JP5631910B2 - 銀被覆銅粉 - Google Patents

銀被覆銅粉 Download PDF

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Publication number
JP5631910B2
JP5631910B2 JP2012036029A JP2012036029A JP5631910B2 JP 5631910 B2 JP5631910 B2 JP 5631910B2 JP 2012036029 A JP2012036029 A JP 2012036029A JP 2012036029 A JP2012036029 A JP 2012036029A JP 5631910 B2 JP5631910 B2 JP 5631910B2
Authority
JP
Japan
Prior art keywords
silver
copper powder
coated copper
coated
branches
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012036029A
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English (en)
Japanese (ja)
Other versions
JP2013100592A5 (enExample
JP2013100592A (ja
Inventor
卓 藤本
卓 藤本
昌宏 三輪
昌宏 三輪
康成 脇森
康成 脇森
林　富雄
富雄 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Kinzoku Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Priority to JP2012036029A priority Critical patent/JP5631910B2/ja
Publication of JP2013100592A publication Critical patent/JP2013100592A/ja
Publication of JP2013100592A5 publication Critical patent/JP2013100592A5/ja
Application granted granted Critical
Publication of JP5631910B2 publication Critical patent/JP5631910B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/10—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
    • B22F2301/255—Silver or gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Powder Metallurgy (AREA)
  • Non-Insulated Conductors (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)
JP2012036029A 2011-10-21 2012-02-22 銀被覆銅粉 Active JP5631910B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012036029A JP5631910B2 (ja) 2011-10-21 2012-02-22 銀被覆銅粉

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011232196 2011-10-21
JP2011232196 2011-10-21
JP2012036029A JP5631910B2 (ja) 2011-10-21 2012-02-22 銀被覆銅粉

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014120721A Division JP2014220244A (ja) 2011-10-21 2014-06-11 銀被覆銅粉

Publications (3)

Publication Number Publication Date
JP2013100592A JP2013100592A (ja) 2013-05-23
JP2013100592A5 JP2013100592A5 (enExample) 2013-12-19
JP5631910B2 true JP5631910B2 (ja) 2014-11-26

Family

ID=48099409

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2012036029A Active JP5631910B2 (ja) 2011-10-21 2012-02-22 銀被覆銅粉
JP2014120721A Pending JP2014220244A (ja) 2011-10-21 2014-06-11 銀被覆銅粉

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2014120721A Pending JP2014220244A (ja) 2011-10-21 2014-06-11 銀被覆銅粉

Country Status (4)

