WO2022095032A1 - Led光源模组 - Google Patents

Led光源模组 Download PDF

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Publication number
WO2022095032A1
WO2022095032A1 PCT/CN2020/127533 CN2020127533W WO2022095032A1 WO 2022095032 A1 WO2022095032 A1 WO 2022095032A1 CN 2020127533 W CN2020127533 W CN 2020127533W WO 2022095032 A1 WO2022095032 A1 WO 2022095032A1
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WO
WIPO (PCT)
Prior art keywords
light
emitting element
electrode
source module
light source
Prior art date
Application number
PCT/CN2020/127533
Other languages
English (en)
French (fr)
Inventor
钟智贤
叶修宏
陈庆员
Original Assignee
瑞仪光电(苏州)有限公司
瑞仪光电股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瑞仪光电(苏州)有限公司, 瑞仪光电股份有限公司 filed Critical 瑞仪光电(苏州)有限公司
Priority to CN202080013657.5A priority Critical patent/CN114762121A/zh
Priority to PCT/CN2020/127533 priority patent/WO2022095032A1/zh
Priority to TW109139841A priority patent/TWI748748B/zh
Publication of WO2022095032A1 publication Critical patent/WO2022095032A1/zh
Priority to US18/311,903 priority patent/US20230275201A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting

Definitions

  • the invention relates to an LED light source module, in particular to an LED light source module with an auxiliary structure.
  • LED Light-emitting diode
  • LED is a semiconductor electronic component that can emit light. Up to now, the light it can emit has spread to visible light, infrared light and ultraviolet light, and has very high brightness.
  • the aforementioned light-emitting diodes have two electrodes on their bottom surface. Therefore, when the aforementioned light-emitting diodes are fixed on the printed circuit board (PCB, printed circuit board) of the light bar (light bar), surface mounting technology (SMT, surface mounting technology) is usually used, that is, usually on the protective film. An opening is formed for the electrode to pass through to be electrically connected with the pad of the printed circuit board.
  • the solder paste is printed on the solder pads of the printed circuit board, secondly, the LEDs are aligned and placed on the solder paste-coated solder pads, and finally, the LEDs are fixed on the solder pads by heating and reflowing.
  • the light emitting diodes are placed in the openings of the protective film, there is a problem that a part of the light cannot be completely aligned with the receiving surface (eg, the light incident surface of the light guide plate of the backlight module).
  • the LEDs tend to be tilted, which affects the vertical alignment of the LEDs, causing the light to be misaligned with the receiving surface, or part of the light emitted by the LEDs will be blocked by the walls of the opening. , which in turn leads to a decrease in the use efficiency of light.
  • an LED light source module comprising: a substrate; a protective layer, which is arranged on the substrate and has at least one opening; a plurality of conductive parts, which are arranged in the at least one opening,
  • the plurality of conductive parts include a first conductive part and a second conductive part;
  • the light-emitting element includes a bottom surface, a light-emitting surface connected to the bottom surface, a back surface opposite to the light-emitting surface, at least one side surface connecting the light-emitting surface and the bottom surface, and multiple a plurality of electrodes, wherein the plurality of electrodes includes a first electrode and a second electrode, the first electrode and the second electrode are respectively electrically connected to the first conductive part and the second conductive part; and an auxiliary structure, which is arranged between the substrate and the light-emitting element without contacting the first electrode and the second electrode, wherein the auxiliary structure includes a main support part provided on the substrate to support
  • the present invention also provides an LED light source module, comprising: a substrate; a protective layer disposed on the substrate and having at least one opening; a plurality of conductive parts disposed in the at least one opening; a light-emitting element including a bottom surface, and a A first side surface connected to the bottom surface, a second side surface connected to the bottom surface and opposite to the first side surface, and a plurality of electrodes, wherein the plurality of electrodes are respectively electrically connected to the plurality of conductive parts; and an auxiliary structure, which includes at least two A support portion, the support portion is disposed between the substrate and the light-emitting element, and at least two support portions respectively correspond to the first side surface and the second side surface of the light-emitting element, and the at least two support portions support the bottom surface of the light-emitting element.
  • the light-emitting element can be arranged horizontally with respect to the light-guiding element, so that the light from the light-emitting element can be aligned with the light-guiding element
  • the receiving surface of the element can therefore improve the use efficiency of light.
  • FIG. 1 is a cross-sectional view of an LED light source module according to a first embodiment of the present invention, illustrating an embodiment.
  • FIG. 2A is a partial top view of the LED light source module according to the first embodiment of the present invention, illustrating an embodiment.
  • FIG. 2B is a partial top view of the LED light source module according to the first embodiment of the present invention, showing another embodiment.
  • FIG. 3 is a cross-sectional view of an LED light source module according to the first embodiment of the present invention, illustrating another embodiment.
  • FIG. 4 is a partial top view of the LED light source module according to the first embodiment of the present invention, showing another embodiment.
  • FIG. 5 is a flow chart illustrating a manufacturing method of an LED light source module according to the first embodiment of the present invention.
  • FIG. 6 is a flowchart illustrating a manufacturing method of an LED light source module according to another embodiment of the present invention.
  • FIG. 7 is a cross-sectional view illustrating an LED light source module according to a second embodiment of the present invention.
  • FIG. 8 is a cross-sectional view of an LED light source module according to a second embodiment of the present invention, illustrating another embodiment.
  • FIG. 9 is a cross-sectional view of an LED light source module according to a second embodiment of the present invention, illustrating an embodiment.
  • FIG. 10A is a schematic diagram illustrating an LED light source module without a light-emitting element according to a second embodiment of the present invention.
  • 10B is a schematic diagram illustrating an LED light source module according to the second embodiment of the present invention.
  • 11A is a partial top view of the LED light source module according to the second embodiment of the present invention, showing another embodiment.
  • 11B is a partial top view of the LED light source module according to the second embodiment of the present invention, showing another embodiment.
  • 11C is a partial top view of the LED light source module according to the second embodiment of the present invention, showing another embodiment.
  • 11D is a partial top view of the LED light source module according to the second embodiment of the present invention, showing another embodiment.
  • 11E is a partial top view of the LED light source module according to the second embodiment of the present invention, showing another embodiment.
  • 11F is a partial top view of the LED light source module according to the second embodiment of the present invention, showing another embodiment.
  • 11G is a partial top view of the LED light source module according to the second embodiment of the present invention, showing another embodiment.
  • the LED light source module 10 is used for optical coupling to a light guide element 20 (eg, a light guide plate), and provides light on the side of the light guide element 20 . After the aforementioned light enters the light guide element 20 , the light can be guided by the light guide element 20 and produce planar light on the light exit surface 21 .
  • the LED light source module 10 mainly includes a substrate 100 , a circuit layer 200 , a protective layer 300 , a first conductive portion 400 , a second conductive portion 500 , at least one auxiliary structure 600 , a light-emitting element 700 and a stopper 800 .
  • the circuit layer 200 and the protective layer 300 of the light source module 10 are disposed on the substrate 100 , and the circuit layer 200 is located between the substrate 100 and the protective layer 300 .
  • the first conductive portion 400 , the second conductive portion 500 , and the auxiliary structure 600 are patterned and etched from the circuit layer 200 on the substrate 100 , so these elements are all formed on the same layer plane of the substrate 100 .
  • the protective layer 300 is formed on the circuit layer 200 and has an opening 310 to expose the first conductive portion 400 , the second conductive portion 500 and the auxiliary structure 600 for soldering of the light-emitting element 700 , thereby achieving the arrangement on the substrate. 100 and accommodated in this opening 310.
  • first conductive portion 400 , the second conductive portion 500 and the auxiliary structure 600 are separated from each other, and the auxiliary structure 600 is disposed between the first conductive portion 400 and the second conductive portion 500 (as shown in FIG. 2A ) .
  • the light emitting element 700 may be disposed on the aforementioned auxiliary structure 600 such that the auxiliary structure 600 is located between the light emitting element 700 and the substrate 100 . Since the top surface 601 of the auxiliary structure 600 is substantially aligned with the top surface 301 of the protective layer 300 , the bottom surface 701 of the light emitting element 700 can be in contact with the two top surfaces 601 and 301 , and then be horizontally disposed relative to the light guide element 20 . That is to say, the light-emitting element 700 is supported by the auxiliary structure 600 in the rear area, so as to be kept horizontal in the XY plane as shown in FIG. 1 .
  • the auxiliary structure 600 supports the first area A1 of the bottom surface 701 of the light emitting element 700 , and the area of the bottom surface 701 of the light emitting element 700 that is not supported by the auxiliary structure 600 is the second area relative to the first area A1 where the auxiliary structure 600 is located.
