WO2019080104A1 - Led光源模组及其制造方法 - Google Patents

Led光源模组及其制造方法

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Publication number
WO2019080104A1
WO2019080104A1 PCT/CN2017/108063 CN2017108063W WO2019080104A1 WO 2019080104 A1 WO2019080104 A1 WO 2019080104A1 CN 2017108063 W CN2017108063 W CN 2017108063W WO 2019080104 A1 WO2019080104 A1 WO 2019080104A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive portion
auxiliary structure
source module
light source
led light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2017/108063
Other languages
English (en)
French (fr)
Chinese (zh)
Inventor
钟智贤
叶修宏
陈庆员
朱延专
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiant Opto Electronics Suzhou Co Ltd
Radiant Opto Electronics Corp
Original Assignee
Radiant Opto Electronics Suzhou Co Ltd
Radiant Opto Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Radiant Opto Electronics Suzhou Co Ltd, Radiant Opto Electronics Corp filed Critical Radiant Opto Electronics Suzhou Co Ltd
Priority to KR1020207011882A priority Critical patent/KR102481413B1/ko
Priority to CN201780012838.4A priority patent/CN110140217B/zh
Priority to JP2020522851A priority patent/JP7100700B2/ja
Priority to PCT/CN2017/108063 priority patent/WO2019080104A1/zh
Priority to TW106137744A priority patent/TWI675468B/zh
Priority to US16/145,904 priority patent/US10883667B2/en
Publication of WO2019080104A1 publication Critical patent/WO2019080104A1/zh
Anticipated expiration legal-status Critical
Priority to US16/953,772 priority patent/US11686896B2/en
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/61—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using light guides
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/009—Positioning aspects of the light source in the package
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to an LED light source module. More specifically, the present invention relates to an LED light source module having an auxiliary structure.
  • a light-emitting diode is a semiconductor electronic component capable of emitting light.
  • Today, the light emitted by the device is widely visible, visible, and ultraviolet, and has a very high brightness.
  • LEDs In general, most LEDs have two electrodes on their bottom surface.
  • the light emitting diode When the light emitting diode is fixed to a printed circuit board (PCB) of a light bar, it is mainly performed by surface mounting technology (SMT), that is, an opening is formed on the protective film so that The electrode is electrically connected to the pad of the printed circuit board through the opening.
  • SMT surface mounting technology
  • the solder paste is first printed on the solder pad of the printed circuit board, and then the light emitting diode is aligned and placed on the solder pad of the solder paste, and finally heated and reflowed to fix the light emitting diode on the solder pad.
  • the light emitting diode when the light emitting diode is placed in the opening of the protective film, the light emitting diode is prone to tilt, which affects the alignment of the light emitting diode in the vertical direction, thereby causing the light to be misaligned to the receiving surface (for example, the backlight module).
  • the light incident surface of the light guide plate or a part of the light emitted by the light emitting diode is shielded by the wall surface of the opening, thereby causing a decrease in the efficiency of use of light.
  • the present invention provides an LED light source module including a substrate, a protective layer, a first conductive portion, a second conductive portion, at least one auxiliary structure, and a light emitting element.
  • the protective layer is disposed on the substrate and has an opening, and the first conductive portion, the second conductive portion and the auxiliary structure are disposed on the substrate and are received in the opening, wherein the auxiliary structure is located at the first conductive portion and the second Between the conductive parts.
  • the light emitting element has a first electrode and a second electrode electrically connected to the first conductive portion and the second conductive portion, respectively, and the auxiliary structure is located between the light emitting element and the substrate.
  • the top surface of the auxiliary structure is substantially aligned with the top surface of the protective layer.
  • the auxiliary structure includes a third conductive portion.
  • the auxiliary structure includes an insulating layer, and the third conductive portion is disposed between the insulating layer and the substrate.
  • the auxiliary structure comprises an insulating layer.
  • the illuminating element has a bottom surface and a plurality of sides connected to the bottom surface, wherein the bottom surface is in contact with the auxiliary structure, and the first electrode and the second electrode are disposed on the side surface.
  • the first electrode and the second electrode are disposed on the same side.
  • the first electrode and the second electrode are disposed on different sides.
  • the LED light source module further includes a stopper disposed on the substrate and housed in the opening, and the light emitting element has a light emitting surface and a side opposite to the light emitting surface, wherein the stopper and the side surface contact.
  • the LED light source module includes a plurality of auxiliary structures, and at least one of the plurality of auxiliary structures extends from the stopper to the protective layer.
  • the first conductive portion, the second conductive portion, and the auxiliary structure are separated from each other.
