TWI570196B - 銀被覆銅粉 - Google Patents
銀被覆銅粉 Download PDFInfo
- Publication number
- TWI570196B TWI570196B TW101108595A TW101108595A TWI570196B TW I570196 B TWI570196 B TW I570196B TW 101108595 A TW101108595 A TW 101108595A TW 101108595 A TW101108595 A TW 101108595A TW I570196 B TWI570196 B TW I570196B
- Authority
- TW
- Taiwan
- Prior art keywords
- silver
- copper powder
- coated copper
- coated
- particles
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 194
- 229910052709 silver Inorganic materials 0.000 claims description 148
- 239000004332 silver Substances 0.000 claims description 148
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 146
- 239000002245 particle Substances 0.000 claims description 86
- 239000011248 coating agent Substances 0.000 claims description 18
- 238000000576 coating method Methods 0.000 claims description 18
- 239000010949 copper Substances 0.000 description 36
- 229910052802 copper Inorganic materials 0.000 description 30
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 25
- 239000000243 solution Substances 0.000 description 23
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 22
- 239000000843 powder Substances 0.000 description 22
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 22
- 229910001431 copper ion Inorganic materials 0.000 description 21
- 238000000034 method Methods 0.000 description 20
- 239000003792 electrolyte Substances 0.000 description 17
- 238000005868 electrolysis reaction Methods 0.000 description 15
- 239000008151 electrolyte solution Substances 0.000 description 15
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 12
- 210000004027 cell Anatomy 0.000 description 12
- 229910001961 silver nitrate Inorganic materials 0.000 description 11
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 10
- 239000011162 core material Substances 0.000 description 10
- 238000006073 displacement reaction Methods 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 238000007747 plating Methods 0.000 description 9
- 239000002738 chelating agent Substances 0.000 description 8
- 229920000159 gelatin Polymers 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000002002 slurry Substances 0.000 description 6
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 description 6
- 238000005406 washing Methods 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 5
- -1 silver ions Chemical class 0.000 description 5
- 108010010803 Gelatin Proteins 0.000 description 4
- 238000001354 calcination Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000003638 chemical reducing agent Substances 0.000 description 4
- 229910000365 copper sulfate Inorganic materials 0.000 description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 4
- 239000008273 gelatin Substances 0.000 description 4
- 235000019322 gelatine Nutrition 0.000 description 4
- 235000011852 gelatine desserts Nutrition 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 229940100890 silver compound Drugs 0.000 description 4
- 150000003379 silver compounds Chemical class 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 3
- 239000005751 Copper oxide Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229910000431 copper oxide Inorganic materials 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 238000003828 vacuum filtration Methods 0.000 description 3
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 2
- 235000011613 Pinus brutia Nutrition 0.000 description 2
- 241000018646 Pinus brutia Species 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000004848 polyfunctional curative Substances 0.000 description 2