  • the second area A2 is closer to the light emitting surface 702 of the light emitting element 700 than the first area A1, and the first area A1 is located behind the second area A2, therefore, the light emitting element 700 is not prone to the downward slope of the back area and the upward slope of the front area It can effectively solve the problem of reduced light use efficiency caused by the misalignment of the light on the receiving surface or the shading by the wall surface of the opening.
  • the top surface 601 of the auxiliary structure 600 is substantially aligned with the top surface 301 of the protective layer 300
  • the auxiliary structure 600 includes a third conductive portion 610 and an insulating layer 620 , wherein the third conductive portion 610 is located between the insulating layer 620 and the substrate 100 and the insulating layer 620 is located between the light emitting element 700 and the third conductive portion 610 .
  • the total thickness of the third conductive portion 610 and the insulating layer 620 is approximately the same as the distance between the top surface 301 of the protective layer 300 and the substrate 100 .
  • the thickness of the third conductive portion 610 may be between 10 mm and 15 mm, and the thickness of the insulating layer 620 may be between 10 mm and 15 mm, so the overall thickness of the auxiliary structure 600 will be between 20 mm and 30 mm. between.
  • the third conductive part 610 , the circuit layer 200 , the first conductive part 400 and the second conductive part 500 may include the same conductive material, such as copper, aluminum or alloys thereof, and the insulating layer 620 may include a suitable insulating material, such as a liquid A liquid photoimageable solder mask (LPSM), wherein the third conductive portion 610 , the first conductive portion 400 and the second conductive portion 500 are all formed by patterning and etching the circuit layer 200 on the substrate 100 . It also has the same height, and the auxiliary structure 600 has an additional insulating layer 620 on the third conductive part 610 , so the height of the auxiliary structure 600 is higher than that of the first conductive part 400 and the second conductive part 500 .
  • LPSM liquid A liquid photoimageable solder mask
  • the aforementioned light-emitting element 700 includes a first electrode 710 and a second electrode 720 .
  • the first electrode 710 and the second electrode 720 are respectively disposed on opposite sides connected to the aforementioned bottom surface 701 . .
  • the heated molten tin tends to gather toward the exposed metal due to the characteristics of its own surface tension. Therefore, it can fill the first electrode 710 and the first conductive portion.
  • the first electrode 710 and the second electrode 720 can be electrically connected to the first conductive part 400 and the second conductive part 500, respectively, so as to provide the light-emitting element 700 required power.
  • the light-emitting element 700 can be further divided into a mounting portion 730 and an excitation portion 740 .
  • the first electrode 710 and the second electrode 720 are disposed on the mounting portion 730 , and the excitation portion 740 has a plurality of fluorescent elements (eg, phosphors).
  • the fluorescent element can be excited to emit light from the light-emitting surface 702 .
  • a part of the protective layer 300 extends between the substrate 100 and the excitation part 740 of the light-emitting element 700 , and the surface of the protective layer 300 is generally high in reflectivity and low in light absorption. color, such as white. Therefore, when the light-emitting element 700 emits light toward the light-guiding element 20 and the planar light is emitted through the light-guiding element 20, even if a part of the light is reflected by the protective layer 300 before entering the light-guiding element 20, the aforementioned planar light will not produce chromatic aberration .
  • the surface of the protective layer 300 is generally a color with low reflectivity and high light-absorbing ability, such as black, which is applied to the high-brightness light-emitting element 700 to absorb the energy of the light-emitting element 700 and avoid backlight mode.
  • the group produces a problem with bright lines.
  • the aforementioned stopper 800 is also disposed on the substrate 100 and accommodated in the opening 310 of the protective layer 300 .
  • the stopper 800 will contact the back surface 703 of the light emitting element 700 opposite to the light emitting surface 702 . Therefore, if the user accidentally pushes the light-emitting element 700 toward the -X axis direction when installing the light-guiding element 20 , the stopper 800 can still provide sufficient supporting force to prevent the light-emitting element 700 from moving or tilting.
  • the stopper 800 may include metal materials such as copper, aluminum or alloys thereof, and the aforementioned substrate 100 and the protective layer 300 may respectively include suitable insulating materials.
  • the substrate 100 may include polyimide (PI).
  • the aforementioned structure of the LED light source module 10 can ensure that the light emitting element 700 is arranged horizontally relative to the light guide element 20 , and the light provided by the light emitting element 700 will not be shielded by other elements, thus improving the utilization rate of light.
  • the auxiliary structure 600 includes a first extension portion 630 and a second extension portion 640 .
  • the first extension portion 630 extends from the first conductive portion 400 toward the second conductive portion 500 and enters between the light-emitting element 700 and the substrate 100
  • the second extension portion 640 extends from the second conductive portion 500 toward the first conductive portion 400 , and enter between the light-emitting element 700 and the substrate 100 .
  • the first extension portion 630 and the first conductive portion 400 may be integrally formed, and the second extension portion 640 and the second conductive portion 500 may also be integrally formed.
  • the surfaces of the first extension portion 630 and the second extension portion 640 may be coated with an insulating material, such as liquid photosensitive solder resist ink.
  • the first extension portion 630 and the second extension portion 640 may extend to positions away from the first electrode 710 and the second electrode 720 respectively before entering between the light emitting element 700 and the substrate 100 .
  • the auxiliary structure 600 only includes the insulating layer 620 .
  • the insulating layer 620 directly contacts the substrate 100 and the bottom surface 701 of the light-emitting element 700 , and the thickness of the insulating layer 620 is approximately the same as the distance between the top surface 301 of the protective layer 300 and the substrate 100 , so the top surface 601 of the auxiliary structure 600 and the protection The top surfaces 301 of the layers 300 are generally aligned.
  • the aforementioned insulating layer 620 may include liquid photosensitive solder resist ink, and the thickness thereof may be between 10 mm ⁇ 30 mm (eg, 25 mm).
  • the LED light source module 10 includes a plurality of auxiliary structures 600 , and these auxiliary structures 600 may be composed of a third conductive portion 610 and an insulating layer 620 (similar to the auxiliary structures in FIG. 1 ) 600), or composed of a single insulating layer 620 (like the auxiliary structure 600 in FIG. 3).
  • the auxiliary structure 600 located in the center can be extended to the protective layer 300 by the stopper 800, so that the light emitting element 700 can be set more stably.
  • the first electrode 710 and the second electrode 720 of the light-emitting element 700 are both located on the back surface 703 opposite to the light-emitting surface 702 , therefore, the first conductive portion 400 , the second conductive portion 500 and the stopper 800 will Contact the same side of the light-emitting element 700 , that is, the back side 703 .
  • the first electrode 710 and the second electrode 720 may be electrically connected to the first conductive part 400 and the second conductive part 500 .
  • the first electrode 710 and the second electrode 720 may be located on the bottom surface 701 of the light emitting element 700 or extend from the back surface 703 of the light emitting element 700 to the bottom surface 701 at the same time.
  • the substrate 100 may be provided (step S1 ), and at least one wiring layer 200 may be formed on the substrate 100 (step S2 ).
  • a first conductive portion 400 and a second conductive portion 500 are formed on the aforementioned circuit layer 200, and one or more auxiliary structures 600 are formed between the first conductive portion 400 and the second conductive portion 500 at the same time (step S3).
  • the step of forming the auxiliary structure 600 includes forming a third conductive portion 610 on the circuit layer 200, and disposing an insulating layer 620 on the third conductive portion 610, wherein the aforementioned third conductive portion 610 is located in the first conductive portion 400 and the second conductive part 500 .
  • a protective layer 300 covering the wiring layer 200 is formed, and an opening 310 is formed on the protective layer 300, wherein the first conductive part 400 and the second conductive part 500 are exposed from the opening 310 (step S4).
  • the light-emitting element 700 can be disposed on the aforementioned auxiliary structure 600 (step S5 ) to form the LED light source module 10 shown in FIG. 1 and FIG. 2A .
  • the first electrode 710 and the second electrode 720 of the light-emitting element 700 are electrically connected to the first conductive portion 400 and the second conductive portion 500 respectively, and the bottom surface 701 of the light-emitting element 700 is in contact with the aforementioned auxiliary structure 600 .
  • the step of forming the third conductive portion 610 can be the same as that of forming the first conductive portion 400 and the second conductive portion
  • the steps of 500 are completed in the same process to simplify the process and shorten the manufacturing time, and then the insulating layer 620 is disposed on the third conductive portion 610 .
  • the step of forming the stopper 800 on the substrate 100 may be further included.
