TWI645498B - 具有溫度分佈控制的基板支架 - Google Patents

具有溫度分佈控制的基板支架 Download PDF

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Publication number
TWI645498B
TWI645498B TW103131407A TW103131407A TWI645498B TW I645498 B TWI645498 B TW I645498B TW 103131407 A TW103131407 A TW 103131407A TW 103131407 A TW103131407 A TW 103131407A TW I645498 B TWI645498 B TW I645498B
Authority
TW
Taiwan
Prior art keywords
shaft
heater
layer
coupled
substrate holder
Prior art date
Application number
TW103131407A
Other languages
English (en)
Chinese (zh)
Other versions
TW201515145A (zh
Inventor
梅利尼爾
沃福斯基里昂
Original Assignee
應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 應用材料股份有限公司 filed Critical 應用材料股份有限公司
Publication of TW201515145A publication Critical patent/TW201515145A/zh
Application granted granted Critical
Publication of TWI645498B publication Critical patent/TWI645498B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/283—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49083—Heater type

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Resistance Heating (AREA)
  • Physical Vapour Deposition (AREA)
TW103131407A 2013-09-16 2014-09-11 具有溫度分佈控制的基板支架 TWI645498B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201361878370P 2013-09-16 2013-09-16
US61/878,370 2013-09-16
US14/481,283 US9698074B2 (en) 2013-09-16 2014-09-09 Heated substrate support with temperature profile control
US14/481,283 2014-09-09

Publications (2)

Publication Number Publication Date
TW201515145A TW201515145A (zh) 2015-04-16
TWI645498B true TWI645498B (zh) 2018-12-21

Family

ID=52666222

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103131407A TWI645498B (zh) 2013-09-16 2014-09-11 具有溫度分佈控制的基板支架

Country Status (6)

Country Link
US (1) US9698074B2 (https=)
JP (1) JP6404355B2 (https=)
KR (1) KR102244625B1 (https=)
CN (1) CN105556656B (https=)
TW (1) TWI645498B (https=)
WO (1) WO2015038610A1 (https=)

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US9972477B2 (en) 2014-06-28 2018-05-15 Applied Materials, Inc. Multiple point gas delivery apparatus for etching materials
US10186437B2 (en) * 2015-10-05 2019-01-22 Lam Research Corporation Substrate holder having integrated temperature measurement electrical devices
EP3414541B1 (en) * 2016-02-08 2020-09-30 Watlow Electric Manufacturing Company Temperature sensing system for rotatable wafer support assembly
US10184183B2 (en) * 2016-06-21 2019-01-22 Applied Materials, Inc. Substrate temperature monitoring
TWI729447B (zh) 2016-09-22 2021-06-01 美商應用材料股份有限公司 用於寬範圍溫度控制的加熱器基座組件
JP6704834B2 (ja) * 2016-10-28 2020-06-03 日本特殊陶業株式会社 加熱装置
KR102329130B1 (ko) * 2017-02-28 2021-11-19 닛폰 하츠죠 가부시키가이샤 기판 지지 유닛 및 기판 지지 유닛을 가지는 성막장치
WO2018213621A2 (en) 2017-05-18 2018-11-22 Applied Materials, Inc. Thermal chamber with improved thermal uniformity
JP7049818B2 (ja) * 2017-12-13 2022-04-07 東京エレクトロン株式会社 成膜装置
WO2019180785A1 (ja) * 2018-03-19 2019-09-26 日新電機株式会社 基板加熱システム及び基板処理装置
JP6952633B2 (ja) * 2018-03-23 2021-10-20 東京エレクトロン株式会社 基板加熱装置及びこれを用いた基板処理装置
KR20230058534A (ko) * 2018-03-23 2023-05-03 엔지케이 인슐레이터 엘티디 멀티 존 히터
KR102098556B1 (ko) * 2018-07-09 2020-04-17 주식회사 테스 기판지지유닛 및 이를 구비한 기판처리장치
WO2020086122A1 (en) * 2018-10-24 2020-04-30 Applied Materials, Inc. Substrate support designs for a deposition chamber
CN111383891B (zh) * 2018-12-29 2023-03-10 中微半导体设备(上海)股份有限公司 用于半导体处理设备的温度控制装置及其温度控制方法
KR102628367B1 (ko) * 2019-03-18 2024-01-24 엔지케이 인슐레이터 엘티디 세라믹 히터 및 그의 제법
CN110060913A (zh) * 2019-04-22 2019-07-26 德淮半导体有限公司 离子植入机以及监测离子植入机中离子束的方法
KR102638093B1 (ko) * 2019-07-01 2024-02-16 엔지케이 인슐레이터 엘티디 샤프트가 있는 세라믹 히터
CN114175851B (zh) * 2019-07-16 2024-06-25 日本碍子株式会社 带轴的陶瓷加热器
JP7174159B2 (ja) * 2019-07-16 2022-11-17 日本碍子株式会社 シャフト付きセラミックヒータ
JP7430617B2 (ja) * 2020-10-16 2024-02-13 日本碍子株式会社 ウエハ載置台
JP7375069B2 (ja) * 2022-03-07 2023-11-07 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法及びプログラム
US20250125181A1 (en) * 2023-10-12 2025-04-17 Applied Materials, Inc. Low temperature electrostatic chuck
US20250227851A1 (en) * 2024-01-08 2025-07-10 Tokyo Electron Limited Substrate support with printed heater

