TWI618222B - 使用整塊三維積體電路技術之完整系統晶片 - Google Patents

使用整塊三維積體電路技術之完整系統晶片 Download PDF

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Publication number
TWI618222B
TWI618222B TW103122569A TW103122569A TWI618222B TW I618222 B TWI618222 B TW I618222B TW 103122569 A TW103122569 A TW 103122569A TW 103122569 A TW103122569 A TW 103122569A TW I618222 B TWI618222 B TW I618222B
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Taiwan
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levels
3dic
monolithic
level
providing
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TW103122569A
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English (en)
Chinese (zh)
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TW201513299A (zh
Inventor
楊 杜
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高通公司
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D88/00—Three-dimensional [3D] integrated devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D88/00—Three-dimensional [3D] integrated devices
    • H10D88/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/297—Configurations of stacked chips characterised by the through-semiconductor vias [TSVs] in the stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Semiconductor Memories (AREA)
  • Semiconductor Integrated Circuits (AREA)
TW103122569A 2013-07-16 2014-06-30 使用整塊三維積體電路技術之完整系統晶片 TWI618222B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201361846648P 2013-07-16 2013-07-16
US61/846,648 2013-07-16
US14/013,399 2013-08-29
US14/013,399 US9418985B2 (en) 2013-07-16 2013-08-29 Complete system-on-chip (SOC) using monolithic three dimensional (3D) integrated circuit (IC) (3DIC) technology

Publications (2)

Publication Number Publication Date
TW201513299A TW201513299A (zh) 2015-04-01
TWI618222B true TWI618222B (zh) 2018-03-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW103122569A TWI618222B (zh) 2013-07-16 2014-06-30 使用整塊三維積體電路技術之完整系統晶片

Country Status (9)

Country Link
US (2) US9418985B2 (https=)
EP (1) EP3022766A1 (https=)
JP (1) JP2016529702A (https=)
KR (1) KR101832330B1 (https=)
CN (1) CN105378918B (https=)
BR (1) BR112016000868B1 (https=)
CA (1) CA2917586C (https=)
TW (1) TWI618222B (https=)
WO (1) WO2015009614A1 (https=)

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US10678985B2 (en) * 2016-08-31 2020-06-09 Arm Limited Method for generating three-dimensional integrated circuit design
US9712168B1 (en) * 2016-09-14 2017-07-18 Qualcomm Incorporated Process variation power control in three-dimensional (3D) integrated circuits (ICs) (3DICs)
US10176147B2 (en) * 2017-03-07 2019-01-08 Qualcomm Incorporated Multi-processor core three-dimensional (3D) integrated circuits (ICs) (3DICs), and related methods
US10727965B2 (en) * 2017-11-21 2020-07-28 Western Digital Technologies, Inc. System and method for time stamp synchronization
US10719100B2 (en) 2017-11-21 2020-07-21 Western Digital Technologies, Inc. System and method for time stamp synchronization
CN110069795A (zh) * 2018-01-23 2019-07-30 长芯半导体有限公司 快速定制芯片方法
GB2586049B (en) * 2019-07-31 2022-03-09 Murata Manufacturing Co Power supply output device
GB2586050B (en) * 2019-07-31 2021-11-10 Murata Manufacturing Co Power supply output device
US11270917B2 (en) * 2020-06-01 2022-03-08 Alibaba Group Holding Limited Scalable and flexible architectures for integrated circuit (IC) design and fabrication
CN112769402B (zh) * 2020-12-21 2024-05-17 中国航天科工集团八五一一研究所 基于TSV技术的X/Ku波段宽带变频组件
EP4024222A1 (en) 2021-01-04 2022-07-06 Imec VZW An integrated circuit with 3d partitioning
KR102443742B1 (ko) * 2021-02-08 2022-09-15 고려대학교 산학협력단 모놀리식 3d 집적 기술 기반 스크래치패드 메모리
US12308072B2 (en) * 2021-03-10 2025-05-20 Invention And Collaboration Laboratory Pte. Ltd. Integrated scaling and stretching platform for optimizing monolithic integration and/or heterogeneous integration in a single semiconductor die
US12230607B2 (en) * 2021-03-31 2025-02-18 Taiwan Semiconductor Manufacturing Company Limited Semiconductor device including power management die in a stack and methods of forming the same
KR102896801B1 (ko) * 2022-02-23 2025-12-05 한국과학기술원 3차원 집적형 고주파 혼성 회로 구조체 및 그의 제조 방법
KR20240033841A (ko) 2022-09-06 2024-03-13 삼성전자주식회사 반도체 장치
WO2025117577A1 (en) * 2023-12-01 2025-06-05 The Penn State Research Foundation Monolithic three-dimensional (3d) integration of two dimensional (2d) field effect transistors (fets)

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Also Published As

Publication number Publication date
EP3022766A1 (en) 2016-05-25
CN105378918A (zh) 2016-03-02
CA2917586C (en) 2019-02-12
US20150022262A1 (en) 2015-01-22
KR101832330B1 (ko) 2018-02-26
JP2016529702A (ja) 2016-09-23
WO2015009614A1 (en) 2015-01-22
CN105378918B (zh) 2018-05-04
US9418985B2 (en) 2016-08-16
TW201513299A (zh) 2015-04-01
BR112016000868A2 (https=) 2017-07-25
CA2917586A1 (en) 2015-01-22
BR112016000868B1 (pt) 2022-08-16
KR20160032182A (ko) 2016-03-23
US20160351553A1 (en) 2016-12-01
US9583473B2 (en) 2017-02-28

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