  • the step of forming the stopper 800 and the steps of forming the first conductive part 400 and the second conductive part 500 may be completed in the same process, and the stopper 800 and the light-emitting element 700 are further formed in the same process.
  • the contact part is provided with insulating material.
  • the substrate 100 may be provided (step S1'), and at least one wiring layer 200 may be formed on the substrate 100 (step S2').
  • a first conductive portion 400 and a second conductive portion 500 are formed on the aforementioned circuit layer 200 (step S3 ′), then a protective layer 300 covering the circuit layer 200 is formed, and an opening 310 is formed on the protective layer 300 , wherein the first The conductive part 400 and the second conductive part 500 are exposed from the opening 310 (step S4').
  • one or more auxiliary structures 600 between the first conductive part 400 and the second conductive part 500 may be formed in the aforementioned opening 310 (step S5'). It should be noted that, in this embodiment, the step of forming the auxiliary structure 600 includes forming the insulating layer 620 directly on the substrate 100 .
  • the light-emitting element 700 can be disposed on the aforementioned auxiliary structure 600 (step S6') to form the LED light source module 10 shown in FIG. 3 .
  • the first electrode 710 and the second electrode 720 of the light-emitting element 700 are electrically connected to the first conductive portion 400 and the second conductive portion 500 respectively, and the bottom surface 701 thereof contacts the aforementioned auxiliary structure 600 .
  • the auxiliary structure 600 is the insulating layer 620 formed on the substrate 100 , it is not necessary to use the circuit layer 200 of the substrate 100 to pattern and etch the first conductive portion 400 and the second conductive portion 500 at the same time. , but the insulating layer 620 is formed afterward.
  • the stopper 800 may also be an insulating material, and similarly, it is not necessary to use the circuit layer 200 of the substrate 100 to pattern and etch the first conductive portion 400 and the second conductive portion 500 at the same time. , but the insulating material is formed on the substrate 100 afterward.
  • an LED light source module is provided.
  • the LED light source module includes an auxiliary structure disposed between the first conductive portion and the second conductive portion, and the top surface of the auxiliary structure and the top surface of the protective layer are provided. Therefore, the light-emitting element can be arranged horizontally with respect to the light-guiding element, thereby increasing the use efficiency of light.
  • FIGS. 8 to 11E are schematic diagrams illustrating an LED light source module according to an example of the second embodiment of the present invention.
  • the auxiliary structures are formed to extend at least from the backside of the light-emitting element to its light-emitting surface.
  • similar elements except auxiliary structures will be denoted by the same element symbols.
  • the LED light source module 10 is used for optical coupling to a light guide element 20 (eg, a light guide plate) so as to face the light incident surface 201 of the light guide element 20
  • a light guide element 20 eg, a light guide plate
  • the light is provided. After entering the light guide element 20 , the light can be guided by the light guide element 20 and generate a planar light out on the light outgoing surface 21 .
  • the LED light source module 10 mainly includes a substrate 100 , a circuit layer 200 , a protective layer 300 , a light-emitting element 700 , and an auxiliary structure 900 , wherein the auxiliary structure 900 is disposed between the substrate 100 and the light-emitting element 700 , and the auxiliary structure 900 is disposed on the substrate 100 to support the bottom surface of the light-emitting element 700 .
  • the circuit layer 200 and the protective layer 300 of the light source module 10 according to the second embodiment of the present invention are disposed on the substrate 100 , and the circuit layer 200 is located between the substrate 100 and the protective layer 300 , please refer to FIG. 7 , the auxiliary structure 900 is provided on the protective layer 300 ; and in FIG.
  • the auxiliary structure 900 is disposed under the protective layer 300 . That is to say, there is no limitation on whether the auxiliary structure 900 is disposed above or below the protective layer 300 , as long as the auxiliary structure 900 can support the light-emitting element 700 to achieve the purpose of aligning the light-incident surface 201 of the light-guiding element 20 . .
  • the bottom surface of the light emitting element 700 is provided with a first electrode 710 and a second electrode 720
  • the protective layer 300 has at least one opening 310
  • a plurality of conductive parts extend from the opening 310
  • These conductive parts include the first conductive part 400 and the second conductive part 500.
  • the above conductive parts are exposed to the pattern of the circuit layer 200 in the opening 310, and the light-emitting element 700 and the circuit layer 200 are effectively electrically connected by soldering materials.
  • the solder material in the present invention can be a metal material, such as solder paste.
  • the soldering material includes the first soldering material and the second soldering material, and is respectively disposed within the range of the first conductive portion 400 or the second conductive portion 500, although the soldering material is also disposed on the light-emitting element 700 and the circuit layer
  • the supporting force of the auxiliary structure 900 is greater than that of the soldering material, which can better support the light emitting element 700 .
  • the soldering material is not used for supporting purposes. Therefore, the first electrode 710 and the second electrode 720 can also be formed on the side of the light-emitting element 700 and electrically connected to the circuit layer 200 through the soldering material.
  • the auxiliary structure 900 has a main support portion 910 disposed on the substrate 100 to support the bottom surface of the light emitting element 700 and extending from at least the back surface 703 of the light emitting element 700 to the light-emitting surface 702 , and does not contact the first electrode 710 and the second electrode 720 .
  • the bottom surface of the light emitting element 700 is stably supported by the main support portion 910 so that the light emitting element 700 is aligned with the light incident surface 201 of the light guide element 20 , so as to achieve better light coupling effect and light utilization rate.
  • the first electrode 710 and the second electrode 720 of the light-emitting element 700 are usually located on opposite sides of the light-emitting element 700, and the first electrode 710 and the second electrode 720 are respectively connected by the first welding material,
  • the second solder material is electrically connected to the circuit layer 200, and there is a blank area between the first electrode 710 and the second electrode 720.
  • the main support portion 910 is disposed in the blank area, and is interposed between the first solder material and the second electrode. Between the soldering materials, that is to say, the auxiliary structure 900 , the first soldering material and the second soldering material are located on the same plane so as to be supported on the bottom of the light emitting element 700 .
  • FIGS. 10A and 10B are formed in a one-to-one manner,
  • a plurality of conductive parts may be exposed in the same opening 310 .
  • the auxiliary structures 900 between two adjacent light-emitting elements 700 may be connected.
  • the auxiliary structures 900 connected between two adjacent light-emitting elements 700 may further form an extension portion 902 , and the extension portion 902 extends toward the light-emitting direction (+X-axis direction) of the light-emitting element 700 .
  • the auxiliary structure 900 has a first reflectivity
  • the protective layer 300 has a second reflectivity, wherein the first reflectivity is greater than or equal to the second reflectivity.
  • the part where the auxiliary structure 900 and its extension 902 are not formed above the protective layer 300 can be used for arranging reflective sheets and light guide elements; alternatively, the aforementioned reflective sheets and light guide elements can also be stacked on the extension part. 902 above.
  • FIG. 10B is a schematic diagram of the light-emitting element 700 disposed in the LED light source module 10 .
  • a plurality of electrodes eg, a first electrode 710 and a second electrode 720
  • a solder material not shown. 500.
  • the heated solder material eg, molten tin
  • the heated solder material tends to gather toward the exposed metal due to its own surface tension properties, so it can fill the first electrode 710 between the first conductive part 400 and the second electrode 720 and the second conductive part 500, so that the first electrode 710 and the second electrode 720 can be electrically connected to the first conductive part 400 and the second conductive part 500, respectively, to provide the power required by the light-emitting element 700 .
  • the above-mentioned electrodes may also be formed on the side surface of the light-emitting element 700 .
  • the auxiliary structure 900 under the light-emitting element 700 may be formed at the part directly under and outside the light-emitting element 700 at the same time, but in other embodiments of this embodiment Among them, the auxiliary structure 900 may be formed only directly below the light-emitting element 700 .
  • the auxiliary structure 900 in FIGS. 10A and 10B is formed to be aligned with the opening 310, in other embodiments of the present invention (for example, FIG. 9 and FIGS. 11A to 11E described later), a part of the auxiliary structure 900 may also be Extends into opening 310 to form a partial overlap with opening 310 .
  • the stopper may be provided on the substrate 100 and accommodated in the opening 310 of the protective layer 300 .
  • the stopper will contact the back surface 703 of the light emitting element 700 opposite to the light emitting surface 702 . Therefore, if the user accidentally pushes the light emitting element 700 toward the -X axis direction when installing the light guide element 20 , the stopper can still provide sufficient supporting force to prevent the light emitting element 700 from moving or tilting.
  • FIGS. 11A to 11G illustrate partial top views of the LED light source module 10 in other embodiments according to the present embodiment.
