KR102214394B1 - 기판 증착 시스템, 로봇 이송 장치, 및 전자 디바이스 제조 방법 - Google Patents

기판 증착 시스템, 로봇 이송 장치, 및 전자 디바이스 제조 방법 Download PDF

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KR102214394B1
KR102214394B1 KR1020157028049A KR20157028049A KR102214394B1 KR 102214394 B1 KR102214394 B1 KR 102214394B1 KR 1020157028049 A KR1020157028049 A KR 1020157028049A KR 20157028049 A KR20157028049 A KR 20157028049A KR 102214394 B1 KR102214394 B1 KR 102214394B1
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end effector
coupled
facet
upper arm
height
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KR20150131117A (ko
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윌리엄 티. 위버
말콤 엔. 주니어 다니엘
로버트 비. 보팻
제이슨 엠. 샬러
제이콥 뉴맨
디네쉬 카나와데
앤드류 제이. 콘스탄트
스티븐 씨. 히커슨
제프리 씨. 허진스
마빈 엘. 프리맨
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어플라이드 머티어리얼스, 인코포레이티드
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B25J9/043—Cylindrical coordinate type comprising an articulated arm double selective compliance articulated robot arms [SCARA]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1679—Programme controls characterised by the tasks executed
    • B25J9/1682—Dual arm manipulator; Coordination of several manipulators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S901/00—Robots
    • Y10S901/27—Arm part
    • Y10S901/28—Joint
    • Y10S901/29—Wrist
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00—Machine element or mechanism
    • Y10T74/20—Control lever and linkage systems
    • Y10T74/20207—Multiple controlling elements for single controlled element
    • Y10T74/20305—Robotic arm

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
KR1020157028049A 2013-03-15 2014-03-14 기판 증착 시스템, 로봇 이송 장치, 및 전자 디바이스 제조 방법 Active KR102214394B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201361787117P 2013-03-15 2013-03-15
US61/787,117 2013-03-15
US201361868795P 2013-08-22 2013-08-22
US61/868,795 2013-08-22
US201361879076P 2013-09-17 2013-09-17
US61/879,076 2013-09-17
PCT/US2014/027567 WO2014143662A1 (en) 2013-03-15 2014-03-14 Substrate deposition systems, robot transfer apparatus, and methods for electronic device manufacturing

Related Child Applications (1)

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KR1020217003363A Division KR20210014778A (ko) 2013-03-15 2014-03-14 기판 증착 시스템, 로봇 이송 장치, 및 전자 디바이스 제조 방법

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Publication Number Publication Date
KR20150131117A KR20150131117A (ko) 2015-11-24
KR102214394B1 true KR102214394B1 (ko) 2021-02-08

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KR1020217003363A Ceased KR20210014778A (ko) 2013-03-15 2014-03-14 기판 증착 시스템, 로봇 이송 장치, 및 전자 디바이스 제조 방법

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US (2) US10427303B2 (enExample)
JP (1) JP6703937B2 (enExample)
KR (2) KR102214394B1 (enExample)
CN (2) CN111489987A (enExample)
TW (1) TWI614102B (enExample)
WO (1) WO2014143662A1 (enExample)

