CN102270562B - 基板处理系统和基板处理方法 - Google Patents

基板处理系统和基板处理方法 Download PDF

Info

Publication number
CN102270562B
CN102270562B CN201110153507.7A CN201110153507A CN102270562B CN 102270562 B CN102270562 B CN 102270562B CN 201110153507 A CN201110153507 A CN 201110153507A CN 102270562 B CN102270562 B CN 102270562B
Authority
CN
China
Prior art keywords
processing
carrier
substrate
processing device
loading
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201110153507.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN102270562A (zh
Inventor
月野木涉
山本雄一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN102270562A publication Critical patent/CN102270562A/zh
Application granted granted Critical
Publication of CN102270562B publication Critical patent/CN102270562B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
CN201110153507.7A 2010-06-01 2011-06-01 基板处理系统和基板处理方法 Active CN102270562B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-126034 2010-06-01
JP2010126034A JP5392190B2 (ja) 2010-06-01 2010-06-01 基板処理システム及び基板処理方法

Publications (2)

Publication Number Publication Date
CN102270562A CN102270562A (zh) 2011-12-07
CN102270562B true CN102270562B (zh) 2015-03-04

Family

ID=45021860

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110153507.7A Active CN102270562B (zh) 2010-06-01 2011-06-01 基板处理系统和基板处理方法

Country Status (5)

Country Link
US (1) US8909364B2 (https=)
JP (1) JP5392190B2 (https=)
KR (1) KR101535317B1 (https=)
CN (1) CN102270562B (https=)
TW (1) TWI502624B (https=)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5951753B2 (ja) * 2011-04-22 2016-07-13 マッパー・リソグラフィー・アイピー・ビー．ブイ． リソグラフィ機のクラスタのためのネットワークアーキテクチャおよびプロトコル
US9405194B2 (en) 2012-11-30 2016-08-02 Semes Co., Ltd. Facility and method for treating substrate
KR101559027B1 (ko) * 2012-11-30 2015-10-13 세메스 주식회사 기판 처리 설비 및 방법
JP5793527B2 (ja) * 2013-03-26 2015-10-14 東京エレクトロン株式会社 搬送装置制御システム及び搬送装置のアクセス位置を調整する方法
JP6298318B2 (ja) 2014-02-25 2018-03-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
KR20160050948A (ko) * 2014-10-31 2016-05-11 세메스 주식회사 기판 처리 장치의 에이징 방법
JP6562803B2 (ja) 2015-09-30 2019-08-21 株式会社Ｓｃｒｅｅｎホールディングス 基板処理システム
JP6838922B2 (ja) 2016-10-11 2021-03-03 キヤノン株式会社 画像読取装置、及び画像形成装置
JP6849378B2 (ja) 2016-10-11 2021-03-24 キヤノン株式会社 画像読取装置、及び画像形成装置
JP6759044B2 (ja) 2016-10-11 2020-09-23 キヤノン株式会社 画像読取装置、及び画像形成装置
JP6821378B2 (ja) * 2016-10-11 2021-01-27 キヤノン株式会社 画像読取装置、及び画像形成装置
US10542168B2 (en) 2016-10-11 2020-01-21 Canon Kabushiki Kaisha Image reading device and image forming apparatus
JP6821377B2 (ja) 2016-10-11 2021-01-27 キヤノン株式会社 画像読取装置、及び画像形成装置
JP6863114B2 (ja) * 2017-06-16 2021-04-21 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP6981918B2 (ja) * 2018-05-11 2021-12-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、基板処理装置、およびコンピュータプログラム
JP6993580B2 (ja) * 2018-08-03 2022-01-13 日本電信電話株式会社 制御システム及び制御方法
KR102678588B1 (ko) 2018-11-14 2024-06-27 램 리써치 코포레이션 차세대 리소그래피에서 유용한 하드 마스크들을 제조하기 위한 방법들
US12211691B2 (en) 2018-12-20 2025-01-28 Lam Research Corporation Dry development of resists
TWI910974B (zh) 2019-06-26 2026-01-01 美商蘭姆研究公司 利用鹵化物化學品的光阻顯影
TWI862745B (zh) * 2019-12-13 2024-11-21 日商東京威力科創股份有限公司 基板處理裝置及基板處理方法
CN114200776A (zh) 2020-01-15 2022-03-18 朗姆研究公司 用于光刻胶粘附和剂量减少的底层
WO2022010809A1 (en) 2020-07-07 2022-01-13 Lam Research Corporation Integrated dry processes for patterning radiation photoresist patterning
WO2022103764A1 (en) 2020-11-13 2022-05-19 Lam Research Corporation Process tool for dry removal of photoresist
US12577466B2 (en) 2020-12-08 2026-03-17 Lam Research Corporation Photoresist development with organic vapor
CN113299587B (zh) * 2021-05-21 2022-04-26 无锡亚电智能装备有限公司 一种晶圆清洗工艺任务排列方法及装置
US11804394B2 (en) * 2021-08-30 2023-10-31 Taiwan Semiconductor Manufacturing Company Limited Methods and systems for improving transfer efficiency of an automated material handling system
KR102725782B1 (ko) 2022-07-01 2024-11-05 램 리써치 코포레이션 에칭 정지 억제 (etch stop deterrence) 를 위한 금속 옥사이드 기반 포토레지스트의 순환적 현상
JP2024090487A (ja) * 2022-12-23 2024-07-04 株式会社荏原製作所 半導体製造装置におけるスループットの算出方法、半導体製造装置、およびコンピュータプログラム
WO2024196643A1 (en) 2023-03-17 2024-09-26 Lam Research Corporation Integration of dry development and etch processes for euv patterning in a single process chamber
KR20250034920A (ko) 2023-07-27 2025-03-11 램 리써치 코포레이션 금속-함유 포토레지스트에 대한 올-인-원 건식 현상

