KR102304741B1 - Ｌｅｄ를 둘러싸는 내부 전반사 층을 갖는 ｌｅｄ를 위한 기판 - Google Patents

Ｌｅｄ를 둘러싸는 내부 전반사 층을 갖는 ｌｅｄ를 위한 기판 Download PDF

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Publication number
KR102304741B1
KR102304741B1 KR1020167014871A KR20167014871A KR102304741B1 KR 102304741 B1 KR102304741 B1 KR 102304741B1 KR 1020167014871 A KR1020167014871 A KR 1020167014871A KR 20167014871 A KR20167014871 A KR 20167014871A KR 102304741 B1 KR102304741 B1 KR 102304741B1
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substrate
lens
layer
led
led die
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KR20160083910A (ko
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마크 멜빈 버터워스
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루미리즈 홀딩 비.브이.
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    • H01L33/58—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H01L33/005—
    • H01L33/50—
    • H01L33/54—
    • H01L33/56—
    • H01L33/60—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means

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  • Led Device Packages (AREA)
KR1020167014871A 2013-11-07 2014-10-22 Ｌｅｄ를 둘러싸는 내부 전반사 층을 갖는 ｌｅｄ를 위한 기판 Active KR102304741B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361901072P 2013-11-07 2013-11-07
US61/901,072 2013-11-07
US201461935360P 2014-02-04 2014-02-04
US61/935,360 2014-02-04
PCT/IB2014/065525 WO2015068072A1 (en) 2013-11-07 2014-10-22 Substrate for led with total-internal reflection layer surrounding led

Publications (2)

Publication Number Publication Date
KR20160083910A KR20160083910A (ko) 2016-07-12
KR102304741B1 true KR102304741B1 (ko) 2021-09-24

Family

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KR1020167014871A Active KR102304741B1 (ko) 2013-11-07 2014-10-22 Ｌｅｄ를 둘러싸는 내부 전반사 층을 갖는 ｌｅｄ를 위한 기판

Country Status (7)

Country Link
US (1) US9899579B2 (enExample)
EP (1) EP3066698B1 (enExample)
JP (2) JP2016535937A (enExample)
KR (1) KR102304741B1 (enExample)
CN (1) CN105684174B (enExample)
TW (2) TWI621287B (enExample)
WO (1) WO2015068072A1 (enExample)

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US9508907B2 (en) * 2014-09-15 2016-11-29 Koninklijke Philips N.V. Light emitting device on a mount with a reflective layer
CN107689408B (zh) * 2016-08-04 2020-03-17 展晶科技(深圳)有限公司 发光二极管覆晶晶粒及显示器
KR102709497B1 (ko) * 2016-10-27 2024-09-26 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 반도체 소자 패키지
JP6443429B2 (ja) * 2016-11-30 2018-12-26 日亜化学工業株式会社 パッケージ及びパッケージの製造方法、発光装置及び発光装置の製造方法
CN111293199A (zh) * 2017-01-20 2020-06-16 光宝光电(常州)有限公司 发光二极管封装结构、发光二极管封装模块
US10020426B1 (en) * 2017-04-10 2018-07-10 Advanced Optoelectronic Technology, Inc Light emitting device
KR102454083B1 (ko) * 2017-08-30 2022-10-12 엘지디스플레이 주식회사 마이크로-led 표시장치 및 그 제조방법
CN109638137A (zh) * 2018-11-07 2019-04-16 惠州市华星光电技术有限公司 倒装led芯片及直下式背光模组
EP3935310A1 (en) * 2019-03-06 2022-01-12 Lumileds Holding B.V. Modular led string
US20220190213A1 (en) * 2020-12-15 2022-06-16 Lumileds Llc Material stack for leds with a dome
KR20230045840A (ko) 2021-09-29 2023-04-05 엘지디스플레이 주식회사 표시 장치
CN116344723B (zh) * 2023-05-31 2023-08-29 硅能光电半导体(广州)有限公司 一种蝙蝠翼光型led灯珠结构及其制备方法

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CN1652365A (zh) 2004-02-05 2005-08-10 西铁城电子股份有限公司 表面安装型发光二极管及其制造方法
US20060261360A1 (en) 2005-04-27 2006-11-23 Kyocera Corporation Base structure for light emitting device and light emitting device using the same
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Also Published As

Publication number Publication date
TW201817047A (zh) 2018-05-01
CN105684174A (zh) 2016-06-15
JP2020061574A (ja) 2020-04-16
US20160260872A1 (en) 2016-09-08
US9899579B2 (en) 2018-02-20
EP3066698B1 (en) 2022-05-11
TW201538892A (zh) 2015-10-16
CN105684174B (zh) 2018-10-09
EP3066698A1 (en) 2016-09-14
KR20160083910A (ko) 2016-07-12
WO2015068072A1 (en) 2015-05-14
JP2016535937A (ja) 2016-11-17
TWI648880B (zh) 2019-01-21
TWI621287B (zh) 2018-04-11

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