TWI585222B - Film forming device - Google Patents
Film forming device Download PDFInfo
- Publication number
- TWI585222B TWI585222B TW100134788A TW100134788A TWI585222B TW I585222 B TWI585222 B TW I585222B TW 100134788 A TW100134788 A TW 100134788A TW 100134788 A TW100134788 A TW 100134788A TW I585222 B TWI585222 B TW I585222B
- Authority
- TW
- Taiwan
- Prior art keywords
- base portion
- vacuum chamber
- mask
- calibration
- upper side
- Prior art date
Links
- 230000007246 mechanism Effects 0.000 claims description 126
- 239000000758 substrate Substances 0.000 claims description 103
- 239000000463 material Substances 0.000 claims description 11
- 238000012937 correction Methods 0.000 claims description 4
- 239000010408 film Substances 0.000 description 39
- 230000032258 transport Effects 0.000 description 15
- 238000003780 insertion Methods 0.000 description 12
- 230000037431 insertion Effects 0.000 description 12
- 238000001816 cooling Methods 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 6
- 230000005484 gravity Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 229910001374 Invar Inorganic materials 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/88—Dummy elements, i.e. elements having non-functional features
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010220263A JP5639431B2 (ja) | 2010-09-30 | 2010-09-30 | 成膜装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201229260A TW201229260A (en) | 2012-07-16 |
| TWI585222B true TWI585222B (zh) | 2017-06-01 |
Family
ID=45892623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100134788A TWI585222B (zh) | 2010-09-30 | 2011-09-27 | Film forming device |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5639431B2 (enExample) |
| KR (1) | KR101846982B1 (enExample) |
| CN (1) | CN103154304B (enExample) |
| TW (1) | TWI585222B (enExample) |
| WO (1) | WO2012043150A1 (enExample) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014015633A (ja) * | 2012-07-05 | 2014-01-30 | Sumitomo Heavy Ind Ltd | 成膜装置、及び成膜装置用搬送トレイ |
| JP2014077170A (ja) * | 2012-10-10 | 2014-05-01 | Sumitomo Heavy Ind Ltd | 成膜装置 |
| CN103132016B (zh) * | 2013-02-22 | 2015-05-13 | 京东方科技集团股份有限公司 | 一种膜边调整器 |
| CN104018117A (zh) * | 2013-03-01 | 2014-09-03 | 昆山允升吉光电科技有限公司 | 一种掩模框架及其对应的掩模组件 |
| JP2014177683A (ja) * | 2013-03-15 | 2014-09-25 | Sumitomo Heavy Ind Ltd | 基板搬送トレイ、及び成膜装置 |
| JP6250999B2 (ja) * | 2013-09-27 | 2017-12-20 | キヤノントッキ株式会社 | アライメント方法並びにアライメント装置 |
| KR102019490B1 (ko) | 2014-12-10 | 2019-09-06 | 어플라이드 머티어리얼스, 인코포레이티드 | 프로세싱 챔버에서 기판을 마스킹하기 위한 마스크 어레인지먼트, 기판 상에 층을 증착하기 위한 장치, 및 프로세싱 챔버에서 기판을 마스킹하기 위한 마스크 어레인지먼트를 정렬하기 위한 방법 |
| CN104404466A (zh) | 2014-12-26 | 2015-03-11 | 合肥京东方光电科技有限公司 | 磁控溅射镀膜方法及系统 |
| US10837111B2 (en) | 2015-01-12 | 2020-11-17 | Applied Materials, Inc. | Holding arrangement for supporting a substrate carrier and a mask carrier during layer deposition in a processing chamber, apparatus for depositing a layer on a substrate, and method for aligning a substrate carrier supporting a substrate and a mask carrier |
| TWI576302B (zh) * | 2015-05-28 | 2017-04-01 | 友達光電股份有限公司 | 板體分離設備及板體分離方法 |
| JP6585191B2 (ja) * | 2016-05-18 | 2019-10-02 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | キャリア又は基板を搬送するための装置及び方法 |
| KR102359244B1 (ko) * | 2016-11-21 | 2022-02-08 | 한국알박(주) | 막 증착 방법 |
| KR20180056990A (ko) * | 2016-11-21 | 2018-05-30 | 한국알박(주) | 막 증착 장치 및 방법 |
| KR20180056989A (ko) * | 2016-11-21 | 2018-05-30 | 한국알박(주) | 막 증착 장치 및 방법 |
| JP6602465B2 (ja) * | 2017-02-24 | 2019-11-06 | アプライド マテリアルズ インコーポレイテッド | 基板キャリア及びマスクキャリアの位置決め装置、基板キャリア及びマスクキャリアの搬送システム、並びにそのための方法 |