- 150000003378 silver Chemical class 0.000 description 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- ZXSQEZNORDWBGZ-UHFFFAOYSA-N 1,3-dihydropyrrolo[2,3-b]pyridin-2-one Chemical compound C1=CN=C2NC(=O)CC2=C1 ZXSQEZNORDWBGZ-UHFFFAOYSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- DMQQXDPCRUGSQB-UHFFFAOYSA-N 2-[3-[bis(carboxymethyl)amino]propyl-(carboxymethyl)amino]acetic acid Chemical compound OC(=O)CN(CC(O)=O)CCCN(CC(O)=O)CC(O)=O DMQQXDPCRUGSQB-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- RBWNDBNSJFCLBZ-UHFFFAOYSA-N 7-methyl-5,6,7,8-tetrahydro-3h-[1]benzothiolo[2,3-d]pyrimidine-4-thione Chemical compound N1=CNC(=S)C2=C1SC1=C2CCC(C)C1 RBWNDBNSJFCLBZ-UHFFFAOYSA-N 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- HHAABMCBSFXQOI-UHFFFAOYSA-H F[Ag](F)(F)(F)(F)F Chemical compound F[Ag](F)(F)(F)(F)F HHAABMCBSFXQOI-UHFFFAOYSA-H 0.000 description 1
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- ZHSOHGDJTZDDIF-UHFFFAOYSA-N acetic acid;2-(2-aminoethylamino)ethane-1,1-diol Chemical compound CC(O)=O.CC(O)=O.NCCNCC(O)O ZHSOHGDJTZDDIF-UHFFFAOYSA-N 0.000 description 1
- ZFVMPHOLEJVJPJ-UHFFFAOYSA-N acetic acid;azane Chemical compound N.N.CC(O)=O.CC(O)=O.CC(O)=O ZFVMPHOLEJVJPJ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000007771 core particle Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 210000001787 dendrite Anatomy 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229940071106 ethylenediaminetetraacetate Drugs 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical compound OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- YWXYYJSYQOXTPL-SLPGGIOYSA-N isosorbide mononitrate Chemical compound [O-][N+](=O)O[C@@H]1CO[C@@H]2[C@@H](O)CO[C@@H]21 YWXYYJSYQOXTPL-SLPGGIOYSA-N 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229960003330 pentetic acid Drugs 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000004590 silicone sealant Substances 0.000 description 1
- CQLFBEKRDQMJLZ-UHFFFAOYSA-M silver acetate Chemical compound [Ag+].CC([O-])=O CQLFBEKRDQMJLZ-UHFFFAOYSA-M 0.000 description 1
- 229940071536 silver acetate Drugs 0.000 description 1
- LKZMBDSASOBTPN-UHFFFAOYSA-L silver carbonate Substances [Ag].[O-]C([O-])=O LKZMBDSASOBTPN-UHFFFAOYSA-L 0.000 description 1
- 229910001958 silver carbonate Inorganic materials 0.000 description 1
- SDLBJIZEEMKQKY-UHFFFAOYSA-M silver chlorate Chemical compound [Ag+].[O-]Cl(=O)=O SDLBJIZEEMKQKY-UHFFFAOYSA-M 0.000 description 1
- XNGYKPINNDWGGF-UHFFFAOYSA-L silver oxalate Chemical compound [Ag+].[Ag+].[O-]C(=O)C([O-])=O XNGYKPINNDWGGF-UHFFFAOYSA-L 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 229910000367 silver sulfate Inorganic materials 0.000 description 1
- YPNVIBVEFVRZPJ-UHFFFAOYSA-L silver sulfate Chemical compound [Ag+].[Ag+].[O-]S([O-])(=O)=O YPNVIBVEFVRZPJ-UHFFFAOYSA-L 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2301/00—Metallic composition of the powder or its coating
- B22F2301/10—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2301/00—Metallic composition of the powder or its coating
- B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
- B22F2301/255—Silver or gold
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Powder Metallurgy (AREA)
- Non-Insulated Conductors (AREA)
- Electrolytic Production Of Metals (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011232196 | 2011-10-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201317311A TW201317311A (zh) | 2013-05-01 |
