TWI566930B - 積層板、覆金屬積層板、印刷配線板、多層印刷配線板 - Google Patents
積層板、覆金屬積層板、印刷配線板、多層印刷配線板 Download PDFInfo
- Publication number
- TWI566930B TWI566930B TW102137718A TW102137718A TWI566930B TW I566930 B TWI566930 B TW I566930B TW 102137718 A TW102137718 A TW 102137718A TW 102137718 A TW102137718 A TW 102137718A TW I566930 B TWI566930 B TW I566930B
- Authority
- TW
- Taiwan
- Prior art keywords
- laminate
- printed wiring
- wiring board
- filler
- particle diameter
- Prior art date
Links
- 239000011888 foil Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 239000002184 metal Substances 0.000 claims description 25
- 239000011256 inorganic filler Substances 0.000 claims description 23
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 23
- 239000000945 filler Substances 0.000 claims description 22
- 239000002245 particle Substances 0.000 claims description 22
- 239000011342 resin composition Substances 0.000 claims description 21
- 229920005989 resin Polymers 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 20
- 239000004020 conductor Substances 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 17
- 239000010410 layer Substances 0.000 claims description 15
- 230000009477 glass transition Effects 0.000 claims description 10
- 238000005979 thermal decomposition reaction Methods 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000002356 single layer Substances 0.000 claims description 4
- 239000013585 weight reducing agent Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 238000000465 moulding Methods 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 239000004848 polyfunctional curative Substances 0.000 description 7
- 229920001187 thermosetting polymer Polymers 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 239000004744 fabric Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- -1 for example Substances 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 238000002411 thermogravimetry Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000010455 vermiculite Substances 0.000 description 3
- 229910052902 vermiculite Inorganic materials 0.000 description 3
- 235000019354 vermiculite Nutrition 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000347 magnesium hydroxide Substances 0.000 description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical class O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- LHENQXAPVKABON-UHFFFAOYSA-N 1-methoxypropan-1-ol Chemical compound CCC(O)OC LHENQXAPVKABON-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- AZQWKYJCGOJGHM-UHFFFAOYSA-N para-benzoquinone Natural products O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012248684 | 2012-11-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201438900A TW201438900A (zh) | 2014-10-16 |
| TWI566930B true TWI566930B (zh) | 2017-01-21 |
Family
ID=50700013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102137718A TWI566930B (zh) | 2012-11-12 | 2013-10-18 | 積層板、覆金屬積層板、印刷配線板、多層印刷配線板 |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP2014111719A (ko) |
| KR (2) | KR20140061243A (ko) |
| CN (1) | CN103802409B (ko) |
| TW (1) | TWI566930B (ko) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014111719A (ja) * | 2012-11-12 | 2014-06-19 | Panasonic Corp | 積層板、金属張積層板、プリント配線板、多層プリント配線板 |
