TWI459542B - 半導體裝置 - Google Patents

半導體裝置 Download PDF

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Publication number
TWI459542B
TWI459542B TW097145717A TW97145717A TWI459542B TW I459542 B TWI459542 B TW I459542B TW 097145717 A TW097145717 A TW 097145717A TW 97145717 A TW97145717 A TW 97145717A TW I459542 B TWI459542 B TW I459542B
Authority
TW
Taiwan
Prior art keywords
film
island
semiconductor
semiconductor device
shaped
Prior art date
Application number
TW097145717A
Other languages
English (en)
Chinese (zh)
Other versions
TW200943540A (en
Inventor
Shunpei Yamazaki
Yuugo Goto
Tsutomu Murakawa
Original Assignee
Semiconductor Energy Lab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Lab filed Critical Semiconductor Energy Lab
Publication of TW200943540A publication Critical patent/TW200943540A/zh
Application granted granted Critical
Publication of TWI459542B publication Critical patent/TWI459542B/zh

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/411Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by materials, geometry or structure of the substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6758Thin-film transistors [TFT] characterised by the insulating substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices

Landscapes

  • Thin Film Transistor (AREA)
  • Electroluminescent Light Sources (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Recrystallisation Techniques (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Electrodes Of Semiconductors (AREA)
TW097145717A 2007-12-03 2008-11-26 半導體裝置 TWI459542B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007312163 2007-12-03

Publications (2)

Publication Number Publication Date
TW200943540A TW200943540A (en) 2009-10-16
TWI459542B true TWI459542B (zh) 2014-11-01

Family

ID=40427859

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097145717A TWI459542B (zh) 2007-12-03 2008-11-26 半導體裝置

Country Status (6)

Country Link
US (2) US8047442B2 (enExample)
EP (1) EP2071627B1 (enExample)
JP (11) JP5514429B2 (enExample)
KR (2) KR101720512B1 (enExample)
CN (2) CN101452962B (enExample)
TW (1) TWI459542B (enExample)

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TWI539597B (zh) * 2011-01-26 2016-06-21 半導體能源研究所股份有限公司 半導體裝置及其製造方法
US8946066B2 (en) 2011-05-11 2015-02-03 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing semiconductor device
US8679905B2 (en) * 2011-06-08 2014-03-25 Cbrite Inc. Metal oxide TFT with improved source/drain contacts
US9431545B2 (en) * 2011-09-23 2016-08-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP6022880B2 (ja) * 2011-10-07 2016-11-09 株式会社半導体エネルギー研究所 半導体装置及び半導体装置の作製方法
JP5912394B2 (ja) 2011-10-13 2016-04-27 株式会社半導体エネルギー研究所 半導体装置
US9018629B2 (en) 2011-10-13 2015-04-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
US8637864B2 (en) 2011-10-13 2014-01-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing the same
JP6026839B2 (ja) 2011-10-13 2016-11-16 株式会社半導体エネルギー研究所 半導体装置
KR20140060776A (ko) * 2012-11-12 2014-05-21 삼성디스플레이 주식회사 플렉서블 표시 장치 및 그 제조 방법
JP2014138179A (ja) * 2013-01-18 2014-07-28 Nippon Hoso Kyokai <Nhk> 薄膜トランジスタアレイ基板及び表示装置
US9577107B2 (en) 2013-03-19 2017-02-21 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor film and method for forming oxide semiconductor film
WO2014189493A1 (en) 2013-05-21 2014-11-27 Halliburton Energy Services, Inc. Thermal securing set screws
JP6345023B2 (ja) * 2013-08-07 2018-06-20 株式会社半導体エネルギー研究所 半導体装置およびその作製方法
CN106105388B (zh) 2014-03-06 2018-07-31 株式会社半导体能源研究所 发光装置
CN206727211U (zh) * 2014-03-28 2017-12-08 株式会社村田制作所 天线装置以及通信设备
JP6468686B2 (ja) 2014-04-25 2019-02-13 株式会社半導体エネルギー研究所 入出力装置
JP2016081051A (ja) 2014-10-10 2016-05-16 株式会社半導体エネルギー研究所 機能パネル、装置、情報処理装置
KR102367251B1 (ko) * 2015-02-02 2022-02-25 삼성디스플레이 주식회사 표시 장치
US9772268B2 (en) 2015-03-30 2017-09-26 International Business Machines Corporation Predicting semiconductor package warpage
WO2017013538A1 (ja) 2015-07-23 2017-01-26 株式会社半導体エネルギー研究所 表示装置、モジュール、及び電子機器
CN107134496B (zh) * 2016-02-29 2019-05-31 昆山工研院新型平板显示技术中心有限公司 薄膜晶体管及其制造方法、显示面板及显示装置
KR102537297B1 (ko) * 2016-07-05 2023-05-30 삼성디스플레이 주식회사 롤러블 표시 장치 및 이를 포함하는 전자 기기
JP7086582B2 (ja) * 2017-12-11 2022-06-20 株式会社ジャパンディスプレイ 表示装置
CN110299369B (zh) * 2019-07-03 2021-11-16 京东方科技集团股份有限公司 显示基板及其制备方法、显示装置
US12408414B2 (en) * 2021-07-14 2025-09-02 Micron Technology, Inc. Transistor and memory circuitry comprising strings of memory cells
CN116131094B (zh) * 2021-11-12 2025-12-05 朗美通日本株式会社 光学半导体器件

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Publication number Priority date Publication date Assignee Title
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TWI276017B (en) * 2003-04-23 2007-03-11 Kuo-Ping Yang Automatic and interactive system for computer teaching aid
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Also Published As

Publication number Publication date
CN103985763B (zh) 2018-02-06
US20090140053A1 (en) 2009-06-04
JP2017147462A (ja) 2017-08-24
KR101720512B1 (ko) 2017-03-28
JP7250882B2 (ja) 2023-04-03
JP6657333B2 (ja) 2020-03-04
JP7660741B2 (ja) 2025-04-11
JP2023073320A (ja) 2023-05-25
JP2015111744A (ja) 2015-06-18
JP2018195843A (ja) 2018-12-06
JP2020074478A (ja) 2020-05-14
JP5514429B2 (ja) 2014-06-04
CN103985763A (zh) 2014-08-13
KR101693543B1 (ko) 2017-01-06
JP5719910B2 (ja) 2015-05-20
US8047442B2 (en) 2011-11-01
EP2071627B1 (en) 2014-06-11
EP2071627A2 (en) 2009-06-17
CN101452962B (zh) 2014-06-18
KR20160023740A (ko) 2016-03-03
EP2071627A3 (en) 2012-11-28
US20120037993A1 (en) 2012-02-16
JP2025096323A (ja) 2025-06-26
JP6968214B2 (ja) 2021-11-17
KR20090057932A (ko) 2009-06-08
JP2022009486A (ja) 2022-01-14
JP2015201663A (ja) 2015-11-12
JP2014075594A (ja) 2014-04-24
JP2009158936A (ja) 2009-07-16
JP5770402B2 (ja) 2015-08-26
CN101452962A (zh) 2009-06-10
JP2024091705A (ja) 2024-07-05
TW200943540A (en) 2009-10-16
JP7471488B2 (ja) 2024-04-19
JP6379250B2 (ja) 2018-08-22
US8272575B2 (en) 2012-09-25

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