TWI502624B - Substrate processing system and substrate processing method - Google Patents

Substrate processing system and substrate processing method Download PDF

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Publication number
TWI502624B
TWI502624B TW100119001A TW100119001A TWI502624B TW I502624 B TWI502624 B TW I502624B TW 100119001 A TW100119001 A TW 100119001A TW 100119001 A TW100119001 A TW 100119001A TW I502624 B TWI502624 B TW I502624B
Authority
TW
Taiwan
Prior art keywords
processing
carrier
substrate
devices
processing device
Prior art date
Application number
TW100119001A
Other languages
English (en)
Chinese (zh)
Other versions
TW201209885A (en
Inventor
月野木涉
山本雄一
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TW201209885A publication Critical patent/TW201209885A/zh
Application granted granted Critical
Publication of TWI502624B publication Critical patent/TWI502624B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
TW100119001A 2010-06-01 2011-05-31 Substrate processing system and substrate processing method TWI502624B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010126034A JP5392190B2 (ja) 2010-06-01 2010-06-01 基板処理システム及び基板処理方法

Publications (2)

Publication Number Publication Date
TW201209885A TW201209885A (en) 2012-03-01
TWI502624B true TWI502624B (zh) 2015-10-01

Family

ID=45021860

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100119001A TWI502624B (zh) 2010-06-01 2011-05-31 Substrate processing system and substrate processing method

Country Status (5)

Country Link
US (1) US8909364B2 (https=)
JP (1) JP5392190B2 (https=)
KR (1) KR101535317B1 (https=)
CN (1) CN102270562B (https=)
TW (1) TWI502624B (https=)

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KR20160050948A (ko) * 2014-10-31 2016-05-11 세메스 주식회사 기판 처리 장치의 에이징 방법
JP6562803B2 (ja) 2015-09-30 2019-08-21 株式会社Ｓｃｒｅｅｎホールディングス 基板処理システム
JP6838922B2 (ja) 2016-10-11 2021-03-03 キヤノン株式会社 画像読取装置、及び画像形成装置
JP6849378B2 (ja) 2016-10-11 2021-03-24 キヤノン株式会社 画像読取装置、及び画像形成装置
JP6759044B2 (ja) 2016-10-11 2020-09-23 キヤノン株式会社 画像読取装置、及び画像形成装置
JP6821378B2 (ja) * 2016-10-11 2021-01-27 キヤノン株式会社 画像読取装置、及び画像形成装置
US10542168B2 (en) 2016-10-11 2020-01-21 Canon Kabushiki Kaisha Image reading device and image forming apparatus
JP6821377B2 (ja) 2016-10-11 2021-01-27 キヤノン株式会社 画像読取装置、及び画像形成装置
JP6863114B2 (ja) * 2017-06-16 2021-04-21 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP6981918B2 (ja) * 2018-05-11 2021-12-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、基板処理装置、およびコンピュータプログラム
JP6993580B2 (ja) * 2018-08-03 2022-01-13 日本電信電話株式会社 制御システム及び制御方法
KR102678588B1 (ko) 2018-11-14 2024-06-27 램 리써치 코포레이션 차세대 리소그래피에서 유용한 하드 마스크들을 제조하기 위한 방법들
US12211691B2 (en) 2018-12-20 2025-01-28 Lam Research Corporation Dry development of resists
TWI910974B (zh) 2019-06-26 2026-01-01 美商蘭姆研究公司 利用鹵化物化學品的光阻顯影
TWI862745B (zh) * 2019-12-13 2024-11-21 日商東京威力科創股份有限公司 基板處理裝置及基板處理方法
CN114200776A (zh) 2020-01-15 2022-03-18 朗姆研究公司 用于光刻胶粘附和剂量减少的底层
WO2022010809A1 (en) 2020-07-07 2022-01-13 Lam Research Corporation Integrated dry processes for patterning radiation photoresist patterning
WO2022103764A1 (en) 2020-11-13 2022-05-19 Lam Research Corporation Process tool for dry removal of photoresist
US12577466B2 (en) 2020-12-08 2026-03-17 Lam Research Corporation Photoresist development with organic vapor
CN113299587B (zh) * 2021-05-21 2022-04-26 无锡亚电智能装备有限公司 一种晶圆清洗工艺任务排列方法及装置
US11804394B2 (en) * 2021-08-30 2023-10-31 Taiwan Semiconductor Manufacturing Company Limited Methods and systems for improving transfer efficiency of an automated material handling system
KR102725782B1 (ko) 2022-07-01 2024-11-05 램 리써치 코포레이션 에칭 정지 억제 (etch stop deterrence) 를 위한 금속 옥사이드 기반 포토레지스트의 순환적 현상
JP2024090487A (ja) * 2022-12-23 2024-07-04 株式会社荏原製作所 半導体製造装置におけるスループットの算出方法、半導体製造装置、およびコンピュータプログラム
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KR20250034920A (ko) 2023-07-27 2025-03-11 램 리써치 코포레이션 금속-함유 포토레지스트에 대한 올-인-원 건식 현상

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Also Published As

Publication number Publication date
US8909364B2 (en) 2014-12-09
KR20110132220A (ko) 2011-12-07
KR101535317B1 (ko) 2015-07-08
US20110292356A1 (en) 2011-12-01
TW201209885A (en) 2012-03-01
CN102270562B (zh) 2015-03-04
JP5392190B2 (ja) 2014-01-22
JP2011253897A (ja) 2011-12-15
CN102270562A (zh) 2011-12-07

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