  • the bottom surface of the light-emitting element 700 is provided with a first electrode 710 and a second electrode 720 that are electrically connected to the first conductive portion 400 and the second conductive portion 500 via soldering material, respectively.
  • the first electrode 710 and the second electrode 720 can also be formed on the side of the light-emitting element 700.
  • the first electrode 710 and the second electrode 720 can be arranged on the same side.
  • the first electrode 710 and the second electrode 720 may be disposed on different sides.
  • an auxiliary structure 900 is also disposed below the light emitting element 700 , the auxiliary structure 900 does not contact the first electrode 710 and the second electrode 720 , and the auxiliary structure 900 does not contact the soldering material.
  • the auxiliary structure 900 further includes at least one front support portion 920 .
  • the front support portion 920 is disposed on the substrate 100 and at least located between the first electrode 710 and the light emitting surface 702 of the light emitting element 700 , or between the second electrode 720 and the light emitting surface 702 of the light emitting element 700 .
  • the front support portion 920 extends from the main support portion 910 to the side of the light emitting element 700 .
  • the front support portion 920 extends from the main support portion 910 toward and beyond the side of the light emitting element 700 . In this way, it can be ensured that the bottom front end of the light emitting element 700 is supported by the front support portion 920, so that the light emitting element 700 cannot be tilted forward, which has the effect of achieving horizontal support.
  • the auxiliary structure 900 further includes at least one side support portion 930 located outside the first electrode 710 or the second electrode 720 , And at least a part of the side support portion 930 in the Z direction is located between the first electrode 710 and the side surface of the light emitting element 700 or between the second electrode 720 and the side surface of the light emitting element 700 .
  • at least one side support portion 930 extends from the front support portion 920 in a direction toward the back surface 703 of the light emitting element 700 . In this way, it can be ensured that the bottom of the light-emitting element 700 is supported by the side support portion 930, and the light-emitting element 700 is not inclined to the left or right, which has the effect of achieving horizontal support.
  • the auxiliary structure 900 further includes at least one rear support portion 940 .
  • at least one rear support portion 940 extends from the main support portion 910 in a direction away from the light emitting surface 702 of the light emitting element 700 .
  • at least one rear support portion 940 is located behind the plurality of electrodes (eg, the first electrode 710 and the second electrode 720 ) and extends in a direction away from the light-emitting surface 702 of the light-emitting element 700 . As shown in FIG.
  • the rear support portion 940 may also include a portion extending from the main support portion 910 in a direction away from the light emitting surface 702 of the light emitting element 700 , and a portion located behind the first electrode 710 and the second electrode 720 and facing away from the light emitting surface 702 . A portion extending in the direction of the light-emitting surface 702 of the light-emitting element 700 . In this way, it can be ensured that the bottom rear end of the light emitting element 700 is supported by the rear support portion 940 , so that the light emitting element 700 is not inclined backward, and has the effect of achieving horizontal support.
  • FIG. 11D is a partial top view of another embodiment of the LED light source module 10 according to the present embodiment.
  • the light-emitting element 700 has a first electrode 710 , a second electrode 720 , and a third electrode 750 , wherein the third electrode 750 is interposed between the first electrode 710 and the second electrode 720 .
  • a third conductive part may be further included, wherein the third conductive part is interposed between the first conductive parts part and the second conductive part.
  • the first electrode 710 , the second electrode 720 , and the third electrode 750 are electrically connected to the first conductive portion, the second conductive portion, and the third conductive portion, respectively, through soldering materials.
  • an auxiliary structure 900 is disposed between the first electrode 710 , the second electrode 720 , and the third electrode 750 , and the auxiliary structure 900 includes a main support portion 910 and a front support portion 920 .
  • an auxiliary structure 900 is provided between at least one of the electrodes and the light-emitting surface, and the auxiliary structure 900 may be selectively provided with only the main support portion 910 or any combination of other support portions, and not This is limited.
  • the first electrode 710, the second electrode 720, and the third electrode 750 in the LED light source module 10 of FIG. 11D can also be formed on the side of the light-emitting element 700.
  • the The first electrode 710, the second electrode 720, and the third electrode 750 can be disposed on the same side.
  • the first electrode 710, the second electrode 720, and the third electrode 750 can also be disposed on different sides. on the side.
  • an auxiliary structure 900 is also disposed below the light emitting element 700 , the auxiliary structure 900 does not contact the first electrode 710 , the second electrode 720 , and the third electrode 750 , and the auxiliary structure 900 does not contact the soldering material.
  • the auxiliary structure 900 also includes a main support portion 910 between the plurality of electrodes (the first electrode 710 , the second electrode 720 , and the third electrode 750 ), a front portion between the plurality of electrodes and the light-emitting surface 702 of the light-emitting element 700 .
  • the support portion 920, and the side support portion 930 located outside the plurality of electrodes in the Z direction.
  • the number of electrodes of the light-emitting element 700 is not particularly limited in this embodiment, and in other embodiments, the number of electrodes of the light-emitting element 700 may be three or more.
  • the extension 902 may extend from the front support 920 of the auxiliary structure 900 toward a direction away from the back surface 703 of the light emitting element 700 and beyond the light emitting surface 702 .
  • the extension portion 902 may also extend from the main support portion 910 in a direction away from the back surface 703 of the light emitting element 700 and beyond the light emitting surface 702 .
  • main support portion 910 , the front support portion 920 , the side support portion 930 , and the rear support portion 940 described in this embodiment can be combined to support the bottom surface of the light-emitting element 700 as required.
  • at least two side supports 930 may be provided to support the bottom surface of the light-emitting element 700 between the plurality of electrodes and the side surfaces of the light-emitting element; in another embodiment, referring to FIG.
  • At least the front support portion 920 and the rear support portion 940 can be provided to support the bottom surface of the light-emitting element 700 from the back of the plurality of electrodes, and also achieve the purpose of supporting the light-emitting element 700 to align it with the receiving surface of the light-guiding element 20.
  • the main supporting part 910 can also be provided to support the light-emitting element 700, so as to increase the auxiliary structure of the light-emitting element 700 900 supported area to achieve better supporting effect, which is not limited to the combinations listed above.
  • the bottom of the light emitting element 700 has the auxiliary structure 900 , wherein the main support portion 910 of the auxiliary structure 900 is provided on the substrate 100 and extends from the back surface 703 of the light emitting element 700 to The light-emitting surface 702 is used to support the bottom surface of the light-emitting element 700 .
  • the light from the light-emitting element 700 can be directed to the receiving surface of the light-guiding element 20, so that the use efficiency of light can be improved.