  • the invention also provides a method for manufacturing an LED light source module, comprising: providing a substrate; forming a first conductive portion, a second conductive portion, and at least one circuit layer on the substrate; forming a first conductive portion and a second conductive portion And a protective layer of the circuit layer; forming an opening on the protective layer, wherein the first conductive portion and the second conductive portion are exposed from the opening; forming at least one auxiliary structure between the first conductive portion and the second conductive portion in the opening And arranging the light-emitting elements on the auxiliary structure, and the first electrode and the second electrode of the light-emitting element are electrically connected to the first conductive portion and the second conductive portion, respectively, and the bottom surface of the light-emitting element is in contact with the auxiliary structure.
  • the step of forming the auxiliary structure further comprises forming a third conductive portion on the substrate, wherein the third conductive portion is located between the first conductive portion and the second conductive portion.
  • the step of forming the auxiliary structure further includes disposing an insulating layer on the third conductive portion.
  • the top surface of the auxiliary structure is substantially aligned with the top surface of the protective layer.
  • the step of forming the auxiliary structure further includes forming an insulating layer on the substrate.
  • FIG. 1 shows a schematic diagram of an LED light source module of an embodiment of the present invention.
  • FIG. 2A shows a partial top view of an LED light source module in accordance with an embodiment of the present invention.
  • FIG. 2B is a partial top plan view of an LED light source module in accordance with another embodiment of the present invention.
  • FIG. 3 shows a schematic diagram of an LED light source module according to another embodiment of the present invention.
  • FIG. 4 is a partial top plan view of an LED light source module in accordance with another embodiment of the present invention.
  • FIG. 5 is a flow chart showing a method of manufacturing an LED light source module according to an embodiment of the present invention.
  • FIG. 6 is a flow chart showing a method of manufacturing an LED light source module according to another embodiment of the present invention.
  • the LED light source module 10 of the embodiment of the present invention is used for optical coupling to the light guiding component 20 (for example, a light guide plate), and provides light to the side of the light guiding component 20, and the light is After entering the light guiding element 20, it is guided by the light guiding element 20 and generates a planar light output on the light emitting surface 21.
  • the LED light source module 10 mainly includes a substrate 100, a circuit layer 200, a protective layer 300, a first conductive portion 400, a second conductive portion 500, at least one auxiliary structure 600, a light-emitting element 700, and a stopper 800.
  • the circuit layer 200 and the protective layer 300 of the light source module 10 are disposed on the substrate 100, and the circuit layer 200 is located between the substrate 100 and the protective layer 300.
  • the first conductive portion 400, the second conductive portion 500, and the auxiliary structure 600 are patterned and etched from the wiring layer 200 on the substrate 100. Therefore, these elements are formed on the same layer plane with respect to the substrate 100.
  • the protective layer 300 is formed on the wiring layer 200, and is formed with an opening 310 that exposes the first conductive portion 400, the second conductive portion 500, and the auxiliary structure 600 to solder the light-emitting element 700 thereon, thereby achieving
  • the first conductive portion 400, the second conductive portion 500, and the auxiliary structure 600 are disposed on the substrate 100 and housed in the opening 310. It should be noted that the first conductive portion 400, the second conductive portion 500, and the auxiliary structure 600 are separated from each other, and the auxiliary structure 600 is disposed between the first conductive portion 400 and the second conductive portion 500 (as
  • the light-emitting element 700 can be disposed on the auxiliary structure 600 such that the auxiliary structure 600 is located between the light-emitting element 700 and the substrate 100. Since the top surface 601 of the auxiliary structure 600 is substantially aligned with the top surface 301 of the protective layer 300, the bottom surface 701 of the light emitting element 700 can be in contact with both the top surface 601 of the auxiliary structure 600 and the top surface 301 of the protective layer 300, thereby The light guiding element 20 is horizontally disposed. That is, the light-emitting element 700 is supported by the auxiliary structure 600 and the protective layer 300 in the back surface region, and can be formed in a state of being horizontal in the XY plane as shown in FIG.
  • the light-emitting element 700 is less prone to the phenomenon that the back surface area is inclined downward and the front area is inclined upward, so that the problem that the light use efficiency is lowered due to the light misalignment receiving surface or the light shielding by the wall surface of the opening is effectively solved.
  • the top surface 601 of the auxiliary structure 600 is substantially aligned with the top surface 301 of the protective layer 300.
  • the auxiliary structure 600 includes a third conductive portion 610 and an insulating layer 620, wherein the third conductive portion 610 is located at the insulating layer 620 and Between the substrates 100, and the insulating layer 620 is located between the light emitting element 700 and the third conductive portion 610.
  • the total thickness of the third conductive portion 610 and the insulating layer 620 is substantially the same as the distance from the top surface 301 of the protective layer 300 to the substrate 100.