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101546186A (zh) * 2008-03-25 2009-09-30 中芯国际集成电路制造(上海)有限公司 一种机台目标产量处理系统以及方法

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5442561A (en) * 1992-05-12 1995-08-15 Nippon Telegraph And Telephone Corporation Production management system and its application method
JP3392461B2 (ja) * 1993-05-12 2003-03-31 株式会社東芝 半導体ウェハの連動予約処理装置
JP3654597B2 (ja) * 1993-07-15 2005-06-02 株式会社ルネサステクノロジ 製造システムおよび製造方法
JPH07297258A (ja) * 1994-04-26 1995-11-10 Tokyo Electron Ltd 板状体の搬送装置
US5993081A (en) * 1995-10-24 1999-11-30 Canon Kabushiki Kaisha In-line processing system
US5975740A (en) * 1996-05-28 1999-11-02 Applied Materials, Inc. Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme
US5928389A (en) * 1996-10-21 1999-07-27 Applied Materials, Inc. Method and apparatus for priority based scheduling of wafer processing within a multiple chamber semiconductor wafer processing tool
US6201999B1 (en) * 1997-06-09 2001-03-13 Applied Materials, Inc. Method and apparatus for automatically generating schedules for wafer processing within a multichamber semiconductor wafer processing tool
US6604624B2 (en) * 1998-09-22 2003-08-12 Hirata Corporation Work conveying system
KR100646906B1 (ko) * 1998-09-22 2006-11-17 동경 엘렉트론 주식회사 기판처리장치 및 기판처리방법
US6678572B1 (en) * 1998-12-31 2004-01-13 Asml Holdings, N.V. Recipe cascading in a wafer processing system
JP3442686B2 (ja) * 1999-06-01 2003-09-02 東京エレクトロン株式会社 基板処理装置
JP3635214B2 (ja) * 1999-07-05 2005-04-06 東京エレクトロン株式会社 基板処理装置
TW494523B (en) * 2000-04-05 2002-07-11 Tokyo Electron Ltd Processing device
SG94851A1 (en) * 2000-07-12 2003-03-18 Tokyo Electron Ltd Substrate processing apparatus and substrate processing method
US6535784B2 (en) * 2001-04-26 2003-03-18 Tokyo Electron, Ltd. System and method for scheduling the movement of wafers in a wafer-processing tool
JP2003188229A (ja) * 2001-12-18 2003-07-04 Hitachi Kasado Eng Co Ltd ウエハ製造システムおよびウエハ製造方法
JP3862596B2 (ja) * 2002-05-01 2006-12-27 東京エレクトロン株式会社 基板処理方法
KR100935291B1 (ko) * 2002-11-28 2010-01-06 도쿄엘렉트론가부시키가이샤 기판 처리 시스템 및 도포 현상 장치
US7221993B2 (en) * 2003-01-27 2007-05-22 Applied Materials, Inc. Systems and methods for transferring small lot size substrate carriers between processing tools
JP4129215B2 (ja) * 2003-09-17 2008-08-06 大日本スクリーン製造株式会社 基板処理装置
US20070276531A1 (en) * 2003-11-06 2007-11-29 Applied Materials, Inc. Methods and apparatus for enhanced operation of substrate carrier handlers
US20070269297A1 (en) * 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
JP4376072B2 (ja) * 2004-01-16 2009-12-02 東京エレクトロン株式会社 基板処理装置及び基板処理方法
TWI316044B (en) * 2004-02-28 2009-10-21 Applied Materials Inc Methods and apparatus for material control system interface
KR101018525B1 (ko) * 2004-03-31 2011-03-03 도쿄엘렉트론가부시키가이샤 기판 처리 장치 및 기판 처리 방법
WO2006057319A1 (ja) * 2004-11-24 2006-06-01 Hitachi Kokusai Electric Inc. 基板処理装置
JP4610317B2 (ja) * 2004-12-06 2011-01-12 東京エレクトロン株式会社 基板処理装置及び基板処理装置の基板搬送方法
US7798764B2 (en) * 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7396412B2 (en) * 2004-12-22 2008-07-08 Sokudo Co., Ltd. Coat/develop module with shared dispense
US7651306B2 (en) * 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US20060182535A1 (en) * 2004-12-22 2006-08-17 Mike Rice Cartesian robot design
US7819079B2 (en) * 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7699021B2 (en) * 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
US20070250202A1 (en) * 2006-04-17 2007-10-25 Tokyo Electron Limited Coating and developing system, method of controlling coating and developing system and storage medium
JP4614455B2 (ja) * 2006-04-19 2011-01-19 東京エレクトロン株式会社 基板搬送処理装置
JP4849969B2 (ja) * 2006-06-15 2012-01-11 東京エレクトロン株式会社 基板処理システムおよび基板搬送方法
WO2008008727A2 (en) * 2006-07-10 2008-01-17 Applied Materials, Inc. Scheduling method for processing equipment
JP2008078630A (ja) * 2006-08-24 2008-04-03 Hitachi Kokusai Electric Inc 基板処理システム
JP5072380B2 (ja) * 2007-02-07 2012-11-14 東京エレクトロン株式会社 基板処理システム
US8452437B2 (en) * 2009-11-10 2013-05-28 International Business Machines Corporation Product release control into time-sensitive processing environments

