TWI625529B - 探針導孔板及其製造方法 - Google Patents

探針導孔板及其製造方法 Download PDF

Info

Publication number
TWI625529B
TWI625529B TW103108624A TW103108624A TWI625529B TW I625529 B TWI625529 B TW I625529B TW 103108624 A TW103108624 A TW 103108624A TW 103108624 A TW103108624 A TW 103108624A TW I625529 B TWI625529 B TW I625529B
Authority
TW
Taiwan
Prior art keywords
substrate
probe
hole
guide plate
main surface
Prior art date
Application number
TW103108624A
Other languages
English (en)
Chinese (zh)
Other versions
TW201447308A (zh
Inventor
白石晶紀
藤原洸輔
Original Assignee
日本電子材料股份有限公司
新光電氣工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電子材料股份有限公司, 新光電氣工業股份有限公司 filed Critical 日本電子材料股份有限公司
Publication of TW201447308A publication Critical patent/TW201447308A/zh
Application granted granted Critical
Publication of TWI625529B publication Critical patent/TWI625529B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
TW103108624A 2013-03-13 2014-03-12 探針導孔板及其製造方法 TWI625529B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013050078A JP6033130B2 (ja) 2013-03-13 2013-03-13 プローブガイド板及びその製造方法
JP2013-050078 2013-03-13

Publications (2)

Publication Number Publication Date
TW201447308A TW201447308A (zh) 2014-12-16
TWI625529B true TWI625529B (zh) 2018-06-01

Family

ID=51524807

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103108624A TWI625529B (zh) 2013-03-13 2014-03-12 探針導孔板及其製造方法

Country Status (4)

Country Link
US (1) US9523716B2 (enExample)
JP (1) JP6033130B2 (enExample)
KR (1) KR102090102B1 (enExample)
TW (1) TWI625529B (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6235785B2 (ja) * 2013-03-18 2017-11-22 日本電子材料株式会社 プローブカード用ガイド板およびプローブカード用ガイド板の製造方法
CN105093000B (zh) * 2014-05-19 2019-03-15 鸿富锦精密电子(郑州)有限公司 测试装置
JP6233331B2 (ja) * 2015-02-27 2017-11-22 トヨタ自動車株式会社 半導体基板の温度検査方法、半導体装置の製造方法及び半導体基板の温度検査装置
TWI702402B (zh) * 2015-05-07 2020-08-21 義大利商探針科技公司 特別用於減少間距應用的具有垂直探針的測試頭
JP6563317B2 (ja) * 2015-11-25 2019-08-21 新光電気工業株式会社 プローブガイド板及びその製造方法とプローブ装置
JP6654061B2 (ja) 2016-02-23 2020-02-26 日本電子材料株式会社 プローブガイド、プローブカード及びプローブガイドの製造方法
JP6855185B2 (ja) * 2016-07-27 2021-04-07 株式会社日本マイクロニクス 電気的接続装置
JP2017201321A (ja) * 2017-06-29 2017-11-09 日本電子材料株式会社 プローブカード用ガイド板およびプローブカード用ガイド板の製造方法
TWI666451B (zh) * 2017-09-15 2019-07-21 中華精測科技股份有限公司 探針裝置及其導板
JP7543004B2 (ja) * 2020-06-19 2024-09-02 キヤノン株式会社 基板および液体吐出ヘッドの製造方法
WO2022024888A1 (ja) * 2020-07-27 2022-02-03 京セラ株式会社 プローブガイド
KR20230165258A (ko) * 2021-03-23 2023-12-05 닐슨 싸이언티픽, 엘엘씨 극저온 프로브 카드
US12237275B2 (en) * 2022-02-18 2025-02-25 Western Digital Technologies, Inc. Semiconductor devices having supportive plating structures
TWI798069B (zh) * 2022-04-26 2023-04-01 寶虹科技股份有限公司 探針卡
KR20240050065A (ko) * 2022-10-11 2024-04-18 (주)포인트엔지니어링 가이드 플레이트 및 이를 포함하는 검사 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200707643A (en) * 2005-06-17 2007-02-16 Shinko Electric Ind Co Semiconductor device having through electrode and method of manufacturing the same
TW200739962A (en) * 2006-01-30 2007-10-16 Shinko Electric Ind Co Semiconductor device and method of manufacturing semiconductor device
TW200919764A (en) * 2007-10-16 2009-05-01 Silicon Base Dev Inc Package base structure of light diode and manufacturing method of the same