  • the thickness of the third conductive portion 610 may be in the range of 10 mm to 15 mm, and the thickness of the insulating layer 620 may also be in the range of 10 mm to 15 mm, so the overall thickness of the auxiliary structure 600 will be between 20 mm and ⁇ Within the range of 30mm.
  • the third conductive portion 610, the wiring layer 200, the first conductive portion 400, and the second conductive portion 500 may include the same conductive material such as copper, aluminum, or an alloy thereof.
  • the insulating layer 620 can include a suitable A rim material, such as a liquid photoimageable solder mask (LPSM).
  • LPSM liquid photoimageable solder mask
  • the third conductive portion 610, the first conductive portion 400, and the second conductive portion 500 are each patterned by etching the wiring layer 200 on the substrate 100, and the three may have the same height. Since the insulating layer 620 is disposed on the third conductive portion 610 of the auxiliary structure 600, the height of the auxiliary structure 600 is higher than the height of the first conductive portion 400 or the second conductive portion 500.
  • the light-emitting element 700 includes a first electrode 710 and a second electrode 720.
  • the first electrode 710 and the second electrode 720 are respectively disposed on opposite sides of the bottom surface 701.
  • the first electrode 710 and the first conductive portion 400 can be filled.
  • the first electrode 710 and the second electrode 720 can be electrically connected to the first conductive portion 400 and the second conductive portion 500, respectively, to provide the light-emitting element 700. Electricity.
  • the light emitting element 700 may further include a mounting portion 730 and an excitation portion 740, the first electrode 710 and the second electrode 720 are disposed on the mounting portion 730, and the excitation portion 740 has a plurality of fluorescent elements (eg, phosphors) therein.
  • the fluorescent element is excited to emit light toward the light emitting surface 702.
  • a portion of the protective layer 300 may extend between the substrate 100 and the excitation portion 740 of the light-emitting element 700, and the surface of the protective layer 300 is substantially a high reflectance, low light-absorbing color. , for example, white. Therefore, when the light-emitting element 700 emits light toward the light-guiding element 20 to generate a planar light-emitting through the light-guiding element 20, even if a part of the light enters the light-guiding element 20 after being reflected by the protective layer 300, the planar light output does not occur. Color difference.
  • the surface of the protective layer 300 is substantially a low reflectivity, high light absorbing color, such as black, which is applied to the high luminance light emitting element 700 to absorb the energy of the light emitting element 700, thereby avoiding backlighting.
  • the module produces a problem with bright lines.
  • the stopper 800 is also disposed on the substrate 100 and housed in the opening 310 of the protective layer 300.
  • the stopper 800 may contact the side surface 703 of the light emitting element 700 opposite to the light emitting surface 702. Thereby, if the user inadvertently pushes the light-emitting element 700 toward the -X-axis direction when the light guide element 20 is installed, the stopper 800 can still provide Sufficient supporting force to prevent the light-emitting element 700 from moving or tilting.
  • the stopper 800 may include a metal material such as copper, aluminum or an alloy thereof, and the substrate 100 and the protective layer 300 may respectively include a suitable insulating material.
  • the substrate 100 may include Polyimide (PI).
  • the LED light source module 10 By the structure of the LED light source module 10, it is ensured that the light-emitting element 700 is horizontally disposed with respect to the light-guiding element 20, and the light provided by the light-emitting element 700 is not blocked by other elements, thereby improving the light usage rate.
  • the auxiliary structure 600 is composed of a first extension portion 630 and a second extension portion 640.
  • the first extending portion 630 extends from the first conductive portion 400 toward the second conductive portion 500 and extends between the light emitting element 700 and the substrate 100
  • the second extending portion 640 extends from the second conductive portion 500 toward the first conductive portion 400 . It extends and extends between the light-emitting element 700 and the substrate 100.
  • the first extending portion 630 and the first conductive portion 400 may be integrally formed, and the second extending portion 640 and the second conductive portion 500 may also be integrally formed.
  • the surfaces of the first extension portion 630 and the second extension portion 640 may be coated with an insulating material such as a liquid photosensitive solder resist ink.
  • the first extension portion 630 and the second extension portion 640 may extend to a position away from the first electrode 710 and the second electrode 720, respectively, and then extend between the light emitting element 700 and the substrate 100.
  • the auxiliary structure 600 includes only the insulating layer 620.
  • the insulating layer 620 is in direct contact with the substrate 100 and the bottom surface 701 of the light emitting element 700, and the thickness of the insulating layer 620 is substantially the same as the distance from the top surface 301 of the protective layer 300 to the substrate 100. Therefore, the top surface 601 of the auxiliary structure 600 and the protective layer 300 The top surface 301 is generally aligned.
  • the insulating layer 620 may include a liquid photosensitive solder resist ink and may have a thickness ranging from 10 mm to 30 mm (for example, 25 mm).
