TWI675468B - Ｌｅｄ光源模組及其製造方法 - Google Patents
Ｌｅｄ光源模組及其製造方法 Download PDFInfo
- Publication number
- TWI675468B TWI675468B TW106137744A TW106137744A TWI675468B TW I675468 B TWI675468 B TW I675468B TW 106137744 A TW106137744 A TW 106137744A TW 106137744 A TW106137744 A TW 106137744A TW I675468 B TWI675468 B TW I675468B
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive portion
- auxiliary structure
- source module
- light source
- led light
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 57
- 239000011241 protective layer Substances 0.000 claims abstract description 35
- 239000010410 layer Substances 0.000 claims description 52
- 238000009413 insulation Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 239000011810 insulating material Substances 0.000 description 6
- 230000005284 excitation Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/61—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using light guides
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0086—Positioning aspects
- G02B6/009—Positioning aspects of the light source in the package
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ??PCT/CN2017/108063 | 2017-10-27 | ||
| PCT/CN2017/108063 WO2019080104A1 (zh) | 2017-10-27 | 2017-10-27 | Led光源模组及其制造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201917879A TW201917879A (zh) | 2019-05-01 |
| TWI675468B true TWI675468B (zh) | 2019-10-21 |
Family
ID=66243606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106137744A TWI675468B (zh) | 2017-10-27 | 2017-11-01 | Ｌｅｄ光源模組及其製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10883667B2 (enExample) |
| JP (1) | JP7100700B2 (enExample) |
| KR (1) | KR102481413B1 (enExample) |
| CN (1) | CN110140217B (enExample) |
| TW (1) | TWI675468B (enExample) |
| WO (1) | WO2019080104A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11686896B2 (en) | 2017-10-27 | 2023-06-27 | Radiant Opto-Electronics(Suzhou) Co., Ltd. | LED light source module |
| CN113261120B (zh) * | 2019-11-27 | 2023-03-24 | 鹏鼎控股(深圳)股份有限公司 | 多面发光电路板及其制作方法 |
| TWI731648B (zh) * | 2020-04-10 | 2021-06-21 | 禾昌興業股份有限公司 | 光源模組連接器 |
| WO2022095032A1 (zh) * | 2020-11-09 | 2022-05-12 | 瑞仪光电(苏州)有限公司 | Led光源模组 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201313055A (zh) * | 2011-09-01 | 2013-03-16 | Au Optronics Corp | 發光二極體模組與採用此發光二極體模組之顯示器 |
| TW201410083A (zh) * | 2012-12-20 | 2014-03-01 | Synergy Optoelectronics Shenzhen Co Ltd | 電路板結構及使用該電路板結構的背光模組 |
| CN106094337A (zh) * | 2016-08-11 | 2016-11-09 | 昆山龙腾光电有限公司 | 一种led灯条及背光模组 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006324608A (ja) * | 2005-05-20 | 2006-11-30 | Pioneer Electronic Corp | フレキシブル基板及びその製造方法、並びにｌｅｄ実装フレキシブル基板及びそれを用いた照明装置 |
| JP5140413B2 (ja) * | 2007-12-28 | 2013-02-06 | 株式会社日立製作所 | 実装基板、及びこの実装基板を備えるｌｅｄ光源装置 |
| CN101656283B (zh) * | 2008-08-22 | 2011-03-30 | 奇力光电科技股份有限公司 | 发光二极管组件及其制造方法 |
| JP2010161279A (ja) | 2009-01-09 | 2010-07-22 | Sharp Corp | 発光装置 |
| CN101577260B (zh) * | 2009-06-05 | 2011-01-19 | 深圳华映显示科技有限公司 | 线路基板及光源模组 |