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010080983A2 (en) 2009-01-11 2010-07-15 Applied Materials, Inc. Robot systems, apparatus and methods for transporting substrates in electronic device manufacturing
KR102153608B1 (ko) * 2012-07-05 2020-09-08 어플라이드 머티어리얼스, 인코포레이티드 전자 디바이스 제조 시스템들에서 기판들을 운송하기 위한 붐 구동 장치, 멀티-아암 로봇 장치, 전자 디바이스 프로세싱 시스템들, 및 방법들
US9190306B2 (en) * 2012-11-30 2015-11-17 Lam Research Corporation Dual arm vacuum robot
CN103192384B (zh) * 2013-03-11 2015-08-19 上海交通大学 一种集成旋转变压器的静态真空轴系装置
US9378994B2 (en) 2013-03-15 2016-06-28 Applied Materials, Inc. Multi-position batch load lock apparatus and systems and methods including same
KR101686032B1 (ko) * 2013-03-28 2016-12-13 가부시키가이샤 히다치 고쿠사이 덴키 기판 처리 장치, 반도체 장치의 제조 방법 및 기록 매체
KR102161685B1 (ko) 2013-09-26 2020-10-05 어플라이드 머티어리얼스, 인코포레이티드 기판 프로세싱을 위한 혼합형-플랫폼 장치, 시스템들, 및 방법들
WO2015103089A1 (en) 2014-01-05 2015-07-09 Applied Materials, Inc Robot apparatus, drive assemblies, and methods for transporting substrates in electronic device manufacturing
JP6705750B2 (ja) * 2014-01-28 2020-06-03 ブルックス オートメーション インコーポレイテッド 基板搬送装置
KR20170084240A (ko) * 2014-11-14 2017-07-19 마퍼 리쏘그라피 아이피 비.브이. 리소그래피 시스템에서 기판을 이송하기 위한 로드 로크 시스템 및 방법
CN107534000B (zh) * 2015-04-20 2021-12-17 应用材料公司 缓冲腔室晶片加热机构和支撑机械臂
US9799544B2 (en) 2015-10-23 2017-10-24 Applied Materials, Inc. Robot assemblies, substrate processing apparatus, and methods for transporting substrates in electronic device manufacturing
CN105702607B (zh) * 2016-03-17 2018-09-25 东方晶源微电子科技（北京）有限公司 机械臂和检查系统
TWI724971B (zh) 2016-06-28 2021-04-11 美商應用材料股份有限公司 包括間隔上臂與交錯腕部的雙機器人以及包括該者之系統及方法
US10099377B2 (en) 2016-06-29 2018-10-16 Applied Materials, Inc. Methods and systems providing misalignment correction in robots
US11270904B2 (en) * 2016-07-12 2022-03-08 Brooks Automation Us, Llc Substrate processing apparatus
US10186449B2 (en) 2016-12-31 2019-01-22 Applied Materials, Inc. Apparatus and methods for wafer rotation to improve spatial ALD process uniformity
TWI813479B (zh) * 2017-02-07 2023-08-21 美商布魯克斯自動機械美國公司 基材運送方法及設備
KR102373081B1 (ko) * 2017-02-15 2022-03-11 퍼시몬 테크놀로지스 코포레이션 다수의 엔드-이펙터들을 가진 재료-핸들링 로봇
US10224224B2 (en) 2017-03-10 2019-03-05 Micromaterials, LLC High pressure wafer processing systems and related methods
JP6881010B2 (ja) * 2017-05-11 2021-06-02 東京エレクトロン株式会社 真空処理装置
US10622214B2 (en) 2017-05-25 2020-04-14 Applied Materials, Inc. Tungsten defluorination by high pressure treatment
US10361099B2 (en) * 2017-06-23 2019-07-23 Applied Materials, Inc. Systems and methods of gap calibration via direct component contact in electronic device manufacturing systems
