TWI487450B - 佈線基板及其製造方法 - Google Patents

佈線基板及其製造方法 Download PDF

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Publication number
TWI487450B
TWI487450B TW099117888A TW99117888A TWI487450B TW I487450 B TWI487450 B TW I487450B TW 099117888 A TW099117888 A TW 099117888A TW 99117888 A TW99117888 A TW 99117888A TW I487450 B TWI487450 B TW I487450B
Authority
TW
Taiwan
Prior art keywords
film
plating film
wiring substrate
support plate
layer
Prior art date
Application number
TW099117888A
Other languages
English (en)
Chinese (zh)
Other versions
TW201108905A (en
Inventor
小谷幸太郎
Original Assignee
新光電氣工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新光電氣工業股份有限公司 filed Critical 新光電氣工業股份有限公司
Publication of TW201108905A publication Critical patent/TW201108905A/zh
Application granted granted Critical
Publication of TWI487450B publication Critical patent/TWI487450B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Wire Bonding (AREA)
TW099117888A 2009-06-03 2010-06-03 佈線基板及其製造方法 TWI487450B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009133604A JP5561460B2 (ja) 2009-06-03 2009-06-03 配線基板および配線基板の製造方法

Publications (2)

Publication Number Publication Date
TW201108905A TW201108905A (en) 2011-03-01
TWI487450B true TWI487450B (zh) 2015-06-01

Family

ID=43300151

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099117888A TWI487450B (zh) 2009-06-03 2010-06-03 佈線基板及其製造方法

Country Status (4)

Country Link
US (2) US8476754B2 (https=)
JP (1) JP5561460B2 (https=)
KR (1) KR101610969B1 (https=)
TW (1) TWI487450B (https=)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101559958B1 (ko) * 2009-12-18 2015-10-13 삼성전자주식회사 3차원 반도체 장치의 제조 방법 및 이에 따라 제조된 3차원 반도체 장치
JP5603600B2 (ja) * 2010-01-13 2014-10-08 新光電気工業株式会社 配線基板及びその製造方法、並びに半導体パッケージ
JP5826532B2 (ja) * 2010-07-15 2015-12-02 新光電気工業株式会社 半導体装置及びその製造方法
TWI495051B (zh) * 2011-07-08 2015-08-01 欣興電子股份有限公司 無核心層之封裝基板及其製法
US20130168132A1 (en) * 2011-12-29 2013-07-04 Sumsung Electro-Mechanics Co., Ltd. Printed circuit board and method of manufacturing the same
TWI557855B (zh) * 2011-12-30 2016-11-11 旭德科技股份有限公司 封裝載板及其製作方法
US8969730B2 (en) * 2012-08-16 2015-03-03 Apple Inc. Printed circuit solder connections
US9716051B2 (en) * 2012-11-02 2017-07-25 Nvidia Corporation Open solder mask and or dielectric to increase lid or ring thickness and contact area to improve package coplanarity
JP6105316B2 (ja) * 2013-02-19 2017-03-29 京セラ株式会社 電子装置
JP2014207388A (ja) * 2013-04-15 2014-10-30 株式会社東芝 半導体パッケージ
CN107170689B (zh) * 2013-06-11 2019-12-31 唐山国芯晶源电子有限公司 芯片封装基板
KR101516072B1 (ko) * 2013-07-09 2015-04-29 삼성전기주식회사 반도체 패키지 및 그 제조 방법
CN104576596B (zh) * 2013-10-25 2019-01-01 日月光半导体制造股份有限公司 半导体基板及其制造方法
US10276562B2 (en) * 2014-01-07 2019-04-30 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device with multiple threshold voltage and method of fabricating the same
US20150255366A1 (en) * 2014-03-06 2015-09-10 Apple Inc. Embedded system in package
JP6351371B2 (ja) * 2014-05-19 2018-07-04 太陽誘電株式会社 弾性波デバイス
CN106455933B (zh) * 2014-06-20 2018-10-30 奥林巴斯株式会社 缆线连接构造和内窥镜装置
JP6314731B2 (ja) * 2014-08-01 2018-04-25 株式会社ソシオネクスト 半導体装置及び半導体装置の製造方法
TWI570816B (zh) * 2014-09-26 2017-02-11 矽品精密工業股份有限公司 封裝結構及其製法
JP6503687B2 (ja) * 2014-10-23 2019-04-24 イビデン株式会社 プリント配線板
JP2016152262A (ja) * 2015-02-16 2016-08-22 イビデン株式会社 プリント配線板
JP6550260B2 (ja) * 2015-04-28 2019-07-24 新光電気工業株式会社 配線基板及び配線基板の製造方法
TWI575619B (zh) * 2015-12-09 2017-03-21 南茂科技股份有限公司 半導體封裝結構及其製作方法
TWI621194B (zh) * 2017-06-28 2018-04-11 中華精測科技股份有限公司 測試介面板組件
TWI612599B (zh) * 2017-06-28 2018-01-21 Chunghwa Precision Test Tech Co., Ltd. 測試介面板組件及其製造方法
US10930574B2 (en) * 2018-05-01 2021-02-23 Rohm Co., Ltd. Semiconductor device and method for manufacturing the same
WO2020090601A1 (ja) * 2018-10-30 2020-05-07 凸版印刷株式会社 半導体パッケージ用配線基板及び半導体パッケージ用配線基板の製造方法
CN111341750B (zh) 2018-12-19 2024-03-01 奥特斯奥地利科技与系统技术有限公司 包括有导电基部结构的部件承载件及制造方法
CN111599687B (zh) * 2019-02-21 2022-11-15 奥特斯科技(重庆)有限公司 具有高刚度的超薄部件承载件及其制造方法
US12205877B2 (en) 2019-02-21 2025-01-21 AT&S(Chongqing) Company Limited Ultra-thin component carrier having high stiffness and method of manufacturing the same
US20200279814A1 (en) * 2019-02-28 2020-09-03 Advanced Semiconductor Engineering, Inc. Wiring structure and method for manufacturing the same
JP7335036B2 (ja) 2019-03-29 2023-08-29 ラピスセミコンダクタ株式会社 半導体パッケージの製造方法
JP2021132068A (ja) * 2020-02-18 2021-09-09 イビデン株式会社 プリント配線板、プリント配線板の製造方法
JP7528557B2 (ja) * 2020-06-19 2024-08-06 日本電気株式会社 量子デバイス及びその製造方法
US20220069489A1 (en) * 2020-08-28 2022-03-03 Unimicron Technology Corp. Circuit board structure and manufacturing method thereof
US11798897B2 (en) * 2021-03-26 2023-10-24 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure and methods of manufacturing the same
US20230095608A1 (en) * 2021-09-24 2023-03-30 Intel Corporation Conformal power delivery structures including embedded passive devices
CN116528466A (zh) * 2022-01-21 2023-08-01 奥特斯奥地利科技与系统技术有限公司 具有突出部的部件承载件和制造方法
TWI831123B (zh) * 2022-01-28 2024-02-01 巨擘科技股份有限公司 多層基板表面處理層結構
KR20230135215A (ko) * 2022-03-15 2023-09-25 삼성디스플레이 주식회사 회로 기판 및 이를 포함하는 표시 장치
CN120413436A (zh) * 2025-04-27 2025-08-01 无锡中微高科电子有限公司 Fc-pbga电路翘曲应力的平衡方法及系统