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Abstract

一种LED光源模组(10)，包括：基板(100)；保护层(300)，其设置于基板(100)上并具有至少一个开口(310)；多个导电部，其设置于至少一个开口(310)中，其中，多个导电部包括第一导电部(400)及第二导电部(500)；发光元件(700)，包括底面(701)、与底面(701)连接的发光面(702)、与发光面(702)相对的背面(703)、连接发光面(702)与底面(701)的至少一个侧面、以及多个电极，其中，多个电极包括第一电极(710)和第二电极(720)，第一电极(710)和第二电极(720)分别电性连接第一导电部(400)和第二导电部(500)；以及辅助结构(900)，其设置于基板(100)与发光元件(700)之间且不接触第一电极(710)及第二电极(720)，其中，辅助结构(900)包括设于基板(100)上以支撑发光元件(700)的底面(701)的主要支撑部(910)，主要支撑部(910)位于电极之间且至少从发光元件(700)的背面(703)延伸至发光面(702)。

Description

LED光源模组 技术领域
本发明涉及一种LED光源模组，特别是涉及一种具有辅助结构的LED光源模组。
背景技术
发光二极管(light-emitting diode,LED)是一种能够发光的半导体电子元件，时至今日，其能够发出的光已遍及可见光、红外线光及紫外线光，具有非常高的亮度。
一般来说，大多数发光二极管在其底面上设置两个电极。因此，当将前述发光二极管固定于灯条(light bar)的印刷电路板(PCB,printed circuit board)时，通常使用表面黏着技术(SMT,surface mounting technology)来进行，即通常会在保护胶片上形成开口，供前述电极穿过以与印刷电路板的焊垫电性连接。详细地说，首先将锡膏印刷在印刷电路板的焊垫上，其次，将发光二极管对准并放置在涂布锡膏的焊垫上，最后，经过加热回焊使发光二极管固定在焊垫上。
然而，当将发光二极管置入保护胶片的开口中时，会存在一部分光线无法完全对准接收面(例如背光模组的导光板的入光面)的问题。例如，在一些情况中，发光二极管较容易倾斜，这影响了发光二极管在垂直方向上的对位准度，进而导致光线未对准接收面、或发光二极管发出的一部分光线会被开口的壁面遮蔽，进而导致光的使用效率降低。在另外一些情况中，例如当上述接收面的底部配置有反射片或其他构件时，这会导致发光二极管的高度低于上述接收面，而造成光线未对准接收面，因此会使得发光二极管发出的光线使用效率降低。
发明内容
为了解决上述习知的问题点，本发明提供一种LED光源模组，包括：基板；保护层，其设置于基板上并具有至少一个开口；多个导电部，其设置于至少一个开口中，其中，多个导电部包括第一导电部及第二导电部；发光元件，其包括底面、与底面连接的发光面、与发光面相对的背面、连接发光面与底面的至少一个侧面、以及多个电极，其中，多个电极包括第一电极和第二电极，第一电极和第二电极分别电性连接第一导电部和第二导电部；以及辅助结构，其设置于基板与发光元件之间且不接触第一电极及第二电极，其中，辅助结构包括设于基板上以支撑发光元件的底面的主要支撑部，主要支撑部位于多个电极之间且至少从发光元件的背面延伸至发光面。
本发明亦提供一种LED光源模组，包括：基板；保护层，其设置于基板上并具有至少一个开口；多个导电部，其设置于至少一个开口中；发光元件，其包括底面、与底面连接的第一侧面、与底面连接且与第一侧面相对的第二侧面、以及多个电极，其中，多个电极分别与多个导电部电性连接；以及辅助结构，其包括至少两个支撑部，所述支撑部设置于基板与发光元件之间，且至少两个支撑部分别对应发光元件的第一侧面及第二侧面，所述至少两个支撑部支撑发光元件的底面。
因此，根据本发明的实施例，通过在基板与发光元件之间设置辅助结构来支撑发光元件，可使发光元件相对于导光元件水平地设置，从而使来自发光元件的光线能够对准导光元件的接收面，因此能够提高光的使用效率。
附图说明
以下将参考附图详述本发明的实施例。应注意的是，依据业界的标准做法，各种特征并未按照比例绘制且仅用以说明例示。事实上，可能任意地放大或缩小元件的尺寸，以清楚地表现本发明的实施例的特征。
图1是根据本发明的第一实施形态、绘示出一实施例的LED光源模组的剖面图。
图2A是根据本发明的第一实施形态、绘示出一实施例的LED光源模组的局部俯视图。
图2B是根据本发明的第一实施形态、绘示出另一实施例的LED光源模组的局部俯视图。
图3是根据本发明的第一实施形态、绘示出另一实施例的LED光源模组的剖面图。
图4是根据本发明的第一实施形态、绘示出另一实施例的LED光源模组的局部俯视图。
图5是根据本发明的第一实施形态、绘示出一实施例的LED光源模组的制造方法的流程图。
图6是根据本发明的第一实施形态、绘示出另一实施例的LED光源模组的制造方法的流程图。
图7是根据本发明的第二实施形态、绘示出LED光源模组的剖面图。
图8是根据本发明的第二实施形态、绘示出另一实施例的LED光源模组的剖面图。
图9是根据本发明的第二实施形态、绘示出一实施例的LED光源模组的剖面图。
图10A是根据本发明的第二实施形态、绘示出未形成发光元件的LED光源模组的示意图。
图10B是根据本发明的第二实施形态、绘示出LED光源模组的示意图。
图11A是根据本发明的第二实施形态、绘示出另一实施例的LED光源模组的局部俯视图。
图11B是根据本发明的第二实施形态、绘示出另一实施例的LED光源模组的局部俯视图。
图11C是根据本发明的第二实施形态、绘示出另一实施例的LED光源模组的局部俯视图。
图11D是根据本发明的第二实施形态、绘示出另一实施例的LED光源模组的局部俯视图。
图11E是根据本发明的第二实施形态、绘示出另一实施例的LED光源模组的局部俯视图。
图11F是根据本发明的第二实施形态、绘示出另一实施例的LED光源模组的局部俯视图。
图11G是根据本发明的第二实施形态、绘示出另一实施例的LED光源模组的局部俯视图。
具体实施方式
以下说明本发明实施例的LED光源模组。然而，可轻易了解，本发明实施例所提供的许多合适的发明概念可实施于广泛的各种特定背景。所揭示的特定实施例仅仅用于说明以特定方法使用本发明，并非用以局限本发明的范围。
除非另外定义，在此使用的全部用语(包括技术及科学用语)具有与此篇发明所属的一般技术人员所通常理解的相同涵义。能理解的是这些用语，例如在通常使用的字典中定义的用语，应被解读成具有与相关技术及本发明的背景或上下文一致的意思，而不应以理想化或过度正式的方式解读，除非在此特别定义。
【第一实施形态】
首先请一并参阅图1和图2A，本发明的一实施例的LED光源模组10用以光耦合于导光元件20(例如导光板)，并在导光元件20的侧边提供光线，前述光线进入导光元件20后可被导光元件20导引并在出光面21产生面状出光。其中，LED光源模组10主要包括基板100、线路层200、保护层300、第一导电部400、第二导电部500、至少一个辅助结构600、发光元件700以及挡止件800。
光源模组10的线路层200和保护层300设置于基板100之上，且线路层200位于基板100和保护层300之间。前述第一导电部400、第二导电部500、辅助结构600由基板100上的线路层200图案化蚀刻而成，故这些元件皆形成于基板100的同一层平面上。保护层300则形成在线路层200之上，并且形成有开口310，使前述第一导电部400、第二导电部500、辅助 结构600暴露出来以供发光元件700焊接，藉此达到设置于基板100上且容置于此开口310中的目的。需特别说明的是，第一导电部400、第二导电部500和辅助结构600彼此分离，且辅助结构600设置于第一导电部400和第二导电部500之间(如图2A所示)。
如图1和图2A所示，发光元件700可设置于前述辅助结构600上，使辅助结构600位于发光元件700和基板100之间。由于辅助结构600的顶面601与保护层300的顶面301大致对齐，因此发光元件700的底面701可接触前述两个顶面601、301，进而相对于导光元件20水平地设置。也就是说，发光元件700在背面区域被辅助结构600所支撑，形成如图1所示在XY平面保持水平的态样。更进一步说明，辅助结构600支撑发光元件700的底面701的第一区A1，相对于辅助结构600所在的第一区A1，发光元件700的底面701未被辅助结构600支撑的区域为第二区A2，第二区A2比第一区A1更靠近发光元件700的发光面702，第一区A1位于第二区A2后方，因此，发光元件700不容易发生背面区域向下倾斜而前面区域向上倾斜的情况，可以有效解决光线未对准接收面、或被开口的壁面所遮蔽所导致的光使用效率降低的问题。
在本实施例中，辅助结构600的顶面601大致对齐保护层300的顶面301，辅助结构600包括第三导电部610和绝缘层620，其中第三导电部610位于绝缘层620和基板100之间，且绝缘层620位于发光元件700和第三导电部610之间。第三导电部610和绝缘层620的总厚度大致与保护层300的顶面301与基板100之间的距离相同。举例而言，第三导电部610的厚度可介于10mm～15mm之间，而绝缘层620的厚度亦可介于10mm～15mm之间，故辅助结构600的整体厚度将介于20mm～30mm之间。