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101546186A (zh) * 2008-03-25 2009-09-30 中芯国际集成电路制造(上海)有限公司 一种机台目标产量处理系统以及方法

Also Published As

Publication number Publication date
US8909364B2 (en) 2014-12-09
KR20110132220A (ko) 2011-12-07
KR101535317B1 (ko) 2015-07-08
US20110292356A1 (en) 2011-12-01
TW201209885A (en) 2012-03-01
JP5392190B2 (ja) 2014-01-22
JP2011253897A (ja) 2011-12-15
TWI502624B (zh) 2015-10-01
CN102270562A (zh) 2011-12-07

Similar Documents

Publication Publication Date Title
CN102270562B (zh) 基板处理系统和基板处理方法
US7934880B2 (en) Coating and developing apparatus, coating and developing method, and storage medium
JP4356936B2 (ja) 塗布、現像装置及びその方法
JP5151383B2 (ja) 塗布、現像装置、その方法及び記憶媒体
CN100573328C (zh) 涂敷、显影装置和涂敷、显影方法
CN100568452C (zh) 涂敷、显影装置及其方法
CN101517703B (zh) 涂敷、显影装置和涂敷、显影装置的控制方法
KR20100129152A (ko) 기판 처리 장치, 기판 처리 방법 및 기억 매체
JP6723110B2 (ja) 基板処理装置および基板処理方法
CN101901748B (zh) 基板处理装置和基板处理方法
JP4079861B2 (ja) 基板処理装置
US7229240B2 (en) Substrate processing apparatus and substrate processing method
CN101107701A (zh) 基板搬送处理装置和基板搬送处理装置的故障对策方法以及基板搬送处理装置的故障对策程序
JP2005294460A (ja) 塗布、現像装置
JP4716362B2 (ja) 基板処理システム及び基板処理方法
JP2010045190A (ja) 加熱システム、塗布、現像装置及び塗布、現像方法並びに記憶媒体
CN1858648B (zh) 涂敷处理方法和涂敷处理装置
KR101399223B1 (ko) 기판처리장치 및 기판처리방법
JP7347658B2 (ja) 基板処理装置及び基板処理方法
JP3936900B2 (ja) 基板の処理システム
CN120530476A (zh) 基片运送方法、基片处理装置和程序

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant