JP6630727B2 - 水平多関節ロボット - Google Patents
水平多関節ロボット Download PDFInfo
- Publication number
- JP6630727B2 JP6630727B2 JP2017520045A JP2017520045A JP6630727B2 JP 6630727 B2 JP6630727 B2 JP 6630727B2 JP 2017520045 A JP2017520045 A JP 2017520045A JP 2017520045 A JP2017520045 A JP 2017520045A JP 6630727 B2 JP6630727 B2 JP 6630727B2
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- JP
- Japan
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- articulated robot
- horizontal articulated
- axis
- robot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 125000006850 spacer group Chemical group 0.000 claims description 26
- 239000012636 effector Substances 0.000 claims description 22
- 239000000758 substrate Substances 0.000 description 45
- 238000012546 transfer Methods 0.000 description 27
- 238000000034 method Methods 0.000 description 14
- 230000004048 modification Effects 0.000 description 13
- 238000012986 modification Methods 0.000 description 13
- 230000007246 mechanism Effects 0.000 description 10
- 210000000707 wrist Anatomy 0.000 description 10
- 230000033001 locomotion Effects 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 7
- 230000003028 elevating effect Effects 0.000 description 7
- 230000002452 interceptive effect Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000000969 carrier Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 210000004247 hand Anatomy 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000013404 process transfer Methods 0.000 description 1
- 210000003857 wrist joint Anatomy 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0028—Gripping heads and other end effectors with movable, e.g. pivoting gripping jaw surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S901/00—Robots
- Y10S901/02—Arm motion controller
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S901/00—Robots
- Y10S901/14—Arm movement, spatial
- Y10S901/17—Cylindrical
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S901/00—Robots
- Y10S901/19—Drive system for arm
- Y10S901/23—Electric motor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S901/00—Robots
- Y10S901/30—End effector
- Y10S901/31—Gripping jaw
- Y10S901/32—Servo-actuated
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
第1リンクと、
前記第1リンクの先端部の下方に基端部が連結された第2リンクと、
前記第2リンクの先端部の上方に基端部が連結された第3リンクと、
前記第3リンクと前記第2リンクとの連結部に配置され、前記第3リンクの動作の軌跡が前記第1リンクと干渉しないように、前記第2リンクと前記第3リンクを上下に離間させるスペーサと、
前記第3リンクの先端部の上方に基端部が連結されたエンドエフェクタと、を備える。
4 :ロボットアーム
5 :エンドエフェクタ
6 :制御装置
21 :基台
30 :コントローラ
40 :昇降軸
41 :第1リンク
42 :第2リンク
42 :第3リンク
49 :スペーサ
60 :昇降駆動装置
61〜64 :関節駆動装置
90 :基板移載装置
91 :キャリア
92 :プロセス装置
100 :基板処理設備
A0〜4 :サーボアンプ
D0〜4 :動力伝達機構
E0〜4 :位置検出器
J1〜4 :第1〜4関節
L1〜4 :第1〜4軸
M0〜4 :サーボモータ
W :基板
Claims (2)
- 第1リンクと、
前記第1リンクの先端部の下方に基端部が連結された第2リンクと、
前記第2リンクの先端部の上方に基端部が連結された第3リンクと、
前記第3リンクと前記第2リンクとの連結部に配置され、前記第3リンクの動作の軌跡が前記第1リンクと干渉しないように、前記第2リンクと前記第3リンクを上下に離間させるスペーサと、
前記第3リンクの先端部の上方に基端部が連結されたエンドエフェクタと、を備える、
水平多関節ロボット。 - 前記スペーサが、中空軸形状を有する、請求項1に記載の水平多関節ロボット。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2015/002622 WO2016189565A1 (ja) | 2015-05-25 | 2015-05-25 | 水平多関節ロボット |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2016189565A1 JPWO2016189565A1 (ja) | 2018-03-15 |
JP6630727B2 true JP6630727B2 (ja) | 2020-01-15 |
Family
ID=57392617
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017520045A Active JP6630727B2 (ja) | 2015-05-25 | 2015-05-25 | 水平多関節ロボット |
Country Status (5)
Country | Link |
---|---|
US (1) | US20180182658A1 (ja) |
JP (1) | JP6630727B2 (ja) |
KR (1) | KR20180008742A (ja) |
CN (1) | CN107530876A (ja) |
WO (1) | WO2016189565A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107000204B (zh) * | 2015-08-07 | 2021-06-15 | 日本电产三协株式会社 | 工业用机器人 |
JP2018089739A (ja) * | 2016-12-02 | 2018-06-14 | 日本電産サンキョー株式会社 | 産業用ロボット |
JP7013766B2 (ja) * | 2017-09-22 | 2022-02-01 | セイコーエプソン株式会社 | ロボット制御装置、ロボットシステム、及び制御方法 |
US11673275B2 (en) * | 2019-02-08 | 2023-06-13 | Yaskawa America, Inc. | Through-beam auto teaching |
US20220111513A1 (en) * | 2020-10-14 | 2022-04-14 | Applied Materials, Inc. | Infinite rotation of vacuum robot linkage through timing belt with isolated environment |
DE102021109904A1 (de) * | 2021-04-20 | 2022-10-20 | J. Schmalz Gmbh | Handhabungsvorrichtung mit definierter Ruhekonfiguration |
KR102394121B1 (ko) * | 2021-10-08 | 2022-05-04 | (주) 티로보틱스 | 기판 이송 로봇을 챔버 내에서 주행하기 위한 주행 로봇 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11188670A (ja) * | 1997-12-26 | 1999-07-13 | Daihen Corp | 2アーム方式の搬送用ロボット装置 |
JPH11284044A (ja) * | 1998-03-27 | 1999-10-15 | Mecs Corp | 薄型基板搬送ロボット |
TW200642812A (en) * | 2005-04-11 | 2006-12-16 | Nidec Sankyo Corp | Articulated robot |
JP4852719B2 (ja) * | 2005-12-05 | 2012-01-11 | 日本電産サンキョー株式会社 | 多関節型ロボット |
JP4595053B2 (ja) * | 2005-04-11 | 2010-12-08 | 日本電産サンキョー株式会社 | 多関節型ロボット |
US8777547B2 (en) * | 2009-01-11 | 2014-07-15 | Applied Materials, Inc. | Systems, apparatus and methods for transporting substrates |
JP2012000740A (ja) * | 2010-06-21 | 2012-01-05 | Mitsubishi Electric Corp | スカラロボット |
JP5527299B2 (ja) * | 2011-09-27 | 2014-06-18 | 株式会社安川電機 | ギヤユニットおよびロボット |
JP2015502654A (ja) * | 2011-10-26 | 2015-01-22 | ブルックス オートメーション インコーポレイテッド | 半導体ウェハのハンドリングおよび搬送 |
-
2015
- 2015-05-25 JP JP2017520045A patent/JP6630727B2/ja active Active
- 2015-05-25 US US15/577,137 patent/US20180182658A1/en not_active Abandoned
- 2015-05-25 CN CN201580078980.XA patent/CN107530876A/zh active Pending
- 2015-05-25 WO PCT/JP2015/002622 patent/WO2016189565A1/ja active Application Filing
- 2015-05-25 KR KR1020177036386A patent/KR20180008742A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JPWO2016189565A1 (ja) | 2018-03-15 |
KR20180008742A (ko) | 2018-01-24 |
WO2016189565A1 (ja) | 2016-12-01 |
CN107530876A (zh) | 2018-01-02 |
US20180182658A1 (en) | 2018-06-28 |
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