| TWI570196B true TWI570196B (zh) | 2017-02-11 |
Family
ID=48099409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101108595A TWI570196B (zh) | 2011-10-21 | 2012-03-14 | 銀被覆銅粉 |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP5631910B2 (enExample) |
| KR (1) | KR20130044132A (enExample) |
| CN (1) | CN103056356B (enExample) |
| TW (1) | TWI570196B (enExample) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014021037A1 (ja) * | 2012-08-02 | 2014-02-06 | 三井金属鉱業株式会社 | 導電性フィルム |
| WO2015060258A1 (ja) * | 2013-10-24 | 2015-04-30 | 三井金属鉱業株式会社 | 銀被覆銅粉 |
| WO2015115139A1 (ja) * | 2014-01-29 | 2015-08-06 | 三井金属鉱業株式会社 | 銅粉 |
| KR101483905B1 (ko) * | 2014-04-04 | 2015-01-16 | 한동철 | 수분경화형 실리콘을 이용한 ｅｍｉ 차폐용 디스펜싱 가스켓에 적용 가능한 은코팅구리분말의 제조 방법 |
| JP2015214742A (ja) * | 2014-05-13 | 2015-12-03 | 有限会社 ナプラ | 多結晶金属粒子、及び、導電性ペースト |
| KR101874500B1 (ko) * | 2014-06-16 | 2018-07-04 | 미쓰이금속광업주식회사 | 구리분, 그 제조 방법, 및 그것을 포함하는 도전성 조성물 |
| JP6432174B2 (ja) * | 2014-06-18 | 2018-12-05 | セメダイン株式会社 | 導電性接着剤 |
| US20170152386A1 (en) * | 2014-06-25 | 2017-06-01 | Sumitomo Metal Mining Co., Ltd. | Copper powder, and copper paste, electrically conductive coating material and electrically conductive sheet each produced using said copper powder |
| WO2016006285A1 (ja) * | 2014-07-07 | 2016-01-14 | 住友金属鉱山株式会社 | 銅粉及びそれを用いた導電性ペースト、導電性塗料、導電性シート、帯電防止塗料 |
| JP5858202B1 (ja) * | 2014-08-26 | 2016-02-10 | 住友金属鉱山株式会社 | 銀コート銅粉及びそれを用いた導電性ペースト、導電性塗料、導電性シート |
| KR20170031210A (ko) | 2014-08-26 | 2017-03-20 | 스미토모 긴조쿠 고잔 가부시키가이샤 | 은 코팅 동분 및 그것을 이용한 도전성 페이스트, 도전성 도료, 도전성 시트 |
| US20170253750A1 (en) * | 2014-09-12 | 2017-09-07 | Sumitomo Metal Mining Co., Ltd. | Silver-coated copper powder, and conductive paste, conductive coating material and conductive sheet, each of which uses said silver-coated copper powder |
| JP5790900B1 (ja) * | 2014-09-12 | 2015-10-07 | 住友金属鉱山株式会社 | 銀コート銅粉及びそれを用いた導電性ペースト、導電性塗料、導電性シート |
| WO2016151859A1 (ja) * | 2015-03-26 | 2016-09-29 | 住友金属鉱山株式会社 | 銀コート銅粉及びそれを用いた導電性ペースト、導電性塗料、導電性シート |
| KR20170131546A (ko) * | 2015-03-26 | 2017-11-29 | 스미토모 긴조쿠 고잔 가부시키가이샤 | 동분 및 그것을 이용한 구리 페이스트, 도전성 도료, 도전성 시트 |
| TWI553661B (zh) * | 2015-03-27 | 2016-10-11 | Sumitomo Metal Mining Co | Silver powder and its use of conductive paste, conductive paint, conductive film |
| JP6056901B2 (ja) * | 2015-04-30 | 2017-01-11 | 住友金属鉱山株式会社 | 樹枝状銀コート銅粉の製造方法、及びその樹枝状銀コート銅粉を用いた銅ペースト、導電性塗料、導電性シート |
| JP5907302B1 (ja) | 2015-05-15 | 2016-04-26 | 住友金属鉱山株式会社 | 銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銅粉の製造方法 |
| JP5907301B1 (ja) * | 2015-05-15 | 2016-04-26 | 住友金属鉱山株式会社 | 銀コート銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銀コート銅粉の製造方法 |
| JP6165399B1 (ja) | 2015-08-31 | 2017-07-19 | 三井金属鉱業株式会社 | 銀被覆銅粉 |
| JP7131908B2 (ja) * | 2016-03-15 | 2022-09-06 | 積水化学工業株式会社 | 金属含有粒子、接続材料、接続構造体及び接続構造体の製造方法 |
| CN110312770A (zh) | 2017-02-17 | 2019-10-08 | 日立化成株式会社 | 粘接剂膜 |
| KR101940772B1 (ko) | 2018-07-13 | 2019-01-21 | 서재원 | 식판 자동 투입장치 |
| CN109598039B (zh) * | 2018-11-21 | 2022-07-08 | 中国电建集团成都勘测设计研究院有限公司 | 对称三岔形梁式岔管及其设计方法 |
| WO2023074580A1 (ja) * | 2021-10-25 | 2023-05-04 | トッパン・フォームズ株式会社 | 焼結材、金属焼結体、焼結材の製造方法、接合体の製造方法、及び接合体 |
| CN117620193B (zh) * | 2023-10-18 | 2024-11-05 | 广东聚砺新材料有限责任公司 | 一种银粉的制备方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63286477A (ja) * | 1987-05-19 | 1988-11-24 | Mitsui Mining & Smelting Co Ltd | 導電性塗料 |
| JP2008122030A (ja) * | 2006-11-15 | 2008-05-29 | Mitsui Mining & Smelting Co Ltd | ヒートパイプ構成原料 |
