KR102090102B1 - 프로브 가이드판 및 그 제조 방법 - Google Patents

프로브 가이드판 및 그 제조 방법 Download PDF

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Publication number
KR102090102B1
KR102090102B1 KR1020140022332A KR20140022332A KR102090102B1 KR 102090102 B1 KR102090102 B1 KR 102090102B1 KR 1020140022332 A KR1020140022332 A KR 1020140022332A KR 20140022332 A KR20140022332 A KR 20140022332A KR 102090102 B1 KR102090102 B1 KR 102090102B1
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South Korea
Prior art keywords
substrate
probe
guide plate
probe guide
insulating film
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KR1020140022332A
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English (en)
Korean (ko)
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KR20140112396A (ko
Inventor
아키노리 시라이시
고스케 후지하라
Original Assignee
재팬 일렉트로닉 메트리얼스 코오포레이숀
신꼬오덴기 고교 가부시키가이샤
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Publication of KR20140112396A publication Critical patent/KR20140112396A/ko
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
KR1020140022332A 2013-03-13 2014-02-26 프로브 가이드판 및 그 제조 방법 Active KR102090102B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013050078A JP6033130B2 (ja) 2013-03-13 2013-03-13 プローブガイド板及びその製造方法
JPJP-P-2013-050078 2013-03-13

Publications (2)

Publication Number Publication Date
KR20140112396A KR20140112396A (ko) 2014-09-23
KR102090102B1 true KR102090102B1 (ko) 2020-03-17

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ID=51524807

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140022332A Active KR102090102B1 (ko) 2013-03-13 2014-02-26 프로브 가이드판 및 그 제조 방법

Country Status (4)

Country Link
US (1) US9523716B2 (enExample)
JP (1) JP6033130B2 (enExample)
KR (1) KR102090102B1 (enExample)
TW (1) TWI625529B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6235785B2 (ja) * 2013-03-18 2017-11-22 日本電子材料株式会社 プローブカード用ガイド板およびプローブカード用ガイド板の製造方法
CN105093000B (zh) * 2014-05-19 2019-03-15 鸿富锦精密电子(郑州)有限公司 测试装置
JP6233331B2 (ja) * 2015-02-27 2017-11-22 トヨタ自動車株式会社 半導体基板の温度検査方法、半導体装置の製造方法及び半導体基板の温度検査装置
MY186784A (en) * 2015-05-07 2021-08-20 Technoprobe Spa Testing head having vertical probes, in particular for reduced pitch applications
JP6563317B2 (ja) * 2015-11-25 2019-08-21 新光電気工業株式会社 プローブガイド板及びその製造方法とプローブ装置
JP6654061B2 (ja) * 2016-02-23 2020-02-26 日本電子材料株式会社 プローブガイド、プローブカード及びプローブガイドの製造方法
JP6855185B2 (ja) * 2016-07-27 2021-04-07 株式会社日本マイクロニクス 電気的接続装置
JP2017201321A (ja) * 2017-06-29 2017-11-09 日本電子材料株式会社 プローブカード用ガイド板およびプローブカード用ガイド板の製造方法
TWI666451B (zh) * 2017-09-15 2019-07-21 中華精測科技股份有限公司 探針裝置及其導板
JP7543004B2 (ja) * 2020-06-19 2024-09-02 キヤノン株式会社 基板および液体吐出ヘッドの製造方法
WO2022024888A1 (ja) * 2020-07-27 2022-02-03 京セラ株式会社 プローブガイド
JP7743104B2 (ja) * 2021-03-23 2025-09-24 ニールソン サイエンティフィック，エルエルシー 極低温プローブカード
US12237275B2 (en) * 2022-02-18 2025-02-25 Western Digital Technologies, Inc. Semiconductor devices having supportive plating structures
TWI798069B (zh) * 2022-04-26 2023-04-01 寶虹科技股份有限公司 探針卡
KR20240050065A (ko) * 2022-10-11 2024-04-18 (주)포인트엔지니어링 가이드 플레이트 및 이를 포함하는 검사 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050266687A1 (en) 2004-05-25 2005-12-01 Canon Kabushiki Kaisha Method of manufacturing semiconductor device and semiconductor device
JP2010085107A (ja) 2008-09-29 2010-04-15 Nidec-Read Corp 検査治具、電極構造及び電極構造の製造方法
JP2012194188A (ja) * 2008-02-21 2012-10-11 Tokyo Electron Ltd プローブ支持板の製造方法、コンピュータ記憶媒体及びプローブ支持板

