KR101333341B1 - 웨이퍼 가공용 필름 및 웨이퍼 가공용 필름을 사용하여 반도체 장치를 제조하는 방법 - Google Patents
웨이퍼 가공용 필름 및 웨이퍼 가공용 필름을 사용하여 반도체 장치를 제조하는 방법 Download PDFInfo
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- KR101333341B1 KR101333341B1 KR1020117023940A KR20117023940A KR101333341B1 KR 101333341 B1 KR101333341 B1 KR 101333341B1 KR 1020117023940 A KR1020117023940 A KR 1020117023940A KR 20117023940 A KR20117023940 A KR 20117023940A KR 101333341 B1 KR101333341 B1 KR 101333341B1
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- Prior art keywords
- film
- adhesive layer
- adhesive
- wafer processing
- wafer
- Prior art date
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Classifications
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- H—ELECTRICITY
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009060572A JP2010219086A (ja) | 2009-03-13 | 2009-03-13 | ウエハ加工用フィルム及びウエハ加工用フィルムを用いて半導体装置を製造する方法 |
| JPJP-P-2009-060572 | 2009-03-13 | ||
| PCT/JP2010/053880 WO2010104071A1 (ja) | 2009-03-13 | 2010-03-09 | ウエハ加工用フィルム及びウエハ加工用フィルムを用いて半導体装置を製造する方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20110129952A KR20110129952A (ko) | 2011-12-02 |
| KR101333341B1 true KR101333341B1 (ko) | 2013-11-28 |
Family
ID=42728360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020117023940A KR101333341B1 (ko) | 2009-03-13 | 2010-03-09 | 웨이퍼 가공용 필름 및 웨이퍼 가공용 필름을 사용하여 반도체 장치를 제조하는 방법 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2010219086A (ja) |
| KR (1) | KR101333341B1 (ja) |
| CN (1) | CN102349134A (ja) |
| TW (1) | TWI519621B (ja) |
| WO (1) | WO2010104071A1 (ja) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5196034B2 (ja) * | 2010-06-18 | 2013-05-15 | 日立化成株式会社 | 接着シート |
| KR101397686B1 (ko) * | 2010-12-06 | 2014-05-22 | 제일모직주식회사 | 기재필름 및 이를 이용한 반도체용 접착필름 |
| JP5916295B2 (ja) * | 2011-04-22 | 2016-05-11 | 古河電気工業株式会社 | ウエハ加工用テープおよびウエハ加工用テープを用いて半導体装置を製造する方法 |
| US10008405B2 (en) | 2012-12-26 | 2018-06-26 | Hitachi Chemical Company, Ltd | Expansion method, method for manufacturing semiconductor device, and semiconductor device |
| JP6021687B2 (ja) * | 2013-02-25 | 2016-11-09 | 株式会社ディスコ | 積層ウェーハの加工方法 |
| JP6066013B2 (ja) * | 2014-02-21 | 2017-01-25 | 株式会社村田製作所 | 電子部品供給体及びその製造方法 |
| KR102455987B1 (ko) * | 2014-07-22 | 2022-10-18 | 아피쿠 야마다 가부시키가이샤 | 성형 금형, 성형 장치, 성형품의 제조 방법 및 수지 몰드 방법 |
| CN112967992B (zh) * | 2020-12-07 | 2022-09-23 | 重庆康佳光电技术研究院有限公司 | 外延结构的转移方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005279755A (ja) | 2004-03-30 | 2005-10-13 | Nitto Denko Corp | レーザー加工品の製造方法及びレーザー加工用保護シート |
| KR20060106819A (ko) * | 2003-12-15 | 2006-10-12 | 후루카와 덴키 고교 가부시키가이샤 | 웨이퍼 가공용 테이프 및 그 제조방법 |
| WO2008047610A1 (fr) | 2006-10-06 | 2008-04-24 | Sumitomo Bakelite Company Limited | Film pour semi-conducteur, procédé de production de film pour semi-conducteur et dispositif à semiconducteurs |
| JP2008303386A (ja) | 2007-05-08 | 2008-12-18 | Hitachi Chem Co Ltd | 接着シート及びその製造方法並びに接着シートを用いた半導体装置の製造方法及び半導体装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3669196B2 (ja) * | 1998-07-27 | 2005-07-06 | 日東電工株式会社 | 紫外線硬化型粘着シート |
| JP4107417B2 (ja) * | 2002-10-15 | 2008-06-25 | 日東電工株式会社 | チップ状ワークの固定方法 |
| JP2005203749A (ja) * | 2003-12-15 | 2005-07-28 | Furukawa Electric Co Ltd:The | ウェハ加工用テープおよびその製造方法 |
| MY138566A (en) * | 2004-03-15 | 2009-06-30 | Hitachi Chemical Co Ltd | Dicing/die bonding sheet |
| JP4776189B2 (ja) * | 2004-08-03 | 2011-09-21 | 古河電気工業株式会社 | ウエハ加工用テープ |
| JP4776188B2 (ja) * | 2004-08-03 | 2011-09-21 | 古河電気工業株式会社 | 半導体装置製造方法およびウエハ加工用テープ |
| JP2007019151A (ja) * | 2005-07-06 | 2007-01-25 | Furukawa Electric Co Ltd:The | ウエハ加工用テープおよびそれを用いたチップの製造方法 |
-
2009
- 2009-03-13 JP JP2009060572A patent/JP2010219086A/ja active Pending
-
2010
- 2010-03-09 CN CN2010800110444A patent/CN102349134A/zh active Pending
- 2010-03-09 WO PCT/JP2010/053880 patent/WO2010104071A1/ja active Application Filing
- 2010-03-09 KR KR1020117023940A patent/KR101333341B1/ko active IP Right Grant
- 2010-03-12 TW TW099107278A patent/TWI519621B/zh not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060106819A (ko) * | 2003-12-15 | 2006-10-12 | 후루카와 덴키 고교 가부시키가이샤 | 웨이퍼 가공용 테이프 및 그 제조방법 |
| JP2005279755A (ja) | 2004-03-30 | 2005-10-13 | Nitto Denko Corp | レーザー加工品の製造方法及びレーザー加工用保護シート |
| WO2008047610A1 (fr) | 2006-10-06 | 2008-04-24 | Sumitomo Bakelite Company Limited | Film pour semi-conducteur, procédé de production de film pour semi-conducteur et dispositif à semiconducteurs |
| JP2008303386A (ja) | 2007-05-08 | 2008-12-18 | Hitachi Chem Co Ltd | 接着シート及びその製造方法並びに接着シートを用いた半導体装置の製造方法及び半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102349134A (zh) | 2012-02-08 |
| TW201040242A (en) | 2010-11-16 |
| TWI519621B (zh) | 2016-02-01 |
| JP2010219086A (ja) | 2010-09-30 |
| WO2010104071A1 (ja) | 2010-09-16 |
| KR20110129952A (ko) | 2011-12-02 |
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