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5688331A (en) * 1993-05-27 1997-11-18 Applied Materisls, Inc. Resistance heated stem mounted aluminum susceptor assembly
US6956186B1 (en) * 1999-08-09 2005-10-18 Ibiden Co., Ltd. Ceramic heater
US7126092B2 (en) * 2005-01-13 2006-10-24 Watlow Electric Manufacturing Company Heater for wafer processing and methods of operating and manufacturing the same
US7683295B2 (en) * 2005-08-09 2010-03-23 Shin-Etsu Chemical Co., Ltd. Heating element
US20110062144A1 (en) * 2009-09-17 2011-03-17 Ngk Insulators, Ltd. Ceramic heater and method for making the same

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JP4637316B2 (ja) * 2000-02-24 2011-02-23 京セラ株式会社 筒状体を有するセラミックヒーター及びこれを用いた加熱装置
US7273526B2 (en) * 2004-04-15 2007-09-25 Asm Japan K.K. Thin-film deposition apparatus
JP4889385B2 (ja) 2006-07-07 2012-03-07 日本発條株式会社 ヒータユニットおよびシャフト
JP4294661B2 (ja) * 2006-07-26 2009-07-15 国立大学法人東北大学 基板ステージ、熱処理装置および基板ステージの製造方法
JP5135915B2 (ja) * 2007-06-28 2013-02-06 東京エレクトロン株式会社 載置台構造及び熱処理装置
KR101305760B1 (ko) * 2008-03-21 2013-09-17 엔지케이 인슐레이터 엘티디 세라믹스 히터
US8274017B2 (en) 2009-12-18 2012-09-25 Applied Materials, Inc. Multifunctional heater/chiller pedestal for wide range wafer temperature control
JP5666167B2 (ja) 2010-05-07 2015-02-12 日本発條株式会社 ステージヒータ及びシャフトの製造方法
US20120211484A1 (en) 2011-02-23 2012-08-23 Applied Materials, Inc. Methods and apparatus for a multi-zone pedestal heater
US9706605B2 (en) 2012-03-30 2017-07-11 Applied Materials, Inc. Substrate support with feedthrough structure

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5688331A (en) * 1993-05-27 1997-11-18 Applied Materisls, Inc. Resistance heated stem mounted aluminum susceptor assembly
US6956186B1 (en) * 1999-08-09 2005-10-18 Ibiden Co., Ltd. Ceramic heater
US7126092B2 (en) * 2005-01-13 2006-10-24 Watlow Electric Manufacturing Company Heater for wafer processing and methods of operating and manufacturing the same
US7683295B2 (en) * 2005-08-09 2010-03-23 Shin-Etsu Chemical Co., Ltd. Heating element
US20110062144A1 (en) * 2009-09-17 2011-03-17 Ngk Insulators, Ltd. Ceramic heater and method for making the same

Also Published As

Publication number Publication date
WO2015038610A1 (en) 2015-03-19
JP6404355B2 (ja) 2018-10-10
JP2016536803A (ja) 2016-11-24
US20150076135A1 (en) 2015-03-19
US9698074B2 (en) 2017-07-04
KR102244625B1 (ko) 2021-04-23
CN105556656A (zh) 2016-05-04
TW201515145A (zh) 2015-04-16
CN105556656B (zh) 2018-11-02
KR20160055257A (ko) 2016-05-17

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