CN104736603B - 聚合性组合物和固化物 - Google Patents

聚合性组合物和固化物 Download PDF

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Publication number
CN104736603B
CN104736603B CN201380054158.0A CN201380054158A CN104736603B CN 104736603 B CN104736603 B CN 104736603B CN 201380054158 A CN201380054158 A CN 201380054158A CN 104736603 B CN104736603 B CN 104736603B
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polymerizable composition
acid
compound
mass parts
compositions
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Chinese (zh)
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CN104736603A (zh
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冈崎仁
并木康佑
竹内基晴
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Mitsubishi Gas Chemical Co Inc
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Mitsubishi Gas Chemical Co Inc
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
    • C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/12—Polythioether-ethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/092—Polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41—Compounds containing sulfur bound to oxygen
    • C08K5/42—Sulfonic acids; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/43—Compounds containing sulfur bound to nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5317—Phosphonic compounds, e.g. R—P(:O)(OR')2
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J181/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon only; Adhesives based on polysulfones; Adhesives based on derivatives of such polymers
    • C09J181/02—Polythioethers; Polythioether-ethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37—Thiols

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polymerisation Methods In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
CN201380054158.0A 2012-10-18 2013-10-16 聚合性组合物和固化物 Active CN104736603B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-230603 2012-10-18
JP2012230603 2012-10-18
PCT/JP2013/078026 WO2014061687A1 (ja) 2012-10-18 2013-10-16 重合性組成物および硬化物

Publications (2)

Publication Number Publication Date
CN104736603A CN104736603A (zh) 2015-06-24
CN104736603B true CN104736603B (zh) 2017-03-15

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CN201380054158.0A Active CN104736603B (zh) 2012-10-18 2013-10-16 聚合性组合物和固化物

Country Status (7)

Country Link
US (1) US9376603B2 (de)
EP (1) EP2910592B1 (de)
JP (1) JP6191615B2 (de)
KR (1) KR102102330B1 (de)
CN (1) CN104736603B (de)
TW (1) TWI593755B (de)
WO (1) WO2014061687A1 (de)

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US20150344698A1 (en) * 2014-06-03 2015-12-03 Corning Incorporated Adhesion primer for glass and ceramics
CN104893650A (zh) * 2015-05-28 2015-09-09 南京先声合成材料有限公司 一种无色无味的防水胶
TWI694125B (zh) * 2015-06-05 2020-05-21 日商三菱瓦斯化學股份有限公司 硬化性組成物及使用其之光學用接著劑
EP3147965B1 (de) * 2015-09-25 2018-11-21 Samsung Electronics Co., Ltd. Kompositmembran, verfahren zu deren herstellung, kompositmembran enthaltende negative elektrodenstruktur, und negative elektrodenstruktur enthaltende lithium sekundärbatterie
CN108473861A (zh) * 2015-12-31 2018-08-31 3M创新有限公司 可固化量子点组合物和制品
US11015114B2 (en) 2015-12-31 2021-05-25 3M Innovative Properties Company Article comprising particles with quantum dots
US10731008B2 (en) * 2016-03-07 2020-08-04 Dow Toray Co., Ltd. Photocurable silicone composition and cured product thereof
KR102024613B1 (ko) * 2016-03-07 2019-09-24 쇼와 덴코 가부시키가이샤 활성 에너지선 경화성 조성물 및 그 경화물
JP2018165354A (ja) * 2016-12-01 2018-10-25 三洋化成工業株式会社 硬化性組成物及び硬化膜
JP7013649B2 (ja) * 2017-01-27 2022-02-01 昭和電工マテリアルズ株式会社 接着剤組成物、フィルム状接着剤、接続構造体及びその製造方法
KR101902974B1 (ko) * 2017-03-31 2018-10-02 에스케이씨 주식회사 폴리티올 화합물의 탈수 방법
JP7061865B2 (ja) * 2017-07-07 2022-05-02 三井化学株式会社 光硬化性樹脂組成物、表示素子用封止剤、有機ｅｌ素子用面封止剤、および面封止層
GB2575793A (en) 2018-07-20 2020-01-29 Montanuniv Leoben Resin composition suitable for printing and printing methods
CN111837061B (zh) * 2018-11-12 2022-05-27 日东电工株式会社 偏振膜、层叠偏振膜、图像显示面板、以及图像显示装置
CN111819259B (zh) * 2018-11-12 2021-03-16 日东电工株式会社 偏振膜、层叠偏振膜、图像显示面板、以及图像显示装置
KR20240097823A (ko) * 2021-11-12 2024-06-27 가부시끼가이샤 쓰리본드 광경화성 조성물
WO2024095924A1 (ja) * 2022-11-04 2024-05-10 株式会社スリーボンド 爪または人工爪用光硬化性組成物

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* Cited by examiner, † Cited by third party
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US5270439A (en) * 1988-10-20 1993-12-14 Sumitomo Seika Chemicals Co., Ltd. Method of producing a curable composition containing 4,4'-bis(methacryloylthio)diphenylsulfide
CN101213258A (zh) * 2005-07-28 2008-07-02 荒川化学工业株式会社 固化性树脂组合物、该固化物以及由此衍生的各种物品

Also Published As

Publication number Publication date
JP6191615B2 (ja) 2017-09-06
JPWO2014061687A1 (ja) 2016-09-05
CN104736603A (zh) 2015-06-24
KR20150070090A (ko) 2015-06-24
WO2014061687A1 (ja) 2014-04-24
EP2910592A1 (de) 2015-08-26
US20150252234A1 (en) 2015-09-10
KR102102330B1 (ko) 2020-04-20
EP2910592B1 (de) 2018-09-05
TWI593755B (zh) 2017-08-01
EP2910592A4 (de) 2016-05-25
US9376603B2 (en) 2016-06-28
TW201425475A (zh) 2014-07-01

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