CN110140217B - Led光源模组及其制造方法 - Google Patents

Led光源模组及其制造方法 Download PDF

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Publication number
CN110140217B
CN110140217B CN201780012838.4A CN201780012838A CN110140217B CN 110140217 B CN110140217 B CN 110140217B CN 201780012838 A CN201780012838 A CN 201780012838A CN 110140217 B CN110140217 B CN 110140217B
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CN
China
Prior art keywords
auxiliary structure
conductive part
source module
light source
led light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201780012838.4A
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English (en)
Chinese (zh)
Other versions
CN110140217A (zh
Inventor
钟智贤
叶修宏
陈庆员
朱延专
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiant Opto Electronics Suzhou Co Ltd
Radiant Opto Electronics Corp
Original Assignee
Radiant Opto Electronics Suzhou Co Ltd
Radiant Opto Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Radiant Opto Electronics Suzhou Co Ltd, Radiant Opto Electronics Corp filed Critical Radiant Opto Electronics Suzhou Co Ltd
Publication of CN110140217A publication Critical patent/CN110140217A/zh
Application granted granted Critical
Publication of CN110140217B publication Critical patent/CN110140217B/zh
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/61—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using light guides
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/009—Positioning aspects of the light source in the package
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
CN201780012838.4A 2017-10-27 2017-10-27 Led光源模组及其制造方法 Active CN110140217B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/108063 WO2019080104A1 (zh) 2017-10-27 2017-10-27 Led光源模组及其制造方法

Publications (2)

Publication Number Publication Date
CN110140217A CN110140217A (zh) 2019-08-16
CN110140217B true CN110140217B (zh) 2023-03-14

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780012838.4A Active CN110140217B (zh) 2017-10-27 2017-10-27 Led光源模组及其制造方法

Country Status (6)

Country Link
US (1) US10883667B2 (enExample)
JP (1) JP7100700B2 (enExample)
KR (1) KR102481413B1 (enExample)
CN (1) CN110140217B (enExample)
TW (1) TWI675468B (enExample)
WO (1) WO2019080104A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11686896B2 (en) 2017-10-27 2023-06-27 Radiant Opto-Electronics(Suzhou) Co., Ltd. LED light source module
WO2021102742A1 (zh) * 2019-11-27 2021-06-03 鹏鼎控股(深圳)股份有限公司 多面发光电路板及其制作方法
TWI731648B (zh) * 2020-04-10 2021-06-21 禾昌興業股份有限公司 光源模組連接器
WO2022095032A1 (zh) * 2020-11-09 2022-05-12 瑞仪光电(苏州)有限公司 Led光源模组

Citations (4)

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CN1867223A (zh) * 2005-05-20 2006-11-22 先锋株式会社 柔性基板及其制造方法、led安装柔性基板及照明装置
CN101656283A (zh) * 2008-08-22 2010-02-24 奇力光电科技股份有限公司 发光二极管组件及其制造方法
CN102779923A (zh) * 2012-07-09 2012-11-14 厦门飞德利照明科技有限公司 一种贴片式led模组的制造方法
TWM474255U (zh) * 2013-10-23 2014-03-11 競國實業股份有限公司 電路板及發光二極體裝置

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JP2010161279A (ja) * 2009-01-09 2010-07-22 Sharp Corp 発光装置
WO2010140604A1 (ja) * 2009-06-05 2010-12-09 先端フォトニクス株式会社 サブマウント、これを備えた光モジュール、及びサブマウントの製造方法
CN101577260B (zh) * 2009-06-05 2011-01-19 深圳华映显示科技有限公司 线路基板及光源模组
CN102082218B (zh) * 2009-11-26 2013-10-23 亿光电子工业股份有限公司 发光二极管及其装置、封装方法
JP5693194B2 (ja) * 2010-12-14 2015-04-01 シチズン電子株式会社 発光ダイオード
TWI430429B (zh) * 2010-12-24 2014-03-11 友達光電股份有限公司 發光模組
KR20120119091A (ko) * 2011-04-20 2012-10-30 삼성디스플레이 주식회사 유기 발광 표시 장치와, 이의 제조 방법
WO2012169717A1 (en) * 2011-06-08 2012-12-13 Seoul Semiconductor Co., Ltd. Light emitting diode package
TWI437909B (zh) * 2011-09-01 2014-05-11 Au Optronics Corp 發光二極體模組與採用此發光二極體模組之顯示器
JP5978572B2 (ja) * 2011-09-02 2016-08-24 日亜化学工業株式会社 発光装置
JP5933959B2 (ja) * 2011-11-18 2016-06-15 スタンレー電気株式会社 半導体光学装置
TWI606618B (zh) * 2012-01-03 2017-11-21 Ｌｇ伊諾特股份有限公司 發光裝置
JP2014067740A (ja) * 2012-09-24 2014-04-17 Stanley Electric Co Ltd 光半導体装置
TW201410083A (zh) * 2012-12-20 2014-03-01 Synergy Optoelectronics Shenzhen Co Ltd 電路板結構及使用該電路板結構的背光模組
JP6414427B2 (ja) * 2013-10-03 2018-10-31 日亜化学工業株式会社 発光装置実装構造体
JP2015207626A (ja) * 2014-04-18 2015-11-19 スタンレー電気株式会社 サイドビュー型半導体発光装置
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JP6409459B2 (ja) * 2014-09-30 2018-10-24 日亜化学工業株式会社 照明装置
JP2016201237A (ja) * 2015-04-09 2016-12-01 パナソニックＩｐマネジメント株式会社 発光モジュール及びそれを用いた発光装置
KR102346643B1 (ko) * 2015-06-30 2022-01-03 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자, 발광 소자 제조방법 및 발광 모듈
CN106558568B (zh) * 2015-09-30 2020-05-12 台达电子工业股份有限公司 封装结构
CN106094377A (zh) 2016-07-25 2016-11-09 深圳市华星光电技术有限公司 一种阵列基板及液晶显示面板
CN106094337A (zh) * 2016-08-11 2016-11-09 昆山龙腾光电有限公司 一种led灯条及背光模组
KR102135584B1 (ko) 2020-01-09 2020-07-20 (주)이씨티 태양광 발전 장치의 발전 효율을 향상시키는 냉각수 공급 장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1867223A (zh) * 2005-05-20 2006-11-22 先锋株式会社 柔性基板及其制造方法、led安装柔性基板及照明装置
CN101656283A (zh) * 2008-08-22 2010-02-24 奇力光电科技股份有限公司 发光二极管组件及其制造方法
CN102779923A (zh) * 2012-07-09 2012-11-14 厦门飞德利照明科技有限公司 一种贴片式led模组的制造方法
TWM474255U (zh) * 2013-10-23 2014-03-11 競國實業股份有限公司 電路板及發光二極體裝置

Also Published As

Publication number Publication date
TW201917879A (zh) 2019-05-01
WO2019080104A1 (zh) 2019-05-02
JP2021510007A (ja) 2021-04-08
KR102481413B1 (ko) 2022-12-26
TWI675468B (zh) 2019-10-21
KR20200081373A (ko) 2020-07-07
US20190128480A1 (en) 2019-05-02
US10883667B2 (en) 2021-01-05
JP7100700B2 (ja) 2022-07-13
CN110140217A (zh) 2019-08-16

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