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JP3350638B2 (ja) * 1997-06-26 2002-11-25 沖電気工業株式会社 半導体素子の製造方法
US6337572B1 (en) * 1997-07-14 2002-01-08 Nhk Spring Co., Ltd. Electric contact probe unit
EP1061578A4 (en) * 1998-12-16 2001-07-18 Seiko Epson Corp SEMICONDUCTOR CHIP, SEMICONDUCTOR ARRANGEMENT, CIRCUIT BOARD AND ELECTRONIC DEVICE AND METHOD FOR THE PRODUCTION THEREOF
WO2000050198A1 (en) * 1999-02-25 2000-08-31 Seiko Epson Corporation Method for machining work by laser beam
JP4690556B2 (ja) * 2000-07-21 2011-06-01 大日本印刷株式会社 微細パターン形成装置と微細ノズルの製造方法
JP2002296297A (ja) 2001-03-29 2002-10-09 Isao Kimoto 接触子組立体
KR20040089244A (ko) 2003-04-11 2004-10-21 주식회사 유림하이테크산업 프로브 카드의 니들 어셈블리
JP4698296B2 (ja) * 2005-06-17 2011-06-08 新光電気工業株式会社 貫通電極を有する半導体装置の製造方法
TWI261933B (en) * 2005-11-21 2006-09-11 Mjc Probe Inc Method for batch production process of micro-hole guide plate of vertical probe card
JP2007171139A (ja) * 2005-12-26 2007-07-05 Apex Inc プローブ保持構造およびバネ型プローブ
JP2007171140A (ja) * 2005-12-26 2007-07-05 Apex Inc プローブカード、インターポーザおよびインターポーザの製造方法
TWI284209B (en) * 2005-12-30 2007-07-21 Ind Tech Res Inst A method of fabricating vertical probe head
JP2007201361A (ja) * 2006-01-30 2007-08-09 Shinko Electric Ind Co Ltd 半導体装置及び半導体装置の製造方法
JP2007263649A (ja) * 2006-03-28 2007-10-11 Dainippon Printing Co Ltd 電気信号計測用治具およびその製造方法
JP4703456B2 (ja) * 2006-03-28 2011-06-15 大日本印刷株式会社 電気信号測定用治具
TWI352440B (en) * 2007-10-16 2011-11-11 Silicon Base Dev Inc Package base structure of light diode and manufact
KR100973413B1 (ko) * 2008-09-04 2010-08-03 이용준 반도체 소자 테스트용 콘택터
JP5367616B2 (ja) * 2009-02-23 2013-12-11 新光電気工業株式会社 配線基板及びその製造方法
JP5379065B2 (ja) * 2010-04-21 2013-12-25 新光電気工業株式会社 プローブカード及びその製造方法
US8723538B2 (en) * 2011-06-17 2014-05-13 Taiwan Semiconductor Manufacturing Company, Ltd. Probe head formation methods employing guide plate raising assembly mechanism
JP5847663B2 (ja) 2012-08-01 2016-01-27 日本電子材料株式会社 プローブカード用ガイド板の製造方法
JP6235785B2 (ja) 2013-03-18 2017-11-22 日本電子材料株式会社 プローブカード用ガイド板およびプローブカード用ガイド板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050266687A1 (en) 2004-05-25 2005-12-01 Canon Kabushiki Kaisha Method of manufacturing semiconductor device and semiconductor device
JP2012194188A (ja) * 2008-02-21 2012-10-11 Tokyo Electron Ltd プローブ支持板の製造方法、コンピュータ記憶媒体及びプローブ支持板
JP2010085107A (ja) 2008-09-29 2010-04-15 Nidec-Read Corp 検査治具、電極構造及び電極構造の製造方法

Also Published As

Publication number Publication date
KR20140112396A (ko) 2014-09-23
TWI625529B (zh) 2018-06-01
US9523716B2 (en) 2016-12-20
JP2014174145A (ja) 2014-09-22
US20140266274A1 (en) 2014-09-18
JP6033130B2 (ja) 2016-11-30
TW201447308A (zh) 2014-12-16

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