TWI529045B - Move out of the robot - Google Patents
Move out of the robot Download PDFInfo
- Publication number
- TWI529045B TWI529045B TW102135815A TW102135815A TWI529045B TW I529045 B TWI529045 B TW I529045B TW 102135815 A TW102135815 A TW 102135815A TW 102135815 A TW102135815 A TW 102135815A TW I529045 B TWI529045 B TW I529045B
- Authority
- TW
- Taiwan
- Prior art keywords
- arm
- head
- loading
- carry
- base portion
- Prior art date
Links
- 230000033001 locomotion Effects 0.000 claims description 24
- 238000009434 installation Methods 0.000 claims description 3
- 230000007246 mechanism Effects 0.000 description 24
- 239000003638 chemical reducing agent Substances 0.000 description 17
- 238000012545 processing Methods 0.000 description 17
- 230000005540 biological transmission Effects 0.000 description 7
- 238000012546 transfer Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000000926 separation method Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J18/00—Arms
- B25J18/02—Arms extensible
- B25J18/04—Arms extensible rotatable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
- B25J9/043—Cylindrical coordinate type comprising an articulated arm double selective compliance articulated robot arms [SCARA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012222551A JP5990359B2 (ja) | 2012-10-04 | 2012-10-04 | 搬入出ロボット |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201424961A TW201424961A (zh) | 2014-07-01 |
| TWI529045B true TWI529045B (zh) | 2016-04-11 |
Family
ID=49354445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102135815A TWI529045B (zh) | 2012-10-04 | 2013-10-03 | Move out of the robot |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9174346B2 (cg-RX-API-DMAC7.html) |
| EP (2) | EP3056321B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP5990359B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR101580718B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN103707285B (cg-RX-API-DMAC7.html) |
| TW (1) | TWI529045B (cg-RX-API-DMAC7.html) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6411852B2 (ja) * | 2014-10-07 | 2018-10-24 | 平田機工株式会社 | 搬送装置、搬送システム及び搬送方法 |
| US10269613B2 (en) | 2014-10-10 | 2019-04-23 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate conveying robot and method of operating the same |
| WO2016172003A1 (en) * | 2015-04-20 | 2016-10-27 | Applied Materials, Inc. | Buffer chamber wafer heating mechanism and supporting robot |
| JP6487267B2 (ja) * | 2015-04-27 | 2019-03-20 | 日本電産サンキョー株式会社 | 製造システム |
| JP6487266B2 (ja) | 2015-04-27 | 2019-03-20 | 日本電産サンキョー株式会社 | 製造システム |
| JP6594177B2 (ja) * | 2015-11-24 | 2019-10-23 | 平田機工株式会社 | ハンド部材およびハンド |
| CN107378982A (zh) * | 2017-09-12 | 2017-11-24 | 李从宾 | 一种智能机器人抓取装置 |
| TWI758595B (zh) * | 2018-03-31 | 2022-03-21 | 日商平田機工股份有限公司 | 腔室構造 |
| JP7183635B2 (ja) * | 2018-08-31 | 2022-12-06 | 東京エレクトロン株式会社 | 基板搬送機構、基板処理装置及び基板搬送方法 |
| JP7225613B2 (ja) | 2018-09-03 | 2023-02-21 | 東京エレクトロン株式会社 | 基板搬送機構、基板処理装置及び基板搬送方法 |
| JP7409800B2 (ja) * | 2019-08-09 | 2024-01-09 | 川崎重工業株式会社 | ロボット制御装置、ロボット、及びロボット制御方法 |
| TWI703079B (zh) * | 2019-11-21 | 2020-09-01 | 辛耘企業股份有限公司 | 輸送裝置 |
| KR102272535B1 (ko) * | 2020-12-14 | 2021-07-05 | (주)볼타오토메이션 | 반송로봇용 듀얼타입의 반송암모듈 |
| KR102348261B1 (ko) * | 2021-05-31 | 2022-01-10 | (주) 티로보틱스 | 진공 챔버에서 기판을 이송하기 위한 기판 이송 로봇 |
| KR102307687B1 (ko) * | 2021-06-25 | 2021-10-05 | (주) 티로보틱스 | 기판 이송 로봇을 진공 챔버 내에서 주행하기 위한 주행 로봇 |