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6747350B1 (en) * 2003-06-06 2004-06-08 Silicon Integrated Systems Corp. Flip chip package structure
TW200539776A (en) * 2004-05-12 2005-12-01 Nec Corp Wiring board and semiconductor package using the same
TW200642008A (en) * 2005-05-24 2006-12-01 Advanced Semiconductor Eng System-in-package structure
TW200833201A (en) * 2006-12-04 2008-08-01 Shinko Electric Ind Co Wiring substrate and method for manufacturing the same

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0368163A (ja) * 1989-06-28 1991-03-25 Hitachi Ltd 半導体装置
JPH10233573A (ja) * 1997-02-20 1998-09-02 Sony Corp プリント配線板及び部品実装方法
JP3834426B2 (ja) * 1997-09-02 2006-10-18 沖電気工業株式会社 半導体装置
EP1744609B1 (en) * 1999-06-02 2012-12-12 Ibiden Co., Ltd. Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
JP3546961B2 (ja) 2000-10-18 2004-07-28 日本電気株式会社 半導体装置搭載用配線基板およびその製造方法、並びに半導体パッケージ
JP2003218249A (ja) 2002-01-18 2003-07-31 Mitsui Chemicals Inc 半導体中空パッケージ
JP2006120738A (ja) * 2004-10-19 2006-05-11 Murata Mfg Co Ltd セラミック多層基板およびその製造方法
US7626829B2 (en) * 2004-10-27 2009-12-01 Ibiden Co., Ltd. Multilayer printed wiring board and manufacturing method of the multilayer printed wiring board
JP4146864B2 (ja) 2005-05-31 2008-09-10 新光電気工業株式会社 配線基板及びその製造方法、並びに半導体装置及び半導体装置の製造方法
JP2007088058A (ja) * 2005-09-20 2007-04-05 Denso Corp 多層基板、及びその製造方法
JP5117692B2 (ja) * 2006-07-14 2013-01-16 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP2008071953A (ja) * 2006-09-14 2008-03-27 Nec Electronics Corp 半導体装置
JP5032187B2 (ja) * 2007-04-17 2012-09-26 新光電気工業株式会社 配線基板の製造方法及び半導体装置の製造方法及び配線基板
US8482119B2 (en) * 2008-06-24 2013-07-09 Infineon Technologies Ag Semiconductor chip assembly
US7964974B2 (en) * 2008-12-02 2011-06-21 General Electric Company Electronic chip package with reduced contact pad pitch

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6747350B1 (en) * 2003-06-06 2004-06-08 Silicon Integrated Systems Corp. Flip chip package structure
TW200539776A (en) * 2004-05-12 2005-12-01 Nec Corp Wiring board and semiconductor package using the same
TW200642008A (en) * 2005-05-24 2006-12-01 Advanced Semiconductor Eng System-in-package structure
TW200833201A (en) * 2006-12-04 2008-08-01 Shinko Electric Ind Co Wiring substrate and method for manufacturing the same

Also Published As

Publication number Publication date
US20130256012A1 (en) 2013-10-03
US8749046B2 (en) 2014-06-10
KR20100130555A (ko) 2010-12-13
JP2010283044A (ja) 2010-12-16
JP5561460B2 (ja) 2014-07-30
KR101610969B1 (ko) 2016-04-08
US8476754B2 (en) 2013-07-02
TW201108905A (en) 2011-03-01
US20100308451A1 (en) 2010-12-09

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