| JP6695046B2 (ja) * | 2015-09-25 | 2020-05-20 | パナソニックＩｐマネジメント株式会社 | プリプレグ、金属張積層板、配線板、並びに、配線板材料の熱応力の測定方法 |
| US10448507B2 (en) | 2016-01-15 | 2019-10-15 | Jx Nippon Mining & Metals Corporation | Copper foil, copper-clad laminate board, method for producing printed wiring board, method for producing electronic apparatus, method for producing transmission channel, and method for producing antenna |
| JP6890301B2 (ja) * | 2017-02-23 | 2021-06-18 | パナソニックＩｐマネジメント株式会社 | プリント配線板及びプリント配線板の製造方法 |
| KR102398722B1 (ko) * | 2017-03-13 | 2022-05-16 | 린텍 가부시키가이샤 | 수지 조성물, 수지 시트, 적층체, 및 반도체 소자 |
| JP6989086B6 (ja) | 2018-02-13 | 2022-02-28 | エルジー・ケム・リミテッド | 半導体パッケージ用熱硬化性樹脂組成物およびこれを用いたプリプレグ |
| JP7133955B2 (ja) * | 2018-03-22 | 2022-09-09 | 太陽インキ製造株式会社 | 熱硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品 |
| WO2020124452A1 (zh) * | 2018-12-19 | 2020-06-25 | 深圳先进技术研究院 | 金属纳米片的制备方法、金属纳米片、用途和负极活性材料 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201109359A (en) * | 2009-07-24 | 2011-03-16 | Sumitomo Bakelite Co | Resin composition, resin sheet, prepreg, metal-clad laminate, printed wiring board and semiconductor device |
| TW201128813A (en) * | 2010-01-28 | 2011-08-16 | Asahi Glass Co Ltd | Substrate for mounting light emitting element, method for producing same, and light emitting device |
| US20110240325A1 (en) * | 2010-03-31 | 2011-10-06 | Daigo Suzuki | Printed Wiring Board and Electronic Apparatus |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0713151B2 (ja) * | 1990-02-14 | 1995-02-15 | 新神戸電機株式会社 | 耐熱性エポキシ樹脂積層板の製造法 |
| JP3648750B2 (ja) * | 1993-09-14 | 2005-05-18 | 株式会社日立製作所 | 積層板及び多層プリント回路板 |
| JPH07258439A (ja) * | 1994-03-24 | 1995-10-09 | Shin Kobe Electric Mach Co Ltd | 難燃性積層板およびその製造法 |
| JP5055668B2 (ja) * | 2001-07-19 | 2012-10-24 | 凸版印刷株式会社 | プリント配線板用熱硬化性樹脂組成物 |
| JP2003192768A (ja) * | 2001-12-27 | 2003-07-09 | Taiyo Ink Mfg Ltd | 難燃性エポキシ樹脂組成物とその成型物およびこれを用いた多層プリント配線板 |
| JP2005314562A (ja) * | 2004-04-28 | 2005-11-10 | Kaneka Corp | 熱硬化性樹脂組成物およびその利用 |
| EP1818350B1 (en) * | 2004-11-30 | 2012-10-03 | Panasonic Corporation | Epoxy resin composition for prepreg, prepreg, and multilayered printed wiring board |
| JP5230059B2 (ja) * | 2005-06-22 | 2013-07-10 | 住友ベークライト株式会社 | プリプレグ、回路基板および半導体装置 |
| JP2006312751A (ja) * | 2006-08-10 | 2006-11-16 | Sumitomo Bakelite Co Ltd | 樹脂組成物、プリプレグ及びそれを用いた銅張積層板 |
| JP2008074934A (ja) * | 2006-09-20 | 2008-04-03 | Mitsubishi Gas Chem Co Inc | プリプレグの製造方法 |
| JP2008174610A (ja) * | 2007-01-17 | 2008-07-31 | Toho Tenax Co Ltd | 耐衝撃性プリプレグ及びその製造方法 |
| WO2008102853A1 (ja) * | 2007-02-23 | 2008-08-28 | Panasonic Electric Works Co., Ltd. | エポキシ樹脂組成物、プリプレグ、積層板、及びプリント配線板 |
| JP5260400B2 (ja) * | 2009-04-24 | 2013-08-14 | パナソニック株式会社 | 多層プリント配線板を作製するための多層板 |
| JP5260458B2 (ja) * | 2009-09-25 | 2013-08-14 | パナソニック株式会社 | プリプレグ用エポキシ樹脂組成物とそれを用いたプリプレグ、積層板、多層板 |
| JP2011153285A (ja) * | 2009-12-28 | 2011-08-11 | Sekisui Chem Co Ltd | 樹脂組成物、ｂステージフィルム、積層フィルム、銅張り積層板及び多層基板 |
| JP5577107B2 (ja) * | 2010-01-22 | 2014-08-20 | パナソニック株式会社 | 樹脂組成物、樹脂組成物の製造方法、樹脂ワニス、プリプレグ、金属張積層板、及びプリント配線板 |
| JP5589470B2 (ja) | 2010-03-18 | 2014-09-17 | 日立化成株式会社 | ビスマレイミド誘導体とその製造方法、並びに熱硬化性樹脂組成物、プリプレグ及び積層板 |
| JP5402761B2 (ja) * | 2010-03-23 | 2014-01-29 | Ｄｉｃ株式会社 | 硬化性樹脂組成物、その硬化物、リン原子含有フェノール類の製造方法、プリント配線基板用樹脂組成物、プリント配線基板、フレキシブル配線基板用樹脂組成物、半導体封止材料用樹脂組成物、及びビルドアップ基板用層間絶縁材料用樹脂組成物 |
