * | 2009-02-16 | 2013-04-17 | Soken Chemical & Engineering Co., Ltd. | Radiation curable adhesive composition for optical components and adhesive optical component |
| WO2011027707A1 (ja) * | 2009-09-01 | 2011-03-10 | 綜研化学株式会社 | 光学部材用放射線硬化型粘着剤組成物および粘着型光学部材 |
| KR20110025258A (ko) * | 2009-09-04 | 2011-03-10 | 도레이첨단소재 주식회사 | 도금용 점착시트 |
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| KR101194544B1 (ko) * | 2011-01-20 | 2012-10-25 | 도레이첨단소재 주식회사 | 다이 익스포즈드 플립칩 패키지(ｄｅｆｃｐ)의 몰드 언더필 공정용 점착 마스킹 테이프 |
| JP2012177084A (ja) * | 2011-01-31 | 2012-09-13 | Dainippon Printing Co Ltd | 耐熱仮着用の粘着剤組成物及び粘着テープ |
| JP2012193321A (ja) * | 2011-03-18 | 2012-10-11 | Furukawa Electric Co Ltd:The | 放射線硬化型粘着剤組成物、それを用いたウェハ加工用粘着テープ、放射線硬化型粘着剤組成物の判定方法 |
| CN103857760B (zh) * | 2011-08-03 | 2016-09-21 | 琳得科株式会社 | 阻气性粘合片材、其制造方法、以及电子构件及光学构件 |
| CN103890118B (zh) * | 2011-10-24 | 2016-11-09 | 王子控股株式会社 | 粘合片及其使用方法以及层叠体 |
| JP2013142132A (ja) * | 2012-01-11 | 2013-07-22 | Dainippon Printing Co Ltd | 積層体、この積層体を用いた透明光学部材及びこの積層体を用いた画像表示装置 |
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| CN104412369B (zh) * | 2012-06-29 | 2017-05-24 | 日立化成株式会社 | 半导体装置的制造方法 |
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Patent Citations (1)
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| TW201430083A (zh) * | 2012-10-24 | 2014-08-01 | Toagosei Co Ltd | 活性能量線硬化型黏接著劑組成物及積層體之製造方法 |
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| Publication number | Publication date |
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| JP5858347B2 (ja) | 2016-02-10 |
| CN105899633A (zh) | 2016-08-24 |
| KR20160118239A (ko) | 2016-10-11 |
| TW201534673A (zh) | 2015-09-16 |
| JP2015147828A (ja) | 2015-08-20 |
| WO2015119042A1 (ja) | 2015-08-13 |
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