第三导电部610、线路层200、第一导电部400和第二导电部500可包括相同的导电材料，例如铜、铝或其合金，而绝缘层620则可包括合适的绝缘材料，例如液态感光防焊油墨(liquid photoimageable solder mask,LPSM)，其中，第三导电部610、第一导电部400和第二导电部500都是利用基板100上的线路层200图案化蚀刻而成，三者也具有相同的高度，而辅助结构600则因为在第三导电部610上多了一层绝缘层620，所以辅助 结构600的高度会高于第一导电部400和第二导电部500的高度。
请继续参阅图1和图2A，前述发光元件700包括第一电极710和第二电极720，在本实施例中，第一电极710和第二电极720分别设置于与前述底面701连接的相对侧面。当发光元件700设置在辅助结构600上并进行SMT制程时，加热后的熔锡容易因为本身表面张力的特性而朝向金属裸露的地方聚集，因此，可以填补于第一电极710与第一导电部400之间，第二电极720与第二导电部500之间，使得第一电极710和第二电极720可分别与第一导电部400和第二导电部500电性连接，以提供发光元件700所需的电力。
此外，发光元件700更可划分为安装部730和激发部740，前述第一电极710和第二电极720设置于安装部730上，且激发部740内具有多个荧光元件(例如荧光粉)。当电力由第一电极710和第二电极720通入发光元件700时，荧光元件可被激发而由发光面702发出光线。
应注意的是，如图1和图2A所示，保护层300的一部分会延伸至基板100和发光元件700的激发部740之间，且保护层300的表面大致为高反射率、低吸光能力的颜色，例如白色。因此，在发光元件700朝向导光元件20发出光线而经由导光元件20产生面状出光时，即使一部分光线被保护层300反射后才进入导光元件20，前述面状出光也不会产生色差。在其他实施例中，保护层300的表面大致为低反射率、高吸光能力的颜色，例如黑色，这应用于高辉度的发光元件700的场合，以吸收发光元件700的能量，避免背光模组产生亮线的问题。
如图2A所示，前述挡止件800同样设置于基板100上且容置于保护层300的开口310中。当发光元件700设置在辅助结构600上时，挡止件800会接触发光元件700的与发光面702相对的背面703。由此，若用户安装导光元件20时不慎朝向-X轴方向推挤发光元件700，挡止件800仍可提供足够的支撑力来避免发光元件700移动或倾斜。
为了提供足够的支撑力，挡止件800可包括铜、铝或其合金等金属材料，而前述基板100和保护层300则可分别包括合适的绝缘材料。举例而言，基板100可包括聚亚酰胺(Polyimide,PI)。
通过前述LED光源模组10的结构，可确保发光元件700相对于导光元件20水平地设置，且发光元件700提供的光线不会被其他元件遮蔽，因此可提升光线的使用率。
请参阅图2B，在本发明的另一实施例中，辅助结构600包括第一延伸部630和第二延伸部640。第一延伸部630由第一导电部400朝向第二导电部500延伸，且进入发光元件700和基板100之间，而第二延伸部640则由第二导电部500朝向第一导电部400延伸，且进入发光元件700和基板100之间。其中，第一延伸部630和第一导电部400可一体成型，且第二延伸部640和第二导电部500亦可一体成型。
为了避免辅助结构600造成第一电极710及/或第二电极720的短路，第一延伸部630和第二延伸部640的表面上可涂布绝缘材料，例如液态感光防焊油墨。或者，第一延伸部630和第二延伸部640可分别延伸至远离第一电极710和第二电极720的位置后再进入发光元件700和基板100之间。
请参阅图3，在本发明的另一实施例的LED光源模组10中，辅助结构600仅包括绝缘层620。此绝缘层620直接接触基板100和发光元件700的底面701，且绝缘层620的厚度大致与保护层300的顶面301与基板100之间的距离相同，故辅助结构600的顶面601与保护层300的顶面301大致对齐。前述绝缘层620可包括液态感光防焊油墨，且其厚度可介于10mm～30mm(例如25mm)之间。
请参阅图4，在本发明的又一实施例中，LED光源模组10包括多个辅助结构600，这些辅助结构600可由第三导电部610和绝缘层620构成(如同图1中的辅助结构600)、或由单一绝缘层620构成(如同图3中的辅助结构600)。位于中央的辅助结构600可由挡止件800延伸至保护层300，而使发光元件700更为稳固地设置。
在本实施例中，发光元件700的第一电极710和第二电极720皆位于与发光面702相对的背面703上，因此，第一导电部400、第二导电部500和挡止件800会接触发光元件700的同一面，也就是背面703。此外，第一电极710和第二电极720可与第一导电部400、第二导电部500电性连接。 在其他实施例中，第一电极710和第二电极720则可以位于发光元件700的底面701上，或同时从发光元件700的背面703延伸到底面701。
请一并参阅图1、图2A、图5，以下说明图1、图2A所示的LED光源模组10的制造方法。首先，可提供基板100(步骤S1)，并在基板100上形成至少一个线路层200(步骤S2)。
其次，在前述线路层200上形成第一导电部400和第二导电部500，并同时在第一导电部400和第二导电部500之间形成一个或多个辅助结构600(步骤S3)。需特别说明的是，形成辅助结构600的步骤包括在线路层200上形成第三导电部610、以及在第三导电部610上设置绝缘层620，其中前述第三导电部610位于第一导电部400和第二导电部500之间。
然后，形成覆盖线路层200的保护层300，并在保护层300上形成开口310，其中第一导电部400和第二导电部500自开口310暴露(步骤S4)。
最后，可将发光元件700设置于前述辅助结构600上(步骤S5)，以构成图1、图2A所示的LED光源模组10。其中，发光元件700的第一电极710和第二电极720分别与第一导电部400和第二导电部500电性连接，且其底面701接触前述辅助结构600。
在本实施例中，由于第三导电部610也可以利用基板100上的线路层200图案化蚀刻而形成，所以形成第三导电部610的步骤能够与形成第一导电部400、第二导电部500的步骤在同一个制程中完成，以简化制程并缩短制造时间，之后再在第三导电部610上设置绝缘层620。此外，在一些实施例中，更可包括在基板100上形成挡止件800的步骤。同样的，在一些实施例中，形成挡止件800的步骤可与形成第一导电部400、第二导电部500的步骤在同一个制程中完成，另外再在挡止件800与发光元件700接触的部分设置绝缘材料。
请一并参阅图3、图6，以下说明图3所示的LED光源模组10的制造方法。首先，可提供基板100(步骤S1’)，并在基板100上形成至少一个线路层200(步骤S2’)。
其次，在前述线路层200上形成第一导电部400和第二导电部500(步骤S3’)，然后形成覆盖线路层200的保护层300，并在保护层300上形成 开口310，其中第一导电部400和第二导电部500自开口310暴露(步骤S4’)。
接着，可在前述开口310中形成位于第一导电部400和第二导电部500之间的一个或多个辅助结构600(步骤S5’)。应注意的是，在此实施例中，形成辅助结构600的步骤包括直接在基板100上形成绝缘层620。
最后，可将发光元件700设置于前述辅助结构600上(步骤S6’)，以构成图3所示的LED光源模组10。同样的，发光元件700的第一电极710和第二电极720分别与第一导电部400和第二导电部500电性连接，且其底面701接触前述辅助结构600。
在本实施例中，因为辅助结构600是形成于基板100上的绝缘层620，所以可以不需要在利用基板100的线路层200图案化蚀刻出第一导电部400和第二导电部500的同时，而是在之后才形成绝缘层620。此外，在一些实施例中，挡止件800也可以是绝缘材料，同样的就可以不需要在利用基板100的线路层200图案化蚀刻出第一导电部400和第二导电部500的同时产生，而是在之后才将绝缘材料形成于基板100上。
在上述实施形态中，提供一种LED光源模组，前述LED光源模组包括设置于第一导电部和第二导电部之间的辅助结构，且此辅助结构的顶面与保护层的顶面对齐，故可使发光元件相对于导光元件水平地设置，进而使光的使用效率增加。
【第二实施形态】
图8～11E是根据本发明的第二实施形态的实施例、绘示出LED光源模组的示意图。与图1～6中所示的辅助结构只接触发光元件的底部的后方的实施例不同，在图8～11E的实施例中，辅助结构形成为至少从发光元件的背面延伸至其发光面。为了简化说明起见，在后续的实施例中，类似的元件(辅助结构除外)将以相同的元件符号表示。
