KR101580718B1 - 반입출 로봇 - Google Patents

반입출 로봇 Download PDF

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Publication number
KR101580718B1
KR101580718B1 KR1020130118383A KR20130118383A KR101580718B1 KR 101580718 B1 KR101580718 B1 KR 101580718B1 KR 1020130118383 A KR1020130118383 A KR 1020130118383A KR 20130118383 A KR20130118383 A KR 20130118383A KR 101580718 B1 KR101580718 B1 KR 101580718B1
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South Korea
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loading
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arm
head portion
unit
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KR1020130118383A
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English (en)
Korean (ko)
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KR20140044278A (ko
Inventor
히로아키 안도
Original Assignee
히라따기꼬오 가부시키가이샤
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Publication of KR20140044278A publication Critical patent/KR20140044278A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00—Arms
    • B25J18/02—Arms extensible
    • B25J18/04—Arms extensible rotatable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B25J9/043—Cylindrical coordinate type comprising an articulated arm double selective compliance articulated robot arms [SCARA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020130118383A 2012-10-04 2013-10-04 반입출 로봇 Active KR101580718B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012222551A JP5990359B2 (ja) 2012-10-04 2012-10-04 搬入出ロボット
JPJP-P-2012-222551 2012-10-04

Publications (2)

Publication Number Publication Date
KR20140044278A KR20140044278A (ko) 2014-04-14
KR101580718B1 true KR101580718B1 (ko) 2015-12-28

Family

ID=49354445

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130118383A Active KR101580718B1 (ko) 2012-10-04 2013-10-04 반입출 로봇

Country Status (6)

Country Link
US (1) US9174346B2 (cg-RX-API-DMAC7.html)
EP (2) EP3056321B1 (cg-RX-API-DMAC7.html)
JP (1) JP5990359B2 (cg-RX-API-DMAC7.html)
KR (1) KR101580718B1 (cg-RX-API-DMAC7.html)
CN (1) CN103707285B (cg-RX-API-DMAC7.html)
TW (1) TWI529045B (cg-RX-API-DMAC7.html)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6411852B2 (ja) * 2014-10-07 2018-10-24 平田機工株式会社 搬送装置、搬送システム及び搬送方法
US10269613B2 (en) 2014-10-10 2019-04-23 Kawasaki Jukogyo Kabushiki Kaisha Substrate conveying robot and method of operating the same
WO2016172003A1 (en) * 2015-04-20 2016-10-27 Applied Materials, Inc. Buffer chamber wafer heating mechanism and supporting robot
JP6487267B2 (ja) * 2015-04-27 2019-03-20 日本電産サンキョー株式会社 製造システム
JP6487266B2 (ja) 2015-04-27 2019-03-20 日本電産サンキョー株式会社 製造システム
JP6594177B2 (ja) * 2015-11-24 2019-10-23 平田機工株式会社 ハンド部材およびハンド
CN107378982A (zh) * 2017-09-12 2017-11-24 李从宾 一种智能机器人抓取装置
TWI758595B (zh) * 2018-03-31 2022-03-21 日商平田機工股份有限公司 腔室構造
JP7183635B2 (ja) * 2018-08-31 2022-12-06 東京エレクトロン株式会社 基板搬送機構、基板処理装置及び基板搬送方法
JP7225613B2 (ja) 2018-09-03 2023-02-21 東京エレクトロン株式会社 基板搬送機構、基板処理装置及び基板搬送方法
JP7409800B2 (ja) * 2019-08-09 2024-01-09 川崎重工業株式会社 ロボット制御装置、ロボット、及びロボット制御方法
TWI703079B (zh) * 2019-11-21 2020-09-01 辛耘企業股份有限公司 輸送裝置
KR102272535B1 (ko) * 2020-12-14 2021-07-05 (주)볼타오토메이션 반송로봇용 듀얼타입의 반송암모듈
KR102348261B1 (ko) * 2021-05-31 2022-01-10 (주) 티로보틱스 진공 챔버에서 기판을 이송하기 위한 기판 이송 로봇
KR102307687B1 (ko) * 2021-06-25 2021-10-05 (주) 티로보틱스 기판 이송 로봇을 진공 챔버 내에서 주행하기 위한 주행 로봇
KR102307690B1 (ko) * 2021-06-25 2021-10-05 (주) 티로보틱스 진공 챔버에서 기판을 이송하기 위한 기판 이송 로봇
KR102396650B1 (ko) * 2021-07-21 2022-05-12 주식회사 싸이맥스 3절 링크 대기형 로봇
CN114043464B (zh) * 2021-11-26 2023-11-03 四川建安工业有限责任公司 可伸缩式机械手
WO2023188181A1 (ja) * 2022-03-30 2023-10-05 平田機工株式会社 基板搬送システム及び移載ロボット
WO2023188177A1 (ja) * 2022-03-30 2023-10-05 平田機工株式会社 基板搬送システム及び移載ロボット制御装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010082742A (ja) 2008-09-30 2010-04-15 Hitachi High-Tech Control Systems Corp ウェーハ搬送ロボット及びウェーハ搬送装置
JP2012186389A (ja) * 2011-03-07 2012-09-27 Yaskawa Electric Corp 搬送ロボット