US10276411B2 (en) 2017-08-18 2019-04-30 Applied Materials, Inc. High pressure and high temperature anneal chamber
JP6947914B2 (ja) 2017-08-18 2021-10-13 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 高圧高温下のアニールチャンバ
US11177128B2 (en) 2017-09-12 2021-11-16 Applied Materials, Inc. Apparatus and methods for manufacturing semiconductor structures using protective barrier layer
US10453725B2 (en) 2017-09-19 2019-10-22 Applied Materials, Inc. Dual-blade robot including vertically offset horizontally overlapping frog-leg linkages and systems and methods including same
CN111357090B (zh) 2017-11-11 2024-01-05 微材料有限责任公司 用于高压处理腔室的气体输送系统
JP7330181B2 (ja) 2017-11-16 2023-08-21 アプライド マテリアルズ インコーポレイテッド 高圧蒸気アニール処理装置
KR20200075892A (ko) 2017-11-17 2020-06-26 어플라이드 머티어리얼스, 인코포레이티드 고압 처리 시스템을 위한 컨덴서 시스템
CN111902929B (zh) 2018-03-09 2025-09-19 应用材料公司 用于含金属材料的高压退火处理
US10950429B2 (en) 2018-05-08 2021-03-16 Applied Materials, Inc. Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom
US10943805B2 (en) 2018-05-18 2021-03-09 Applied Materials, Inc. Multi-blade robot apparatus, electronic device manufacturing apparatus, and methods adapted to transport multiple substrates in electronic device manufacturing
TWI680532B (zh) * 2018-07-04 2019-12-21 環球晶圓股份有限公司 製程設備及其晶圓承載盤
US10748783B2 (en) 2018-07-25 2020-08-18 Applied Materials, Inc. Gas delivery module
US10675581B2 (en) 2018-08-06 2020-06-09 Applied Materials, Inc. Gas abatement apparatus
JP7183635B2 (ja) * 2018-08-31 2022-12-06 東京エレクトロン株式会社 基板搬送機構、基板処理装置及び基板搬送方法
KR102531483B1 (ko) * 2018-10-04 2023-05-10 어플라이드 머티어리얼스, 인코포레이티드 이송 시스템
WO2020117462A1 (en) 2018-12-07 2020-06-11 Applied Materials, Inc. Semiconductor processing system
US10998209B2 (en) 2019-05-31 2021-05-04 Applied Materials, Inc. Substrate processing platforms including multiple processing chambers
US11850742B2 (en) 2019-06-07 2023-12-26 Applied Materials, Inc. Dual robot including splayed end effectors and systems and methods including same
CN110255156A (zh) * 2019-06-29 2019-09-20 苏州精濑光电有限公司 一种中转装置
KR102240925B1 (ko) * 2019-07-17 2021-04-15 세메스 주식회사 기판 처리 설비 및 기판 반송 장치
TWI797461B (zh) * 2019-07-26 2023-04-01 日商新川股份有限公司 封裝裝置
CN112582318B (zh) * 2019-09-30 2025-07-25 沈阳芯源微电子设备股份有限公司 涂胶显影设备
CN114450439A (zh) * 2019-10-03 2022-05-06 洛佩诗公司 具有存储室的处理装置和外延反应器
US11901222B2 (en) 2020-02-17 2024-02-13 Applied Materials, Inc. Multi-step process for flowable gap-fill film
US11557496B2 (en) * 2020-03-23 2023-01-17 Applied Materials, Inc. Load lock with integrated features
CN113829377B (zh) * 2020-06-24 2023-08-18 拓荆科技股份有限公司 一种衬底的装载和拾取装置及衬底的装载和拾取方法