| WO2018166634A1 (en) * | 2017-03-17 | 2018-09-20 | Applied Materials,Inc. | Methods of handling a mask device in a vacuum system, mask handling apparatus, and vacuum system |
| KR102111722B1 (ko) * | 2017-03-17 | 2020-05-15 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판의 진공 프로세싱을 위한 장치, 기판의 진공 프로세싱을 위한 시스템, 및 진공 챔버 내에서의 기판 캐리어 및 마스크 캐리어의 이송을 위한 방법 |
| CN106987798B (zh) * | 2017-04-17 | 2020-02-11 | 京东方科技集团股份有限公司 | 一种镀膜装置 |
| KR102378672B1 (ko) * | 2017-05-17 | 2022-03-24 | 이매진 코퍼레이션 | 고정밀 섀도 마스크 증착 시스템 및 그 방법 |
| TWI684659B (zh) * | 2017-06-29 | 2020-02-11 | 日商愛發科股份有限公司 | 成膜裝置 |
| TWI673375B (zh) * | 2017-06-30 | 2019-10-01 | 日商愛發科股份有限公司 | 成膜裝置、遮罩框架、對準方法 |
| CN110114502B (zh) * | 2017-10-05 | 2021-11-19 | 株式会社爱发科 | 溅射装置 |
| JP6662840B2 (ja) * | 2017-12-11 | 2020-03-11 | 株式会社アルバック | 蒸着装置 |
| JP6662841B2 (ja) * | 2017-12-21 | 2020-03-11 | 株式会社アルバック | 蒸着装置 |
| CN110557953B (zh) * | 2018-04-03 | 2021-10-29 | 应用材料公司 | 用于在真空腔室中的载体对准的设备和真空系统以及对准载体的方法 |
| CN110557954A (zh) * | 2018-04-03 | 2019-12-10 | 应用材料公司 | 用于将载体夹持到装置的布置 |
| JP2020518122A (ja) * | 2018-04-03 | 2020-06-18 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 真空チャンバ内でキャリアを操作するための装置、真空堆積システム、および真空チャンバ内でキャリアを操作する方法 |
| WO2020030252A1 (en) * | 2018-08-07 | 2020-02-13 | Applied Materials, Inc. | Material deposition apparatus, vacuum deposition system and method of processing a large area substrate |
| CN112640073B (zh) * | 2018-08-29 | 2024-11-12 | 应用材料公司 | 用于运输第一载体及第二载体的设备、用于垂直处理基板的处理系统及用于其的方法 |
| JP2019206761A (ja) * | 2019-07-09 | 2019-12-05 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 処理チャンバにおいて基板をマスキングするためのマスク構成 |
| KR20230155655A (ko) * | 2022-05-03 | 2023-11-13 | 삼성디스플레이 주식회사 | 표시 장치의 제조장치 및 표시 장치의 제조방법 |
| KR20230155654A (ko) * | 2022-05-03 | 2023-11-13 | 삼성디스플레이 주식회사 | 표시 장치의 제조장치 및 표시 장치의 제조방법 |
| KR102676831B1 (ko) * | 2023-11-14 | 2024-06-20 | 파인원 주식회사 | 블랭크-존 코팅이 가능한 마스크용 트레이 시스템 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101783397A (zh) * | 2008-12-15 | 2010-07-21 | 株式会社日立高新技术 | 有机el器件制造装置、成膜装置及其成膜方法、液晶显示基板制造、定位装置及定位方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3789857B2 (ja) * | 2002-06-25 | 2006-06-28 | トッキ株式会社 | 蒸着装置 |
| JP4463492B2 (ja) * | 2003-04-10 | 2010-05-19 | 株式会社半導体エネルギー研究所 | 製造装置 |
| JP4596794B2 (ja) * | 2004-02-27 | 2010-12-15 | 日立造船株式会社 | 真空蒸着用アライメント装置 |
| JP4609756B2 (ja) | 2005-02-23 | 2011-01-12 | 三井造船株式会社 | 成膜装置のマスク位置合わせ機構および成膜装置 |
| CN100587103C (zh) * | 2005-08-25 | 2010-02-03 | 日立造船株式会社 | 真空蒸镀用校准装置 |
| JP5074368B2 (ja) * | 2008-12-15 | 2012-11-14 | 株式会社日立ハイテクノロジーズ | 成膜装置 |
| JP2011096393A (ja) * | 2009-10-27 | 2011-05-12 | Hitachi High-Technologies Corp | 有機ｅｌデバイス製造装置及びその製造方法並びに成膜装置及び成膜方法 |
-
2010
- 2010-09-30 JP JP2010220263A patent/JP5639431B2/ja active Active
-
2011
- 2011-09-05 CN CN201180046526.8A patent/CN103154304B/zh active Active
- 2011-09-05 KR KR1020137006250A patent/KR101846982B1/ko active Active
- 2011-09-05 WO PCT/JP2011/070119 patent/WO2012043150A1/ja not_active Ceased
- 2011-09-27 TW TW100134788A patent/TWI585222B/zh active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101783397A (zh) * | 2008-12-15 | 2010-07-21 | 株式会社日立高新技术 | 有机el器件制造装置、成膜装置及其成膜方法、液晶显示基板制造、定位装置及定位方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5639431B2 (ja) | 2014-12-10 |
| CN103154304A (zh) | 2013-06-12 |
| KR20130139867A (ko) | 2013-12-23 |
| WO2012043150A1 (ja) | 2012-04-05 |
| KR101846982B1 (ko) | 2018-04-10 |
| JP2012072478A (ja) | 2012-04-12 |
| TW201229260A (en) | 2012-07-16 |
| CN103154304B (zh) | 2015-06-03 |
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