| KR102307690B1 (ko) * | 2021-06-25 | 2021-10-05 | (주) 티로보틱스 | 진공 챔버에서 기판을 이송하기 위한 기판 이송 로봇 |
| KR102396650B1 (ko) * | 2021-07-21 | 2022-05-12 | 주식회사 싸이맥스 | 3절 링크 대기형 로봇 |
| CN114043464B (zh) * | 2021-11-26 | 2023-11-03 | 四川建安工业有限责任公司 | 可伸缩式机械手 |
| WO2023188181A1 (ja) * | 2022-03-30 | 2023-10-05 | 平田機工株式会社 | 基板搬送システム及び移載ロボット |
| WO2023188177A1 (ja) * | 2022-03-30 | 2023-10-05 | 平田機工株式会社 | 基板搬送システム及び移載ロボット制御装置 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4585387A (en) * | 1983-10-11 | 1986-04-29 | William Jayne | Robot arm |
| JPH03154736A (ja) * | 1989-11-10 | 1991-07-02 | Hitachi Ltd | 移動体のストツパ機構 |
| JPH0549293U (ja) * | 1991-11-29 | 1993-06-29 | ぺんてる株式会社 | ロボットア−ムのストッパ装置 |
| JPH0650778U (ja) * | 1992-12-24 | 1994-07-12 | 株式会社ダイフク | アーム回動式作業装置 |
| JPH08172121A (ja) | 1994-12-20 | 1996-07-02 | Hitachi Ltd | 基板搬送装置 |
| US5993142A (en) * | 1997-07-10 | 1999-11-30 | Genmark Automation, Inc. | Robot having multiple degrees of freedom in an isolated environment |
| JPH11188671A (ja) * | 1997-12-26 | 1999-07-13 | Daihen Corp | ２アーム方式の搬送用ロボット装置 |
| JPH11300659A (ja) * | 1998-04-24 | 1999-11-02 | Mecs Corp | 薄型基板搬送多関節ロボット |
| JP2000000786A (ja) * | 1998-06-16 | 2000-01-07 | Komatsu Ltd | 同期制御装置 |
| JP2000077499A (ja) | 1998-09-03 | 2000-03-14 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| US6297611B1 (en) | 2000-07-06 | 2001-10-02 | Genmark Automation | Robot having independent end effector linkage motion |
| TW550651B (en) * | 2001-08-08 | 2003-09-01 | Tokyo Electron Ltd | Substrate conveying apparatus, substrate processing system, and substrate conveying method |
| JP4411025B2 (ja) * | 2003-07-11 | 2010-02-10 | 株式会社ダイヘン | ２アーム式搬送ロボット |
| JP4959427B2 (ja) * | 2007-06-05 | 2012-06-20 | 日本電産サンキョー株式会社 | 産業用ロボット |
| JP5059729B2 (ja) * | 2008-09-30 | 2012-10-31 | 株式会社日立ハイテクコントロールシステムズ | ウェーハ搬送ロボット及びウェーハ搬送装置 |
| US8757345B2 (en) * | 2009-04-29 | 2014-06-24 | Novellus Systems, Inc. | Magnetic rotational hardstop for robot |
| JP2011119556A (ja) * | 2009-12-07 | 2011-06-16 | Yaskawa Electric Corp | 水平多関節ロボットおよびそれを備えた搬送装置 |
| JP5071514B2 (ja) * | 2010-04-21 | 2012-11-14 | 株式会社安川電機 | 水平多関節ロボットおよびそれを備えた基板搬送システム |
| JP5578973B2 (ja) * | 2010-07-16 | 2014-08-27 | 日本電産サンキョー株式会社 | 産業用ロボット |
| JP5565345B2 (ja) * | 2011-03-07 | 2014-08-06 | 株式会社安川電機 | 搬送ロボット |
-
2012
- 2012-10-04 JP JP2012222551A patent/JP5990359B2/ja active Active
-
2013
- 2013-09-29 CN CN201310455928.4A patent/CN103707285B/zh active Active
- 2013-10-03 TW TW102135815A patent/TWI529045B/zh active
- 2013-10-04 KR KR1020130118383A patent/KR101580718B1/ko active Active
- 2013-10-04 EP EP16162163.6A patent/EP3056321B1/en active Active
- 2013-10-04 EP EP13187347.3A patent/EP2716416B1/en active Active
- 2013-10-04 US US14/046,485 patent/US9174346B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN103707285B (zh) | 2016-06-29 |
| EP3056321B1 (en) | 2019-07-03 |
| US20140099180A1 (en) | 2014-04-10 |
| JP2014073558A (ja) | 2014-04-24 |
| KR101580718B1 (ko) | 2015-12-28 |
| TW201424961A (zh) | 2014-07-01 |
| EP2716416A3 (en) | 2014-11-12 |
| US9174346B2 (en) | 2015-11-03 |
| CN103707285A (zh) | 2014-04-09 |
| EP2716416B1 (en) | 2016-04-27 |
| EP2716416A2 (en) | 2014-04-09 |
| JP5990359B2 (ja) | 2016-09-14 |
| EP3056321A3 (en) | 2017-03-01 |
| KR20140044278A (ko) | 2014-04-14 |
| EP3056321A2 (en) | 2016-08-17 |
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