US12080571B2 (en) 2020-07-08 2024-09-03 Applied Materials, Inc. Substrate processing module and method of moving a workpiece
US11749542B2 (en) 2020-07-27 2023-09-05 Applied Materials, Inc. Apparatus, system, and method for non-contact temperature monitoring of substrate supports
US11817331B2 (en) 2020-07-27 2023-11-14 Applied Materials, Inc. Substrate holder replacement with protective disk during pasting process
US11600507B2 (en) 2020-09-09 2023-03-07 Applied Materials, Inc. Pedestal assembly for a substrate processing chamber
US11610799B2 (en) 2020-09-18 2023-03-21 Applied Materials, Inc. Electrostatic chuck having a heating and chucking capabilities
CN112249685B (zh) * 2020-10-27 2022-04-01 光驰科技(上海)有限公司 进行基板快速交互搬送的机构及其搬送方法
US11996307B2 (en) * 2020-12-23 2024-05-28 Applied Materials, Inc. Semiconductor processing tool platform configuration with reduced footprint
US12195314B2 (en) 2021-02-02 2025-01-14 Applied Materials, Inc. Cathode exchange mechanism to improve preventative maintenance time for cluster system
US11674227B2 (en) 2021-02-03 2023-06-13 Applied Materials, Inc. Symmetric pump down mini-volume with laminar flow cavity gas injection for high and low pressure
US11358809B1 (en) * 2021-03-01 2022-06-14 Applied Materials, Inc. Vacuum robot apparatus for variable pitch access
US12002668B2 (en) 2021-06-25 2024-06-04 Applied Materials, Inc. Thermal management hardware for uniform temperature control for enhanced bake-out for cluster tool
WO2023129142A1 (en) * 2021-12-28 2023-07-06 Applied Materials, Inc. Electronic device manufacturing systems having paired deposition chambers for enhanced deposition uniformity
KR102431679B1 (ko) * 2022-02-15 2022-08-12 (주) 티로보틱스 진공 챔버에서 기판을 이송하기 위한 기판 이송 로봇
KR102431664B1 (ko) * 2022-02-15 2022-08-12 (주) 티로보틱스 진공 챔버에서 기판을 이송하기 위한 기판 이송 로봇
WO2025006647A2 (en) * 2023-06-29 2025-01-02 Kabushiki Kaisha Yaskawa Denki Apparatus and method for optimizing swap time
CN119725151A (zh) * 2023-09-28 2025-03-28 Asm Ip私人控股有限公司 衬底搬运室前体及制造衬底搬运室的方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004080053A (ja) * 2003-11-07 2004-03-11 Hitachi Kokusai Electric Inc 半導体製造装置
JP2004282002A (ja) * 2003-02-27 2004-10-07 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP2005032942A (ja) 2003-07-11 2005-02-03 Daihen Corp ２アーム式搬送ロボット
JP2011077399A (ja) * 2009-09-30 2011-04-14 Tokyo Electron Ltd 被処理体の搬送方法及び被処理体処理装置
JP2011222825A (ja) 2010-04-12 2011-11-04 Tokyo Electron Ltd 被処理体処理装置
US20120232690A1 (en) 2011-03-11 2012-09-13 Brooks Automation, Inc. Substrate processing apparatus
JP2013042112A (ja) * 2011-07-15 2013-02-28 Tokyo Electron Ltd 基板搬送装置、基板処理システムおよび基板搬送方法、ならびに記憶媒体

