TWI593755B - Polymerizable composition and hardened | cured material - Google Patents

Polymerizable composition and hardened | cured material Download PDF

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Publication number
TWI593755B
TWI593755B TW102137112A TW102137112A TWI593755B TW I593755 B TWI593755 B TW I593755B TW 102137112 A TW102137112 A TW 102137112A TW 102137112 A TW102137112 A TW 102137112A TW I593755 B TWI593755 B TW I593755B
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TW
Taiwan
Prior art keywords
acid
compound
polymerizable composition
mass
component
Prior art date
Application number
TW102137112A
Other languages
English (en)
Chinese (zh)
Other versions
TW201425475A (zh
Inventor
Hitoshi Okazaki
Kousuke NAMIKI
Motoharu Takeuchi
Original Assignee
Mitsubishi Gas Chemical Co
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Publication date
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Publication of TW201425475A publication Critical patent/TW201425475A/zh
Application granted granted Critical
Publication of TWI593755B publication Critical patent/TWI593755B/zh

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02Polythioethers
    • C08G75/04Polythioethers from mercapto compounds or metallic derivatives thereof
    • C08G75/045Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/12Polythioether-ethers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/09Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/092Polycarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/36Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41Compounds containing sulfur bound to oxygen
    • C08K5/42Sulfonic acids; Derivatives thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/36Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/43Compounds containing sulfur bound to nitrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • C08K5/51Phosphorus bound to oxygen
    • C08K5/53Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5313Phosphinic compounds, e.g. R2=P(:O)OR'
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • C08K5/51Phosphorus bound to oxygen
    • C08K5/53Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5317Phosphonic compounds, e.g. R—P(:O)(OR')2
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J181/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon only; Adhesives based on polysulfones; Adhesives based on derivatives of such polymers
    • C09J181/02Polythioethers; Polythioether-ethers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/36Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37Thiols

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polymerisation Methods In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW102137112A 2012-10-18 2013-10-15 Polymerizable composition and hardened | cured material TWI593755B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012230603 2012-10-18

Publications (2)

Publication Number Publication Date
TW201425475A TW201425475A (zh) 2014-07-01
TWI593755B true TWI593755B (zh) 2017-08-01

Family

ID=50488248

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102137112A TWI593755B (zh) 2012-10-18 2013-10-15 Polymerizable composition and hardened | cured material

Country Status (7)

Country Link
US (1) US9376603B2 (de)
EP (1) EP2910592B1 (de)
JP (1) JP6191615B2 (de)
KR (1) KR102102330B1 (de)
CN (1) CN104736603B (de)
TW (1) TWI593755B (de)
WO (1) WO2014061687A1 (de)

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US20150344698A1 (en) * 2014-06-03 2015-12-03 Corning Incorporated Adhesion primer for glass and ceramics
CN104893650A (zh) * 2015-05-28 2015-09-09 南京先声合成材料有限公司 一种无色无味的防水胶
TWI694125B (zh) * 2015-06-05 2020-05-21 日商三菱瓦斯化學股份有限公司 硬化性組成物及使用其之光學用接著劑
EP3147965B1 (de) * 2015-09-25 2018-11-21 Samsung Electronics Co., Ltd. Kompositmembran, verfahren zu deren herstellung, kompositmembran enthaltende negative elektrodenstruktur, und negative elektrodenstruktur enthaltende lithium sekundärbatterie
CN108473861A (zh) * 2015-12-31 2018-08-31 3M创新有限公司 可固化量子点组合物和制品
US11015114B2 (en) 2015-12-31 2021-05-25 3M Innovative Properties Company Article comprising particles with quantum dots
US10731008B2 (en) * 2016-03-07 2020-08-04 Dow Toray Co., Ltd. Photocurable silicone composition and cured product thereof
KR102024613B1 (ko) * 2016-03-07 2019-09-24 쇼와 덴코 가부시키가이샤 활성 에너지선 경화성 조성물 및 그 경화물
JP2018165354A (ja) * 2016-12-01 2018-10-25 三洋化成工業株式会社 硬化性組成物及び硬化膜
JP7013649B2 (ja) * 2017-01-27 2022-02-01 昭和電工マテリアルズ株式会社 接着剤組成物、フィルム状接着剤、接続構造体及びその製造方法
KR101902974B1 (ko) * 2017-03-31 2018-10-02 에스케이씨 주식회사 폴리티올 화합물의 탈수 방법
JP7061865B2 (ja) * 2017-07-07 2022-05-02 三井化学株式会社 光硬化性樹脂組成物、表示素子用封止剤、有機el素子用面封止剤、および面封止層
GB2575793A (en) 2018-07-20 2020-01-29 Montanuniv Leoben Resin composition suitable for printing and printing methods
CN111837061B (zh) * 2018-11-12 2022-05-27 日东电工株式会社 偏振膜、层叠偏振膜、图像显示面板、以及图像显示装置
CN111819259B (zh) * 2018-11-12 2021-03-16 日东电工株式会社 偏振膜、层叠偏振膜、图像显示面板、以及图像显示装置
KR20240097823A (ko) * 2021-11-12 2024-06-27 가부시끼가이샤 쓰리본드 광경화성 조성물
WO2024095924A1 (ja) * 2022-11-04 2024-05-10 株式会社スリーボンド 爪または人工爪用光硬化性組成物

Citations (5)

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US5270439A (en) * 1988-10-20 1993-12-14 Sumitomo Seika Chemicals Co., Ltd. Method of producing a curable composition containing 4,4'-bis(methacryloylthio)diphenylsulfide
CN1317515A (zh) * 2000-03-27 2001-10-17 三井化学株式会社 多硫醇、可聚合组合物、树脂和镜片以及制备硫醇化合物的方法
CN101675082A (zh) * 2007-03-16 2010-03-17 三菱瓦斯化学株式会社 光学材料用树脂组合物和由该树脂组合物获得的光学材料
CN102040929A (zh) * 2009-10-16 2011-05-04 琳得科株式会社 粘合剂组合物、粘合剂及光学膜
TWI521035B (zh) * 2011-04-28 2016-02-11 Mitsubishi Gas Chemical Co A hardening composition and an optical follower

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US5270439A (en) * 1988-10-20 1993-12-14 Sumitomo Seika Chemicals Co., Ltd. Method of producing a curable composition containing 4,4'-bis(methacryloylthio)diphenylsulfide
CN1317515A (zh) * 2000-03-27 2001-10-17 三井化学株式会社 多硫醇、可聚合组合物、树脂和镜片以及制备硫醇化合物的方法
CN101675082A (zh) * 2007-03-16 2010-03-17 三菱瓦斯化学株式会社 光学材料用树脂组合物和由该树脂组合物获得的光学材料
CN102040929A (zh) * 2009-10-16 2011-05-04 琳得科株式会社 粘合剂组合物、粘合剂及光学膜
TWI521035B (zh) * 2011-04-28 2016-02-11 Mitsubishi Gas Chemical Co A hardening composition and an optical follower

Also Published As

Publication number Publication date
JP6191615B2 (ja) 2017-09-06
JPWO2014061687A1 (ja) 2016-09-05
CN104736603A (zh) 2015-06-24
KR20150070090A (ko) 2015-06-24
WO2014061687A1 (ja) 2014-04-24
EP2910592A1 (de) 2015-08-26
US20150252234A1 (en) 2015-09-10
CN104736603B (zh) 2017-03-15
KR102102330B1 (ko) 2020-04-20
EP2910592B1 (de) 2018-09-05
EP2910592A4 (de) 2016-05-25
US9376603B2 (en) 2016-06-28
TW201425475A (zh) 2014-07-01

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