CN114762121A - Led光源模组 - Google Patents

Led光源模组 Download PDF

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Publication number
CN114762121A
CN114762121A CN202080013657.5A CN202080013657A CN114762121A CN 114762121 A CN114762121 A CN 114762121A CN 202080013657 A CN202080013657 A CN 202080013657A CN 114762121 A CN114762121 A CN 114762121A
Authority
CN
China
Prior art keywords
light emitting
electrode
emitting element
source module
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080013657.5A
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English (en)
Inventor
钟智贤
叶修宏
陈庆员
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiant Opto Electronics Suzhou Co Ltd
Radiant Opto Electronics Corp
Original Assignee
Radiant Opto Electronics Suzhou Co Ltd
Radiant Opto Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Radiant Opto Electronics Suzhou Co Ltd, Radiant Opto Electronics Corp filed Critical Radiant Opto Electronics Suzhou Co Ltd
Publication of CN114762121A publication Critical patent/CN114762121A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

一种LED光源模组(10)，包括：基板(100)；保护层(300)，其设置于基板(100)上并具有至少一个开口(310)；多个导电部，其设置于至少一个开口(310)中，其中，多个导电部包括第一导电部(400)及第二导电部(500)；发光元件(700)，包括底面(701)、与底面(701)连接的发光面(702)、与发光面(702)相对的背面(703)、连接发光面(702)与底面(701)的至少一个侧面、以及多个电极，其中，多个电极包括第一电极(710)和第二电极(720)，第一电极(710)和第二电极(720)分别电性连接第一导电部(400)和第二导电部(500)；以及辅助结构(900)，其设置于基板(100)与发光元件(700)之间且不接触第一电极(710)及第二电极(720)，其中，辅助结构(900)包括设于基板(100)上以支撑发光元件(700)的底面(701)的主要支撑部(910)，主要支撑部(910)位于电极之间且至少从发光元件(700)的背面(703)延伸至发光面(702)。

Description

PCT国内申请，说明书已公开。

Claims (20)

  1. PCT国内申请，权利要求书已公开。
CN202080013657.5A 2020-11-09 2020-11-09 Led光源模组 Pending CN114762121A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/127533 WO2022095032A1 (zh) 2020-11-09 2020-11-09 Led光源模组

Publications (1)

Publication Number Publication Date
CN114762121A true CN114762121A (zh) 2022-07-15

Family

ID=80680975

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080013657.5A Pending CN114762121A (zh) 2020-11-09 2020-11-09 Led光源模组

Country Status (4)

Country Link
US (1) US20230275201A1 (zh)
CN (1) CN114762121A (zh)
TW (1) TWI748748B (zh)
WO (1) WO2022095032A1 (zh)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201129643Y (zh) * 2007-12-04 2008-10-08 胜华科技股份有限公司 光源模组及具有此光源模组的背光模组
TWI363234B (en) * 2008-11-18 2012-05-01 Au Optronics Corp Backlight module and lcd panel display using the same
TWI371996B (en) * 2008-11-25 2012-09-01 Chimei Innolux Corp Flexible print circuit and backlight module
KR20120019139A (ko) * 2010-08-25 2012-03-06 삼성전자주식회사 액정표시장치
KR101295358B1 (ko) * 2011-03-16 2013-08-12 삼성전자주식회사 액정 표시 장치 및 이에 구비되는 엘이디 모듈
CN103712167A (zh) * 2014-01-16 2014-04-09 瑞仪光电股份有限公司 光源组件及背光模组
WO2017073471A1 (ja) * 2015-10-30 2017-05-04 シャープ株式会社 照明装置及び表示装置
CN207635016U (zh) * 2017-10-27 2018-07-20 瑞仪光电股份有限公司 Led光源模组
KR102481413B1 (ko) * 2017-10-27 2022-12-26 라디안트 옵토-엘렉트로닉스(쑤저우) 컴퍼니 리미티드 Led 광원 모듈 및 이의 제조방법
JP2019179174A (ja) * 2018-03-30 2019-10-17 シャープ株式会社 表示装置、及び表示装置の製造方法

Also Published As

Publication number Publication date
TW202219428A (zh) 2022-05-16
US20230275201A1 (en) 2023-08-31
WO2022095032A1 (zh) 2022-05-12
TWI748748B (zh) 2021-12-01

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