| CN101514486A (zh) * | 2009-02-27 | 2009-08-26 | 华东师范大学 | 一种Cu树枝状单晶纳米材料及其制备方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60226570A (ja) * | 1984-04-25 | 1985-11-11 | Fukuda Kinzoku Hakufun Kogyo Kk | 導電塗料用銅粉およびその製造方法 |
| JPS6381706A (ja) * | 1986-09-26 | 1988-04-12 | 三井金属鉱業株式会社 | 銅系厚膜用組成物 |
| JPH01119602A (ja) * | 1987-11-02 | 1989-05-11 | Mitsui Mining & Smelting Co Ltd | 銀被覆銅粉の製造法 |
| JP2706110B2 (ja) * | 1988-11-18 | 1998-01-28 | 福田金属箔粉工業株式会社 | 銅微粉末の製造方法 |
| US4944797A (en) * | 1989-01-03 | 1990-07-31 | Gte Products Corporation | Low oxygen content fine spherical copper particles and process for producing same by fluid energy milling and high temperature processing |
| JPH10147801A (ja) * | 1996-11-20 | 1998-06-02 | Tokuyama Corp | 樹枝状銅粉の表面処理法 |
| US6036839A (en) * | 1998-02-04 | 2000-03-14 | Electrocopper Products Limited | Low density high surface area copper powder and electrodeposition process for making same |
| JP4163278B2 (ja) * | 1998-02-26 | 2008-10-08 | 福田金属箔粉工業株式会社 | 導電塗料用片状銅粉の製造方法 |
| CN1206064C (zh) * | 2002-10-10 | 2005-06-15 | 武汉大学 | 一种镀银铜粉的制备方法 |
| JP4149364B2 (ja) * | 2003-11-18 | 2008-09-10 | 三井金属鉱業株式会社 | デンドライト状微粒銀粉及びその製造方法 |
| JP5181434B2 (ja) * | 2006-07-10 | 2013-04-10 | 住友金属鉱山株式会社 | 微小銅粉及びその製造方法 |
| CN101214547A (zh) * | 2008-01-07 | 2008-07-09 | 李伟强 | 一种含有纳米级别表面结构的微米银-铜颗粒及其制备方法和用途 |
| CN102211186B (zh) * | 2011-06-08 | 2013-10-16 | 北京工业大学 | 一种树枝状铜粉表面镀银的方法 |
-
2012
- 2012-02-22 JP JP2012036029A patent/JP5631910B2/ja active Active
- 2012-03-09 KR KR1020120024483A patent/KR20130044132A/ko not_active Ceased
- 2012-03-14 TW TW101108595A patent/TWI570196B/zh active
- 2012-03-30 CN CN201210091140.5A patent/CN103056356B/zh active Active
-
2014
- 2014-06-11 JP JP2014120721A patent/JP2014220244A/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63286477A (ja) * | 1987-05-19 | 1988-11-24 | Mitsui Mining & Smelting Co Ltd | 導電性塗料 |
| JP2008122030A (ja) * | 2006-11-15 | 2008-05-29 | Mitsui Mining & Smelting Co Ltd | ヒートパイプ構成原料 |
| CN101514486A (zh) * | 2009-02-27 | 2009-08-26 | 华东师范大学 | 一种Cu树枝状单晶纳米材料及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201317311A (zh) | 2013-05-01 |
| JP2014220244A (ja) | 2014-11-20 |
| KR20130044132A (ko) | 2013-05-02 |
| JP2013100592A (ja) | 2013-05-23 |
| CN103056356B (zh) | 2016-08-10 |
| JP5631910B2 (ja) | 2014-11-26 |
| CN103056356A (zh) | 2013-04-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI570196B (zh) | 銀被覆銅粉 | |
| JP5320442B2 (ja) | デンドライト状銅粉 | |
| JP5631841B2 (ja) | 銀被覆銅粉 | |
| JP5858201B1 (ja) | 銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート | |
| JP6165399B1 (ja) | 銀被覆銅粉 | |
| JP5920540B1 (ja) | 銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート | |
| WO2016038914A1 (ja) | 銀コート銅粉及びそれを用いた導電性ペースト、導電性塗料、導電性シート | |
| JP2013053347A (ja) | デンドライト状銅粉 | |
| WO2016151859A1 (ja) | 銀コート銅粉及びそれを用いた導電性ペースト、導電性塗料、導電性シート | |
| WO2016185628A1 (ja) | 銀コート銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銀コート銅粉の製造方法 | |
| JP6278969B2 (ja) | 銀被覆銅粉 | |
| JP2016139598A (ja) | 銀コート銅粉、及びそれを用いた銅ペースト、導電性塗料、導電性シート | |
| JP2014159646A (ja) | 銀被覆銅粉 | |
| JP2013168375A (ja) | デンドライト状銅粉 | |
| JP6274076B2 (ja) | 銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート | |
| JP5711435B2 (ja) | 銅粉 | |
| JP6332125B2 (ja) | 銀コート銅粉及びそれを用いた導電性ペースト、導電性塗料、導電性シート | |
| JP5790900B1 (ja) | 銀コート銅粉及びそれを用いた導電性ペースト、導電性塗料、導電性シート | |
| JP2016008333A (ja) | 銅粉及びそれを用いた銅ペースト | |
| TWI553661B (zh) | Silver powder and its use of conductive paste, conductive paint, conductive film | |
| JP2016138300A (ja) | 銅粉、及びそれを用いた銅ペースト、導電性塗料、導電性シート | |
| JP2018154856A (ja) | 銀コート銅粉の製造方法 |