请参照图7、图8、图9，本发明的第二实施形态的LED光源模组10用以光耦合于导光元件20(例如导光板)，以朝导光元件20的入光面201提供光线，前述光线进入导光元件20后可被导光元件20导引并在出光面21产生面状出光。LED光源模组10主要包括基板100、线路层200、保护 层300、发光元件700、以及辅助结构900，其中，辅助结构900设置于基板100与发光元件700之间，辅助结构900设于基板100上以支撑发光元件700的底面。本发明的第二实施例的光源模组10的线路层200和保护层300设置于基板100之上，且线路层200位于基板100和保护层300之间，请参照图7，辅助结构900设于保护层300之上；而图8中，辅助结构900则设于保护层300之下。也就是说，辅助结构900设置在保护层300的上方或下方并不加以限制，只要能确保辅助结构900能够支撑发光元件700以达到使其对齐导光元件20的入光面201的目的即可。
在图9所示的LED光源模组10的实施例中，发光元件700的底面设有第一电极710和第二电极720，保护层300具有至少一个开口310，并且多个导电部从开口310中露出，这些导电部包括第一导电部400、第二导电部500，上述导电部露出于开口310中的线路层200图案，发光元件700与线路层200之间通过焊接材料而完成有效的电性连接，本发明中的焊接材料可以是金属材料，例如锡膏。在本实施例中，焊接材料包含第一焊接材料与第二焊接材料，并分别设置在第一导电部400或第二导电部500的范围内，虽然焊接材料同样设置在发光元件700与线路层200之间，但就支撑发光元件700的目的而言，辅助结构900的支撑力大于焊接材料的支撑力，可对发光元件700更佳的支撑效果。可理解的是，焊接材料并非作为支撑目的，因此，第一电极710和第二电极720也可以形成于发光元件700的侧面，且通过焊接材料与线路层200电性连接。
在图9所示的LED光源模组10的实施例中，辅助结构900具有一个主要支撑部910，其设于基板100上以支撑发光元件700的底面，且至少从发光元件700的背面703延伸至发光面702，并且不接触第一电极710与第二电极720。如此，发光元件700的底面被主要支撑部910稳定地支撑以使发光元件700对准导光元件20的入光面201，达到较佳的光耦合效果与光使用率。需特别说明的是，一般而言，发光元件700的第一电极710与第二电极720通常位于发光元件700的相对两侧，而第一电极710与第二电极720分别通过第一焊接材料、第二焊接材料与线路层200电性连接，而第一电极710与第二电极720之间具有一个空白区域，主要支撑部910设 于该空白区域中，且介于第一焊接材料、第二焊接材料之间，也就是说辅助结构900与第一焊接材料、第二焊接材料大致上位于同一个平面上以支撑在发光元件700的底部。
在另一实施例中，依照不同电极型态的发光元件或者制程需求，虽然在图10A、图10B中的开口310与第一导电部400、第二导电部500以一对一的方式形成，但在本发明的其他实施例中，也可以如图2A、图2B所示，在同一个开口310中露出多个导电部。
在一些实施例中，如图10A、图10B所示，相邻两个发光元件700之间的辅助结构900可以相连。又，相邻两个发光元件700之间相连的辅助结构900可再形成延伸部902，延伸部902朝向发光元件700的发光方向(+X轴方向)延伸。在LED光源模组10中，辅助结构900具有第一反射率，保护层300具有第二反射率，其中第一反射率大于或等于第二反射率。经由使辅助结构900的反射率接近反射片的反射率，可以减少明暗带的产生。另外，在图10A中保护层300上方未形成辅助结构900及其延伸部902的部分可以用于设置反光片以及导光元件；或者，前述反光片以及导光元件等也可以叠置于延伸部902上方。
图10B是在LED光源模组10中配置有发光元件700的示意图。如图10B所示，发光元件700的下方具有多个电极(例如第一电极710、第二电极720)，其经由焊接材料(未显示)电性连接至第一导电部400以及第二导电部500。当发光元件700设置在辅助结构900上并进行SMT制程时，加热后的焊接材料(例如熔锡)容易因为本身表面张力的特性而朝向金属裸露的地方聚集，因此，可以填补于第一电极710与第一导电部400之间以及第二电极720与第二导电部500之间，使得第一电极710和第二电极720可分别与第一导电部400和第二导电部500电性连接，以提供发光元件700所需的电力。在其他实施例中，上述多个电极也可以形成于发光元件700的侧面。
在本实施形态的一些实施例中，如图10B所示，发光元件700下方的辅助结构900可以同时形成于发光元件700的正下方以及正下方以外的部分，但是在本实施形态的其他实施例中，辅助结构900也可以只形成于发 光元件700的正下方。另外，虽然图10A、图10B中的辅助结构900形成为与开口310对齐，但在本发明的其他实施例中(例如图9及后述的图11A～11E)，辅助结构900的一部分也可以延伸进入开口310以和开口310形成部分重叠。
在本实施形态中也可以和第一实施形态一样(参照图2A、图2B)，将挡止件设置于基板100上且容置于保护层300的开口310中。当发光元件700设置在辅助结构900上时，挡止件会接触发光元件700的与发光面702相对的背面703。由此，若用户安装导光元件20时不慎朝向-X轴方向推挤发光元件700，挡止件仍可提供足够的支撑力以避免发光元件700移动或倾斜。
接着参照图11A～11G，图11A～11G示示出了根据本实施形态的其他实施例中的LED光源模组10的局部俯视图。如图11A～11C所示，发光元件700的底面设有经由焊接材料分别电性连接至第一导电部400和第二导电部500的第一电极710和第二电极720。可理解的是，第一电极710和第二电极720也可以形成于发光元件700的侧面，例如，在一些实施例中，第一电极710和第二电极720可以设置于同一侧面上，在另外一些实施例中，第一电极710和第二电极720可以设置于相异侧面上。此外，发光元件700下方也设有辅助结构900，辅助结构900不接触第一电极710和第二电极720，且辅助结构900也不接触焊接材料。
接着，参照图11A所示的LED光源模组10，在本实施形态的一些实施例中，辅助结构900还包括至少一个前支撑部920。前支撑部920设于基板100上，且至少位于第一电极710与发光元件700的发光面702之间，或位于第二电极720与发光元件700的发光面702之间。在一些实施例中，前支撑部920从主要支撑部910延伸至发光元件700的侧面。在一些其他的实施例中，前支撑部920从主要支撑部910朝向发光元件700的侧面延伸并超出上述侧面。如此，可确保发光元件700的底部前端被前支撑部920支撑，确保发光元件700不会向前倾斜，具有达成水平支撑的功效。
接着，参照图11B所示的LED光源模组10，在本实施形态的一些实施例中，辅助结构900还包括至少一个侧支撑部930，其位于第一电极710 或第二电极720之外，且侧支撑部930的至少一部分在Z方向上的位置位于第一电极710与发光元件700的侧面之间或位于第二电极720与发光元件700的侧面之间。在另外一些实施例中，至少一个侧支撑部930从前支撑部920朝向发光元件700的背面703的方向延伸。如此，可确保发光元件700的底部被侧支撑部930所支撑，确保发光元件700不会向左或向右倾斜，具有达成水平支撑的功效。
接着，参照图11C所示的LED光源模组10，在本实施形态的一些实施例中，辅助结构900还包括至少一个后支撑部940。在一些实施例中，至少一个后支撑部940从主要支撑部910朝向远离发光元件700的发光面702的方向延伸。在另外一些实施例中，至少一个后支撑部940位于多个电极(例如第一电极710、第二电极720)的后方且朝向远离发光元件700的发光面702的方向延伸。如图11C所示，后支撑部940也可以同时具有从主要支撑部910朝向远离发光元件700的发光面702的方向延伸的部分、以及位于第一电极710、第二电极720的后方且朝向远离发光元件700的发光面702的方向延伸的部分。如此，可确保发光元件700的底部后端被后支撑部940所支撑，确保发光元件700不会向后倾斜，具有达成水平支撑的功效。
图11D所示为根据本实施形态的LED光源模组10的其他实施例的局部俯视图。如图11D所示，发光元件700具有第一电极710、第二电极720、以及第三电极750，其中第三电极750介于第一电极710与第二电极720之间。在保护层300的开口310中所设置的多个导电部(未显示)中，除了第一导电部和第二导电部，更可以包括第三导电部，其中第三导电部介于第一导电部与第二导电部之间。第一电极710、第二电极720、以及第三电极750通过焊接材料分别电性连接至第一导电部、第二导电部、以及第三导电部。在一些实施例中，第一电极710、第二电极720、以及第三电极750之间设有辅助结构900，辅助结构900包含主要支撑部910以及前支撑部920。在另一些实施例中，这些电极的至少其中一者至发光面之间设有辅助结构900，辅助结构900可以选择性地仅设置有主要支撑部910或其他支撑部的任意组合，并不以此为限。
在本实施形态中，图11D的LED光源模组10中的第一电极710、第二电极720、以及第三电极750也可以形成于发光元件700的侧面，例如，在一些实施例中，第一电极710、第二电极720、以及第三电极750可以设置于同一侧面上，在一些其他的实施例中，第一电极710、第二电极720、以及第三电极750也可以设置于相异侧面上。