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5447409A (en) 1989-10-20 1995-09-05 Applied Materials, Inc. Robot assembly
US20040005211A1 (en) 1996-02-28 2004-01-08 Lowrance Robert B. Multiple independent robot assembly and apparatus and control system for processing and transferring semiconductor wafers
US5789878A (en) 1996-07-15 1998-08-04 Applied Materials, Inc. Dual plane robot
US6722834B1 (en) 1997-10-08 2004-04-20 Applied Materials, Inc. Robot blade with dual offset wafer supports
US6267549B1 (en) 1998-06-02 2001-07-31 Applied Materials, Inc. Dual independent robot blades with minimal offset
US6379095B1 (en) 2000-04-14 2002-04-30 Applied Materials, Inc. Robot for handling semiconductor wafers
US6582175B2 (en) 2000-04-14 2003-06-24 Applied Materials, Inc. Robot for handling semiconductor wafers
JP2002158272A (ja) * 2000-11-17 2002-05-31 Tatsumo Kk ダブルアーム基板搬送装置
US20020098072A1 (en) * 2001-01-19 2002-07-25 Applied Materials, Inc. Dual bladed robot apparatus and associated method
US7891935B2 (en) * 2002-05-09 2011-02-22 Brooks Automation, Inc. Dual arm robot
WO2005123565A2 (en) * 2004-06-09 2005-12-29 Brooks Automation, Inc. Dual sacra arm
CN1942288B (zh) 2005-02-12 2010-12-22 应用材料公司 一种多轴真空电机组件
US20060231388A1 (en) * 2005-04-14 2006-10-19 Ravi Mullapudi Multi-station sputtering and cleaning system
TWI342597B (en) * 2005-11-21 2011-05-21 Applied Materials Inc Methods and apparatus for transferring substrates during electronic device manufacturing
KR20080004118A (ko) 2006-07-04 2008-01-09 피에스케이 주식회사 기판 처리 설비
JP5185932B2 (ja) 2006-08-11 2013-04-17 アプライド マテリアルズ インコーポレイテッド ロボット・リスト・アセンブリの為の方法および装置
CN103862463B (zh) 2007-05-31 2017-08-15 应用材料公司 延伸双scara机械手连接装置的伸出距离的方法及设备
KR100850436B1 (ko) 2007-06-20 2008-08-05 주식회사 싸이맥스 반도체 제조설비
US20090194026A1 (en) 2008-01-31 2009-08-06 Burrows Brian H Processing system for fabricating compound nitride semiconductor devices
US8264187B2 (en) 2009-01-11 2012-09-11 Applied Materials, Inc. Systems, apparatus and methods for making an electrical connection
WO2010080983A2 (en) * 2009-01-11 2010-07-15 Applied Materials, Inc. Robot systems, apparatus and methods for transporting substrates in electronic device manufacturing
US8777547B2 (en) 2009-01-11 2014-07-15 Applied Materials, Inc. Systems, apparatus and methods for transporting substrates
TWI394224B (zh) * 2009-02-24 2013-04-21 Intevac Inc 載送及處理基板之裝置與方法
JP5314765B2 (ja) 2009-11-09 2013-10-16 東京エレクトロン株式会社 基板処理装置及び基板処理装置の制御方法
CN103476551B (zh) * 2010-11-10 2016-08-10 布鲁克斯自动化公司 双臂机器人
JP2011139074A (ja) * 2011-01-07 2011-07-14 Applied Materials Inc 基板の破損及び移動中の基板のずれを動的に検出するセンサ
US9076829B2 (en) 2011-08-08 2015-07-07 Applied Materials, Inc. Robot systems, apparatus, and methods adapted to transport substrates in electronic device manufacturing
US9076830B2 (en) 2011-11-03 2015-07-07 Applied Materials, Inc. Robot systems and apparatus adapted to transport dual substrates in electronic device manufacturing with wrist drive motors mounted to upper arm
US9202733B2 (en) * 2011-11-07 2015-12-01 Persimmon Technologies Corporation Robot system with independent arms
WO2013090181A1 (en) 2011-12-12 2013-06-20 Applied Materials, Inc Fully-independent robot systems, apparatus, and methods adapted to transport multiple substrates in electronic device manufacturing
WO2013090898A1 (en) * 2011-12-16 2013-06-20 Brooks Automation, Inc. Transport apparatus
TWI629743B (zh) * 2012-02-10 2018-07-11 布魯克斯自動機械公司 基材處理設備
KR102153608B1 (ko) 2012-07-05 2020-09-08 어플라이드 머티어리얼스, 인코포레이티드 전자 디바이스 제조 시스템들에서 기판들을 운송하기 위한 붐 구동 장치, 멀티-아암 로봇 장치, 전자 디바이스 프로세싱 시스템들, 및 방법들
US9190306B2 (en) * 2012-11-30 2015-11-17 Lam Research Corporation Dual arm vacuum robot
US9325228B2 (en) * 2012-11-30 2016-04-26 Applied Materials, Inc. Multi-axis robot apparatus with unequal length forearms, electronic device manufacturing systems, and methods for transporting substrates in electronic device manufacturing
US9281222B2 (en) * 2013-03-15 2016-03-08 Applied Materials, Inc. Wafer handling systems and methods
US9245783B2 (en) 2013-05-24 2016-01-26 Novellus Systems, Inc. Vacuum robot with linear translation carriage
US10157763B2 (en) * 2013-08-29 2018-12-18 Varian Semiconductor Equipment Associates, Inc. High throughput substrate handling endstation and sequence

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004282002A (ja) * 2003-02-27 2004-10-07 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP2005032942A (ja) 2003-07-11 2005-02-03 Daihen Corp ２アーム式搬送ロボット
JP2004080053A (ja) * 2003-11-07 2004-03-11 Hitachi Kokusai Electric Inc 半導体製造装置
JP2011077399A (ja) * 2009-09-30 2011-04-14 Tokyo Electron Ltd 被処理体の搬送方法及び被処理体処理装置
JP2011222825A (ja) 2010-04-12 2011-11-04 Tokyo Electron Ltd 被処理体処理装置
US20120232690A1 (en) 2011-03-11 2012-09-13 Brooks Automation, Inc. Substrate processing apparatus
JP2013042112A (ja) * 2011-07-15 2013-02-28 Tokyo Electron Ltd 基板搬送装置、基板処理システムおよび基板搬送方法、ならびに記憶媒体

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