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US4585387A (en) * 1983-10-11 1986-04-29 William Jayne Robot arm
JPH03154736A (ja) * 1989-11-10 1991-07-02 Hitachi Ltd 移動体のストツパ機構
JPH0549293U (ja) * 1991-11-29 1993-06-29 ぺんてる株式会社 ロボットア−ムのストッパ装置
JPH0650778U (ja) * 1992-12-24 1994-07-12 株式会社ダイフク アーム回動式作業装置
JPH08172121A (ja) 1994-12-20 1996-07-02 Hitachi Ltd 基板搬送装置
US5993142A (en) * 1997-07-10 1999-11-30 Genmark Automation, Inc. Robot having multiple degrees of freedom in an isolated environment
JPH11188671A (ja) * 1997-12-26 1999-07-13 Daihen Corp ２アーム方式の搬送用ロボット装置
JPH11300659A (ja) * 1998-04-24 1999-11-02 Mecs Corp 薄型基板搬送多関節ロボット
JP2000000786A (ja) * 1998-06-16 2000-01-07 Komatsu Ltd 同期制御装置
JP2000077499A (ja) 1998-09-03 2000-03-14 Dainippon Screen Mfg Co Ltd 基板処理装置
US6297611B1 (en) 2000-07-06 2001-10-02 Genmark Automation Robot having independent end effector linkage motion
TW550651B (en) * 2001-08-08 2003-09-01 Tokyo Electron Ltd Substrate conveying apparatus, substrate processing system, and substrate conveying method
JP4411025B2 (ja) * 2003-07-11 2010-02-10 株式会社ダイヘン ２アーム式搬送ロボット
JP4959427B2 (ja) * 2007-06-05 2012-06-20 日本電産サンキョー株式会社 産業用ロボット
US8757345B2 (en) * 2009-04-29 2014-06-24 Novellus Systems, Inc. Magnetic rotational hardstop for robot
JP2011119556A (ja) * 2009-12-07 2011-06-16 Yaskawa Electric Corp 水平多関節ロボットおよびそれを備えた搬送装置
JP5071514B2 (ja) * 2010-04-21 2012-11-14 株式会社安川電機 水平多関節ロボットおよびそれを備えた基板搬送システム
JP5578973B2 (ja) * 2010-07-16 2014-08-27 日本電産サンキョー株式会社 産業用ロボット

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010082742A (ja) 2008-09-30 2010-04-15 Hitachi High-Tech Control Systems Corp ウェーハ搬送ロボット及びウェーハ搬送装置
JP2012186389A (ja) * 2011-03-07 2012-09-27 Yaskawa Electric Corp 搬送ロボット

Also Published As

Publication number Publication date
CN103707285B (zh) 2016-06-29
EP3056321B1 (en) 2019-07-03
US20140099180A1 (en) 2014-04-10
JP2014073558A (ja) 2014-04-24
TW201424961A (zh) 2014-07-01
EP2716416A3 (en) 2014-11-12
US9174346B2 (en) 2015-11-03
CN103707285A (zh) 2014-04-09
EP2716416B1 (en) 2016-04-27
EP2716416A2 (en) 2014-04-09
JP5990359B2 (ja) 2016-09-14
EP3056321A3 (en) 2017-03-01
KR20140044278A (ko) 2014-04-14
EP3056321A2 (en) 2016-08-17
TWI529045B (zh) 2016-04-11

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