  • the LED light source module 10 includes a plurality of auxiliary structures 600, which may be composed of a third conductive portion 610 and an insulating layer 620 (like the auxiliary structure in FIG. 1). 600) or consists of a single insulating layer 620 (like the auxiliary structure 600 in Figure 3).
  • the centrally located auxiliary structure 600 can extend from the stop 800 to the protective layer 300 to provide the light-emitting element 700 more securely disposed.
  • the first electrode 710 and the second electrode 720 of the light-emitting element 700 are both located on the side 703 opposite to the light-emitting surface 702. Therefore, the first conductive portion 400, the second conductive portion 500, and the stopper 800 It will be in contact with the same side of the light-emitting element 700, that is, the side surface 703.
  • the first electrode 710 and the second electrode 720 are electrically connected to the first conductive portion 400 and the second conductive portion 500, respectively.
  • the first electrode 710 and the second electrode 720 may be located on the bottom surface 701 of the light emitting element 700 or simultaneously extend from the side 703 of the light emitting element 700 to the bottom surface 701.
  • the substrate 100 may be provided (step S1), and at least one wiring layer 200 is formed on the substrate 100 (step S2).
  • the first conductive portion 400 and the second conductive portion 500 are formed on the wiring layer 200, and at the same time, one or more auxiliary structures 600 are formed between the first conductive portion 400 and the second conductive portion 500 (step S3).
  • the step of forming the auxiliary structure 600 includes forming the third conductive portion 610 on the circuit layer 200 and providing the insulating layer 620 on the third conductive portion 610, wherein the third conductive portion 610 is located at the first conductive portion 400 and Between the second conductive portions 500.
  • step S4 the protective layer 300 covering the wiring layer 200 is formed, and an opening 310 is formed on the protective layer 300, wherein the first conductive portion 400 and the second conductive portion 500 are exposed from the opening 310 (step S4).
  • the light-emitting element 700 is disposed on the auxiliary structure 600 (step S5) to constitute the LED light source module 10 as shown in FIGS.
  • the first electrode 710 and the second electrode 720 of the light-emitting element 700 are electrically connected to the first conductive portion 400 and the second conductive portion 500, respectively, and the bottom surface 701 of the light-emitting element 700 is in contact with the auxiliary structure 600.
  • the step of forming the third conductive portion 610 can form the first conductive portion 400 and the second conductive portion.
  • the step of 500 is completed in the same process, and then an insulating layer 620 is provided on the third conductive portion 610 to simplify the process and shorten the manufacturing time.
  • the step of forming a stop 800 on the substrate 100 can also be included.
  • the step of forming the stopper 800 may be performed in the same process as the step of forming the first conductive portion 400 and the second conductive portion 500, and the portion of the stopper 800 in contact with the light-emitting element 700 An additional insulating material is provided.
  • the substrate 100 may be provided (step S1'), and at least one wiring layer 200 is formed on the substrate 100 (step S2').
  • step S3' the first conductive portion 400 and the second conductive portion 500 are formed on the wiring layer 200 (step S3'), then the protective layer 300 covering the wiring layer 200 is formed, and an opening 310 is formed on the protective layer 300, wherein the first conductive The portion 400 and the second conductive portion 500 are exposed from the opening 310 (step S4').
  • one or more auxiliary structures 600 between the first conductive portion 400 and the second conductive portion 500 may be formed in the opening 310 (step S5'). It should be noted that in this embodiment, the step of forming the auxiliary structure 600 includes forming the insulating layer 620 directly on the substrate 100.
  • the light-emitting element 700 can be disposed on the auxiliary structure 600 (step S6') to constitute the LED light source module 10 as shown in FIG.
  • the first electrode 710 and the second electrode 720 of the light-emitting element 700 are electrically connected to the first conductive portion 400 and the second conductive portion 500, respectively, and the bottom surface 701 of the light-emitting element 700 is in contact with the auxiliary structure 600.
  • the auxiliary structure 600 is the insulating layer 620 formed on the substrate 100, it is not necessary to pattern and etch the first conductive portion 400 and the second conductive portion 500 while using the wiring layer 200 of the substrate 100. Instead, the insulating layer 620 is formed after this.
  • the stopper 800 may also include an insulating material. Similarly, it is not necessary to pattern and etch the first conductive portion 400 and the second conductive portion 500 while using the wiring layer 200 of the substrate 100. Instead, the insulating material is formed on the substrate 100 after that.
  • the present invention provides an LED light source module, wherein the LED light source module includes an auxiliary structure disposed between the first conductive portion and the second conductive portion, and the top surface and the protective layer of the auxiliary structure The top surface is aligned so that the light-emitting elements can be horizontally disposed with respect to the light-guiding elements, thereby increasing the efficiency of use of light.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
PCT/CN2017/108063 2017-10-27 2017-10-27 Led光源模组及其制造方法 Ceased WO2019080104A1 (zh)