继续参照图11D，发光元件700下方也设有辅助结构900，辅助结构900不接触第一电极710、第二电极720、以及第三电极750，且辅助结构900也不接触焊接材料。辅助结构900同时包括位于多个电极(第一电极710、第二电极720、以及第三电极750)之间的主要支撑部910、位于多个电极与发光元件700的发光面702之间的前支撑部920、以及在Z方向位于多个电极之外的侧支撑部930。此外，发光元件700的电极数目在本实施形态中并未特别限定，在另外一些实施例中，发光元件700的电极也可以是三个以上。
参照图11E，在一些实施例中，延伸部902可以从辅助结构900的前支撑部920朝向远离发光元件700的背面703的方向延伸且超过发光面702。在一些其他的实施例中，延伸部902也可以从主要支撑部910朝向远离发光元件700的背面703的方向延伸且超过发光面702。
需特别说明的是，本实施形态中分别描述的主要支撑部910、前支撑部920、侧支撑部930、后支撑部940可依照需求组合来支撑发光元件700的底面。例如，在一个实施例中，参照图11F，可以至少设置两个侧支撑部930，以在多个电极与发光元件的侧面之间支撑发光元件700的底面；在另外一个实施例中，参照图11G，可以至少设置前支撑部920与后支撑部940，以从多个电极的后方支撑发光元件700的底面，同样能达到支撑发光元件700以使其对准导光元件20的接收面的目的。除了前述设置两个侧支撑部930或者设置前支撑部920与后支撑部940的实施态样之外，也能够再设置前述主要支撑部910来支撑发光元件700，以增加发光元件700被辅助结构900支撑的面积，而达到更好的支撑效果，在此不以上述列举的组合为限。
如上所述，根据本发明的第二实施形态的实施例，发光元件700的底 部具有辅助结构900，其中辅助结构900的主要支撑部910设于基板100上且从发光元件700的背面703延伸至发光面702，用以支撑发光元件700的底面。由此，使得来自发光元件700的光线能够对准导光元件20的接收面，因此能够提高光的使用效率。
虽然本发明的实施例及其优点已揭露如上，但应该了解的是，任何所属技术领域的技术人员，在不脱离本发明的精神和范围内，应当可以做出更动、替代与润饰。此外，本发明的保护范围并未局限于说明书内所述特定实施例中的制程、机器、制造、物质组成、装置、方法及步骤，任何所属技术领域的技术人员可以从本发明的揭示内容中理解现行或未来所发展出的制程、机器、制造、物质组成、装置、方法及步骤，只要可以在本文所述实施例中实施大抵相同功能或获得大抵相同结果皆可根据本发明使用。因此，本发明的保护范围包括上述制程、机器、制造、物质组成、装置、方法及步骤。
因此，本发明的保护范围应当以所附的权利要求书界定的范围为准。此外，每个权利要求构成独立的实施例，且各种权利要求及实施例的组合皆属于本发明的范围内。
【附图标记列表】
10：LED光源模组
20：导光元件
21：出光面
100：基板
200：线路层
201：入光面
300：保护层
301：顶面
310：开口
400：第一导电部
500：第二导电部
600：辅助结构
601：顶面
610：第三导电部
620：绝缘层
630：第一延伸部
640：第二延伸部
700：发光元件
701：底面
702：发光面
703：背面(与发光面702相对的侧面)
710：第一电极
720：第二电极
730：安装部
740：激发部
750：第三电极
800：挡止件
900：辅助结构
902：延伸部
910：主要支撑部
920：前支撑部
930：侧支撑部
940：后支撑部
S1～S5、S1’～S6’：步骤。

Claims (20)

  1. 一种LED光源模组，包括：
    基板；
    保护层，其设置于所述基板上并具有至少一个开口；
    多个导电部，设置于所述至少一个开口中，其中，所述多个导电部包括第一导电部及第二导电部；
    发光元件，其包括底面、与所述底面连接的发光面、与所述发光面相对的背面、连接所述发光面与所述底面的至少一个侧面、以及多个电极，其中，所述多个电极包括第一电极和第二电极，所述第一电极和所述第二电极分别电性连接所述第一导电部和所述第二导电部；以及
    辅助结构，其设置于所述基板与所述发光元件之间且不接触所述第一电极及第二电极，其中，所述辅助结构包括设于所述基板上以支撑所述发光元件的底面的主要支撑部，所述主要支撑部位于所述多个电极之间且至少从所述发光元件的背面延伸至所述发光面。
  2. 根据权利要求1的LED光源模组，其中，所述辅助结构还包括至少一个前支撑部，所述前支撑部设于所述基板上且至少位于所述第一电极与所述发光元件的所述发光面之间或位于所述第二电极与所述发光元件的所述发光面之间。
  3. 根据权利要求2的LED光源模组，其中，所述前支撑部从所述主要支撑部延伸至所述发光元件的所述侧面。
  4. 根据权利要求1的LED光源模组，其中，所述辅助结构还包括至少一个侧支撑部，所述侧支撑部位于所述第一电极或所述第二电极之外，且所述侧支撑部的至少一部分位于所述第一电极与所述发光元件的所述侧面之间或位于所述第二电极与所述发光元件的所述侧面之间。
  5. 根据权利要求2的LED光源模组，其中，所述辅助结构还包括至少一个侧支撑部，所述侧支撑部从所述前支撑部朝向所述发光元件的所述背面的方向延伸。
  6. 根据权利要求1的LED光源模组，其中，所述辅助结构还包括至少一个后支撑部，所述后支撑部从所述主要支撑部朝向远离所述发光元件的所述发光面的方向延伸。
  7. 根据权利要求1的LED光源模组，其中，所述辅助结构还包括至少一个后支撑部，所述后支撑部位于所述多个电极的后方且朝向远离所述发光元件的所述发光面的方向延伸。
  8. 根据权利要求1的LED光源模组，其中，所述辅助结构具有第一反射率，所述保护层具有第二反射率，所述第一反射率大于或等于所述第二反射率。
  9. 根据权利要求1的LED光源模组，其中，所述辅助结构更具有延伸部，所述延伸部从所述主要支撑部朝向远离所述发光元件的所述背面延伸且超过所述发光面。
  10. 根据权利要求2的LED光源模组，其中，所述辅助结构更具有一延伸部，所述延伸部从所述前支撑部朝向远离所述发光元件的所述背面延伸且超过所述发光面。
  11. 根据权利要求1的LED光源模组，其中，所述多个导电部更包括第三导电部，所述第三导电部设置于所述至少一个开口中，且所述第三导电部介于所述第一导电部及所述第二导电部之间；
    所述多个电极更具有第三电极，所述第三电极介于所述第一电极与所述第二电极之间，其中，所述第三电极电性连接所述第三导电部；
    其中，所述第一电极、所述第二电极、以及所述第三电极之间设有所述辅助结构。
  12. 根据权利要求1的LED光源模组，其中，所述多个导电部更包括第三导电部，所述第三导电部设置于所述至少一个开口中，且所述第三导电部介于所述第一导电部及所述第二导电部之间；
    所述多个电极更具有第三电极，所述第三电极介于所述第一电极与所述第二电极之间，其中，所述第三电极电性连接所述第三导电部；
    其中，所述多个电极的至少其中一者至所述发光面之间设有所述辅助结构。
  13. 根据权利要求1的LED光源模组，更包括挡止件，所述挡止件设置于所述基板上并容置于所述开口中，其中，所述挡止件接触所述背面。
  14. 一种LED光源模组，包括：
    基板；
    保护层，其设置于所述基板上并具有至少一个开口；
    多个导电部，其设置于所述至少一个开口中；
    发光元件，其包括底面、与所述底面连接的第一侧面、与所述底面连接且与所述第一侧面相对的第二侧面、以及多个电极，其中，所述多个电极分别与所述多个导电部电性连接；以及
    辅助结构，其包括至少两个支撑部，所述支撑部设置于所述基板与所述发光元件之间，且至少两个所述支撑部分别对应于所述发光元件的所述第一侧面及所述第二侧面，所述支撑部支撑所述发光元件的所述底面。
  15. 根据权利要求14的LED光源模组，其中，所述发光元件包含发光面，所述发光面位于所述第一侧面及所述第二侧面之间，且所述发光面与所述底面连接。
  16. 根据权利要求15的LED光源模组，其中，所述多个电极位于所述发光元件的所述底面，所述支撑部位于所述多个电极之外，且所述支撑部的其中一者的至少一部分位于所述多个电极与所述发光元件的所述第一侧面之间，所述支撑部的另一者的至少一部分位于所述多个电极与所述发光元件的所述第二侧面之间。
  17. 根据权利要求14的LED光源模组，其中，所述第一侧面为发光面，所述第二侧面为所述发光元件的与所述发光面相对的背面，所述发光面与所述背面皆与所述底面连接。
  18. 根据权利要求17的LED光源模组，其中，所述支撑部的其中一者设于所述基板上且至少位于所述多个电极与所述发光元件的所述发光面之间。
  19. 根据权利要求17的LED光源模组，其中，所述支撑部的其中一者位于所述多个电极的后方且朝向远离所述发光元件的所述发光面的方向延伸。
  20. 根据权利要求15至19中任一项的LED光源模组，其中，所述辅助结构还包括主要支撑部，所述主要支撑部设于所述基板上以支撑所述发光元件的底面，所述主要支撑部位于所述多个电极之间且至少从所述发光元件的所述发光面延伸至与所述发光面相对的另一面。
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