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3350638B2 (ja) * 1997-06-26 2002-11-25 沖電気工業株式会社 半導体素子の製造方法
EP0995996B1 (en) * 1997-07-14 2005-09-07 Nhk Spring Co.Ltd. Conductive contact
AU1687300A (en) * 1998-12-16 2000-07-03 Seiko Epson Corporation Semiconductor chip, semiconductor device, circuit board and electronic equipmentand production methods for them
AU2692100A (en) * 1999-02-25 2000-09-14 Seiko Epson Corporation Method for machining work by laser beam
JP4690556B2 (ja) * 2000-07-21 2011-06-01 大日本印刷株式会社 微細パターン形成装置と微細ノズルの製造方法
JP2002296297A (ja) 2001-03-29 2002-10-09 Isao Kimoto 接触子組立体
KR20040089244A (ko) 2003-04-11 2004-10-21 주식회사 유림하이테크산업 프로브 카드의 니들 어셈블리
JP4955935B2 (ja) 2004-05-25 2012-06-20 キヤノン株式会社 貫通孔形成方法および半導体装置の製造方法
TWI261933B (en) * 2005-11-21 2006-09-11 Mjc Probe Inc Method for batch production process of micro-hole guide plate of vertical probe card
JP2007171139A (ja) * 2005-12-26 2007-07-05 Apex Inc プローブ保持構造およびバネ型プローブ
JP2007171140A (ja) * 2005-12-26 2007-07-05 Apex Inc プローブカード、インターポーザおよびインターポーザの製造方法
TWI284209B (en) * 2005-12-30 2007-07-21 Ind Tech Res Inst A method of fabricating vertical probe head
JP2007263649A (ja) * 2006-03-28 2007-10-11 Dainippon Printing Co Ltd 電気信号計測用治具およびその製造方法
JP4703456B2 (ja) * 2006-03-28 2011-06-15 大日本印刷株式会社 電気信号測定用治具
JPWO2009104589A1 (ja) * 2008-02-21 2011-06-23 東京エレクトロン株式会社 プローブ支持板の製造方法、コンピュータ記憶媒体及びプローブ支持板
KR100973413B1 (ko) * 2008-09-04 2010-08-03 이용준 반도체 소자 테스트용 콘택터
JP5386769B2 (ja) 2008-09-29 2014-01-15 日本電産リード株式会社 検査治具
JP5367616B2 (ja) * 2009-02-23 2013-12-11 新光電気工業株式会社 配線基板及びその製造方法
JP5379065B2 (ja) * 2010-04-21 2013-12-25 新光電気工業株式会社 プローブカード及びその製造方法
US8723538B2 (en) * 2011-06-17 2014-05-13 Taiwan Semiconductor Manufacturing Company, Ltd. Probe head formation methods employing guide plate raising assembly mechanism
JP5847663B2 (ja) 2012-08-01 2016-01-27 日本電子材料株式会社 プローブカード用ガイド板の製造方法
JP6235785B2 (ja) 2013-03-18 2017-11-22 日本電子材料株式会社 プローブカード用ガイド板およびプローブカード用ガイド板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200707643A (en) * 2005-06-17 2007-02-16 Shinko Electric Ind Co Semiconductor device having through electrode and method of manufacturing the same
TW200739962A (en) * 2006-01-30 2007-10-16 Shinko Electric Ind Co Semiconductor device and method of manufacturing semiconductor device
TW200919764A (en) * 2007-10-16 2009-05-01 Silicon Base Dev Inc Package base structure of light diode and manufacturing method of the same

Also Published As

Publication number Publication date
JP2014174145A (ja) 2014-09-22
US20140266274A1 (en) 2014-09-18
US9523716B2 (en) 2016-12-20
TW201447308A (zh) 2014-12-16
KR102090102B1 (ko) 2020-03-17
KR20140112396A (ko) 2014-09-23
JP6033130B2 (ja) 2016-11-30

Similar Documents

Publication Publication Date Title
TWI625529B (zh) 探針導孔板及其製造方法
US7227370B2 (en) Semiconductor inspection apparatus and manufacturing method of semiconductor device
TWI626449B (zh) 探針導引板及其製造方法、半導體檢測裝置
TWI686614B (zh) 探針導引板及探針裝置
US6724204B2 (en) Probe structure for testing semiconductor devices and method for fabricating the same
CN104062476A (zh) 探针卡用导板
US8952454B2 (en) SOI wafer and method of manufacturing the same
JP2012238894A (ja) 半導体装置の製造方法
KR20100048673A (ko) 프로브 구조물 및 프로브 구조물 제조 방법
JP2005043159A (ja) 圧力センサ
JP2005038942A (ja) 貫通電極付き基板、その製造方法及び電子デバイス
US20120231564A1 (en) Monitoring test element groups (tegs) for etching process and methods of manufacturing a semiconductor device using the same
US20220359258A1 (en) Method of Manufacturing and Passivating a Die
JPH09213759A (ja) 半導体装置
US9530692B2 (en) Method of forming through wiring
US7546670B2 (en) Method for producing thermally matched probe assembly
KR100290483B1 (ko) 테스트 패턴 형성 방법 및 이를 이용한 절연막의 공극검출 방법
KR100745108B1 (ko) 프로브 카드의 실리콘 기판
US10410986B2 (en) Semiconductor device and manufacture thereof
KR101258609B1 (ko) Ｇｏｉ평가용 반도체 소자의 제조 방법
JP3961394B2 (ja) コネクタ基板の製造方法
JP2002134572A (ja) 半導体素子検査装置
KR100403351B1 (ko) 듀얼 다마신 공정에서의 식각 모니터링 박스 형성방법
JP4680624B2 (ja) 半導体装置の製造方法
Margesin et al. Suspended connection array for ultra low temperature applications