Priority Applications (7)

Application Number Priority Date Filing Date Title
KR1020207011882A KR102481413B1 (ko) 2017-10-27 2017-10-27 Led 광원 모듈 및 이의 제조방법
CN201780012838.4A CN110140217B (zh) 2017-10-27 2017-10-27 Led光源模组及其制造方法
JP2020522851A JP7100700B2 (ja) 2017-10-27 2017-10-27 Ｌｅｄ光源モジュール及びその製造方法
PCT/CN2017/108063 WO2019080104A1 (zh) 2017-10-27 2017-10-27 Led光源模组及其制造方法
TW106137744A TWI675468B (zh) 2017-10-27 2017-11-01 Ｌｅｄ光源模組及其製造方法
US16/145,904 US10883667B2 (en) 2017-10-27 2018-09-28 LED light source module and method for manufacturing the same
US16/953,772 US11686896B2 (en) 2017-10-27 2020-11-20 LED light source module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/108063 WO2019080104A1 (zh) 2017-10-27 2017-10-27 Led光源模组及其制造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US16/145,904 Continuation US10883667B2 (en) 2017-10-27 2018-09-28 LED light source module and method for manufacturing the same

Publications (1)

Publication Number Publication Date
WO2019080104A1 true WO2019080104A1 (zh) 2019-05-02

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Application Number Title Priority Date Filing Date
PCT/CN2017/108063 Ceased WO2019080104A1 (zh) 2017-10-27 2017-10-27 Led光源模组及其制造方法

Country Status (6)

Country Link
US (1) US10883667B2 (enExample)
JP (1) JP7100700B2 (enExample)
KR (1) KR102481413B1 (enExample)
CN (1) CN110140217B (enExample)
TW (1) TWI675468B (enExample)
WO (1) WO2019080104A1 (enExample)

Cited By (1)

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Publication number Priority date Publication date Assignee Title
CN113261120A (zh) * 2019-11-27 2021-08-13 鹏鼎控股(深圳)股份有限公司 多面发光电路板及其制作方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11686896B2 (en) 2017-10-27 2023-06-27 Radiant Opto-Electronics(Suzhou) Co., Ltd. LED light source module
TWI731648B (zh) * 2020-04-10 2021-06-21 禾昌興業股份有限公司 光源模組連接器
CN114762121A (zh) * 2020-11-09 2022-07-15 瑞仪光电(苏州)有限公司 Led光源模组

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