TWI621287B - 發光裝置及形成發光裝置之方法 - Google Patents

發光裝置及形成發光裝置之方法 Download PDF

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Publication number
TWI621287B
TWI621287B TW103138242A TW103138242A TWI621287B TW I621287 B TWI621287 B TW I621287B TW 103138242 A TW103138242 A TW 103138242A TW 103138242 A TW103138242 A TW 103138242A TW I621287 B TWI621287 B TW I621287B
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TW
Taiwan
Prior art keywords
layer
lens
substrate
refractive index
light
Prior art date
Application number
TW103138242A
Other languages
English (en)
Chinese (zh)
Other versions
TW201538892A (zh
Inventor
馬克 麥森 巴特渥夫
Mark Melvin Butterworth
Original Assignee
皇家飛利浦有限公司
Koninklijke Philips N.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 皇家飛利浦有限公司, Koninklijke Philips N.V. filed Critical 皇家飛利浦有限公司
Publication of TW201538892A publication Critical patent/TW201538892A/zh
Application granted granted Critical
Publication of TWI621287B publication Critical patent/TWI621287B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • H10W90/724—

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  • Led Device Packages (AREA)
TW103138242A 2013-11-07 2014-11-04 發光裝置及形成發光裝置之方法 TWI621287B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201361901072P 2013-11-07 2013-11-07
US61/901,072 2013-11-07
US201461935360P 2014-02-04 2014-02-04
US61/935,360 2014-02-04

Publications (2)

Publication Number Publication Date
TW201538892A TW201538892A (zh) 2015-10-16
TWI621287B true TWI621287B (zh) 2018-04-11

Family

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Family Applications (2)

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TW103138242A TWI621287B (zh) 2013-11-07 2014-11-04 發光裝置及形成發光裝置之方法
TW107100281A TWI648880B (zh) 2013-11-07 2014-11-04 形成發光裝置之方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW107100281A TWI648880B (zh) 2013-11-07 2014-11-04 形成發光裝置之方法

Country Status (7)

Country Link
US (1) US9899579B2 (enExample)
EP (1) EP3066698B1 (enExample)
JP (2) JP2016535937A (enExample)
KR (1) KR102304741B1 (enExample)
CN (1) CN105684174B (enExample)
TW (2) TWI621287B (enExample)
WO (1) WO2015068072A1 (enExample)

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KR102709497B1 (ko) * 2016-10-27 2024-09-26 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 반도체 소자 패키지
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CN108336075B (zh) * 2017-01-20 2020-03-27 光宝光电(常州)有限公司 发光二极管封装结构、发光二极管封装模块及其成形方法
US10020426B1 (en) * 2017-04-10 2018-07-10 Advanced Optoelectronic Technology, Inc Light emitting device
KR102454083B1 (ko) * 2017-08-30 2022-10-12 엘지디스플레이 주식회사 마이크로-led 표시장치 및 그 제조방법
CN109638137A (zh) * 2018-11-07 2019-04-16 惠州市华星光电技术有限公司 倒装led芯片及直下式背光模组
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Also Published As

Publication number Publication date
US20160260872A1 (en) 2016-09-08
EP3066698B1 (en) 2022-05-11
EP3066698A1 (en) 2016-09-14
JP2020061574A (ja) 2020-04-16
TW201538892A (zh) 2015-10-16
KR102304741B1 (ko) 2021-09-24
JP2016535937A (ja) 2016-11-17
CN105684174A (zh) 2016-06-15
KR20160083910A (ko) 2016-07-12
US9899579B2 (en) 2018-02-20
TWI648880B (zh) 2019-01-21
TW201817047A (zh) 2018-05-01
CN105684174B (zh) 2018-10-09
WO2015068072A1 (en) 2015-05-14

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