TW200642008A - System-in-package structure - Google Patents

System-in-package structure

Info

Publication number
TW200642008A
TW200642008A TW094116885A TW94116885A TW200642008A TW 200642008 A TW200642008 A TW 200642008A TW 094116885 A TW094116885 A TW 094116885A TW 94116885 A TW94116885 A TW 94116885A TW 200642008 A TW200642008 A TW 200642008A
Authority
TW
Taiwan
Prior art keywords
carrier
package structure
passive devices
structure includes
package
Prior art date
Application number
TW094116885A
Other languages
Chinese (zh)
Other versions
TWI281716B (en
Inventor
Ming-Hsiang Cheng
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW94116885A priority Critical patent/TWI281716B/en
Publication of TW200642008A publication Critical patent/TW200642008A/en
Application granted granted Critical
Publication of TWI281716B publication Critical patent/TWI281716B/en

Links

Landscapes

  • Transceivers (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

A system-in-package (SIP) structure includes a first package structure, a second package structure disposed above the first package structure, and a plurality of passive devices interposed between therebetween. The first package structure includes a first carrier, and at least a first chip disposed on the surface of the first carrier. The second package structure includes a second carrier, and at least a second chip disposed on the surface of the second carrier. The passive devices, such as resistors or capacitors, are interposed between the first carrier and the second carrier, and the gap between the first carrier and the second carrier are decided by the thickness of the passive devices.
TW94116885A 2005-05-24 2005-05-24 System-in-package structure TWI281716B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94116885A TWI281716B (en) 2005-05-24 2005-05-24 System-in-package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94116885A TWI281716B (en) 2005-05-24 2005-05-24 System-in-package structure

Publications (2)

Publication Number Publication Date
TW200642008A true TW200642008A (en) 2006-12-01
TWI281716B TWI281716B (en) 2007-05-21

Family

ID=38751633

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94116885A TWI281716B (en) 2005-05-24 2005-05-24 System-in-package structure

Country Status (1)

Country Link
TW (1) TWI281716B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI487450B (en) * 2009-06-03 2015-06-01 Shinko Electric Ind Co Wiring substrate and method of manufacturing the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10991656B2 (en) 2019-06-19 2021-04-27 Advanced Semiconductor Engineering, Inc. Semiconductor device package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI487450B (en) * 2009-06-03 2015-06-01 Shinko Electric Ind Co Wiring substrate and method of manufacturing the same

Also Published As

Publication number Publication date
TWI281716B (en) 2007-05-21

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