TWI519621B - A wafer for processing a wafer, and a method for manufacturing a semiconductor device using a wafer processing wafer - Google Patents
A wafer for processing a wafer, and a method for manufacturing a semiconductor device using a wafer processing wafer Download PDFInfo
- Publication number
- TWI519621B TWI519621B TW099107278A TW99107278A TWI519621B TW I519621 B TWI519621 B TW I519621B TW 099107278 A TW099107278 A TW 099107278A TW 99107278 A TW99107278 A TW 99107278A TW I519621 B TWI519621 B TW I519621B
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive layer
- film
- wafer
- adhesive
- ring frame
- Prior art date
Links
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Dicing (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009060572A JP2010219086A (ja) | 2009-03-13 | 2009-03-13 | ウエハ加工用フィルム及びウエハ加工用フィルムを用いて半導体装置を製造する方法 |
Publications (2)
Publication Number | Publication Date |
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TW201040242A TW201040242A (en) | 2010-11-16 |
TWI519621B true TWI519621B (zh) | 2016-02-01 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW099107278A TWI519621B (zh) | 2009-03-13 | 2010-03-12 | A wafer for processing a wafer, and a method for manufacturing a semiconductor device using a wafer processing wafer |
Country Status (5)
Country | Link |
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JP (1) | JP2010219086A (ja) |
KR (1) | KR101333341B1 (ja) |
CN (1) | CN102349134A (ja) |
TW (1) | TWI519621B (ja) |
WO (1) | WO2010104071A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011158835A1 (ja) * | 2010-06-18 | 2011-12-22 | 日立化成工業株式会社 | 接着シート |
KR101397686B1 (ko) * | 2010-12-06 | 2014-05-22 | 제일모직주식회사 | 기재필름 및 이를 이용한 반도체용 접착필름 |
JP5916295B2 (ja) * | 2011-04-22 | 2016-05-11 | 古河電気工業株式会社 | ウエハ加工用テープおよびウエハ加工用テープを用いて半導体装置を製造する方法 |
KR102047347B1 (ko) | 2012-12-26 | 2019-11-21 | 히타치가세이가부시끼가이샤 | 익스팬드 방법, 반도체 장치의 제조방법, 및 반도체 장치 |
JP6021687B2 (ja) * | 2013-02-25 | 2016-11-09 | 株式会社ディスコ | 積層ウェーハの加工方法 |
WO2015125351A1 (ja) * | 2014-02-21 | 2015-08-27 | 株式会社村田製作所 | 電子部品供給体及びその製造方法 |
KR102455987B1 (ko) * | 2014-07-22 | 2022-10-18 | 아피쿠 야마다 가부시키가이샤 | 성형 금형, 성형 장치, 성형품의 제조 방법 및 수지 몰드 방법 |
CN112967992B (zh) * | 2020-12-07 | 2022-09-23 | 重庆康佳光电技术研究院有限公司 | 外延结构的转移方法 |
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JP3669196B2 (ja) * | 1998-07-27 | 2005-07-06 | 日東電工株式会社 | 紫外線硬化型粘着シート |
JP4107417B2 (ja) * | 2002-10-15 | 2008-06-25 | 日東電工株式会社 | チップ状ワークの固定方法 |
JP2005203749A (ja) * | 2003-12-15 | 2005-07-28 | Furukawa Electric Co Ltd:The | ウェハ加工用テープおよびその製造方法 |
WO2005057644A1 (ja) * | 2003-12-15 | 2005-06-23 | The Furukawa Electric Co., Ltd. | ウェハ加工用テープおよびその製造方法 |
JP4781635B2 (ja) * | 2004-03-30 | 2011-09-28 | 日東電工株式会社 | レーザー加工品の製造方法及びレーザー加工用保護シート |
MY138566A (en) * | 2004-03-15 | 2009-06-30 | Hitachi Chemical Co Ltd | Dicing/die bonding sheet |
JP4776189B2 (ja) * | 2004-08-03 | 2011-09-21 | 古河電気工業株式会社 | ウエハ加工用テープ |
JP4776188B2 (ja) * | 2004-08-03 | 2011-09-21 | 古河電気工業株式会社 | 半導体装置製造方法およびウエハ加工用テープ |
JP2007019151A (ja) * | 2005-07-06 | 2007-01-25 | Furukawa Electric Co Ltd:The | ウエハ加工用テープおよびそれを用いたチップの製造方法 |
EP2068352A4 (en) * | 2006-10-06 | 2010-04-28 | Sumitomo Bakelite Co | FILM FOR A SEMICONDUCTOR, METHOD FOR PRODUCING A FILM FOR A SEMICONDUCTOR AND SEMICONDUCTOR COMPONENT |
JP2008303386A (ja) * | 2007-05-08 | 2008-12-18 | Hitachi Chem Co Ltd | 接着シート及びその製造方法並びに接着シートを用いた半導体装置の製造方法及び半導体装置 |
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2009
- 2009-03-13 JP JP2009060572A patent/JP2010219086A/ja active Pending
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2010
- 2010-03-09 CN CN2010800110444A patent/CN102349134A/zh active Pending
- 2010-03-09 KR KR1020117023940A patent/KR101333341B1/ko active IP Right Grant
- 2010-03-09 WO PCT/JP2010/053880 patent/WO2010104071A1/ja active Application Filing
- 2010-03-12 TW TW099107278A patent/TWI519621B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20110129952A (ko) | 2011-12-02 |
CN102349134A (zh) | 2012-02-08 |
TW201040242A (en) | 2010-11-16 |
KR101333341B1 (ko) | 2013-11-28 |
JP2010219086A (ja) | 2010-09-30 |
WO2010104071A1 (ja) | 2010-09-16 |
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