JP5392190B2 - 基板処理システム及び基板処理方法 - Google Patents

基板処理システム及び基板処理方法 Download PDF

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Publication number
JP5392190B2
JP5392190B2 JP2010126034A JP2010126034A JP5392190B2 JP 5392190 B2 JP5392190 B2 JP 5392190B2 JP 2010126034 A JP2010126034 A JP 2010126034A JP 2010126034 A JP2010126034 A JP 2010126034A JP 5392190 B2 JP5392190 B2 JP 5392190B2
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Prior art keywords
processing
carrier
substrate
devices
lot
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JP2010126034A
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English (en)
Japanese (ja)
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JP2011253897A5 (https=
JP2011253897A (ja
Inventor
渉 月野木
雄一 山本
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2010126034A priority Critical patent/JP5392190B2/ja
Priority to KR1020110036893A priority patent/KR101535317B1/ko
Priority to US13/114,103 priority patent/US8909364B2/en
Priority to TW100119001A priority patent/TWI502624B/zh
Priority to CN201110153507.7A priority patent/CN102270562B/zh
Publication of JP2011253897A publication Critical patent/JP2011253897A/ja
Publication of JP2011253897A5 publication Critical patent/JP2011253897A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
JP2010126034A 2010-06-01 2010-06-01 基板処理システム及び基板処理方法 Active JP5392190B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2010126034A JP5392190B2 (ja) 2010-06-01 2010-06-01 基板処理システム及び基板処理方法
KR1020110036893A KR101535317B1 (ko) 2010-06-01 2011-04-20 기판 처리 시스템 및 기판 처리 방법
US13/114,103 US8909364B2 (en) 2010-06-01 2011-05-24 Substrate processing system and substrate processing method
TW100119001A TWI502624B (zh) 2010-06-01 2011-05-31 Substrate processing system and substrate processing method
CN201110153507.7A CN102270562B (zh) 2010-06-01 2011-06-01 基板处理系统和基板处理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010126034A JP5392190B2 (ja) 2010-06-01 2010-06-01 基板処理システム及び基板処理方法

Publications (3)

Publication Number Publication Date
JP2011253897A JP2011253897A (ja) 2011-12-15
JP2011253897A5 JP2011253897A5 (https=) 2013-02-21
JP5392190B2 true JP5392190B2 (ja) 2014-01-22

Family

ID=45021860

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010126034A Active JP5392190B2 (ja) 2010-06-01 2010-06-01 基板処理システム及び基板処理方法

Country Status (5)

Country Link
US (1) US8909364B2 (https=)
JP (1) JP5392190B2 (https=)
KR (1) KR101535317B1 (https=)
CN (1) CN102270562B (https=)
TW (1) TWI502624B (https=)

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Also Published As

Publication number Publication date
US8909364B2 (en) 2014-12-09
KR20110132220A (ko) 2011-12-07
KR101535317B1 (ko) 2015-07-08
US20110292356A1 (en) 2011-12-01
TW201209885A (en) 2012-03-01
CN102270562B (zh) 2015-03-04
JP2011253897A (ja) 2011-12-15
TWI502624B (zh) 2015-10-01
CN102270562A (zh) 2011-12-07

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