TWI601202B - Substrate processing apparatus and processing method - Google Patents

Substrate processing apparatus and processing method Download PDF

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Publication number
TWI601202B
TWI601202B TW104113076A TW104113076A TWI601202B TW I601202 B TWI601202 B TW I601202B TW 104113076 A TW104113076 A TW 104113076A TW 104113076 A TW104113076 A TW 104113076A TW I601202 B TWI601202 B TW I601202B
Authority
TW
Taiwan
Prior art keywords
semiconductor wafer
etching
substrate
thickness
processing
Prior art date
Application number
TW104113076A
Other languages
English (en)
Chinese (zh)
Other versions
TW201535506A (zh
Inventor
林航之介
松井繪美
大田垣崇
檜森洋輔
Original Assignee
芝浦機械電子裝置股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 芝浦機械電子裝置股份有限公司 filed Critical 芝浦機械電子裝置股份有限公司
Publication of TW201535506A publication Critical patent/TW201535506A/zh
Application granted granted Critical
Publication of TWI601202B publication Critical patent/TWI601202B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/282—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials
    • H10P50/283—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/60—Wet etching
    • H10P50/66—Wet etching of conductive or resistive materials
    • H10P50/663—Wet etching of conductive or resistive materials by chemical means only
    • H10P50/667—Wet etching of conductive or resistive materials by chemical means only by liquid etching only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW104113076A 2011-12-27 2012-12-22 Substrate processing apparatus and processing method TWI601202B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011285877 2011-12-27
JP2012263347A JP6091193B2 (ja) 2011-12-27 2012-11-30 基板の処理装置及び処理方法

Publications (2)

Publication Number Publication Date
TW201535506A TW201535506A (zh) 2015-09-16
TWI601202B true TWI601202B (zh) 2017-10-01

Family

ID=49049249

Family Applications (2)

Application Number Title Priority Date Filing Date
TW104113076A TWI601202B (zh) 2011-12-27 2012-12-22 Substrate processing apparatus and processing method
TW101149312A TWI494992B (zh) 2011-12-27 2012-12-22 Substrate processing device and processing method thereof

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW101149312A TWI494992B (zh) 2011-12-27 2012-12-22 Substrate processing device and processing method thereof

Country Status (4)

Country Link
JP (2) JP6091193B2 (https=)
KR (1) KR101432009B1 (https=)
CN (1) CN105070673A (https=)
TW (2) TWI601202B (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6289961B2 (ja) * 2014-03-27 2018-03-07 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
KR20160045299A (ko) * 2014-10-17 2016-04-27 도쿄엘렉트론가부시키가이샤 기판 처리 장치, 연계 처리 시스템 및 기판 처리 방법
KR101680214B1 (ko) * 2015-01-22 2016-11-28 주식회사 엘지실트론 웨이퍼 이송 장치
DE102017212887A1 (de) 2017-07-26 2019-01-31 Gebr. Schmid Gmbh Verfahren, Vorrichtung und Anlage zur Leiterplattenherstellung
JP7130524B2 (ja) * 2018-10-26 2022-09-05 東京エレクトロン株式会社 基板処理装置の制御装置および基板処理装置の制御方法
JP7273660B2 (ja) 2019-08-30 2023-05-15 キオクシア株式会社 半導体製造装置、および半導体装置の製造方法
JP7544625B2 (ja) * 2021-03-04 2024-09-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、及び基板処理方法
CN117448748B (zh) * 2023-11-02 2025-10-03 浙江众凌科技有限公司 一种用于掩膜版生产用的喷压设备及其生产工艺

Citations (3)

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JPH09223680A (ja) * 1996-02-16 1997-08-26 Disco Abrasive Syst Ltd エッチング機能付き研磨装置
TW200603705A (en) * 2004-04-23 2006-01-16 Matsushita Electric Works Ltd Wiring board and method for producing the same
TWI286817B (en) * 2004-01-30 2007-09-11 Lam Res Corp Stress free etch processing in combination with a dynamic liquid meniscus

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JPS63256342A (ja) * 1987-04-10 1988-10-24 Sumitomo Electric Ind Ltd 半導体ウエ−ハの研削方法
JPH03265586A (ja) * 1990-03-15 1991-11-26 Toshiba Corp 窒化アルミニウム基板の製造方法
JP3748527B2 (ja) * 2001-09-26 2006-02-22 大日本スクリーン製造株式会社 エッチング装置およびエッチング方法
JP2003203897A (ja) * 2002-01-08 2003-07-18 Toshiba Corp ノズル、基板処理装置、基板処理方法、及び基板処理プログラム
JP4192482B2 (ja) * 2002-03-22 2008-12-10 株式会社Ｓｕｍｃｏ シリコンウェーハの製造方法
KR100452918B1 (ko) * 2002-04-12 2004-10-14 한국디엔에스 주식회사 두께측정시스템이 구비된 회전식각장치
JP2005262406A (ja) * 2004-03-19 2005-09-29 Toshiba Corp 研磨装置および半導体装置の製造方法
JP3638020B1 (ja) * 2004-09-17 2005-04-13 孝昭 鈴木 ウエハの薄厚化方法、及びウエハの薄厚化装置
CN1632165A (zh) * 2004-12-28 2005-06-29 北京科技大学 一种在硬质合金工具上制备金刚石涂层的方法
JP2008166576A (ja) * 2006-12-28 2008-07-17 Rohm Co Ltd 半導体装置の製造方法
JP4937674B2 (ja) * 2006-08-16 2012-05-23 株式会社ディスコ ウエーハのエッチング方法
JP2009224511A (ja) * 2008-03-14 2009-10-01 Fuji Electric Device Technology Co Ltd 半導体装置の製造方法
JP5422907B2 (ja) * 2008-04-11 2014-02-19 富士電機株式会社 半導体装置の製造方法
JP5012632B2 (ja) * 2008-04-15 2012-08-29 富士電機株式会社 半導体装置の製造方法
JP2010040543A (ja) * 2008-07-31 2010-02-18 Sumco Corp 半導体ウェーハの加工装置
JP2010171330A (ja) * 2009-01-26 2010-08-05 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 エピタキシャルウェハの製造方法、欠陥除去方法およびエピタキシャルウェハ
JP2011086654A (ja) * 2009-10-13 2011-04-28 Seiko Epson Corp 基板の加工方法及び基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09223680A (ja) * 1996-02-16 1997-08-26 Disco Abrasive Syst Ltd エッチング機能付き研磨装置
TWI286817B (en) * 2004-01-30 2007-09-11 Lam Res Corp Stress free etch processing in combination with a dynamic liquid meniscus
TW200603705A (en) * 2004-04-23 2006-01-16 Matsushita Electric Works Ltd Wiring board and method for producing the same

Also Published As

Publication number Publication date
JP6091193B2 (ja) 2017-03-08
KR101432009B1 (ko) 2014-08-20
CN105070673A (zh) 2015-11-18
KR20140024948A (ko) 2014-03-03
JP6321234B2 (ja) 2018-05-09
TW201535506A (zh) 2015-09-16
JP2013153141A (ja) 2013-08-08
TW201334055A (zh) 2013-08-16
TWI494992B (zh) 2015-08-01
JP2017085174A (ja) 2017-05-18

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