| JP2011219674A (ja) * | 2010-04-13 | 2011-11-04 | Sumitomo Bakelite Co Ltd | 回路基板用熱硬化樹脂性組成物 |
| JP5471931B2 (ja) * | 2010-07-23 | 2014-04-16 | 住友ベークライト株式会社 | プリント配線板、金属張積層板、樹脂シート及びプリント配線板の製造方法 |
| KR20130095730A (ko) | 2010-08-06 | 2013-08-28 | 히타치가세이가부시끼가이샤 | 상용화 수지의 제조 방법, 열경화성 수지 조성물, 프리프레그 및 적층판 |
| JP5598190B2 (ja) * | 2010-09-09 | 2014-10-01 | 住友ベークライト株式会社 | 回路基板用熱硬化性樹脂組成物 |
| MY155995A (en) * | 2011-01-24 | 2015-12-31 | Sumitomo Bakelite Co | Prepreg, laminate, printed wiring board, and semiconductor device |
| JP5909808B2 (ja) * | 2012-01-30 | 2016-04-27 | 日立化成株式会社 | 加熱加圧成形用プリプレグ及び積層板 |
| JP2014111719A (ja) * | 2012-11-12 | 2014-06-19 | Panasonic Corp | 積層板、金属張積層板、プリント配線板、多層プリント配線板 |
-
2013
- 2013-10-09 JP JP2013212177A patent/JP2014111719A/ja active Pending
- 2013-10-18 TW TW102137718A patent/TWI566930B/zh active
- 2013-11-01 KR KR1020130132009A patent/KR20140061243A/ko active Application Filing
- 2013-11-07 CN CN201310548252.3A patent/CN103802409B/zh active Active
-
2017
- 2017-05-26 JP JP2017105044A patent/JP6512521B2/ja active Active
- 2017-08-07 KR KR1020170099707A patent/KR101865286B1/ko active IP Right Grant
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201109359A (en) * | 2009-07-24 | 2011-03-16 | Sumitomo Bakelite Co | Resin composition, resin sheet, prepreg, metal-clad laminate, printed wiring board and semiconductor device |
| TW201128813A (en) * | 2010-01-28 | 2011-08-16 | Asahi Glass Co Ltd | Substrate for mounting light emitting element, method for producing same, and light emitting device |
| US20110240325A1 (en) * | 2010-03-31 | 2011-10-06 | Daigo Suzuki | Printed Wiring Board and Electronic Apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017189981A (ja) | 2017-10-19 |
| TW201438900A (zh) | 2014-10-16 |
| JP2014111719A (ja) | 2014-06-19 |
| KR20140061243A (ko) | 2014-05-21 |
| JP6512521B2 (ja) | 2019-05-15 |
| CN103802409B (zh) | 2017-09-05 |
| KR101865286B1 (ko) | 2018-06-07 |
| KR20170094111A (ko) | 2017-08-17 |
| CN103802409A (zh) | 2014-05-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI566930B (zh) | 積層板、覆金屬積層板、印刷配線板、多層印刷配線板 | |
| CN107614608B (zh) | 用于半导体封装的热固性树脂组合物及使用其的预浸料 | |
| TWI538955B (zh) | 用於半導體封裝之熱固性樹脂組成物以及使用其之預浸材及覆金屬層合物 | |
| TWI594882B (zh) | 熱固型樹脂組成物及使用其之預浸材與覆金屬層壓板 | |
| JP6624573B2 (ja) | 金属張積層板の製造方法、プリント配線板の製造方法、及び多層プリント配線板の製造方法 | |
| KR20110008044A (ko) | 절연 수지 시트 및 상기 절연 수지 시트를 사용한 다층 프린트 배선판의 제조 방법 | |
| KR20180135900A (ko) | 프리프레그, 금속 클래드 적층판 및 프린트 배선판 | |
| TW201315767A (zh) | 預浸體、積層板、半導體封裝及積層板之製造方法 | |
| TWI829631B (zh) | 樹脂組成物、預浸體、敷金屬積層板、印刷配線板及可撓剛性印刷配線板 | |
| US10371612B2 (en) | Prepreg, metal-clad laminated plate, wiring board, and method for measuring thermal stress of wiring board material | |
| JP2007128955A (ja) | プリント配線板及びその製造方法 | |
| KR101641210B1 (ko) | 저열팽창 프리프레그의 제조방법 및 금속박 적층판의 제조방법 | |
| JP6989086B6 (ja) | 半導体パッケージ用熱硬化性樹脂組成物およびこれを用いたプリプレグ | |
| JP2014070098A (ja) | プリプレグ、積層板及びプリント配線板 | |
| TWI551632B (zh) | 預浸材、覆金屬層積板、印刷配線板、多層印刷配線板 | |
| JP2020528471A6 (ja) | 半導体パッケージ用熱硬化性樹脂組成物およびこれを用いたプリプレグ | |
| JP2015086293A (ja) | プリプレグ及び多層プリント配線板 | |
| JP2006165095A (ja) | プリント配線板およびその製造方法 | |
| JP2010187035A (ja) | プリント配線板およびその製造方法 | |
| WO2013015577A1 (ko) | 열경화성 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판 |