| JPWO2010140604A1 (ja) | 2009-06-05 | 2012-11-22 | 先端フォトニクス株式会社 | サブマウント、これを備えた光モジュール、及びサブマウントの製造方法 |
| CN102082218B (zh) | 2009-11-26 | 2013-10-23 | 亿光电子工业股份有限公司 | 发光二极管及其装置、封装方法 |
| JP5693194B2 (ja) | 2010-12-14 | 2015-04-01 | シチズン電子株式会社 | 発光ダイオード |
| TWI430429B (zh) | 2010-12-24 | 2014-03-11 | 友達光電股份有限公司 | 發光模組 |
| KR20120119091A (ko) * | 2011-04-20 | 2012-10-30 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치와, 이의 제조 방법 |
| WO2012169717A1 (en) | 2011-06-08 | 2012-12-13 | Seoul Semiconductor Co., Ltd. | Light emitting diode package |
| JP5978572B2 (ja) * | 2011-09-02 | 2016-08-24 | 日亜化学工業株式会社 | 発光装置 |
| JP5933959B2 (ja) | 2011-11-18 | 2016-06-15 | スタンレー電気株式会社 | 半導体光学装置 |
| TWI606618B (zh) * | 2012-01-03 | 2017-11-21 | Ｌｇ伊諾特股份有限公司 | 發光裝置 |
| CN102779923B (zh) * | 2012-07-09 | 2015-02-04 | 厦门吉瓦特照明科技有限公司 | 一种贴片式led模组的制造方法 |
| JP2014067740A (ja) * | 2012-09-24 | 2014-04-17 | Stanley Electric Co Ltd | 光半導体装置 |
| JP6414427B2 (ja) * | 2013-10-03 | 2018-10-31 | 日亜化学工業株式会社 | 発光装置実装構造体 |
| TWM474255U (zh) * | 2013-10-23 | 2014-03-11 | 競國實業股份有限公司 | 電路板及發光二極體裝置 |
| JP2015207626A (ja) | 2014-04-18 | 2015-11-19 | スタンレー電気株式会社 | サイドビュー型半導体発光装置 |
| JP6661890B2 (ja) * | 2014-05-21 | 2020-03-11 | 日亜化学工業株式会社 | 発光装置 |
| JP6409459B2 (ja) | 2014-09-30 | 2018-10-24 | 日亜化学工業株式会社 | 照明装置 |
| JP2016201237A (ja) * | 2015-04-09 | 2016-12-01 | パナソニックＩｐマネジメント株式会社 | 発光モジュール及びそれを用いた発光装置 |
| KR102346643B1 (ko) * | 2015-06-30 | 2022-01-03 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광 소자, 발광 소자 제조방법 및 발광 모듈 |
| CN106558568B (zh) * | 2015-09-30 | 2020-05-12 | 台达电子工业股份有限公司 | 封装结构 |
| CN106094377A (zh) | 2016-07-25 | 2016-11-09 | 深圳市华星光电技术有限公司 | 一种阵列基板及液晶显示面板 |
| KR102135584B1 (ko) | 2020-01-09 | 2020-07-20 | (주)이씨티 | 태양광 발전 장치의 발전 효율을 향상시키는 냉각수 공급 장치 |
-
2017
- 2017-10-27 WO PCT/CN2017/108063 patent/WO2019080104A1/zh not_active Ceased
- 2017-10-27 CN CN201780012838.4A patent/CN110140217B/zh active Active
- 2017-10-27 JP JP2020522851A patent/JP7100700B2/ja active Active
- 2017-10-27 KR KR1020207011882A patent/KR102481413B1/ko active Active
- 2017-11-01 TW TW106137744A patent/TWI675468B/zh active
-
2018
- 2018-09-28 US US16/145,904 patent/US10883667B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201313055A (zh) * | 2011-09-01 | 2013-03-16 | Au Optronics Corp | 發光二極體模組與採用此發光二極體模組之顯示器 |
| TW201410083A (zh) * | 2012-12-20 | 2014-03-01 | Synergy Optoelectronics Shenzhen Co Ltd | 電路板結構及使用該電路板結構的背光模組 |
| CN106094337A (zh) * | 2016-08-11 | 2016-11-09 | 昆山龙腾光电有限公司 | 一种led灯条及背光模组 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20190128480A1 (en) | 2019-05-02 |
| JP7100700B2 (ja) | 2022-07-13 |
| JP2021510007A (ja) | 2021-04-08 |
| TW201917879A (zh) | 2019-05-01 |
| CN110140217A (zh) | 2019-08-16 |
| US10883667B2 (en) | 2021-01-05 |
| KR20200081373A (ko) | 2020-07-07 |
| CN110140217B (zh) | 2023-03-14 |
| WO2019080104A1 (zh) | 2019-05-02 |
| KR102481413B1 (ko) | 2022-12-26 |
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