Country Link
JP (2) JP5631910B2 (enExample)
KR (1) KR20130044132A (enExample)
CN (1) CN103056356B (enExample)
TW (1) TWI570196B (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014021037A1 (ja) * 2012-08-02 2014-02-06 三井金属鉱業株式会社 導電性フィルム
WO2015060258A1 (ja) * 2013-10-24 2015-04-30 三井金属鉱業株式会社 銀被覆銅粉
WO2015115139A1 (ja) * 2014-01-29 2015-08-06 三井金属鉱業株式会社 銅粉
KR101483905B1 (ko) * 2014-04-04 2015-01-16 한동철 수분경화형 실리콘을 이용한 ｅｍｉ 차폐용 디스펜싱 가스켓에 적용 가능한 은코팅구리분말의 제조 방법
JP2015214742A (ja) * 2014-05-13 2015-12-03 有限会社 ナプラ 多結晶金属粒子、及び、導電性ペースト
KR101874500B1 (ko) * 2014-06-16 2018-07-04 미쓰이금속광업주식회사 구리분, 그 제조 방법, 및 그것을 포함하는 도전성 조성물
JP6432174B2 (ja) * 2014-06-18 2018-12-05 セメダイン株式会社 導電性接着剤
US20170152386A1 (en) * 2014-06-25 2017-06-01 Sumitomo Metal Mining Co., Ltd. Copper powder, and copper paste, electrically conductive coating material and electrically conductive sheet each produced using said copper powder
WO2016006285A1 (ja) * 2014-07-07 2016-01-14 住友金属鉱山株式会社 銅粉及びそれを用いた導電性ペースト、導電性塗料、導電性シート、帯電防止塗料
JP5858202B1 (ja) * 2014-08-26 2016-02-10 住友金属鉱山株式会社 銀コート銅粉及びそれを用いた導電性ペースト、導電性塗料、導電性シート
KR20170031210A (ko) 2014-08-26 2017-03-20 스미토모 긴조쿠 고잔 가부시키가이샤 은 코팅 동분 및 그것을 이용한 도전성 페이스트, 도전성 도료, 도전성 시트
US20170253750A1 (en) * 2014-09-12 2017-09-07 Sumitomo Metal Mining Co., Ltd. Silver-coated copper powder, and conductive paste, conductive coating material and conductive sheet, each of which uses said silver-coated copper powder
JP5790900B1 (ja) * 2014-09-12 2015-10-07 住友金属鉱山株式会社 銀コート銅粉及びそれを用いた導電性ペースト、導電性塗料、導電性シート
WO2016151859A1 (ja) * 2015-03-26 2016-09-29 住友金属鉱山株式会社 銀コート銅粉及びそれを用いた導電性ペースト、導電性塗料、導電性シート
KR20170131546A (ko) * 2015-03-26 2017-11-29 스미토모 긴조쿠 고잔 가부시키가이샤 동분 및 그것을 이용한 구리 페이스트, 도전성 도료, 도전성 시트
TWI553661B (zh) * 2015-03-27 2016-10-11 Sumitomo Metal Mining Co Silver powder and its use of conductive paste, conductive paint, conductive film
JP6056901B2 (ja) * 2015-04-30 2017-01-11 住友金属鉱山株式会社 樹枝状銀コート銅粉の製造方法、及びその樹枝状銀コート銅粉を用いた銅ペースト、導電性塗料、導電性シート
JP5907302B1 (ja) 2015-05-15 2016-04-26 住友金属鉱山株式会社 銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銅粉の製造方法
JP5907301B1 (ja) * 2015-05-15 2016-04-26 住友金属鉱山株式会社 銀コート銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銀コート銅粉の製造方法
JP6165399B1 (ja) 2015-08-31 2017-07-19 三井金属鉱業株式会社 銀被覆銅粉
JP7131908B2 (ja) * 2016-03-15 2022-09-06 積水化学工業株式会社 金属含有粒子、接続材料、接続構造体及び接続構造体の製造方法
CN110312770A (zh) 2017-02-17 2019-10-08 日立化成株式会社 粘接剂膜
KR101940772B1 (ko) 2018-07-13 2019-01-21 서재원 식판 자동 투입장치
CN109598039B (zh) * 2018-11-21 2022-07-08 中国电建集团成都勘测设计研究院有限公司 对称三岔形梁式岔管及其设计方法
WO2023074580A1 (ja) * 2021-10-25 2023-05-04 トッパン・フォームズ株式会社 焼結材、金属焼結体、焼結材の製造方法、接合体の製造方法、及び接合体
CN117620193B (zh) * 2023-10-18 2024-11-05 广东聚砺新材料有限责任公司 一种银粉的制备方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60226570A (ja) * 1984-04-25 1985-11-11 Fukuda Kinzoku Hakufun Kogyo Kk 導電塗料用銅粉およびその製造方法
JPS6381706A (ja) * 1986-09-26 1988-04-12 三井金属鉱業株式会社 銅系厚膜用組成物
JPS63286477A (ja) * 1987-05-19 1988-11-24 Mitsui Mining & Smelting Co Ltd 導電性塗料
JPH01119602A (ja) * 1987-11-02 1989-05-11 Mitsui Mining & Smelting Co Ltd 銀被覆銅粉の製造法
JP2706110B2 (ja) * 1988-11-18 1998-01-28 福田金属箔粉工業株式会社 銅微粉末の製造方法
US4944797A (en) * 1989-01-03 1990-07-31 Gte Products Corporation Low oxygen content fine spherical copper particles and process for producing same by fluid energy milling and high temperature processing
JPH10147801A (ja) * 1996-11-20 1998-06-02 Tokuyama Corp 樹枝状銅粉の表面処理法
US6036839A (en) * 1998-02-04 2000-03-14 Electrocopper Products Limited Low density high surface area copper powder and electrodeposition process for making same
JP4163278B2 (ja) * 1998-02-26 2008-10-08 福田金属箔粉工業株式会社 導電塗料用片状銅粉の製造方法
CN1206064C (zh) * 2002-10-10 2005-06-15 武汉大学 一种镀银铜粉的制备方法
JP4149364B2 (ja) * 2003-11-18 2008-09-10 三井金属鉱業株式会社 デンドライト状微粒銀粉及びその製造方法
JP5181434B2 (ja) * 2006-07-10 2013-04-10 住友金属鉱山株式会社 微小銅粉及びその製造方法
JP2008122030A (ja) * 2006-11-15 2008-05-29 Mitsui Mining & Smelting Co Ltd ヒートパイプ構成原料
CN101214547A (zh) * 2008-01-07 2008-07-09 李伟强 一种含有纳米级别表面结构的微米银-铜颗粒及其制备方法和用途
CN101514486B (zh) * 2009-02-27 2011-09-21 华东师范大学 一种Cu树枝状单晶纳米材料及其制备方法
CN102211186B (zh) * 2011-06-08 2013-10-16 北京工业大学 一种树枝状铜粉表面镀银的方法

Also Published As

Publication number Publication date
TW201317311A (zh) 2013-05-01
JP2014220244A (ja) 2014-11-20
TWI570196B (zh) 2017-02-11
KR20130044132A (ko) 2013-05-02
JP2013100592A (ja) 2013-05-23
CN103056356B (zh) 2016-08-10
CN103056356A (zh) 2013-04-24

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