TWI668548B - 流體控制裝置 - Google Patents

流體控制裝置 Download PDF

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Publication number
TWI668548B
TWI668548B TW107114767A TW107114767A TWI668548B TW I668548 B TWI668548 B TW I668548B TW 107114767 A TW107114767 A TW 107114767A TW 107114767 A TW107114767 A TW 107114767A TW I668548 B TWI668548 B TW I668548B
Authority
TW
Taiwan
Prior art keywords
fluid
pipe section
output
flow control
flow
Prior art date
Application number
TW107114767A
Other languages
English (en)
Chinese (zh)
Other versions
TW201935165A (zh
Inventor
Chuan-Chang Feng
馮傳彰
Mao-Lin Liu
劉茂林
Ting-Yu Wu
吳庭宇
Chih-Hui Lai
賴志諱
Original Assignee
Scientech Corporation
辛耘企業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Scientech Corporation, 辛耘企業股份有限公司 filed Critical Scientech Corporation
Application granted granted Critical
Publication of TWI668548B publication Critical patent/TWI668548B/zh
Publication of TW201935165A publication Critical patent/TW201935165A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K27/00—Construction of housing; Use of materials therefor
    • F16K27/02—Construction of housing; Use of materials therefor of lift valves
    • F16K27/0236—Diaphragm cut-off apparatus
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K7/00—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves
    • F16K7/12—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves with flat, dished, or bowl-shaped diaphragm
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17D—PIPE-LINE SYSTEMS; PIPE-LINES
    • F17D3/00—Arrangements for supervising or controlling working operations
    • F17D3/01—Arrangements for supervising or controlling working operations for controlling, signalling, or supervising the conveyance of a product
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Coating Apparatus (AREA)
  • Reciprocating Pumps (AREA)
  • Fluid-Pressure Circuits (AREA)
  • Pipeline Systems (AREA)
  • Jet Pumps And Other Pumps (AREA)
TW107114767A 2018-02-13 2018-05-01 流體控制裝置 TWI668548B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW107105303 2018-02-13
CN107105303 2018-02-13

Publications (2)

Publication Number Publication Date
TWI668548B true TWI668548B (zh) 2019-08-11
TW201935165A TW201935165A (zh) 2019-09-01

Family

ID=67644871

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107114767A TWI668548B (zh) 2018-02-13 2018-05-01 流體控制裝置

Country Status (3)

Country Link
KR (1) KR102126845B1 (ko)
CN (1) CN110159928B (ko)
TW (1) TWI668548B (ko)

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1084856C (zh) * 1997-07-11 2002-05-15 Smc株式会社 开闭阀
CN1716138A (zh) * 2004-07-01 2006-01-04 波克股份有限公司 流体流量控制设备和系统
US20070102046A1 (en) * 2003-11-18 2007-05-10 Motoyasu Kimura Flow control device
TW200941171A (en) * 2008-03-31 2009-10-01 Yamatake Corp Flow control system
US20100094469A1 (en) * 2008-07-03 2010-04-15 Gm Global Technology Operations, Inc. Control method and system for a fluid control device, based on position sensor learning
TW201115293A (en) * 2009-10-22 2011-05-01 Univ Ishou Flow rate control apparatus
CN103338807A (zh) * 2010-08-10 2013-10-02 加利福尼亚大学董事会 自动的流体输送系统及方法
US20130340860A1 (en) * 2012-06-26 2013-12-26 Fujikoki Corporation Electrically operated valve control device and electrically operated valve device
JP2014137724A (ja) * 2013-01-17 2014-07-28 Asahi Organic Chemicals Industry Co Ltd 流体制御装置
JP2015170267A (ja) * 2014-03-10 2015-09-28 旭有機材工業株式会社 流量調整弁及びこれを備える流体制御装置
US9163748B2 (en) * 2010-01-26 2015-10-20 Fujikin Incorporated Fluid control device and flow rate control apparatus
JP2016192243A (ja) * 2016-08-17 2016-11-10 株式会社堀場エステック 流体制御装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09153453A (ja) * 1995-09-28 1997-06-10 Dainippon Screen Mfg Co Ltd 処理液供給装置
JPH1133471A (ja) * 1997-07-23 1999-02-09 Tokyo Electron Ltd 塗布装置
CN101052802B (zh) * 2004-12-22 2011-11-23 松下电工株式会社 液体排出控制装置
JP5189403B2 (ja) * 2008-05-08 2013-04-24 国立大学法人信州大学 逆流防止装置
JP5045741B2 (ja) * 2009-12-25 2012-10-10 東京エレクトロン株式会社 薬液供給ノズル及び薬液供給方法
JP5853971B2 (ja) * 2013-03-01 2016-02-09 東京エレクトロン株式会社 液供給装置
US10490429B2 (en) * 2014-11-26 2019-11-26 Applied Materials, Inc. Substrate carrier using a proportional thermal fluid delivery system
KR20170040024A (ko) * 2015-10-02 2017-04-12 사이언테크 코포레이션 배기관 차단장치 및 기판처리장치
CN106567980A (zh) * 2015-10-08 2017-04-19 辛耘企业股份有限公司 管尾关断装置以及基板处理装置

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1084856C (zh) * 1997-07-11 2002-05-15 Smc株式会社 开闭阀
US20070102046A1 (en) * 2003-11-18 2007-05-10 Motoyasu Kimura Flow control device
CN1716138A (zh) * 2004-07-01 2006-01-04 波克股份有限公司 流体流量控制设备和系统
TW200625046A (en) * 2004-07-01 2006-07-16 Boc Group Inc Fluid flow control device and system
TW200941171A (en) * 2008-03-31 2009-10-01 Yamatake Corp Flow control system
US20100094469A1 (en) * 2008-07-03 2010-04-15 Gm Global Technology Operations, Inc. Control method and system for a fluid control device, based on position sensor learning
TW201115293A (en) * 2009-10-22 2011-05-01 Univ Ishou Flow rate control apparatus
US9163748B2 (en) * 2010-01-26 2015-10-20 Fujikin Incorporated Fluid control device and flow rate control apparatus
CN103338807A (zh) * 2010-08-10 2013-10-02 加利福尼亚大学董事会 自动的流体输送系统及方法
US20130340860A1 (en) * 2012-06-26 2013-12-26 Fujikoki Corporation Electrically operated valve control device and electrically operated valve device
JP2014137724A (ja) * 2013-01-17 2014-07-28 Asahi Organic Chemicals Industry Co Ltd 流体制御装置
JP2015170267A (ja) * 2014-03-10 2015-09-28 旭有機材工業株式会社 流量調整弁及びこれを備える流体制御装置
JP2016192243A (ja) * 2016-08-17 2016-11-10 株式会社堀場エステック 流体制御装置

Also Published As

Publication number Publication date
KR102126845B1 (ko) 2020-06-26
CN110159928B (zh) 2021-04-20
TW201935165A (zh) 2019-09-01
KR20200067991A (ko) 2020-06-15
CN110159928A (zh) 2019-08-23

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