TWI528040B - Printed board inspection device - Google Patents

Printed board inspection device Download PDF

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Publication number
TWI528040B
TWI528040B TW103127590A TW103127590A TWI528040B TW I528040 B TWI528040 B TW I528040B TW 103127590 A TW103127590 A TW 103127590A TW 103127590 A TW103127590 A TW 103127590A TW I528040 B TWI528040 B TW I528040B
Authority
TW
Taiwan
Prior art keywords
inspection
circuit board
printed circuit
tray
unit
Prior art date
Application number
TW103127590A
Other languages
English (en)
Chinese (zh)
Other versions
TW201512682A (zh
Inventor
Toshiaki Hanaoka
Shigetaka NAKANO
Hirokazu Uemura
Original Assignee
Taiyo Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ind Co Ltd filed Critical Taiyo Ind Co Ltd
Publication of TW201512682A publication Critical patent/TW201512682A/zh
Application granted granted Critical
Publication of TWI528040B publication Critical patent/TWI528040B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G01R1/07335—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards for double-sided contacting or for testing boards with surface-mounted devices (SMD's)
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2805—Bare printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
TW103127590A 2013-08-12 2014-08-12 Printed board inspection device TWI528040B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013167429A JP5797240B2 (ja) 2013-08-12 2013-08-12 プリント基板検査装置

Publications (2)

Publication Number Publication Date
TW201512682A TW201512682A (zh) 2015-04-01
TWI528040B true TWI528040B (zh) 2016-04-01

Family

ID=52468262

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103127590A TWI528040B (zh) 2013-08-12 2014-08-12 Printed board inspection device

Country Status (5)

Country Link
JP (1) JP5797240B2 (ko)
KR (1) KR101735992B1 (ko)
CN (1) CN105358994B (ko)
TW (1) TWI528040B (ko)
WO (1) WO2015022875A1 (ko)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200485752Y1 (ko) * 2015-12-21 2018-02-19 (주)영우디에스피 디스플레이 패널 검사용 프로브 유닛 클램핑 장치
JP6611251B2 (ja) * 2016-03-22 2019-11-27 ヤマハファインテック株式会社 検査治具、検査装置及び検査方法
JP6564345B2 (ja) * 2016-05-25 2019-08-21 ヤマハファインテック株式会社 電気検査方法及び電気検査装置
JP6726077B2 (ja) * 2016-10-13 2020-07-22 ヤマハファインテック株式会社 処理装置
JP6834548B2 (ja) * 2017-02-06 2021-02-24 富士ゼロックス株式会社 支持構造、検査装置
CN107015058A (zh) * 2017-03-17 2017-08-04 广东长盈精密技术有限公司 自动化测试装置
JP2019052914A (ja) * 2017-09-14 2019-04-04 日本電産サンキョー株式会社 検査装置
EP3470857A1 (en) * 2017-10-10 2019-04-17 Fitech sp. z o.o. Press assembly for an in-circuit tester
JP7124834B2 (ja) * 2017-12-26 2022-08-24 日本電産リード株式会社 基板検査装置
KR102200527B1 (ko) * 2019-04-19 2021-01-11 주식회사 아이에스시 소켓 보드 조립체
TWI692644B (zh) * 2019-06-18 2020-05-01 旺矽科技股份有限公司 電子元件針測裝置
WO2021124862A1 (ja) * 2019-12-20 2021-06-24 日本電産リード株式会社 検査装置
CN112285533A (zh) * 2020-10-20 2021-01-29 庄园 一种集成电路板自动化检测线
CN114428207B (zh) * 2022-04-06 2022-06-28 深圳市恒讯通电子有限公司 印刷电路板测试设备
CN115848769B (zh) * 2022-12-02 2023-11-14 苏州冠韵威电子技术有限公司 一种具有自动贴标功能的工件智能测试平台

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0454468A (ja) * 1990-06-25 1992-02-21 Hitachi Electron Eng Co Ltd セラミック配線基板の導通／絶縁検査装置
JPH0735808A (ja) * 1993-07-21 1995-02-07 Matsushita Electric Ind Co Ltd コンタクトプローブ移動式回路基板両面検査装置
JP3313939B2 (ja) * 1995-06-13 2002-08-12 セイコープレシジョン株式会社 ワーク供給装置
JP4047456B2 (ja) * 1998-05-29 2008-02-13 日置電機株式会社 回路基板検査装置
CN2518113Y (zh) * 2001-12-14 2002-10-23 耀华电子股份有限公司 电路板测试用复合式模具
CN2658755Y (zh) * 2003-09-19 2004-11-24 王云阶 复合式治具
JP4481111B2 (ja) * 2004-08-26 2010-06-16 三井金属鉱業株式会社 導体パターンの電気検査用前処理方法、導体パターンの電気検査方法、導体パターンの電気検査用前処理装置、導体パターンの電気検査装置、検査済みプリント配線板、及び検査済み半導体装置
JP4835317B2 (ja) * 2006-08-10 2011-12-14 パナソニック株式会社 プリント配線板の電気検査方法
JP2011185702A (ja) * 2010-03-08 2011-09-22 Yamaha Fine Technologies Co Ltd 回路基板の電気検査方法及び電気検査装置
JP2011242260A (ja) * 2010-05-18 2011-12-01 Gardian Japan Co Ltd 配線検査治具

Also Published As

Publication number Publication date
CN105358994A (zh) 2016-02-24
KR20160013992A (ko) 2016-02-05
WO2015022875A1 (ja) 2015-02-19
KR101735992B1 (ko) 2017-05-15
JP2015036625A (ja) 2015-02-23
JP5797240B2 (ja) 2015-10-21
CN105358994B (zh) 2016-10-12
TW201512682A (zh) 2015-04-01

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