CN105684174B - 用于led的具有包围led的全内反射层的衬底 - Google Patents

用于led的具有包围led的全内反射层的衬底 Download PDF

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Publication number
CN105684174B
CN105684174B CN201480061133.8A CN201480061133A CN105684174B CN 105684174 B CN105684174 B CN 105684174B CN 201480061133 A CN201480061133 A CN 201480061133A CN 105684174 B CN105684174 B CN 105684174B
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layer
lens
refractive index
substrate
substrate surface
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CN201480061133.8A
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Chinese (zh)
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CN105684174A (zh
Inventor
M.M.巴特沃思
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Lumileds Holding BV
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Koninklijke Philips NV
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means

Landscapes

  • Led Device Packages (AREA)
CN201480061133.8A 2013-11-07 2014-10-22 用于led的具有包围led的全内反射层的衬底 Active CN105684174B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361901072P 2013-11-07 2013-11-07
US61/901072 2013-11-07
US201461935360P 2014-02-04 2014-02-04
US61/935360 2014-02-04
PCT/IB2014/065525 WO2015068072A1 (en) 2013-11-07 2014-10-22 Substrate for led with total-internal reflection layer surrounding led

Publications (2)

Publication Number Publication Date
CN105684174A CN105684174A (zh) 2016-06-15
CN105684174B true CN105684174B (zh) 2018-10-09

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480061133.8A Active CN105684174B (zh) 2013-11-07 2014-10-22 用于led的具有包围led的全内反射层的衬底

Country Status (7)

Country Link
US (1) US9899579B2 (enExample)
EP (1) EP3066698B1 (enExample)
JP (2) JP2016535937A (enExample)
KR (1) KR102304741B1 (enExample)
CN (1) CN105684174B (enExample)
TW (2) TWI621287B (enExample)
WO (1) WO2015068072A1 (enExample)

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US9508907B2 (en) * 2014-09-15 2016-11-29 Koninklijke Philips N.V. Light emitting device on a mount with a reflective layer
CN107689408B (zh) * 2016-08-04 2020-03-17 展晶科技(深圳)有限公司 发光二极管覆晶晶粒及显示器
KR102709497B1 (ko) * 2016-10-27 2024-09-26 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 반도체 소자 패키지
JP6443429B2 (ja) * 2016-11-30 2018-12-26 日亜化学工業株式会社 パッケージ及びパッケージの製造方法、発光装置及び発光装置の製造方法
CN111293199A (zh) * 2017-01-20 2020-06-16 光宝光电(常州)有限公司 发光二极管封装结构、发光二极管封装模块
US10020426B1 (en) * 2017-04-10 2018-07-10 Advanced Optoelectronic Technology, Inc Light emitting device
KR102454083B1 (ko) * 2017-08-30 2022-10-12 엘지디스플레이 주식회사 마이크로-led 표시장치 및 그 제조방법
CN109638137A (zh) * 2018-11-07 2019-04-16 惠州市华星光电技术有限公司 倒装led芯片及直下式背光模组
EP3935310A1 (en) * 2019-03-06 2022-01-12 Lumileds Holding B.V. Modular led string
US20220190213A1 (en) * 2020-12-15 2022-06-16 Lumileds Llc Material stack for leds with a dome
KR20230045840A (ko) 2021-09-29 2023-04-05 엘지디스플레이 주식회사 표시 장치
CN116344723B (zh) * 2023-05-31 2023-08-29 硅能光电半导体(广州)有限公司 一种蝙蝠翼光型led灯珠结构及其制备方法

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Also Published As

Publication number Publication date
TW201817047A (zh) 2018-05-01
CN105684174A (zh) 2016-06-15
JP2020061574A (ja) 2020-04-16
US20160260872A1 (en) 2016-09-08
US9899579B2 (en) 2018-02-20
EP3066698B1 (en) 2022-05-11
TW201538892A (zh) 2015-10-16
EP3066698A1 (en) 2016-09-14
KR20160083910A (ko) 2016-07-12
WO2015068072A1 (en) 2015-05-14
JP2016535937A (ja) 2016-11-17
TWI648880B (zh) 2019-01-21
KR102304741B1 (ko) 2021-09-24
TWI621287B (zh) 2018-04-11

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