TWI614102B - 基板沉積系統、機械手臂運輸設備及用於電子裝置製造之方法 - Google Patents

基板沉積系統、機械手臂運輸設備及用於電子裝置製造之方法 Download PDF

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Publication number
TWI614102B
TWI614102B TW103109720A TW103109720A TWI614102B TW I614102 B TWI614102 B TW I614102B TW 103109720 A TW103109720 A TW 103109720A TW 103109720 A TW103109720 A TW 103109720A TW I614102 B TWI614102 B TW I614102B
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TW
Taiwan
Prior art keywords
facet
load lock
end effector
coupled
rotary
Prior art date
Application number
TW103109720A
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English (en)
Chinese (zh)
Other versions
TW201438858A (zh
Inventor
韋佛爾威廉泰勒
William Tyler Weaver
丹尼爾二世馬科尼Ｎ
Malcolm N. Daniel Jr.
渥帕特羅伯特伯內特
Robert Brent Vopat
雪勒傑森Ｍ
Jason M. Schaller
纽曼傑寇柏
Jacob Newman
卡納瓦德狄奈許
Dinesh Kanawade
康斯坦特安德魯Ｊ
Andrew J. CONSTANT
西根森史帝芬Ｃ
Stephen C. Hickerson
休根斯傑佛瑞Ｃ
Jeffrey C. Hudgens
佛里曼馬文Ｌ
Marvin L. Freeman
Original Assignee
應用材料股份有限公司
Applied Materials, Inc.
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Filing date
Publication date
Application filed by 應用材料股份有限公司, Applied Materials, Inc. filed Critical 應用材料股份有限公司
Publication of TW201438858A publication Critical patent/TW201438858A/zh
Application granted granted Critical
Publication of TWI614102B publication Critical patent/TWI614102B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/16—Program controls
    • B25J9/1679—Program controls characterised by the tasks executed
    • B25J9/1682—Dual arm manipulator; Coordination of several manipulators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B25J9/043—Cylindrical coordinate type comprising an articulated arm double selective compliance articulated robot arms [SCARA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S901/00—Robots
    • Y10S901/27—Arm part
    • Y10S901/28—Joint
    • Y10S901/29—Wrist
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00—Machine element or mechanism
    • Y10T74/20—Control lever and linkage systems
    • Y10T74/20207—Multiple controlling elements for single controlled element
    • Y10T74/20305—Robotic arm

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
TW103109720A 2013-03-15 2014-03-14 基板沉積系統、機械手臂運輸設備及用於電子裝置製造之方法 TWI614102B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201361787117P 2013-03-15 2013-03-15
US61/787,117 2013-03-15
US201361868795P 2013-08-22 2013-08-22
US61/868,795 2013-08-22
US201361879076P 2013-09-17 2013-09-17
US61/879,076 2013-09-17

Publications (2)

Publication Number Publication Date
TW201438858A TW201438858A (zh) 2014-10-16
TWI614102B true TWI614102B (zh) 2018-02-11

Family

ID=51527659

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103109720A TWI614102B (zh) 2013-03-15 2014-03-14 基板沉積系統、機械手臂運輸設備及用於電子裝置製造之方法

Country Status (6)

Country Link
US (2) US10427303B2 (enExample)
JP (1) JP6703937B2 (enExample)
KR (2) KR102214394B1 (enExample)
CN (2) CN105164799B (enExample)
TW (1) TWI614102B (enExample)
WO (1) WO2014143662A1 (enExample)

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WO2014143662A1 (en) 2014-09-18
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US20190375105A1 (en) 2019-12-12
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