CN105684174B - 用于led的具有包围led的全内反射层的衬底 - Google Patents

用于led的具有包围led的全内反射层的衬底 Download PDF

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Publication number
CN105684174B
CN105684174B CN201480061133.8A CN201480061133A CN105684174B CN 105684174 B CN105684174 B CN 105684174B CN 201480061133 A CN201480061133 A CN 201480061133A CN 105684174 B CN105684174 B CN 105684174B
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China
Prior art keywords
layer
lens
substrate surface
led
refractive index
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CN201480061133.8A
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Chinese (zh)
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CN105684174A (zh
Inventor
M.M.巴特沃思
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Lumileds Holding BV
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Koninklijke Philips NV
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Led Device Packages (AREA)
CN201480061133.8A 2013-11-07 2014-10-22 用于led的具有包围led的全内反射层的衬底 Active CN105684174B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361901072P 2013-11-07 2013-11-07
US61/901072 2013-11-07
US201461935360P 2014-02-04 2014-02-04
US61/935360 2014-02-04
PCT/IB2014/065525 WO2015068072A1 (en) 2013-11-07 2014-10-22 Substrate for led with total-internal reflection layer surrounding led

Publications (2)

Publication Number Publication Date
CN105684174A CN105684174A (zh) 2016-06-15
CN105684174B true CN105684174B (zh) 2018-10-09

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480061133.8A Active CN105684174B (zh) 2013-11-07 2014-10-22 用于led的具有包围led的全内反射层的衬底

Country Status (7)

Country Link
US (1) US9899579B2 (enExample)
EP (1) EP3066698B1 (enExample)
JP (2) JP2016535937A (enExample)
KR (1) KR102304741B1 (enExample)
CN (1) CN105684174B (enExample)
TW (2) TWI648880B (enExample)
WO (1) WO2015068072A1 (enExample)

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CN107689408B (zh) * 2016-08-04 2020-03-17 展晶科技(深圳)有限公司 发光二极管覆晶晶粒及显示器
KR102709497B1 (ko) * 2016-10-27 2024-09-26 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 반도체 소자 패키지
JP6443429B2 (ja) * 2016-11-30 2018-12-26 日亜化学工業株式会社 パッケージ及びパッケージの製造方法、発光装置及び発光装置の製造方法
CN111293199A (zh) * 2017-01-20 2020-06-16 光宝光电(常州)有限公司 发光二极管封装结构、发光二极管封装模块
US10020426B1 (en) * 2017-04-10 2018-07-10 Advanced Optoelectronic Technology, Inc Light emitting device
KR102454083B1 (ko) * 2017-08-30 2022-10-12 엘지디스플레이 주식회사 마이크로-led 표시장치 및 그 제조방법
CN109638137A (zh) * 2018-11-07 2019-04-16 惠州市华星光电技术有限公司 倒装led芯片及直下式背光模组
CN113892007B (zh) * 2019-03-06 2023-03-28 亮锐有限责任公司 模块化led串
US20220190213A1 (en) * 2020-12-15 2022-06-16 Lumileds Llc Material stack for leds with a dome
KR102921821B1 (ko) 2021-09-29 2026-02-02 엘지디스플레이 주식회사 표시 장치
CN116344723B (zh) * 2023-05-31 2023-08-29 硅能光电半导体(广州)有限公司 一种蝙蝠翼光型led灯珠结构及其制备方法

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WO2012141094A1 (ja) * 2011-04-13 2012-10-18 シャープ株式会社 光源モジュールおよびこれを備えた電子機器

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Also Published As

Publication number Publication date
EP3066698B1 (en) 2022-05-11
TWI648880B (zh) 2019-01-21
WO2015068072A1 (en) 2015-05-14
KR102304741B1 (ko) 2021-09-24
JP2020061574A (ja) 2020-04-16
JP2016535937A (ja) 2016-11-17
TWI621287B (zh) 2018-04-11
US9899579B2 (en) 2018-02-20
US20160260872A1 (en) 2016-09-08
CN105684174A (zh) 2016-06-15
TW201538892A (zh) 2015-10-16
EP3066698A1 (en) 2016-09-14
KR20160083910A (ko) 2016-07-12
TW201817047A (zh) 2018-05-01

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